CN213889506U - Quick processingequipment of used deflector roll surface guide slot of wafer cutting process - Google Patents

Abstract

The utility model discloses an used deflector roll surface guide slot rapid machining device of wafer cutting process, include: the clamping assembly is used for loading a workpiece and drives the workpiece to rotate and move up and down; a guide roller assembly for arranging and driving the cutting wires such that the cutting wires are arranged in parallel and directionally moved along the guide roller guide groove; the wire loading assembly is used for collecting or releasing the cutting wire, so that the parts of the cutting wire which do not participate in the processing and are processed cannot be mutually wound; the tensioning wheel is used for arranging and pressing the cutting line, so that the cutting line bears certain tension and has certain pressure on the surface of the workpiece; and the wire body of the cutting wire is consistent with the groove shape of the workpiece to be processed and is used for removing the surface material of the workpiece. The utility model discloses a mutually supporting of centre gripping subassembly, line of cut, guide roller subassembly, line loading subassembly, take-up pulley realizes many guide slots simultaneous processing on deflector roll surface, improves deflector roll guide slot precision and surface quality to greatly improve machining efficiency.

Description

Quick processingequipment of used deflector roll surface guide slot of wafer cutting process

Technical Field

The utility model relates to a semiconductor wafer processing field especially relates to a quick processingequipment of used deflector roll surface guide slot of wafer cutting process.

Background

With the rapid development of electronic information technology, the demand for semiconductor wafers is increasing. In the production process of semiconductor wafers, an ingot is first cut into thin chips (thickness less than 1 mm). The process generally adopts diamond sand wire cutting, and in the cutting process, a rubber guide roller for guiding the diamond sand wire is easily worn, so that the size and the distance of the groove are inconsistent, and the thickness uniformity of the cut wafer is seriously influenced. Therefore, the groove of the rubber guide roller needs to be corrected, the traditional method is to use a turning processing line to turn the surface of the guide roller smoothly, and then process a guide groove on the surface by a profiling turning tool, but because one guide roller can be provided with thousands of guide grooves, the common turning processing efficiency is low, and the consistency of the guide groove is poor along with the abrasion of a cutter.

Therefore, a device capable of rapidly processing the rubber guide roller guide groove is needed, so that the simultaneous processing of multiple guide grooves is realized, and the consistency and the processing efficiency of each guide groove are ensured.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the technical problem and providing a quick processingequipment of used deflector roll surface guide slot of wafer cutting process.

The technical scheme of the utility model: a quick processingequipment of used deflector roll surface guide slot of wafer cutting process includes:

the clamping assembly is used for loading the workpiece and drives the workpiece to rotate and move up and down;

a guide roller assembly for arranging and driving the cutting wires such that the cutting wires are arranged in parallel and directionally moved along the guide roller guide groove;

the wire loading assembly is used for collecting or releasing the cutting wire, so that the parts of the cutting wire which do not participate in the processing and are processed cannot be mutually wound;

the tensioning wheel is used for arranging and pressing the cutting line, so that the cutting line bears certain tension and has certain pressure on the surface of the workpiece;

and the wire body of the cutting wire is consistent with the groove shape of the workpiece to be processed and is used for removing the surface material of the workpiece.

Preferably, the clamping assembly comprises a workpiece driver, a fixed jaw, a jaw coupler, a movable jaw and a workpiece table moving assembly, and the fixed jaw and the movable jaw are used for clamping the workpiece; the movable clamping jaw can be adjusted according to the length of a workpiece, the output end of the workpiece driver is connected with the fixed clamping jaw through a clamping jaw coupler, and the workpiece driver is used for driving the workpiece to move; the workpiece table moving assembly drives the workpiece to move up and down.

Preferably, the guide roller assembly is divided into a driving guide roller assembly for arranging and driving the cutting string to move and a driven guide roller assembly for arranging the cutting string only.

Preferably, the initiative guide roller subassembly includes initiative deflector roll driving piece, initiative deflector roll shaft coupling and initiative deflector roll, the output of initiative deflector roll driving piece is connected with the initiative deflector roll through the initiative deflector roll shaft coupling, initiative deflector roll driving piece drive the initiative deflector roll is rotatory, and then the motion of drive cutting line.

Preferably, the wire loading assembly comprises a wire releasing assembly and a wire collecting assembly, the wire releasing assembly is used for releasing the cutting wire, so that the cutting wire is directionally moved under the action of the driving guide roller assembly, the wire collecting assembly is used for collecting the cutting wire, and after the surface of the workpiece is machined by the cutting wire, the cutting wire enters the wire collecting assembly along the driven guide roller set, so that the machined cutting wire is collected.

Preferably, the pay-off assembly comprises a pay-off driver, a pay-off shaft coupler and a pay-off shaft, the pay-off shaft surrounds the cutting lines and intensively accommodates the cutting lines, the output end of the pay-off driver is connected with the pay-off shaft through the pay-off shaft coupler, and the pay-off driver drives the pay-off shaft to rotate; the take-up assembly comprises a take-up driver, a take-up shaft coupler, a take-up shaft, a pay-off shaft bearing and a pay-off shaft bearing end cover, the take-up shaft is surrounded by the cutting line, the output end of the take-up driver passes through the take-up shaft coupler and the take-up shaft, and the take-up driver drives the take-up shaft to rotate.

Preferably, the surface of the tension wheel is provided with corresponding guide grooves, the cutting wires can be arranged, and the tension wheel can move up and down and is used for adjusting the pressure of the cutting wires on the surface of the workpiece.

Preferably, the device further comprises a machine frame, wherein the machine frame is used for bearing and installing the workpiece clamping assembly, the guide roller assembly, the wire loading assembly, the tensioning wheel and the cutting wire.

The utility model has the advantages that: the utility model provides a used deflector roll surface guide slot rapid processing method of wafer cutting processing, including following step: a guide roller workpiece to be processed is arranged on the clamping assembly; the cutting line is wound on the guide grooves on the surfaces of the driving guide roller, the driven guide roller, the tension wheel and the like, so that the cutting line is arranged as required, and the tension wheel is adjusted to enable the cutting line to have certain pressure on the surface of the workpiece; simultaneously starting each driving piece to enable the cutting line to move directionally to generate relative motion with the surface of the workpiece to remove the surface material to be processed, enabling the workpiece table component to move up and down to drive the workpiece to move, and further controlling the depth of the guide groove on the surface of the workpiece by controlling the distance of the up-and-down motion of the workpiece; the guide groove rapid processing method for the guide roller surface used for wafer cutting processing can realize simultaneous processing of multiple guide grooves on the guide roller surface to be processed, greatly improves the processing efficiency, and better ensures the consistency of the space, depth and appearance of each guide groove.

The utility model provides a quick processingequipment of used deflector roll surface guide slot of wafer cutting processing based on the used deflector roll surface guide slot quick processing method of above-mentioned wafer cutting processing processes the deflector roll guide slot, and this quick processingequipment of used deflector roll surface guide slot of wafer cutting processing can realize the many guide slots of deflector roll surface simultaneous processing, once accomplishes the multislot processing, very big improvement machining efficiency to improve guide slot processingquality.

Drawings

Fig. 1 is a top view of a guide roller surface guide groove rapid processing device for wafer cutting according to an embodiment of the present invention;

fig. 2 is a front view of a guide roller surface guide groove rapid processing device for wafer cutting according to an embodiment of the present invention;

fig. 3 is a side view of a structure of a guide roller surface guide groove rapid processing device for wafer cutting according to an embodiment of the present invention;

fig. 4 is a structural diagram of a driving guide roller according to a first embodiment of the present invention;

fig. 5 is a structure diagram of a driven guide roller according to a first embodiment of the present invention;

fig. 6 is a drawing of a tension pulley structure according to a first embodiment of the present invention;

fig. 7 is a schematic diagram of a tensioner adjustment provided by a first embodiment of the present invention;

FIG. 8 is a flow chart of a process according to a first embodiment of the present invention;

fig. 9 is a schematic diagram of different guide grooves for wire cutting according to the second embodiment of the present invention;

fig. 10 is a schematic diagram of processing and cooling according to the second embodiment of the present invention.

Reference numerals: the workpiece comprises a workpiece 1, a workpiece driver 21, a fixed jaw 22, a jaw coupler 23, a workpiece bearing end cover 24, a workpiece table moving assembly 25, a workpiece table moving screw rod 251, a moving shaft sleeve 252, a screw rod driving piece 253, a workpiece table base 254, a moving jaw 26, a driving guide roller assembly 31, a driving guide roller driving piece 311, a driving guide roller coupler 312, a driving guide roller 313, a driven guide roller assembly 32, a driven guide roller 321, a driven guide roller bearing 322, a driven guide roller bearing end cover 323, a pay-off assembly 41, a pay-off driver 411, a pay-off shaft coupler 412, a pay-off shaft 413, a take-up assembly 42, a take-up driver 421, a take-up shaft coupler 422, a take-up shaft 423, a tensioning wheel 5, a cutting line 6, a line body 61, abrasive particles 62 and a frame 7.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The first embodiment is as follows:

the present embodiment provides a device for rapidly processing a guide groove on a surface of a guide roller for wafer cutting, as shown in fig. 1-7, the device for rapidly processing a guide groove on a surface of a guide roller for wafer cutting comprises a clamping assembly, a guide roller assembly, a wire loading assembly, a tension wheel 5, a cutting wire 6, etc. The clamping assembly is used for loading a workpiece 1 and drives the workpiece 1 to rotate and move up and down; the guide roller assembly is used for arranging and driving the cutting wire 6, and the surfaces of the driving guide roller 313 and the driven guide roller 321 are provided with annular guide grooves, so that the arrangement and the moving direction of the cutting wire 6 can be better controlled; the wire loading assembly is used for taking in or putting out the cutting wire 6 so that the cutting wire 6 moves orderly; the tensioning wheel 5 is used for arranging and guiding the cutting lines 6, the tension of the cutting lines 6 and the pressure on the surface of the workpiece 1 are adjusted by moving up and down, and the surface of the tensioning wheel 5 is provided with annular guide grooves which are uniformly arranged, so that the arrangement positions of the cutting lines 6 can be better controlled; the structure of the wire body 61 of the cutting wire 6 is consistent with the shape of a groove to be processed on the surface of the workpiece 1, and the wire body 61 is bonded with an abrasive 62 for removing the surface material of the workpiece 1; the workpiece 1 rotates under the action of the clamping assembly, the cutting wire 6 directionally moves under the action of the guide roller assembly, the wire loading assembly and the tension wheel 5 to form relative motion with the surface of the workpiece 1, and the multiple guide grooves on the surface of the workpiece 1 are simultaneously machined by removing the abrasive particles 62 on the surface of the cutting wire 6. The quick processing device for the guide roller surface guide groove for wafer cutting processing can realize the processing of the guide groove on the surface of the workpiece 1 with multiple guide grooves, greatly improves the processing efficiency of the guide groove on the surface of the workpiece 1, and simultaneously ensures the consistency of the guide grooves.

Optionally, the clamping assembly includes a fixed jaw 22, a movable jaw 26, a workpiece stage moving assembly 25, and the like, where the jaws respectively clamp two ends of the workpiece 1 to drive the workpiece 1 to rotate; the workpiece stage moving group 25 may be movable for driving the workpiece 1 to move up and down.

Furthermore, one end of a fixed jaw 22 clamps the workpiece, the other end of the fixed jaw is connected with the output end of the workpiece driver 21 through a jaw coupler 23, and the fixed jaw 22 is installed on the frame 7 through a bearing and a workpiece bearing end cover 24; one end of the movable clamping jaw 26 clamps the workpiece 1, the other end of the movable clamping jaw is mounted on the rack 7 through a spline, a bearing end cover and the like, the whole movable clamping jaw 26 can move axially, so that workpieces 1 with different lengths can be clamped conveniently, and the sizes of the fixed clamping jaw 22 and the movable clamping jaw 26 can be adjusted along the radial direction, so that workpieces 1 with different diameters can be clamped conveniently.

Specifically, the workpiece 1 is placed in a fixed jaw 22 and a movable jaw 26, the jaws are adjusted according to the diameter and the length of the workpiece, the workpiece 1 is clamped, a workpiece driver 21 is started, and the two jaws and the workpiece 1 are driven to rotate through a jaw coupler 23.

Further, the workpiece table moving group 25 includes a workpiece table moving screw 251, a moving shaft sleeve 252, a screw driving member 253, a workpiece table base 254 and the like, wherein a guide groove is formed in a side surface of the workpiece table base 254, the workpiece table moving screw is mounted on the frame 7 and can move up and down on the frame 7, the fixed jaw 22, the moving jaw 26, the workpiece 1 and the like are mounted on the workpiece table base 254 and can move together with the workpiece table base 254, the workpiece table moving screw 251 is connected with the workpiece table base 254 through the moving shaft sleeve 252, the other end of the workpiece table moving screw is connected with the frame through a shaft sleeve similar to the moving shaft sleeve 252 in structure, the tail end of the moving screw 251 is connected with the output end of the screw driving member 253 through a connecting shaft, and the screw driving member 253 is fixed on the frame 7;

specifically, the screw driving member 253 is started to drive the workpiece stage moving screw 251 to rotate, the moving shaft sleeve 252 is internally provided with a spiral groove which is matched with the workpiece stage moving screw 251, when the workpiece stage moving screw 251 rotates, the moving shaft sleeve 252 can axially move along the workpiece stage moving screw 251 to further drive the workpiece stage base 254 and the accessories on the workpiece stage base 254 to move up and down.

Optionally, the guide roller assembly comprises a driving guide roller assembly 31 and a driven guide roller assembly 32, which are used for arranging and driving the cutting line 1, and ensuring consistent spacing and smooth movement of the cutting line.

Further, the active guide roller assembly 31 includes an active guide roller driving part 311, an active guide roller coupler 312, an active guide roller 313, etc., wherein the surface of the active guide roller 313 is provided with a corresponding annular guide groove (see fig. 4) for driving and arranging the cutting lines 6, the active guide roller 313 is mounted on the frame 7 through a bearing and a bearing end cover, and one end of the active guide roller is connected with the output end of the active guide roller driver 311 through the active guide roller coupler 312, and the active guide roller coupler 312 and the active guide roller 313 are driven to rotate through the active guide roller driver 311, so as to drive the cutting lines 6 to move; the driven guide roller assembly 32 includes a driven guide roller 321, a driven guide roller bearing 322, a driven guide roller bearing cover 323 and the like, the surface of the driven guide roller 321 is consistent with the surface of the driving guide roller 313, the driven guide roller bearing 322 and the driven guide roller bearing cover 323 are both provided with the same guide groove, two ends of the driven guide roller 321 are installed on the frame 7 through the driven guide roller bearing 322 and the driven guide roller bearing cover 323, the cutting wire 6 is wound in the guide groove on the surface of the driven guide roller 321, and the driven guide roller 321 moves along with the movement of the cutting wire 6.

Specifically, the cutting line 6 surrounds the circular guide grooves on the surfaces of the driving guide roller 313 and the driven guide roller 321 (see fig. 3), the driving guide roller driver 311 is started to drive the driving guide roller 313 to rotate, and further to drive the cutting line 6 to move directionally, while the cutting line 6 also surrounds the surface of the driven guide roller 321, and the directional movement of the cutting line 6 drives the driven guide roller 321 to rotate; the cutting wire 6 moves horizontally relative to the surface of the workpiece 1 under the action of the guide roller assembly, but the whole cutting wire advances spirally, and the surface of the cutting wire 6 is adhered with the abrasive 62, so that the guide roller material can be selected from materials with higher hardness, such as hard alloy materials, in order to reduce the abrasion of the cutting wire to the guide grooves on the surfaces of the driving guide roller 313 and the driven guide roller 321.

Optionally, the wire loading assembly comprises a wire releasing assembly 41 and a wire collecting assembly 42 for receiving and releasing the cutting wires 6, so that the cutting wires 6 which do not participate in the processing and are processed are arranged in order and do not interfere with each other.

Further, the pay-off assembly 41 comprises a pay-off driver 411, a pay-off shaft coupler 412, a pay-off shaft 413 and the like, wherein a cutting line 6 is wound on the surface of the pay-off shaft 413, one end of the pay-off shaft is connected with the pay-off driver 411 through the pay-off shaft coupler 412, the pay-off driver 411 is started, the pay-off shaft 413 is driven, and the cutting line 6 is paid out from the pay-off shaft 413 and enters a groove on the surface of the driving guide roller 313 to perform directional motion; the wire take-up assembly 42 comprises a wire take-up driver 421, a wire take-up shaft coupler 422, a wire take-up shaft 423, a wire pay-off shaft bearing 424 and a wire pay-off shaft bearing end cover 425, wherein a cutting wire 6 is wound on the wire take-up shaft 423, the output end of the wire take-up driver 421 is connected with the wire take-up shaft 423 through the wire take-up shaft coupler 422, the wire take-up driver 421 drives the wire take-up shaft 423 to rotate, and the wire take-up assembly 42 has the function of accommodating the cutting wire coming out of the driven guide roller 321.

In this embodiment, the cutting line 6 is easy to generate axial runout due to a long span, in order to reduce the axial runout of the cutting line 6 and improve the consistency of the distance between the grooves, and meanwhile, the cutting line 6 has a larger wrap angle to the surface of the workpiece 1, and the guide roller surface guide groove rapid processing device for wafer cutting processing is provided with a tensioning wheel 5 for arranging the cutting line 6 and adjusting the pressure of the cutting line 6 to the surface of the workpiece 1.

Optionally, the surface of the tension wheel 5 is provided with annular microgrooves (see fig. 6), and the microgrooves have the same pitch as the surface pitches of the driving guide roller and the driven guide roller, so that the cutting lines 6 arranged in parallel are vertical to the axis of the workpiece 1, and the guide grooves on the surface of the machined workpiece 1 are ensured to be consistent in pitch; two ends of the tension wheel 5 are arranged on the frame 7, the height of the axis of the tension wheel can be adjusted, and the pressure of the cutting line 6 on the surface of the workpiece 1 is further adjusted; the two ends of the tensioning wheel 5 are respectively provided with a bearing, the bearings are fixed on the frame 7 through two wedge-shaped blocks, the wedge-shaped blocks can be drawn out from the frame 7 under the action of external force, the installation mode is as shown in figure 6, the heights of the two ends of the shaft of the tensioning wheel 5 are adjusted through the two wedge-shaped blocks, and the height adjustment of the center of the tensioning wheel is realized. Similarly, the fixing manner of the two ends of the tension wheel is not limited to this, as long as the center height of the tension wheel can be adjusted.

In the embodiment, because the number of the guide grooves on the surface of the workpiece 1 is large (about 3000), the requirements on the space, the groove depth and the groove type precision of the guide grooves are high, the rapid processing method of the guide roller surface guide grooves for wafer cutting can realize the simultaneous processing of multiple grooves, and the consistency of the groove types can be ensured by processing the profile cutting lines.

Optionally, the shape of the line body 61 of the cutting line 6 is the same as the groove shape to be processed of the workpiece 1, and the abrasive material 62 is adhered to the lower surface of the line, so that the surface material of the workpiece 1 is removed by the relative movement of the cutting line 6 and the surface of the workpiece 1.

Specifically, one end of the cutting wire 6 is fixed on the pay-off shaft 413, most of the cutting wire is also wound on the pay-off shaft 413, the other end of the cutting wire 6 is arranged along surface guide grooves of a driving guide roller 313, a tension roller 5, a driven guide rail 321 and a second tension roller 52 in an alternating mode, the cutting wire 6 is finally fixed on the take-up shaft 433, meanwhile, each driving part is started, the cutting wire 6 is paid out from the pay-off shaft 313, the cutting wire is directionally moved under the driving of the driving guide roller 313 to complete the processing of the surface of the workpiece 1, and finally enters the take-up wheel 423, the cutting wires 6 on the pay-off shaft 413 are reduced along with the prolonging of the processing time, the cutting wires 6 on the take-up wheel 423 are increased, when the cutting wires 6 on the pay-off shaft 413 are used up, all the driving parts reversely move, and the functions of the pay-off assembly 41 and the take-up assembly 42 are replaced; in order to ensure a uniform tension of the cutting wires 6, the rotation of the rotary motion members should be synchronized.

Alternatively, each component is mounted on the frame 7, and each component rotates and is connected to the frame 7 through a bearing, a bearing end cover, and the like, or other connection manners may be adopted as long as the above-described assembly structure can be implemented.

Example two:

the embodiment provides a method for rapidly processing a guide roller surface guide groove for wafer cutting, which is based on the apparatus for rapidly processing a guide roller surface guide groove for wafer cutting in the first embodiment, as shown in fig. 8-10, and includes the following steps:

step S1, placing the workpiece 1 to be processed on the clamping component;

step S2, installing the cutting wire 6 on the wire loading assembly, the guide roller assembly, the tension wheel 5 and the like in a surrounding way;

step S3, adjusting the tension wheel 5 to enable the cutting line 6 to have certain pressure on the surface of the workpiece 1;

and step S4, starting the driving parts simultaneously, so that the cutting line 6 moves on the surface of the workpiece 1, and the clamping assembly moves up and down simultaneously, thereby finishing the processing of the guide groove on the surface of the workpiece 1.

Optionally, before the surface guide groove processing is performed on the workpiece 1, a corresponding cutting line 6 is further selected according to the surface guide groove shape of the workpiece 1 to be processed, the shape of the cutting line 6 is consistent with the shape of the groove to be processed on the surface of the workpiece, the groove shape of the cutting line is as shown in fig. 9 and can be a trapezoid, a V-shape or a U-shape, the wire body 61 can be made of metal wire or nylon wire, the abrasive grains 62 bonded on the surface of the cutting line 6 can be abrasive grains with higher hardness such as diamond, silicon carbide, aluminum oxide and the like, the grain size of the abrasive grains 62 is 1-10 μm, and the bonding mode of the abrasive grains 62 and the wire body 61 can be organic bonding, vapor deposition, electroplating and the like.

Optionally, step S2 specifically includes: the cutting lines 6 are installed and crossly wound on the surface guide grooves of the driving guide roller 312, the driven guide roller 321 and the tension wheel 5, the arrangement interval of the cutting lines 6 is consistent with the guide groove interval of the workpiece 1 to be processed, one end of each cutting line 6 is fixed on the pay-off shaft 413, most of the cutting lines are wound on the pay-off shaft 413, the other ends of the cutting lines 6 are alternately arranged along the surface guide grooves of the driving guide roller 313, the workpiece 1, the tension wheel 5 and the driven guide rail 321, and finally the cutting lines are fixed on the take-up shaft 433.

Optionally, step S3 specifically includes: the wedge-shaped blocks at the two ends of the tensioning wheel 5 are adjusted, so that the center height of the tensioning wheel 5 is changed, and the surface pressure of the cutting line is adjusted.

Optionally, step S4 specifically includes: simultaneously starting each driving piece, paying off the cutting line 6 from the paying-off shaft 313, and forming guide grooves with the same shapes as the cutting line 6 on the surface to move directionally under the driving of the driving guide roller 313 so as to finish the processing of the surface of the workpiece 1; the cutting wire 6 finally enters the wire take-up pulley 423, the cutting wire 6 on the pay-off shaft 413 is reduced along with the increase of the processing time, the cutting wire 6 on the take-up pulley 423 is increased, when the cutting wire 6 on the pay-off shaft 413 is used up soon, all the driving members move in reverse directions, the functions of the pay-off assembly 41 and the wire take-up assembly 42 are replaced at the moment, in order to ensure that the tension of each cutting wire 6 is uniform, the rotation of each rotating movement member should be synchronous, and the movement speed of the cutting wire 6 is between 1 and 15 m/s.

Optionally, a large amount of heat is generated by friction between the cutting line 6 and the surface of the workpiece 1 during the machining process, and in order to avoid damaging the rubber workpiece due to overheating, a cold cutting fluid (fig. 10) can be used in the machining area to reduce the temperature of the machining surface and simultaneously flush the machining surface, wherein the flow rate of the cooling fluid is 30-100mL/min, and the machining area is ensured to be completely soaked by the cooling fluid.

Optionally, the cooling liquid can be oil-based cooling liquid or water-based cooling liquid, and if water-based cold cutting liquid is used, a certain proportion (2-5 mass percent) of antioxidant can be added to prevent the water-based cooling liquid from being oxidized and deteriorated and corroding workpieces and equipment.

Optionally, when the cooling liquid is used, a corresponding cooling liquid circulating system is further required for recycling the cold cutting liquid, a driving piece of the circulating system can be a peristaltic pump, the peristaltic pump has the advantages of adjustable flow, convenience in replacement and the like, and the peristaltic pump can also be driven by other mechanisms as long as the circulation of the cooling liquid can be realized.

Optionally, the cooling liquid circulation system includes a filter for filtering chips generated during processing and abrasive particles 62 falling from the cutting line 6, so as to prevent such impurities from entering the processing area along with the cooling liquid, and generating scratches in the guide groove, which affects the surface quality of the guide groove, the filter may be a common filter element with a filtering diameter of 1 μm, or other filters may be used, as long as the filtering of the cooling liquid can be realized.

By adopting the method and the device, the simultaneous processing of the multiple surface guide grooves on the guide roller with the multiple surface guide grooves can be realized, the processing efficiency of the guide grooves on the surface of the workpiece 1 is improved, and meanwhile, the consistency of the guide grooves can be well ensured.

It is to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (8)

1. The utility model provides a used deflector roll surface guide slot rapid tooling device of wafer cutting process which characterized in that includes:

the clamping assembly is used for loading a workpiece (1), and drives the workpiece (1) to rotate and move up and down;

the cutting line (6), the line body (61) of the cutting line (6) is consistent with the groove shape of the workpiece (1) to be processed, and is used for removing the surface material of the workpiece (1);

the tensioning wheel (5) is used for arranging and pressing the cutting wire (6) so that the cutting wire (6) bears certain tensile force and has certain pressure on the surface of the workpiece (1);

a guide roller assembly for arranging and driving the cutting wires (6) such that the cutting wires (6) are arranged in parallel and move directionally along the guide roller guide groove;

a wire loading assembly for taking in or putting out the cutting wire (6) so that the parts of the cutting wire (6) which are not yet involved in the process and have finished the process do not become entangled with each other.

2. The apparatus as claimed in claim 1, wherein the guide groove is formed on a surface of the guide roller for wafer cutting, and the apparatus further comprises: the clamping assembly comprises a workpiece driver (21), a fixed jaw (22), a jaw coupler (23), a movable jaw (26) and a workpiece table moving assembly (25), wherein the fixed jaw (22) and the movable jaw (26) are used for clamping the workpiece (1); the movable clamping jaw (26) can be adjusted according to the length of a workpiece (1), the output end of the workpiece driver (21) is connected with the fixed clamping jaw (22) through a clamping jaw coupler (23), and the workpiece driver (21) is used for driving the workpiece (1) to move; the workpiece table moving assembly (25) drives the workpiece (1) to move up and down.

3. The apparatus as claimed in claim 1, wherein the guide groove is formed on a surface of the guide roller for wafer cutting, and the apparatus further comprises: the guide roller assembly is divided into a driving guide roller assembly (31) and a driven guide roller assembly (32), the driving guide roller assembly (31) is used for arranging and driving the cutting wire (6) to move, and the driven guide roller assembly (32) is only used for arranging the cutting wire (6).

4. The device as claimed in claim 3, wherein the guide groove is formed on the surface of the guide roller for wafer cutting, and comprises: the active guide roller assembly (31) comprises an active guide roller driving part (311), an active guide roller coupler (312) and an active guide roller (313), the output end of the active guide roller driving part (311) is connected with the active guide roller (313) through the active guide roller coupler (312), the active guide roller driving part (311) drives the active guide roller (313) to rotate, and then the cutting line (6) is driven to move.

5. The apparatus as claimed in claim 1, wherein the guide groove is formed on a surface of the guide roller for wafer cutting, and the apparatus further comprises: the wire loading assembly comprises a wire releasing assembly (41) and a wire collecting assembly (42), wherein the wire releasing assembly (41) is used for releasing the cutting wire (6) to enable the cutting wire (6) to directionally move under the action of the driving guide roller assembly (31), the wire collecting assembly (42) is used for receiving the cutting wire (6), and after the cutting wire (6) finishes processing the surface of a workpiece, the cutting wire enters the wire collecting assembly (42) along the driven guide roller assembly (32) to finish receiving the processed cutting wire (6).

6. The device as claimed in claim 5, wherein the guide groove is formed on the surface of the guide roller for wafer cutting, and comprises: the paying-off assembly (41) comprises a paying-off driver (411), a paying-off shaft coupler (412) and a paying-off shaft (413), the paying-off shaft (413) surrounds the cutting line (6) and intensively receives the cutting line (6), the output end of the paying-off driver (411) is connected with the paying-off shaft (413) through the paying-off shaft coupler (412), and the paying-off driver (411) drives the paying-off shaft (413) to rotate; receive line subassembly (42) including receiving line driver (421), receipts spool shaft coupling (422), receipts spool (423), unwrapping wire shaft bearing (424) and unwrapping wire shaft bearing end cover (425), it centers on to receive spool (423) line of cut (6), the output that receives line driver (421) passes through receive spool shaft coupling (422) with it links to each other to receive spool (423), receive line driver (421) drive it is rotatory to receive spool (423).

7. The apparatus as claimed in claim 1, wherein the guide groove is formed on a surface of the guide roller for wafer cutting, and the apparatus further comprises: the surface of the tension wheel (5) is provided with corresponding guide grooves, the cutting lines (6) can be arranged, and the tension wheel (5) can move up and down and is used for adjusting the pressure of the cutting lines (6) on the surface of a workpiece.

8. The apparatus as claimed in claim 1, wherein the guide groove is formed on a surface of the guide roller for wafer cutting, and the apparatus further comprises: the device also comprises a machine frame (7), wherein the machine frame (7) is used for bearing and installing the clamping assembly, the guide roller assembly, the wire loading assembly, the tensioning wheel (5) and the cutting wire (6).

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