CN213826090U

CN213826090U - Cleaning device for basket-free wafer multi-cleaning tank

Info

Publication number: CN213826090U
Application number: CN202022272267.XU
Authority: CN
Inventors: 钱诚; 李刚; 童建
Original assignee: Jiangsu Asia Electronics Technology Co Ltd
Current assignee: Jiangsu Asia Electronics Technology Co Ltd
Priority date: 2020-10-13
Filing date: 2020-10-13
Publication date: 2021-07-30
Anticipated expiration: 2030-10-13

Abstract

The utility model provides a many washing tanks belt cleaning device of basket-free wafer, because the wafer directly is put into on the wafer support frame, by the fixed wafer of wafer support frame direct support, the wafer box has been saved, therefore, on the first spray tube nozzle can spun washing liquid or clear water spray the brilliant periphery with the form of parabola, thereby the rivers are cut by the wafer and flow to the front and back surface of wafer and directly wash the wafer, the wafer is through first washing tank simultaneously, the washing of the three washing tank of second washing tank and third washing tank, the cleaning performance has been improved.

Description

Cleaning device for basket-free wafer multi-cleaning tank

Technical Field

The application belongs to the technical field of wafer cleaning equipment, and particularly relates to a cleaning device for a basket-free wafer multi-cleaning tank.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and the wafer manufacturing process is complicated and has many steps, and different chemical materials are used in different steps, and impurities such as chemicals, particles, metals, and the like usually remain on the surface of the wafer, so that the wafer needs to be cleaned. When cleaning a wafer, the wafer is usually put into a wafer cleaning apparatus together with a wafer cassette for cleaning.

Due to the blockage of the wafer box, when the wafer box is sprayed, part of water flow is inevitably blocked by the wafer box, so that the cleaning effect is influenced.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is: in order to solve the defects in the prior art, the cleaning device for the basket-free wafer multi-cleaning tank is provided.

The utility model provides a technical scheme that its technical problem adopted is:

a cleaning device for a basket-free wafer multi-cleaning tank comprises:

a horizontal conveying sliding table;

the basket-free wafer grabbing mechanical arm is used for grabbing the wafer and driving the wafer to lift under the action of the lifting mechanism;

the first cleaning tank, the second cleaning tank and the third cleaning tank are horizontally arranged in parallel;

the basket-free wafer grabbing manipulator is arranged on the horizontal conveying sliding table and can reach the upper part of any cleaning tank;

the first cleaning tank, the second cleaning tank and the third cleaning tank are all provided with tank bodies capable of containing wafers, a first spray pipe is arranged at the top of each tank body, and a wafer support frame is arranged at the bottom inside each tank body;

the nozzle on the first spray pipe is arranged obliquely upwards, and the cleaning liquid or the clear water which can be sprayed out is sprayed onto the periphery of the wafer in a parabolic mode, and the water flow is cut by the wafer and flows to the front surface and the rear surface of the wafer.

Preferably, the utility model discloses a no basket wafer multi-cleaning tank belt cleaning device, the nozzle corresponds 1-3 wafers on the first spray tube to make single nozzle spun washing liquid or clear water can be cut by the wafer of corresponding quantity.

Preferably, the utility model discloses a many washing tanks belt cleaning device of basket-free wafer, the bottom of first washing tank still is provided with the second spray tube, the nozzle on the second spray tube also sets up to the slant to can spun washing liquid or clear water spray to brilliant periphery with the form of parabola on.

Preferably, the utility model discloses a no basket wafer multi-cleaning groove belt cleaning device, first spray tube can rotate to make washing liquid or clear water in the wafer circumference ascending contact point be the region between 60 jiaos at the topmost diameter of wafer to with the wafer, the second spray tube also can rotate, so that washing liquid or clear water be the region between 60 jiaos at the wafer most lateral end to the diameter with the level at the wafer circumference ascending contact point.

Preferably, the utility model discloses a no basket wafer many washing tanks belt cleaning device, first washing tank is the spray rinsing groove, and the second washing tank is the leaching tank, and the third washing tank adds the leaching tank for spray rinsing

Preferably, the utility model discloses a no basket wafer many washing tanks belt cleaning device has the wafer support groove of in bank setting from the wafer support frame, and the wafer supports the groove and snatchs the broach one-to-one that is used for fixed wafer on the frame.

Preferably, the cleaning device for the basket-free wafer multi-cleaning tank of the utility model,

the wafer support frame is arranged on the lifting device so that the wafer in the cleaning tank can be lifted.

Preferably, the utility model discloses a many washing tanks belt cleaning device of basket-free wafer, first spray tube and second spray tube are fixed, and the lift through the wafer in the washing tank realizes that first spray tube spun washing liquid or clear water are in the wafer topmost to be the region between 60 jiaos with the diameter of wafer topmost to the contact point of wafer circumference to make second spray tube spun washing liquid or clear water be the region between 60 jiaos at the wafer topmost to be with the horizontally diameter at the wafer ascending contact point of wafer circumference.

The utility model has the advantages that:

Drawings

The technical solution of the present application is further explained below with reference to the drawings and the embodiments.

FIG. 1 is a schematic structural diagram of a cleaning apparatus for a basket-less wafer multi-cleaning tank according to an embodiment of the present application;

fig. 2 and fig. 3 are schematic structural views of the first cleaning tank according to the embodiment of the present application;

FIG. 4 is a schematic diagram of a nozzle spraying position to a wafer according to an embodiment of the present invention;

FIG. 5 is a schematic view of a basket-less wafer pick robot according to an embodiment of the present application;

FIG. 6 is a schematic view of another orientation configuration of a basket-less wafer pick robot in accordance with an embodiment of the present application;

FIG. 7 is a schematic structural diagram of a gripper frame according to an embodiment of the present disclosure;

fig. 8 is a front view of a gripper frame according to an embodiment of the present application.

The reference numbers in the figures are:

1, horizontally conveying a sliding table;

2, a lifting mechanism;

3, a basket-free wafer grabbing manipulator;

4 a first cleaning tank;

5 a second cleaning tank;

6 a third washing tank;

9, a wafer;

31, mounting a frame;

32 a rotating shaft;

33 a mounting seat;

34 a gripping rack;

35 a pull line;

36 tensioning the spring;

37 a power element;

51 a trough body;

52 a second nozzle;

53 a first nozzle;

54 a wafer support frame;

331 an adjusting block;

341 a rectangular frame;

342 bottom edge;

351, a rotating wheel;

3421 upper and lower edges;

3422 lower base edge;

3423 comb gap.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be considered limiting of the scope of the present application. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the invention, unless otherwise specified, "a plurality" means two or more.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art through specific situations.

The technical solutions of the present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Example 1

The present embodiment provides a cleaning apparatus for a basket-less wafer multi-cleaning tank, as shown in fig. 1, comprising:

a horizontal conveying sliding table 1;

the basket-free wafer grabbing mechanical arm 3 is used for grabbing the wafer and driving the wafer 9 to ascend and descend under the action of the lifting mechanism 2;

a first cleaning tank 4, a second cleaning tank 5 and a third cleaning tank 6 which are horizontally arranged in parallel;

the basket-free wafer grabbing manipulator 3 is arranged on the horizontal conveying sliding table 1 and can reach the upper part of any one of the first cleaning groove 4, the second cleaning groove 5 and the third cleaning groove 6;

the first cleaning tank 4, the second cleaning tank 5 and the third cleaning tank 6 are all provided with tank bodies 51 capable of containing wafers, a first spray pipe 53 is arranged at the top of each tank body 51, and a wafer support frame 54 is arranged at the bottom of each tank body 51;

the cleaning liquid or clear water sprayed from the nozzle of the first nozzle 53 is sprayed onto the periphery of the wafer in a parabolic manner (the sprayed cleaning liquid or clear water is a water column rather than a water mist), and the water flow is cut by the wafer and flows to the front and rear surfaces of the wafer.

In this embodiment, since the wafer is directly placed on the wafer support 54 and the wafer support 54 directly supports and fixes the wafer, a wafer box is omitted, and therefore, the cleaning solution or the clean water which can be sprayed from the nozzle of the first spray pipe 53 is sprayed onto the wafer circumferential surface in a parabolic manner, and the water flow is cut by the wafer and flows to the front and rear surfaces of the wafer to directly clean the wafer, thereby ensuring the cleaning effect.

One nozzle may correspond to one or more wafers, and typically, one nozzle may correspond to 2-3 wafers due to the precision of wafer placement.

The bottom of the first cleaning tank 4 is also provided with a second spray pipe 52.

As shown in fig. 4, which shows a state where only one side of the nozzles ejects the cleaning solution or the rinsing water, the first nozzles 53 are respectively disposed at both sides of the top of the wafer, and the second nozzles 52 are respectively disposed at both sides of the bottom of the wafer. The first nozzle 53 is rotatable so that a contact point of the cleaning liquid or the clean water in the wafer circumferential direction is in a region between the uppermost end of the wafer and a 60 ° angle with respect to the diameter of the uppermost end of the wafer (i.e., α is 60 ° in fig. 5), and the second nozzle 52 is also rotatable so that a contact point of the cleaning liquid or the clean water in the wafer circumferential direction is in a region between the outermost end (leftmost or rightmost end) of the wafer and a 60 ° angle with respect to the horizontal diameter (β is 60 ° in fig. 5).

The cleaning liquid or the clean water sprayed out of the first spray pipe 53 at the top is sprayed onto the wafer from the top and can flow along the front and back surfaces of the wafer, the contact point of the cleaning liquid or the clean water in the circumferential direction of the wafer is located in the area from the topmost end of the wafer to the topmost end of the wafer, and the diameter of the contact point of the cleaning liquid or the clean water in the circumferential direction of the wafer is 60 degrees, so that the sprayed cleaning liquid or the clean water can flow to the upper half part and the lower half part of the front and back surfaces of the wafer, the contact point of the cleaning liquid or the clean water in the circumferential direction of the wafer is located in the area from the topmost end of the wafer to the horizontal diameter, the area to which the cleaning liquid or the clean water sprayed out of the first spray pipe 53 cannot flow is covered, and the whole front and back surfaces of the wafer can be sprayed.

Of course, the first nozzle 53 and the second nozzle 52 are fixed and do not rotate, and the lifting of the wafer in the cleaning tank realizes that the contact point of the cleaning liquid or the clean water sprayed by the first nozzle 53 in the circumferential direction of the wafer is in the region from the topmost end of the wafer to the diameter at the topmost end of the wafer, so that the contact point of the cleaning liquid or the clean water sprayed by the second nozzle 52 in the circumferential direction of the wafer is in the region from the topmost end of the wafer to the diameter at the horizontal angle of 60 degrees. Since the direct contact points are the same, the cleaning effect is the same.

The basket-less wafer grabbing mechanical arm 3 can place the wafer on the wafer support frame 54 or take the wafer away from the wafer support frame 54 when being lifted.

The slave wafer support 54 has wafer support grooves arranged in rows corresponding to the comb teeth of the gripper 34.

The structure of the basket-free wafer grabbing manipulator 3 is as follows:

a mounting bracket 31;

two rotating shafts 32 arranged in parallel, one end of each rotating shaft 32 being arranged on the mounting frame 31 and being driven by a power member 37 (the power member 37 is usually a motor) to move in opposite directions of rotation (the rotating shafts 32 are fixed on the mounting frame 31 through bearings);

as shown in fig. 5, the grabbing frame 34 is respectively disposed at the other end of the rotating shaft 32, and includes a rectangular frame 341, a bottom side 342 of the rectangular frame 341 is in a comb shape, the bottom side 342 of the comb shape includes an upper bottom side 3421 and a lower bottom side 3422, a bottom surface of the comb gap of the upper bottom side 3421 is a straight line, and a bottom surface of the comb gap 3423 of the lower bottom side 3422 is an arc shape (i.e., a shape of the comb gap after the bottom side 342 of the comb shape is cut open). The space between the upper bottom edge 3421 and the lower bottom edge 3422 is hollow.

As shown in fig. 6 and 7, the grabbing frame 34 is vertically downward, which is an initial state, when the power element 37 drives the rotating shaft 32 to rotate the two grabbing frames 34 in opposite directions, the lower portions of the two grabbing frames 34 are away from each other, the wafer can be placed between the two grabbing frames 34, the comb-shaped bottom edge 342 grabs and fixes the wafer 9, the wafer 9 can be directly placed in the comb gap, and 4 supporting positions are reached through the upper bottom edge 3421 and the lower bottom edge 3422 of the two grabbing frames 34, so as to form a stable fixing.

It should be noted that a dust box is usually provided outside the mounting frame 31, and one end of the rotating shaft 32, the bearing, the power member 37, and the like are covered by the dust box.

The drive of the power member 37 to the rotating shaft 32 may be driven by various existing driving means, such as a gear drive.

Furthermore, the top of the grabbing frame 34 is provided with two round rods, and the two round rods are fixed with the mounting seat 33 on the rotating shaft 32, so that a good fixing effect can be achieved.

The two rotating shafts 32 are further provided with tensioning springs 36, the tensioning springs 36 apply tension to return the rotating angles of the two rotating shafts 32 to the original positions, and when the rotating angles of the two rotating shafts 32 return to the original positions, the grabbing brackets 34 respectively positioned on the two rotating shafts 32 are parallel to each other.

The rotation shaft 32 is provided on the grasping frame 34 through an adjusting block 331, and the position of the grasping frame 34 is adjusted by the adjusting block 331.

The bottom side 342 is made of PP material, and the other material of the grabbing frame 34 is stainless steel material. The PP material (polypropylene) is lightweight and durable while preventing the wafer 9 from being worn.

The periphery of the mounting frame 31 is provided with the tensioned stay wire 35 (the position and the extending direction of the stay wire 35 are changed through the rotating wheels 351), one end of the stay wire 35 is fixed, the other end of the stay wire 35 is connected with the tension sensor (not shown in the figure), and once a part of the stay wire 35 is collided with the stay wire 35, the tension sensor senses the increase of tension, so that an alarm is sent out or the basket-free wafer grabbing manipulator stops acting.

The opening of the comb gap is larger than the bottom of the comb gap, so that the wafer 9 can be more easily placed in the comb gap. The tops of the comb teeth are generally arranged in a parabolic cylinder shape.

The width of the comb gap is set according to the width of the wafer 9.

In light of the foregoing description of the preferred embodiments according to the present application, it is to be understood that various changes and modifications may be made without departing from the spirit and scope of the invention. The technical scope of the present application is not limited to the contents of the specification, and must be determined according to the scope of the claims.

Claims

1. A cleaning device for a basket-free wafer multi-cleaning tank is characterized by comprising:

a horizontal conveying sliding table (1);

the basket-free wafer grabbing mechanical arm (3) is used for grabbing the wafer and driving the wafer (9) to lift under the action of the lifting mechanism (2);

a first cleaning tank (4), a second cleaning tank (5) and a third cleaning tank (6) which are horizontally arranged in parallel;

the basket-free wafer grabbing manipulator (3) is arranged on the horizontal conveying sliding table (1) and can reach the upper part of any cleaning tank;

the first cleaning tank (4), the second cleaning tank (5) and the third cleaning tank (6) are respectively provided with a tank body (51) capable of containing wafers, a first spray pipe (53) is arranged at the top of the tank body (51), and a wafer support frame (54) is arranged at the bottom inside the tank body (51);

the nozzle on the first spray pipe (53) is arranged obliquely upwards, and the cleaning liquid or clear water which can be sprayed out is sprayed onto the periphery of the wafer in a parabolic mode, and water flow is cut by the wafer and flows to the front surface and the rear surface of the wafer.

2. The cleaning apparatus for the basket-less wafer multi-cleaning tank as recited in claim 1, wherein the nozzles of the first nozzle (53) correspond to 1-3 wafers, so that the cleaning solution or the clean water sprayed from a single nozzle can be cut by a corresponding number of wafers.

3. The cleaning device for the basket-free wafer multi-cleaning tank as recited in claim 1, wherein the bottom of the first cleaning tank (4) is further provided with a second spray pipe (52), a nozzle on the second spray pipe (52) is also arranged obliquely upwards, and the cleaning liquid or the clear water which can be sprayed out is sprayed onto the surface of the wafer in a parabolic manner.

4. The apparatus as claimed in claim 3, wherein the first nozzle (53) and the second nozzle (52) are rotatable.

5. The apparatus for cleaning a basket-less wafer through multiple cleaning tanks according to claim 1, wherein the first cleaning tank (4) is a spray tank, the second cleaning tank (5) is a rinse tank, and the third cleaning tank (6) is a spray tank and a rinse tank.

6. The apparatus for cleaning a basket-less wafer cleaning tank as claimed in claim 1, wherein the wafer support rack (54) has wafer support slots arranged in rows, and the wafer support slots correspond to comb teeth on the grasping rack (34) for fixing wafers one by one.

7. The apparatus as claimed in claim 1, wherein the cleaning tank is a multi-tank cleaning tank,

the wafer support frame (54) is arranged on the lifting device so as to enable the wafer in the cleaning tank to be lifted.