CN213802164U - Winding device for semiconductor chip braiding machine - Google Patents
Winding device for semiconductor chip braiding machine Download PDFInfo
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- CN213802164U CN213802164U CN202022415470.8U CN202022415470U CN213802164U CN 213802164 U CN213802164 U CN 213802164U CN 202022415470 U CN202022415470 U CN 202022415470U CN 213802164 U CN213802164 U CN 213802164U
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Abstract
The utility model relates to a winding device for a semiconductor chip braider, which comprises a bracket, a material tray blanking mechanism and a material tray fixing mechanism; the charging tray blanking mechanism comprises a fixed plate and a rotating plate; the material tray fixing mechanism comprises a material frame and a fixing mechanism; the material frame is fixed on the lower part of one end of the support, which is close to the discharge end on the rotating plate, the bottom of the material frame is horizontally provided with a sliding door in a sliding manner, one end of the sliding door is provided with a second air cylinder, and a through hole is arranged right below the material frame on the supporting plate; the fixing mechanism comprises a fixed disc and a movable disc; the fixed disc is horizontally and rotatably arranged on one side of the inner wall of the material frame, and one end of the fixed disc is provided with a driving motor; and a third cylinder is arranged on one side of the material frame, which faces the fixed disc, and the movable disc rotates at the end part of a cylinder rod on the third cylinder. The utility model discloses a semiconductor chip is coiling mechanism for braider can carry out orderly to the material tray for the braider, and high-efficient secret material presss from both sides holds the operation, conveniently carries out the rolling to the chip area, and degree of automation is high.
Description
Technical Field
The utility model relates to an unwinding device, especially semiconductor chip taping machine coiling mechanism.
Background
At present, wafers are basic raw materials for manufacturing integrated circuits, and the preparation process of the wafers comprises several steps, firstly, the purification treatment of silicon element is carried out, the silicon element is purified to 99.999%, then the purified silicon is grown into silicon crystal rods, wherein, the polycrystalline silicon is melted and pulled out of the silicon crystal rods mainly through the processes of photomechanical production, polishing, slicing and the like, and finally, the silicon crystal rods are cut into thin wafers for packaging and taping.
When the winding device on the braiding machine in the prior art is used, a chip is inconvenient to place and install by using a material tray, and the material tray cannot be adjusted and fixed according to the requirements of a user, so that the braiding machine cannot be used conveniently.
In view of the above-described conventional techniques, it is desirable to provide a winding device for a semiconductor chip taping machine.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a winding device for a semiconductor chip braider, which comprises a bracket, a material tray blanking mechanism and a material tray fixing mechanism;
a support plate is horizontally and fixedly arranged at the lower part of the bracket;
the charging tray discharging mechanism comprises a fixed plate and a rotating plate; the fixing plate is arranged at the top of the bracket, the upper surface of the fixing plate is provided with a placing hole, and the placing hole penetrates through the upper surface and the lower surface of the fixing plate; one end of the lower surface of the fixed plate is provided with a hinged shaft; one end of the upper surface of one end of the rotating plate is provided with a hinged part, and the rotating plate is hinged with a hinged shaft on the fixed plate through a hinged shaft at the end part; the other end of the rotating plate is a discharge end; the two sides of the rotating plate are hinged with first cylinders, the bottoms of the first cylinders are hinged to the supporting plate, and the tops of telescopic rods on the first cylinders are hinged to the side face of the rotating plate;
the material tray fixing mechanism comprises a material frame and a fixing mechanism; the material frame is fixed on the lower portion of one end, close to the discharge end on the rotating plate, of the support, a sliding door is horizontally arranged at the bottom of the material frame in a sliding mode, a second air cylinder is arranged at one end of the sliding door, the sliding door is driven by the second air cylinder to move, and a through hole is formed in the support plate and located right below the material frame; the fixing mechanism comprises a fixed disc and a movable disc; the fixed disc is horizontally and rotatably arranged on one side of the inner wall of the material frame, and one end of the fixed disc is provided with a driving motor which is driven by the driving motor to rotate; and a third cylinder is arranged on one side, facing the fixed disk, of the material frame, the movable disk rotates at the end part of a cylinder rod on the third cylinder, and the axes of the movable disk and the fixed disk are overlapped.
Preferably, limiting plates are arranged on two sides of the rotating plate.
Preferably, a material guide rail is arranged on one side, close to the support, of the inner wall of the material frame, so that the material plate can fall to the position, located between the fixed disc and the movable disc, of the material frame conveniently.
Preferably, a guide plate is obliquely arranged upwards above the material guide rail on the material frame on the support, and a positioning plate is arranged at the bottom of the guide plate in a forward extending mode.
Preferably, when the rotating plate is in a horizontal position, the distance between the upper surface of the rotating plate and the lower surface of the fixed plate is smaller than or equal to the thickness of the material tray to be fixed.
The utility model discloses a semiconductor chip taping machine coiling mechanism compares with prior art and has following advantage:
(1) the material discs for the braiding machine can be orderly and efficiently clamped by the underground materials, the chip belts are conveniently wound, and the material discs automatically fall onto an external collecting device after winding is completed, so that the automation degree is high;
(2) simple structure and convenient use.
Drawings
Fig. 1 is a schematic structural view 1 of a winding device for a semiconductor chip braiding machine according to the present invention;
FIG. 2 is an enlarged view of a portion of the rotating plate of FIG. 1;
FIG. 3 is an enlarged view of a portion of the frame of FIG. 1;
fig. 4 is a schematic structural view 2 of the winding device for the semiconductor chip braiding machine of the present invention;
FIG. 5 is an enlarged view of a portion of the guide plate of FIG. 4;
fig. 6 is a schematic structural diagram 3 of a winding device for a semiconductor chip taping machine according to the present invention.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1 to 6, the winding device for the semiconductor chip braiding machine comprises a bracket 1, a material tray blanking mechanism and a material tray fixing mechanism;
a support plate 6 is horizontally and fixedly arranged at the lower part of the bracket 1;
the charging tray blanking mechanism comprises a fixed plate 2 and a rotating plate 4; the fixing plate 2 is arranged at the top of the bracket 1, a placing hole 3 is formed in the upper surface of the fixing plate 2, and the placing hole 3 penetrates through the upper surface and the lower surface of the fixing plate 2; one end of the lower surface of the fixed plate 2 is provided with a hinged shaft; one end of the upper surface of one end of the rotating plate 4 is provided with a hinged part, and the rotating plate 4 is hinged with a hinged shaft on the fixed plate 2 through a hinged shaft at the end part; the other end of the rotating plate 4 is a discharging end; two sides of the rotating plate 4 are hinged with first cylinders 5, the bottoms of the first cylinders 5 are hinged on a supporting plate 6, and the tops of telescopic rods on the first cylinders 5 are hinged with the side surface of the rotating plate 4; according to the arrangement, the rotating plate 4 is driven to rotate on the fixed plate 2 through the extension and retraction of the telescopic rod on the first air cylinder 5, so that the charging tray is discharged; preferably, limiting plates 11 are arranged on two sides of the rotating plate 4, so that the material tray is prevented from falling off the rotating plate 4 when the rotating plate 4 rotates;
the material tray fixing mechanism comprises a material frame 7 and a fixing mechanism; the material frame 7 is fixed on the lower portion of one end, close to the discharge end of the rotating plate 4, of the support 1, a moving door 9 is horizontally arranged at the bottom of the material frame 7 in a sliding mode, a second air cylinder 8 is arranged at one end of the moving door 9, the moving door 9 is driven by the second air cylinder 8 to move, a through hole is formed in the support plate 6 and located right below the material frame 7, and after a material tray on the fixing mechanism is completely rolled, the material tray can conveniently fall onto an external collecting device located below the support plate 6 from the material frame 7; the fixing mechanism comprises a fixed disc 15 and a movable disc 10; the fixed disc 15 is horizontally and rotatably arranged on one side of the inner wall of the material frame 7, and one end of the fixed disc 15 is provided with a driving motor which is driven by the driving motor to rotate; a third cylinder 14 is arranged on one side of the material frame 7, which faces the fixed disc 15, the movable disc 10 rotates at the end part of a cylinder rod on the third cylinder 14, and the axes of the movable disc 10 and the fixed disc 15 are overlapped; according to the arrangement, when the material tray falls into the material frame 7, the third air cylinder 14 starts the movable tray 10 to rotate, so that the material tray is clamped by the fixed tray 15 and the movable tray 10; and the chip belt with the woven chips is rotated to be rolled under the driving of the fixed disc 15.
In this embodiment, a material guiding rail 13 is disposed on a side of the inner wall of the material frame 7 close to the support 1, so that the material tray can fall onto the material frame 7 at a position between the fixed tray 15 and the movable tray 10. Preferably, a guide plate 12 is arranged on the bracket 1 above the material guide rail 13 on the material frame 7 in an inclined upward direction, and a positioning plate 16 is arranged at the bottom of the guide plate 12 in a forward extending manner; with the arrangement, when the rotating plate 4 rotates to the position of the positioning plate 16, the positioning plate 16 has a limiting effect, and the material tray on the rotating plate 4 flows into the material frame 7 along the guide plate 12.
In addition, when the rotating plate 4 is in the horizontal position, the distance between the upper surface of the rotating plate 4 and the lower surface of the fixed plate 2 is smaller than or equal to the thickness of the material tray, so that the arrangement ensures that only one material tray falls from the placing hole on the fixed plate 2 at each time, and the effective clamping operation of the material tray fixing mechanism is ensured
When the charging tray needs to be discharged, the first cylinder 5 is started, the rotating plate 4 rotates, the charging tray falls onto the rotating plate 4 from the placing hole 3 and falls into the material frame 7 along the rotating plate 4, the third cylinder 14 is started to enable the charging tray to be clamped by the fixed disc 15 and the movable disc 10, the driving motor is started, and the charging tray rotates to realize winding; after the winding is finished, the second cylinder 8 drives the moving door 9 to be opened, and the material tray falls onto an external collecting device.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.
Claims (5)
1. The winding device for the semiconductor chip braiding machine is characterized by comprising a support, a material tray blanking mechanism and a material tray fixing mechanism;
a support plate is horizontally and fixedly arranged at the lower part of the bracket;
the charging tray discharging mechanism comprises a fixed plate and a rotating plate; the fixing plate is arranged at the top of the bracket, the upper surface of the fixing plate is provided with a placing hole, and the placing hole penetrates through the upper surface and the lower surface of the fixing plate; one end of the lower surface of the fixed plate is provided with a hinged shaft; one end of the upper surface of one end of the rotating plate is provided with a hinged part, and the rotating plate is hinged with a hinged shaft on the fixed plate through a hinged shaft at the end part; the other end of the rotating plate is a discharge end; the two sides of the rotating plate are hinged with first cylinders, the bottoms of the first cylinders are hinged to the supporting plate, and the tops of telescopic rods on the first cylinders are hinged to the side face of the rotating plate;
the material tray fixing mechanism comprises a material frame and a fixing mechanism; the material frame is fixed on the lower portion of one end, close to the discharge end on the rotating plate, of the support, a sliding door is horizontally arranged at the bottom of the material frame in a sliding mode, a second air cylinder is arranged at one end of the sliding door, the sliding door is driven by the second air cylinder to move, and a through hole is formed in the support plate and located right below the material frame; the fixing mechanism comprises a fixed disc and a movable disc; the fixed disc is horizontally and rotatably arranged on one side of the inner wall of the material frame, and one end of the fixed disc is provided with a driving motor which is driven by the driving motor to rotate; and a third cylinder is arranged on one side, facing the fixed disk, of the material frame, the movable disk rotates at the end part of a cylinder rod on the third cylinder, and the axes of the movable disk and the fixed disk are overlapped.
2. The winding device for the semiconductor chip taping machine according to claim 1, wherein the rotating plate is provided with a stopper plate at both sides.
3. The winding device for the semiconductor chip taping machine according to claim 1 or 2, wherein a material guiding rail is provided on a side of the inner wall of the material frame adjacent to the support to facilitate the material tray to fall to a position on the material frame between the fixed tray and the movable tray.
4. The winding device for the semiconductor chip taping machine as claimed in claim 3, wherein a guide plate is provided on the support obliquely upward above the guide rail on the frame, and a positioning plate is provided on the bottom of the guide plate extending forward.
5. The winding device for the semiconductor chip taping machine according to claim 1, 2 or 4, wherein when the rotary plate is in a horizontal position, a distance between an upper surface of the rotary plate and a lower surface of the fixed plate is less than or equal to a thickness of a tray to be fixed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202022415470.8U CN213802164U (en) | 2020-10-27 | 2020-10-27 | Winding device for semiconductor chip braiding machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202022415470.8U CN213802164U (en) | 2020-10-27 | 2020-10-27 | Winding device for semiconductor chip braiding machine |
Publications (1)
Publication Number | Publication Date |
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CN213802164U true CN213802164U (en) | 2021-07-27 |
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CN202022415470.8U Active CN213802164U (en) | 2020-10-27 | 2020-10-27 | Winding device for semiconductor chip braiding machine |
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CN (1) | CN213802164U (en) |
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2020
- 2020-10-27 CN CN202022415470.8U patent/CN213802164U/en active Active
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