CN213905336U - Suction nozzle capable of reducing chip damage rate - Google Patents

Suction nozzle capable of reducing chip damage rate Download PDF

Info

Publication number
CN213905336U
CN213905336U CN202023007666.XU CN202023007666U CN213905336U CN 213905336 U CN213905336 U CN 213905336U CN 202023007666 U CN202023007666 U CN 202023007666U CN 213905336 U CN213905336 U CN 213905336U
Authority
CN
China
Prior art keywords
suction nozzle
chip
tube socket
trachea
damage rate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202023007666.XU
Other languages
Chinese (zh)
Inventor
邓国发
刘海波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guoke Semiconductor Shenzhen Co ltd
Original Assignee
Shenzhen Guangshenghao Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Guangshenghao Technology Co ltd filed Critical Shenzhen Guangshenghao Technology Co ltd
Priority to CN202023007666.XU priority Critical patent/CN213905336U/en
Application granted granted Critical
Publication of CN213905336U publication Critical patent/CN213905336U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The utility model relates to a LD chip test field specifically is a reduce suction nozzle of chip damage rate, including the suction nozzle head, suction nozzle head top is provided with the trachea tube socket, is provided with the tube socket hole in the trachea tube socket, and trachea tube socket one side is provided with and is used for carrying out the side tangent plane that circumference is fixed to the suction nozzle, and the connection position between suction nozzle head and the trachea tube socket is provided with the spacing step of trachea, runs through in the suction nozzle head to be provided with and extends to the downthehole suction hole of tube socket, and suction nozzle head bottom is provided with the plane, and the cross is provided with first suction nozzle recess and second suction nozzle recess in the plane. The chip is from point contact or line contact to face contact when being adsorbed, through set up two and be ninety criss-cross first suction nozzle recess and the second suction nozzle recess of degree on the first head plane of suction nozzle, the width and the degree of depth of first suction nozzle recess and second suction nozzle recess are greater than the width and the height of chip upper surface bulge, have effectively avoided the damage that the chip caused when being adsorbed.

Description

Suction nozzle capable of reducing chip damage rate
Technical Field
The utility model relates to a LD chip test field specifically is a reduce suction nozzle of chip damage rate.
Background
The semiconductor laser, abbreviated as LD, has the advantages of high efficiency, long service life, good beam quality, small volume, light weight, full-curing, etc.
LD chip need carry out performance test after production is accomplished, and current suction nozzle is when carrying out the chip absorption, and the bulge on the chip and suction nozzle direct contact have the problem that the probability of chip damage is on the high side to this kind of form suction nozzle, lead to the chip to appear badly, influence product quality. Therefore, it is necessary to design a suction nozzle for reducing the damage rate of the chip to solve the disadvantages of the prior art.
SUMMERY OF THE UTILITY MODEL
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a suction nozzle that can reduce chip damage rate, includes the suction nozzle head, suction nozzle top is provided with the trachea tube socket, be provided with the trachea tube socket hole in the trachea tube socket, trachea tube socket one side is provided with and is used for carrying out the side tangent plane that circumference is fixed to the suction nozzle, the suction nozzle head with the junction between the trachea tube socket is provided with the spacing step of trachea, run through to be provided with in the suction nozzle head and extend to the downthehole suction hole of tube socket, suction nozzle head bottom is provided with the plane, the cross arrangement has first suction nozzle recess and second suction nozzle recess in the plane.
Further, the width and depth of the first nozzle groove and the second nozzle groove are larger than the width and height of the raised part on the upper surface of the chip, and the first nozzle groove and the second nozzle groove are crossed at an included angle of ninety degrees.
Furthermore, the suction nozzle head is of a conical body structure, four faces which are opposite in pairs are arranged on the conical body, the areas of two opposite faces in the four faces are equal, and the areas of two adjacent faces are not equal.
Furthermore, the trachea tube seat is a cylindrical tube body with an opening arranged inside.
Further, the nozzle head is made of 404 stainless steel plate.
Compared with the prior art, the beneficial effects of the utility model are that:
the chip is from point contact or line contact to face contact when being adsorbed, through set up two and be ninety criss-cross first suction nozzle recess and the second suction nozzle recess of degree on the first head plane of suction nozzle, the width and the degree of depth of first suction nozzle recess and second suction nozzle recess are greater than the width and the height of chip upper surface bulge, have effectively avoided the damage that the chip caused when being adsorbed.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a bottom view of the present invention;
fig. 3 is a side view of the present invention;
fig. 4 is a top view of the present invention.
In the figure: 1-a suction nozzle head; 2-a gas pipe limiting step; 3-side section; 4-a tube seat hole; 5-trachea tube seat; 6-a suction hole; 7-plane, 71-first nozzle recess, 72-second nozzle recess.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution:
the utility model provides a can reduce suction nozzle of chip damage rate, including suction nozzle head 1, suction nozzle head 1 top is provided with trachea tube socket 5, be provided with pipe socket hole 4 in the trachea tube socket 5, trachea tube socket 5 one side is provided with and is used for carrying out the side tangent plane 3 that circumference is fixed to the suction nozzle, the connecting point between suction nozzle head 1 and the trachea tube socket 5 is provided with spacing step 2 of trachea, it is provided with the suction hole 6 that extends to the pipe socket downthehole to run through in suction nozzle head 1, suction hole 6 communicates with each other with pipe socket hole 4, form suction nozzle negative pressure zone jointly, suction nozzle head 1 bottom is provided with plane 7, cross in plane 7 is provided with first suction nozzle recess 71 and second suction nozzle recess 72.
Due to the arranged side cutting surface, the suction nozzle can be positioned during installation, the directions of the first suction nozzle groove 71 and the second suction nozzle groove 72 at the bottom of the suction nozzle head are ensured to be consistent with the direction of the columnar protruding waveguide of the chip, and the position of the suction nozzle is fixed, so that the protruding position on the chip can be ensured to be rightly aligned.
As a preferable mode of the present invention, the width and depth of the first suction nozzle groove 71 and the second suction nozzle groove 72 are larger than the width and height of the protruding portion of the upper surface of the chip, and the first suction nozzle groove 71 and the second suction nozzle groove 72 are crossed at an included angle of ninety degrees.
As an optimized mode of the utility model, the suction nozzle head 1 is a conical body structure, and four faces opposite to each other are arranged on the conical body, and two opposite face areas in the four faces are equal, and two adjacent face areas are unequal.
As a preferred mode of the present invention, the tracheal tube base 5 is a cylindrical tube body with an opening formed therein.
As a preferred mode of the utility model, the suction nozzle head 1 is made of a 404 stainless steel plate, and the 404 stainless steel material has higher hardness, so that the service life of the suction nozzle head 1 can be prolonged.
When the suction nozzle is used, the suction nozzle is arranged at the suction nozzle mounting position of the equipment carrying mechanical arm, and the carrying mechanical arm can automatically carry the chip according to a set program. When the suction nozzle moves downwards to a set position, the vacuum pump sucks air from an air passage inside the suction nozzle, the pressure inside the suction nozzle and around the chip is reduced, meanwhile, compressed air is blown out from the back surface of the chip to blow the chip away from the surface of the chip bearing film, the chip is adsorbed by the suction nozzle, negative pressure is formed at the joint of the upper surface of the chip and the plane on the suction nozzle, the chip is adsorbed, the bulge parts are over against two grooves on the surface of the suction nozzle, the bulge parts are positioned in the grooves and do not contact with the grooves when the chip is adsorbed, the contact mode is changed from point contact or line contact into surface contact, no collision occurs, the chip is effectively protected, and the probability of chip damage can be effectively reduced.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and equivalents may be made without departing from the spirit and scope of the invention.

Claims (6)

1. The utility model provides a reduce suction nozzle of chip damage rate, includes suction nozzle head (1), suction nozzle head (1) top is provided with trachea tube socket (5), be provided with pipe socket hole (4) in trachea tube socket (5), its characterized in that, trachea tube socket (5) one side is provided with and is used for carrying out side tangent plane (3) that circumference is fixed to the suction nozzle, suction nozzle head (1) with the junction between trachea tube socket (5) is provided with spacing step of trachea (2), run through being provided with in suction nozzle head (1) and extend to suction hole (6) in the pipe socket hole, suction nozzle head (1) bottom is provided with plane (7), the crisscross first suction nozzle recess (71) and second suction nozzle recess (72) in plane (7).
2. The suction nozzle for reducing the chip damage rate as claimed in claim 1, wherein: the width and depth of the first nozzle groove (71) and the second nozzle groove (72) are larger than the width and height of the raised part on the upper surface of the chip.
3. The suction nozzle for reducing the damage rate of the chip as claimed in claim 2, wherein: the first nozzle groove (71) and the second nozzle groove (72) intersect at a ninety degree included angle.
4. The suction nozzle for reducing the chip damage rate as claimed in claim 1, wherein: the suction nozzle head (1) is of a conical body structure, four faces which are opposite in pairs are arranged on the conical body, the areas of two opposite faces in the four faces are equal, and the areas of two adjacent faces are unequal.
5. The suction nozzle for reducing the chip damage rate as claimed in claim 1, wherein: the trachea tube seat (5) is a cylindrical tube body with an opening arranged inside.
6. The suction nozzle for reducing the chip damage rate as claimed in claim 1, wherein: the suction nozzle head (1) is made of a 404 stainless steel plate.
CN202023007666.XU 2020-12-15 2020-12-15 Suction nozzle capable of reducing chip damage rate Active CN213905336U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202023007666.XU CN213905336U (en) 2020-12-15 2020-12-15 Suction nozzle capable of reducing chip damage rate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202023007666.XU CN213905336U (en) 2020-12-15 2020-12-15 Suction nozzle capable of reducing chip damage rate

Publications (1)

Publication Number Publication Date
CN213905336U true CN213905336U (en) 2021-08-06

Family

ID=77103711

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202023007666.XU Active CN213905336U (en) 2020-12-15 2020-12-15 Suction nozzle capable of reducing chip damage rate

Country Status (1)

Country Link
CN (1) CN213905336U (en)

Similar Documents

Publication Publication Date Title
CN111266756A (en) High-power vacuum laser welding transmission lens protection mechanism and welding system
CN213905336U (en) Suction nozzle capable of reducing chip damage rate
CN104482028B (en) A kind of omnipotent negative pressure of vacuum sucker
CN211804473U (en) High-power vacuum laser welding transmission lens protection device and welding system
CN214721717U (en) Wire welding device of DIP packaging photoelectric coupler
CN209963040U (en) Sucking disc device for wafer cutting
CN213691991U (en) Suction nozzle and die bonder
CN115547854A (en) Array die applied to small-size ceramic shell packaging patch
CN215578484U (en) Special-shaped suction nozzle
CN113035725A (en) Deep cavity bonding method
CN215496671U (en) Bernoulli sucker
CN108585534A (en) A kind of glass etching bubbling device
CN212947408U (en) Vacuum chuck jig
CN220282797U (en) Bernoulli sucker capable of preventing mutual interference
CN110465755A (en) A method of improving mark point crack
CN215849718U (en) Ultrasonic welding die for vehicle rear fog lamp
CN214986662U (en) Suction nozzle
CN221102111U (en) Air knife, battery piece suspension separation device and photovoltaic module processing system
CN216213346U (en) Sucking disc and silicon chip handling device
CN221282082U (en) Thin-wall deep cavity COC patch suction nozzle
CN214477375U (en) Sucker for solar cell production equipment
CN214242842U (en) Photovoltaic bernoulli chuck
CN220998485U (en) Bernoulli sucker for adsorbing rectangular sheet
CN215846314U (en) Vortex pressure nozzle for laser cutting machine
CN221875719U (en) Combined sucker with auxiliary sucker

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: 518031 11th floor, building B, Tengfei Industrial Building, 6 Taohua Road, free trade zone, Futian District, Shenzhen City, Guangdong Province

Patentee after: Shenzhen guangshenghao Technology Co.,Ltd.

Address before: 518031 11th floor, building B, Tengfei Industrial Building, 6 Taohua Road, free trade zone, Futian District, Shenzhen City, Guangdong Province

Patentee before: SHENZHEN GUANGSHENGHAO TECHNOLOGY Co.,Ltd.

CP01 Change in the name or title of a patent holder
CP03 Change of name, title or address

Address after: 518000 11th floor, building B, Tengfei Industrial Building, 6 Taohua Road, free trade zone, Futian District, Shenzhen City, Guangdong Province

Patentee after: Guoke Semiconductor (Shenzhen) Co.,Ltd.

Country or region after: China

Address before: 518031 11th floor, building B, Tengfei Industrial Building, 6 Taohua Road, free trade zone, Futian District, Shenzhen City, Guangdong Province

Patentee before: Shenzhen guangshenghao Technology Co.,Ltd.

Country or region before: China

CP03 Change of name, title or address