CN213857024U

CN213857024U - Mold cooling monitoring system

Info

Publication number: CN213857024U
Application number: CN202022735859.0U
Authority: CN
Inventors: 纪旭
Original assignee: Changsha Boda Science And Engineering Co ltd
Current assignee: Changsha Boda Science And Engineering Co ltd
Priority date: 2020-11-23
Filing date: 2020-11-23
Publication date: 2021-08-03
Anticipated expiration: 2030-11-23

Abstract

The utility model provides a mould cooling monitoring system, which comprises a water tank, wherein a supporting plate is arranged on the inner wall of the water tank in a sliding manner, hydraulic rods are symmetrically arranged on two sides of the outer wall of the water tank, the upper ends of the hydraulic rods are symmetrically arranged and connected with the supporting plate through symmetrically arranged pull rods, the outer wall of the water tank is symmetrically provided with a water inlet pipe and a water outlet pipe in a penetrating manner, one end of the water outlet pipe, which is far away from the water tank, is provided with a water circulating pump, the water circulating pump is connected with one end of the water inlet pipe, which is far away from the water tank, through a water pipe, the outer wall of the water pipe is provided with a sleeve pipe, a semiconductor refrigerating sheet is arranged on the sleeve pipe in a penetrating manner, the outer wall of the water tank is provided with a PLC controller, the bottom end of the inner wall of the water tank is provided with a temperature sensor, the semiconductor refrigerating sheet and the water circulating pump are mutually matched, so that the temperature of the liquid in the water tank is accurately controlled when the liquid in the water tank is cooled, the die-casting metal water inlet tank is rapidly cooled, and the strength of metal is increased.

Description

Mold cooling monitoring system

Technical Field

The utility model relates to a technical field of mould processing specifically is a mould cooling monitored control system.

Background

The traditional gravity casting device is usually to cast high-temperature metal liquid into a steel casting die, and then naturally cools, so that the internal feeding of metal is insufficient, the cooling speed is slow, shrinkage cavities and shrinkage porosity of alloy castings are caused, and crystal grains are coarse, so that the strength, hardness and wear resistance of metal are difficult to meet the production requirements of parts.

SUMMERY OF THE UTILITY MODEL

The utility model mainly provides a mould cooling monitored control system for solve the technical problem who proposes among the above-mentioned background art.

The utility model provides a technical scheme that above-mentioned technical problem adopted does:

the utility model provides a mould cooling monitoring system, includes the basin, the basin inner wall slides and is equipped with the backup pad, basin outer wall bilateral symmetry is equipped with the hydraulic stem, and the symmetry sets up the pull rod that the hydraulic stem upper end set up through the symmetry links to each other with the backup pad, basin outer wall symmetry runs through and is equipped with inlet tube and outlet pipe, the one end that the basin was kept away from to the outlet pipe is equipped with the water circulating pump, the water circulating pump links to each other through the water service pipe with the one end that the basin was kept away from to the inlet tube, the water service pipe outer wall is equipped with the sleeve pipe, run through on the sleeve pipe and be equipped with the semiconductor refrigeration piece, the basin outer wall is equipped with the PLC controller, basin inner wall bottom is equipped with temperature sensor, link to each other through the wire between PLC controller, water circulating pump, semiconductor refrigeration piece and the temperature sensor. Through mutually supporting between PLC controller and temperature sensor, semiconductor refrigeration piece and the water circulating pump to further realization is when to the interior liquid cooling of basin, and the temperature of liquid in the accurate control basin makes the die-casting metal intake chamber cool down rapidly, increases the intensity of metal.

Furthermore, one end of the semiconductor refrigeration piece, which is close to the water through pipe, is a cold end, and the liquid in the water through pipe is refrigerated and cooled.

Furthermore, the outer wall of the temperature sensor is wrapped by a waterproof layer, and the waterproof layer plays a role in enabling the temperature sensor to be arranged in the water tank, so that the sensing accuracy is improved.

Furthermore, a plurality of water leakage holes are uniformly distributed on the supporting plate, so that liquid can flow out of the water leakage holes, and the ascending and descending resistance of the supporting plate is reduced.

Furthermore, the length of the pull rod on the inner wall of the water tank is equal to the height of the inner wall of the water tank, so that the support plate can be immersed into the bottom of the water tank.

Furthermore, one side of the water outlet pipe, which is close to the inner wall of the water tank, is provided with a filter screen, and the filter screen can filter large impurities in water and prevent the large impurities from entering the water pipeline to block the water pipeline.

Compared with the prior art, the beneficial effects of the utility model are that:

this mould cooling monitoring system, through mutually supporting between temperature sensor and the basin, thereby realize the effect of real time monitoring inslot liquid temperature, mutually support between water circulating pump and inlet tube and the outlet pipe, thereby make the liquid in the basin at the basin inner loop flow, through mutually supporting between semiconductor refrigeration piece and the water service pipe, to the liquid cooling that flows in the water service pipe, through PLC controller and temperature sensor, mutually support between semiconductor refrigeration piece and the water circulating pump, thereby further realization is in the liquid cooling to the basin, the temperature of liquid in the accurate control basin, make the die-casting metal intake chamber cool down rapidly, increase the intensity of metal.

The present invention will be explained in detail with reference to the drawings and specific embodiments.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the overall and partial disassembled structure of the present invention;

FIG. 3 is a schematic structural view of the support plate and the hydraulic rod of the present invention;

FIG. 4 is a schematic view of the cross-sectional structure of the water tank of the present invention;

fig. 5 is a schematic view of a local structure of the water tank of the present invention.

In the figure: 1. a water tank; 2. a support plate; 2a, water leakage holes; 3. a hydraulic lever; 4. a water inlet pipe; 5. a water outlet pipe; 6. a water circulation pump; 7. a water pipe; 8. a sleeve; 9. a semiconductor refrigeration sheet; 10. a pull rod; 11. a PLC controller; 12. a temperature sensor; 13. a waterproof layer; 14. and (4) a filter screen.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully with reference to the accompanying drawings, in which several embodiments of the present invention are shown, but the present invention can be implemented in different forms, and is not limited to the embodiments described in the text, but rather, these embodiments are provided to make the disclosure of the present invention more thorough and comprehensive.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may be present, and when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present, as the terms "vertical", "horizontal", "left", "right" and the like are used herein for descriptive purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, and the use of the term knowledge in the specification of the present invention is for the purpose of describing particular embodiments and is not intended to limit the present invention, and the term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Please refer to fig. 1-5 in greater detail, a mold cooling monitoring system comprises a water tank 1, a support plate 2 is slidably disposed on the inner wall of the water tank 1, hydraulic rods 3 are symmetrically disposed on two sides of the outer wall of the water tank 1, the upper ends of the symmetrically arranged hydraulic rods 3 are connected with the supporting plate 2 through symmetrically arranged pull rods 10, a water inlet pipe 4 and a water outlet pipe 5 are symmetrically arranged on the outer wall of the water tank 1 in a penetrating way, a water circulating pump 6 is arranged at one end of the water outlet pipe 5 far away from the water tank 1, the water circulating pump 6 is connected with one end of the water inlet pipe 4 far away from the water tank 1 through a water pipe 7, the outer wall of the water pipe 7 is provided with a sleeve 8, a semiconductor refrigerating sheet 9 is arranged on the sleeve 8 in a penetrating way, a PLC controller 11 is arranged on the outer wall of the water tank 1, the bottom end of the inner wall of the water tank 1 is provided with a temperature sensor 12, and the PLC controller 11, the water circulating pump 6, the semiconductor refrigerating sheet 9 and the temperature sensor 12 are connected through wires.

Please refer to fig. 2 and 4, the end of the semiconductor refrigeration sheet 9 close to the water pipe 7 is a cold end, and the outer wall of the temperature sensor 12 is wrapped with a waterproof layer 13; in this embodiment, through the mutual cooperation between the semiconductor refrigeration piece 9 and the temperature sensor 12, the real-time temperature in the water tank 1 is detected while the semiconductor refrigeration piece 9 cools the liquid in the water tank 1.

Please refer to fig. 3 again, a plurality of water leakage holes 2a are uniformly distributed on the supporting plate 2; in the present embodiment, the mutual cooperation between the support plate 2 and the water leakage hole 2a is utilized to further reduce the resistance of the support plate 2 to rise and fall.

Please refer to fig. 2-5 again, the length of the pull rod 10 on the inner wall of the water tank 1 is equal to the height of the inner wall of the water tank 1, and a filter screen 14 is arranged on one side of the water outlet pipe 5 close to the inner wall of the water tank 1; in the present embodiment, the water outlet pipe 5 and the filter 14 are matched with each other, so that the impurities entering the water pipe 7 are further reduced to block the water pipe.

The utility model discloses a concrete operation as follows:

when the cooling device is used, cooling liquid is poured into the water tank 1, the hydraulic rod 3 is lifted, the supporting plate 2 is kept away from one end far away from the water tank 1 through the pull rod 10 at the same time until the whole supporting plate 2 is positioned above the liquid level in the water tank 1, then the die-casting metal to be cooled is stably placed on the supporting plate 2, then the hydraulic rod 3 is contracted to enable the supporting plate 2 to be close to one end close to the water tank 1 until the whole die-casting metal to be cooled is submerged in the cooling liquid, at the moment, through heat conduction, the temperature of the cooling liquid is lower than that of the die-casting metal to be cooled, so that the die-casting metal to be cooled transmits heat to the cooling liquid until the temperature of the cooling liquid is consistent, after the temperature of the die-casting metal to be cooled is transmitted to the cooling liquid, the temperature of the cooling liquid is raised, at the moment, if the temperature sensor 12 detects that the temperature of the cooling liquid is higher than a preset value, the signal is transmitted to a PLC (programmable logic controller) 11, a water circulating pump 6 and a semiconductor refrigerating sheet 9 are controlled to work through the PLC 11, the semiconductor refrigerating sheet 9 cools liquid flowing in a water service pipe 7, the cooled liquid is conveyed into a water tank 1 through a water inlet pipe 4 through the water circulating pump 6, the circulation is repeated in the above way, and the water circulating pump 6 and the semiconductor refrigerating sheet 9 are controlled to stop working through the PLC 11 until a temperature sensor 12 detects that the liquid in the water tank 1 is lower than or equal to a preset value, and the circulation is repeated in the above way.

The present invention has been described above with reference to the accompanying drawings, and it is obvious that the present invention is not limited by the above-mentioned manner, if the method and the technical solution of the present invention are adopted, the present invention can be directly applied to other occasions without substantial improvement, and the present invention is within the protection scope of the present invention.

Claims

1. A mold cooling monitoring system comprises a water tank (1) and is characterized in that a supporting plate (2) is arranged on the inner wall of the water tank (1) in a sliding mode, hydraulic rods (3) are symmetrically arranged on two sides of the outer wall of the water tank (1), the upper ends of the hydraulic rods (3) are symmetrically arranged and connected with the supporting plate (2) through pull rods (10) symmetrically arranged, a water inlet pipe (4) and a water outlet pipe (5) symmetrically penetrate through the outer wall of the water tank (1), a water circulating pump (6) is arranged at one end, far away from the water tank (1), of the water outlet pipe (5), the water circulating pump (6) is connected with one end, far away from the water tank (1), of the water inlet pipe (4) through a water service pipe (7), a sleeve (8) is arranged on the outer wall of the water service pipe (7), a semiconductor refrigerating sheet (9) is arranged on the sleeve (8) in a penetrating mode, and a PLC (11) is arranged on the outer wall of the water tank (1), temperature sensor (12) are equipped with in basin (1) inner wall bottom, link to each other through the wire between PLC controller (11), water circulating pump (6), semiconductor refrigeration piece (9) and temperature sensor (12).

2. The mold cooling monitoring system according to claim 1, wherein the end of the semiconductor cooling plate (9) near the water pipe (7) is a cold end.

3. A mould cooling monitoring system according to claim 1, characterized in that the outer wall of the temperature sensor (12) is wrapped with a water-proof layer (13).

4. A mould cooling monitoring system according to claim 1, characterized in that a plurality of water leakage holes (2 a) are evenly distributed on the supporting plate (2).

5. A mould cooling monitoring system according to claim 1, characterized in that the length of the tie rod (10) in the inner wall of the basin (1) is equal to the height of the inner wall of the basin (1).

6. The mold cooling monitoring system according to claim 1, wherein a filter screen (14) is provided on a side of the water outlet pipe (5) close to the inner wall of the water tank (1).