CN213815557U - Built-in high-precision dynamic instrument for Internet of things device - Google Patents
Built-in high-precision dynamic instrument for Internet of things device Download PDFInfo
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- CN213815557U CN213815557U CN202022703370.5U CN202022703370U CN213815557U CN 213815557 U CN213815557 U CN 213815557U CN 202022703370 U CN202022703370 U CN 202022703370U CN 213815557 U CN213815557 U CN 213815557U
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Abstract
The utility model discloses a built-in high-precision dynamic instrument for an internet of things device, which comprises a connecting shell, an installing mechanism and a buffering mechanism, wherein an instrument body is installed in an inner cavity of the connecting shell, the installing mechanism is installed on both sides of the connecting shell and comprises an L-shaped installing plate, an installing groove and a first fixing screw, the installing groove is formed in the bottom of the upper half part of the installing plate, a screw hole communicated with the installing groove is formed in one side of the installing plate, and the first fixing screw is screwed in the screw hole; the buffer mechanism comprises a connecting plate, a second fixing screw and a spring, the connecting plate is integrally formed at the bottom of one side of the mounting plate, a connecting hole is formed in the middle of the connecting plate, the second fixing screw is movably inserted in the connecting hole, and a connecting ring is movably sleeved on the side wall of the second fixing screw. This built-in high accuracy developments instrument for thing networking device, the inside of installing at thing networking device that can be comparatively stable, and have certain shock-absorbing capacity.
Description
Technical Field
The utility model belongs to the technical field of built-in instrument, concretely relates to built-in thing networking high accuracy dynamic instrument for device.
Background
As a product of a new technology, the Internet of things device can improve the intelligent and automatic level of the society, and realizes the functions which cannot be realized or are difficult to realize originally, and in order to ensure the normal use of the Internet of things device, a built-in high-precision dynamic instrument needs to be installed on the Internet of things device. In order to promote the long-time use of instrument, just need the inside at the thing networking device that the instrument can be comparatively stable to install, and have certain shock-absorbing capacity.
Therefore, in view of the current situation, it is urgently needed to design and produce a high-precision dynamic instrument for a built-in internet of things device so as to meet the requirement of practical use.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a built-in thing networking high accuracy dynamic instrument for device to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a high-precision dynamic instrument for a built-in Internet of things device comprises a connecting shell, an installing mechanism and a buffering mechanism, wherein an instrument body is installed in an inner cavity of the connecting shell, the installing mechanism is installed on two sides of the connecting shell and comprises an L-shaped installing plate, an installing groove and a first fixing screw, the installing groove is formed in the bottom of the upper half part of the installing plate, a screw hole communicated with the installing groove is formed in one side of the installing plate, and the first fixing screw is screwed in the screw hole;
the buffer mechanism comprises a connecting plate, a second fixing screw and a spring, the connecting plate is integrally formed at the bottom of one side of the mounting plate, a connecting hole is formed in the middle of the connecting plate, the second fixing screw is movably inserted into the connecting hole, a connecting ring is movably sleeved on the side wall of the second fixing screw and supported at the top of the connecting plate, and the spring is connected between the top of the connecting ring and the head of the second fixing screw;
the instrument comprises an instrument body and is characterized in that a heat dissipation fan is installed below the instrument body, and a plurality of heat dissipation holes are uniformly formed in the bottom of a connecting shell.
Preferably, a spongy cushion is arranged between the heat dissipation fan and the bottom of the inner cavity of the connecting shell.
Preferably, an injection molding integrated forming structure is arranged between the connecting plate and the mounting plate.
Preferably, one side of the mounting plate is provided with a groove communicated with the screw hole, and the head of the first fixing screw is positioned in the groove.
Preferably, a gasket is supported between the head of the first fixing screw and the inner wall of the groove, and the gasket is movably sleeved on the side wall of the first fixing screw.
Preferably, the top of the mounting plate and the top of the connection housing are flush.
The utility model discloses a technological effect and advantage: according to the high-precision dynamic instrument for the built-in Internet of things device, the device is clamped on a plate-shaped structure in the Internet of things device through a mounting groove, then a fixing screw is screwed, so that the fixing screw can abut against the plate-shaped structure, the device can be stably mounted in the Internet of things device by matching with the connection of a fixing screw II and the Internet of things device, if the device is impacted, the impact force drives a connecting plate to deform, so that the connecting ring is slightly jacked up, and the spring buffers the connecting ring, so that the high-precision dynamic instrument has certain buffering performance; this built-in high accuracy developments instrument for thing networking device, the inside of installing at thing networking device that can be comparatively stable, and have certain shock-absorbing capacity.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a cross-sectional view of the present invention;
fig. 3 is an enlarged view of a portion a in fig. 2 according to the present invention.
In the figure: the device comprises a connecting shell 1, an instrument body 2, an installation mechanism 3, a mounting plate 4, a mounting groove 5, a slot 6, a fixing screw I7, a buffering mechanism 8, a connecting plate 9, a fixing screw II 10, a spring 11, a connecting ring 12, a heat dissipation fan 13, a spongy cushion 14, heat dissipation holes 15 and a gasket 16.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Unless defined otherwise, all references to up, down, left, right, front, back, inner and outer directions herein are to be interpreted as referring to up, down, left, right, front, back, inner and outer directions in the drawings to which the invention is applied, and all references are hereby incorporated herein by reference.
The utility model provides a built-in high accuracy dynamic instrument for internet of things device as shown in fig. 1-3, including connecting casing 1, installation mechanism 3 and buffer gear 8, the inner chamber of connecting casing 1 is installed with instrument body 2, installation mechanism 3 is installed on both sides of connecting casing 1, installation mechanism 3 includes L-shaped mounting panel 4, mounting groove 5 and fixed screw one 7, mounting groove 5 is opened on the bottom of the upper half of mounting panel 4, one side of mounting panel 4 is opened with the screw hole that communicates with mounting groove 5, screw threaded connection has fixed screw one 7 in the screw hole;
the buffer mechanism 8 comprises a connecting plate 9, a second fixing screw 10 and a spring 11, the connecting plate 9 is integrally formed at the bottom of one side of the mounting plate 4, a connecting hole is formed in the middle of the connecting plate 9, the second fixing screw 10 is movably inserted into the connecting hole, a connecting ring 12 is movably sleeved on the side wall of the second fixing screw 10, the connecting ring 12 is supported at the top of the connecting plate 9, and the spring 11 is connected between the top of the connecting ring 12 and the head of the second fixing screw 10;
the instrument body 2 is provided with a heat dissipation fan 13 below, and a plurality of heat dissipation holes 15 are uniformly formed in the bottom of the connecting shell 1.
Specifically, a spongy cushion 14 is arranged between the heat dissipation fan 13 and the bottom of the inner cavity of the connecting shell 1, so that the connecting shell 1 is prevented from being affected with damp.
Specifically, an injection molding integrated structure is arranged between the connecting plate 9 and the mounting plate 4, and the structural strength is high.
Specifically, one side of the mounting plate 4 is provided with a slot 6 communicated with the screw hole, and the head of the first fixing screw 7 is positioned in the slot 6.
Specifically, a gasket 16 is supported between the head of the first fixing screw 7 and the inner wall of the slot 6, and the gasket 16 is movably sleeved on the side wall of the first fixing screw 7 to prevent the first fixing screw 7 from being screwed too tightly.
Specifically, the top of the mounting plate 4 is flush with the top of the connecting shell 1, so that the integration is stronger.
The theory of operation, this built-in high accuracy dynamic instrument for thing networking device, with the device through mounting groove 5 block on the inside platelike structure of thing networking device, then screw fixed screw 7 and can support this platelike structure, again with fixed screw two 10 and thing networking device spiro union connection, can ensure that the device can be stable install in the inside of thing networking device, if the device receives the impact force, thereby the impact force drives connecting plate 9 deformation and slightly jacks up go-between 12, spring 11 cushions go-between 12, consequently, certain shock-absorbing capacity has, cooling fan 13 is connected with external power supply, cooperation louvre 15 can provide certain heat dissipation for instrument body 2.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (6)
1. The utility model provides a built-in thing networking high accuracy developments instrument for device, includes connecting casing (1), installation mechanism (3) and buffer gear (8), its characterized in that: an instrument body (2) is installed in an inner cavity of the connecting shell (1), installation mechanisms (3) are installed on two sides of the connecting shell (1), each installation mechanism (3) comprises an L-shaped installation plate (4), an installation groove (5) and a first fixing screw (7), the installation groove (5) is formed in the bottom of the upper half portion of the installation plate (4), a screw hole communicated with the installation groove (5) is formed in one side of the installation plate (4), and the first fixing screw (7) is screwed in the screw hole;
the buffer mechanism (8) comprises a connecting plate (9), a second fixing screw (10) and a spring (11), the connecting plate (9) is integrally formed at the bottom of one side of the mounting plate (4), a connecting hole is formed in the middle of the connecting plate (9), the second fixing screw (10) is movably inserted into the connecting hole, a connecting ring (12) is movably sleeved on the side wall of the second fixing screw (10), the connecting ring (12) is supported at the top of the connecting plate (9), and the spring (11) is connected between the top of the connecting ring (12) and the head of the second fixing screw (10);
the instrument is characterized in that a heat dissipation fan (13) is installed below the instrument body (2), and a plurality of heat dissipation holes (15) are uniformly formed in the bottom of the connecting shell (1).
2. The high-precision dynamic instrument for the built-in internet of things device according to claim 1, wherein: a spongy cushion (14) is arranged between the heat dissipation fan (13) and the bottom of the inner cavity of the connecting shell (1).
3. The high-precision dynamic instrument for the built-in internet of things device according to claim 1, wherein: and an injection molding integrated forming structure is arranged between the connecting plate (9) and the mounting plate (4).
4. The high-precision dynamic instrument for the built-in internet of things device according to claim 1, wherein: and one side of the mounting plate (4) is provided with a slot (6) communicated with the screw hole, and the head of the first fixing screw (7) is positioned in the slot (6).
5. The high-precision dynamic instrument for the built-in internet of things device according to claim 1, wherein: a gasket (16) is supported between the head of the first fixing screw (7) and the inner wall of the slot (6), and the gasket (16) is movably sleeved on the side wall of the first fixing screw (7).
6. The high-precision dynamic instrument for the built-in internet of things device according to claim 1, wherein: the top of the mounting plate (4) is flush with the top of the connecting shell (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022703370.5U CN213815557U (en) | 2020-11-20 | 2020-11-20 | Built-in high-precision dynamic instrument for Internet of things device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022703370.5U CN213815557U (en) | 2020-11-20 | 2020-11-20 | Built-in high-precision dynamic instrument for Internet of things device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213815557U true CN213815557U (en) | 2021-07-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022703370.5U Active CN213815557U (en) | 2020-11-20 | 2020-11-20 | Built-in high-precision dynamic instrument for Internet of things device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213815557U (en) |
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2020
- 2020-11-20 CN CN202022703370.5U patent/CN213815557U/en active Active
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