CN213818330U - High heat dissipation single face circuit board - Google Patents
High heat dissipation single face circuit board Download PDFInfo
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- CN213818330U CN213818330U CN202022594891.1U CN202022594891U CN213818330U CN 213818330 U CN213818330 U CN 213818330U CN 202022594891 U CN202022594891 U CN 202022594891U CN 213818330 U CN213818330 U CN 213818330U
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- shell
- circuit board
- heat dissipation
- high heat
- sided circuit
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Abstract
The utility model discloses a high heat dissipation single-sided circuit board, which comprises a shell and a board body, wherein the board body is detachably connected with the shell; the shell comprises a shell and a supporting shell, the supporting shell is detachably connected with the upper part of the shell, a first groove is formed between the supporting shell and the shell, and the plate body is arranged on the first groove; be equipped with the radiator in the shell, the support shell array is equipped with the louvre, through the setting of radiator, has solved the circuit board and has dispelled the heat at the operation in-process too big unstable problem that leads to of operation, has realized that the circuit board operates stably, effectively ensures quality, the increase of service life of circuit board, improves circuit board operation yield, improves work efficiency.
Description
Technical Field
The utility model belongs to the technical field of the circuit board is made, concretely relates to high heat dissipation single face circuit board.
Background
At present, in the circuit board operation process, the circuit board gives off the heat easily to lead to the circuit board operation unstable, reduce the yield, the substrate layer separates even appears, the board phenomenon of warping, greatly reduced work efficiency.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a high heat dissipation single face circuit board, through the setting of radiator, has solved the circuit board and dispel the heat at the operation in-process too big problem that leads to the operation unstable, has realized that the circuit board operates stably, effectively ensures quality, the increase of service life of circuit board, improves circuit board operation yield, improves work efficiency.
The technical scheme provided by the embodiment of the application is as follows:
a high-heat-dissipation single-sided circuit board comprises a shell and a board body, wherein the board body is detachably connected with the shell; the shell comprises a shell and a supporting shell, the supporting shell is detachably connected with the upper part of the shell, a first groove is formed between the supporting shell and the shell, and the plate body is arranged on the first groove; the utility model discloses a solar panel, including the shell, the shell is equipped with the radiator, support the shell array and be equipped with the louvre, the plate body includes substrate layer, copper layer, solder mask, the copper layer is located the substrate layer with between the solder mask, the four sides array of plate body is equipped with first connecting hole, the shell upper end is equipped with the opening, open-ended four sides are equipped with the chimb, the chimb corresponds first connecting hole is equipped with the second connecting hole, the four sides of supporting the shell correspond first connecting hole is equipped with the third connecting hole.
The utility model discloses in, stack the chimb at the shell in proper order with the plate body and support shell, pass third connecting hole, second connecting hole, first connecting hole after-fixing in proper order through the bolt, plate body and radiator start-up operation simultaneously, and support the shell array and be equipped with the louvre, the radiator will blow to the louvre, will blow to the circuit board in the operation, effectively reduce the heat that the circuit board operation distributed out, guarantee circuit board operation is stable, increase of service life improves work efficiency.
Through the detachable connection of the plate body, the supporting shell and the convex edge, the quick maintenance and the overhaul are facilitated, the use is simple, and the operation space for installing the radiator is large.
Furthermore, the depth of the first groove is equal to the thickness of the plate body, the horizontal cross-sectional area of the plate body is equal to the horizontal cross-sectional area of the supporting shell, and through the arrangement, the structure distribution is reasonable, and the structure utilization rate is effectively improved.
Further, the bottom of shell is equipped with the polyethylene polypropylene fibre waterproof layer, through this setting, improves the tensile strength of shell, improves impervious ability, effectively promotes the protection of shell to the plate body, provides more excellent operational environment for the plate body.
Further, the bilateral symmetry of shell is equipped with the second recess, and through this setting, the second recess is placed to staff's accessible hand, makes things convenient for the staff to carry and takes, and easy operation is convenient.
Further, second recess surface is equipped with the silica gel layer, through this setting, improves the comfort level that the staff took, and the practicality is strong.
The utility model has the advantages that:
through the arrangement of the radiator, the problem that the circuit board is unstable in operation due to overlarge heat dissipation in the operation process is solved, the circuit board is stable in operation, the quality of the circuit board is effectively guaranteed, the service life of the circuit board is prolonged, the operation yield of the circuit board is improved, and the working efficiency is improved.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural diagram of the middle housing of the present invention.
The labels in the figure are: the heat sink comprises a shell 1, a shell 11, a supporting shell 12, third connecting holes 122, heat dissipation holes 121, a first groove 13, a heat sink 14, a flange 15, second connecting holes 151 and a second groove 16; the board body 2, the substrate layer 21, the copper layer 22, the solder resist layer 23, and the first connection hole 24.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
To facilitate understanding of the present invention for those skilled in the art, the present invention will be described in further detail with reference to the following detailed description and accompanying drawings.
A high heat dissipation single-sided circuit board comprises a shell 1 and a board body 2, wherein the board body 2 is detachably connected with the shell 1; the shell comprises a shell 11 and a supporting shell 12, the supporting shell 12 is detachably connected with the upper part of the shell 11, the supporting shell 12 and the shell 11 form a first groove 13, and the plate body 2 is arranged on the first groove 13; be equipped with radiator 14 in the shell 11, support 12 arrays of shell are equipped with louvre 121, plate body 2 includes substrate layer 21, copper layer 22, solder mask 23, copper layer 22 is located substrate layer 21 with between the solder mask 23, the four sides array of plate body 2 is equipped with first connecting hole 24, the shell 11 upper end is equipped with the opening, open-ended four sides are equipped with chimb 15, chimb 15 corresponds first connecting hole 24 is equipped with second connecting hole 151, the four sides of support 12 correspond first connecting hole 24 is equipped with third connecting hole 122.
The utility model discloses in, stack plate body 2 and support shell 12 in proper order in chimb 15 of shell 11, pass third connecting hole 122 through the bolt in proper order, second connecting hole 151, 24 after-fixing of first connecting hole, plate body 2 and the operation of 14 simultaneous start-ups of radiator, and support shell 12 array and be equipped with louvre 121, radiator 14 blows to louvre 121, blow to the circuit board in the operation with wind, effectively reduce the heat that the circuit board operation distributed out, the guarantee circuit board operation is stable, and long service life improves work efficiency.
Through the detachable connection of the plate body 2, the supporting shell 12 and the convex edge 15, the quick maintenance and the overhaul are facilitated, the use is simple, and the operation space for installing the radiator 14 is large.
Further, the depth of the first groove 13 is the same as the thickness of the plate body 2, the horizontal cross-sectional area of the plate body 2 is the same as the horizontal cross-sectional area of the support shell 12, and through the arrangement, the structure distribution is reasonable, and the structure utilization rate is effectively improved.
Further, the bottom of shell 11 is equipped with the polyethylene polypropylene fibre waterproof layer, through this setting, improves shell 11's tensile strength, improves impervious ability, effectively promotes shell 11 to plate body 2's protection, provides more excellent operational environment for the plate body.
Further, shell 11's bilateral symmetry is equipped with second recess 16, and through this setting, second recess 16 is placed to staff's accessible hand, makes things convenient for the staff to carry and takes, and easy operation is convenient.
Further, the 16 surfaces of second recess are equipped with the silica gel layer, through this setting, improve the comfort level that the staff took, and the practicality is strong.
The utility model has the advantages that:
through the arrangement of the radiator, the problem that the circuit board is unstable in operation due to overlarge heat dissipation in the operation process is solved, the circuit board is stable in operation, the quality of the circuit board is effectively guaranteed, the service life of the circuit board is prolonged, the operation yield of the circuit board is improved, and the working efficiency is improved.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art.
Claims (10)
1. A high heat dissipation single-sided circuit board is characterized by comprising a shell and a board body, wherein the board body is detachably connected with the shell; the shell comprises a shell and a supporting shell, the supporting shell is detachably connected with the upper part of the shell, a first groove is formed between the supporting shell and the shell, and the plate body is arranged on the first groove; the heat radiator is arranged in the shell, and the support shell array is provided with heat dissipation holes.
2. The high heat dissipation single-sided circuit board of claim 1, wherein the board body comprises a substrate layer, a copper layer and a solder resist layer, and the copper layer is disposed between the substrate layer and the solder resist layer.
3. The high heat dissipation single-sided circuit board of claim 1, wherein the depth of the first groove is the same as the thickness of the board body.
4. The high heat dissipation single-sided circuit board of claim 1, wherein the four-sided array of the board body is provided with first connection holes.
5. The high heat dissipation single-sided circuit board of claim 1, wherein the horizontal cross-sectional area of the board body is the same as the horizontal cross-sectional area of the supporting case.
6. The high heat dissipation single-sided circuit board of claim 4, wherein the housing has an opening at an upper end thereof, four sides of the opening are provided with flanges, and the flanges are provided with second connection holes corresponding to the first connection holes.
7. The high heat dissipation single-sided circuit board of claim 1, wherein the bottom of the housing is provided with a polyethylene polypropylene waterproof layer.
8. The high heat dissipation single-sided circuit board of claim 1, wherein the housing is symmetrically provided with second grooves at two sides.
9. The high heat dissipation single-sided circuit board of claim 4, wherein the support case is provided with third connection holes on four sides corresponding to the first connection holes.
10. The high heat dissipation single-sided circuit board of claim 8, wherein a silicone layer is disposed on the surface of the second groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022594891.1U CN213818330U (en) | 2020-11-11 | 2020-11-11 | High heat dissipation single face circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022594891.1U CN213818330U (en) | 2020-11-11 | 2020-11-11 | High heat dissipation single face circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213818330U true CN213818330U (en) | 2021-07-27 |
Family
ID=76932039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022594891.1U Active CN213818330U (en) | 2020-11-11 | 2020-11-11 | High heat dissipation single face circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213818330U (en) |
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2020
- 2020-11-11 CN CN202022594891.1U patent/CN213818330U/en active Active
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