CN213798617U - Rotary forming system of transfer roller and ion etching equipment - Google Patents

Rotary forming system of transfer roller and ion etching equipment Download PDF

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Publication number
CN213798617U
CN213798617U CN202022096109.3U CN202022096109U CN213798617U CN 213798617 U CN213798617 U CN 213798617U CN 202022096109 U CN202022096109 U CN 202022096109U CN 213798617 U CN213798617 U CN 213798617U
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linear
etcher
metal transfer
transfer roller
space
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林刘恭
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K Laser Technology Inc
KLASER Tech Inc
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K Laser Technology Inc
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Abstract

The utility model discloses a rotary type forming system and ion etching equipment of rendition gyro wheel. A rotary forming system for a transfer roller comprising: an ion etching apparatus, comprising: a dust-free cavity, which is formed with a workpiece space and an etcher space communicated with each other; a linear ion etcher mounted in the clean room and located in the etcher space, and having a linear driving surface facing the work piece space; the supporting member is arranged in the dust-free cavity and corresponds to the workpiece space; the rotating mechanism is arranged in the dust-free cavity; and a metal transfer roller detachably disposed on the support member and located in the work space, and an outer surface of the metal transfer roller is disposed opposite to the linear driving surface at a distance. Accordingly, the ion etching equipment can rotate relative to the metal transfer printing roller so as to form the transfer printing microstructure layer on the outer surface of the metal transfer printing roller in a concave mode through the linear driving surface, and therefore cost is effectively reduced, and yield is improved.

Description

Rotary forming system of transfer roller and ion etching equipment
Technical Field
The utility model relates to a rendition gyro wheel forming system especially relates to a rotary type forming system and ion etching equipment of rendition gyro wheel.
Background
The conventional transfer roller forming system is used to form a microstructure layer on an outer surface of a metal roller by stacking the microstructure layer through a series of complicated processes and techniques, and further, a hologram layer is formed on an optical film by the microstructure layer. However, the conventional transfer roller forming system has a complicated structure, which results in an excessive cost and a low yield.
Therefore, the present inventors have considered that the above-mentioned defects can be improved, and therefore, they have made an intensive study and use of scientific principles, and finally have proposed a novel and rational design that can effectively improve the above-mentioned defects.
SUMMERY OF THE UTILITY MODEL
An embodiment of the present invention provides a rotary type forming system of transfer roller and an ion etching apparatus, which can effectively improve the existing transfer roller forming system.
The embodiment of the utility model discloses rotary type forming system of rendition gyro wheel, it includes: an ion etching apparatus, comprising: a dust-free chamber, which is formed with a workpiece space and an etcher space communicated with each other; a linear ion etcher mounted in the clean room and located in the etcher space, the linear ion etcher having a linear driving surface facing the work piece space; the supporting member is arranged in the dust-free cavity and corresponds to the space of the workpiece; the rotating mechanism is arranged in the dust-free cavity; the metal transfer printing roller is detachably arranged on the supporting member and positioned in the workpiece space, and the outer surface of the metal transfer printing roller and the linear driving surface are oppositely arranged at intervals; the linear ion etcher and the metal transfer printing roller can be driven by the rotating mechanism to relatively rotate along a rotating direction, so that the linear driving surface can relatively rotate to pass through the whole outer surface of the metal transfer printing roller, and the metal transfer printing roller is concavely provided with a transfer printing microstructure layer on the outer surface through etching ions formed between the linear driving surface and the metal transfer printing roller.
Preferably, the linear driving surface defines a length direction, and the metal transfer roller has a central axis parallel to the length direction; the rotating forming system of the transfer printing roller further comprises a power supply module, the power supply module is connected with the linear ion etcher and used for applying a positive voltage to the linear ion etcher, and the power supply module is connected with the metal transfer printing roller and used for applying a negative voltage to the metal transfer printing roller.
Preferably, the rotating mechanism is connected to the metal transfer roller, and the rotating mechanism can drive the metal transfer roller to rotate at least one turn in the rotating direction by taking the central axis as the axis.
Preferably, the rotating mechanism is connected to the linear ion etcher and drives the linear ion etcher to rotate around the metal transfer roller at least one turn in the rotating direction with the central axis as the axis.
Preferably, the linear drive surface is spaced from the outer surface of the metal transfer roller by a distance of between 1 mm and 39 mm.
Preferably, the linear ion etcher is further defined as a linear Transformer Coupled Plasma (TCP) etcher, a linear Reactive Ion Etcher (RIE), or a linear High Density Plasma (HDP) etcher.
The embodiment of the utility model provides a also disclose an ion etching equipment, its surface that is used for making a metal rendition gyro wheel is formed with a rendition micro-structure layer, and ion etching equipment includes: a dust-free chamber, which is formed with a workpiece space and an etcher space communicated with each other; a linear ion etcher mounted in the clean room and located in the etcher space, the linear ion etcher having a linear driving surface facing the work piece space; the supporting member is arranged in the dust-free cavity and corresponds to the space of the workpiece; the support member is used for arranging the metal transfer printing roller and receiving the metal transfer printing roller in a workpiece space, so that the outer surface of the metal transfer printing roller and the linear driving surface are oppositely arranged at intervals; and a rotating mechanism, which is arranged in the dust-free cavity and is used for driving the linear ion etcher and the metal transfer printing roller to relatively rotate along a rotating direction.
Preferably, the linear drive surface is spaced from the outer surface of the metal transfer roller by a distance of between 1 mm and 39 mm.
Preferably, the linear ion etcher is further defined as a linear transformer coupled plasma etcher, a linear reactive ion etcher, or a linear high density plasma etcher.
To sum up, the embodiment of the present invention discloses a rotary forming system and an ion etching apparatus for a transfer roller, which can rotate relative to a metal transfer roller through the cooperation between the dust-free chamber and each component (e.g. the linear ion etcher, the supporting member, and the rotating mechanism), and further form a transfer microstructure layer by recessing the linear driving surface on the outer surface of the metal transfer roller, thereby effectively reducing the cost and improving the yield.
For a further understanding of the features and technical content of the present invention, reference should be made to the following detailed description and accompanying drawings, which are only intended to illustrate the present invention, and not to limit the scope of the present invention.
Drawings
Fig. 1 is a perspective view of a rotary forming system of a transfer roller according to an embodiment of the present invention.
Fig. 2 is a schematic plan view of a rotary forming system of a transfer roller according to an embodiment of the present invention, without a power module.
Fig. 3A is a schematic plan view of a rotary forming system of a transfer roller according to an embodiment of the present invention, without a power supply module.
Fig. 3B is an enlarged view of the portion IIIB in fig. 3A.
Fig. 4 is a schematic plan view of a rotary forming system of a transfer roller according to an embodiment of the present invention, after a power module is omitted.
Fig. 5 is a perspective view of a rotary type forming system of a transfer roller according to a second embodiment of the present invention.
Fig. 6 is a schematic plan view of a rotary forming system of a transfer roller according to a second embodiment of the present invention, without a power supply module.
Fig. 7 is another schematic plan view of a rotary type forming system of a transfer roller according to a second embodiment of the present invention, without a power supply module.
Fig. 8 is a further schematic plan view of a rotary forming system of a transfer roller according to a second embodiment of the present invention, without a power supply module.
Detailed Description
The following embodiments of the present invention will be described with reference to the accompanying drawings, and will be apparent to those skilled in the art from this description. The present invention may be practiced or carried out in other different embodiments, and various modifications and changes may be made in the details of this description based on the different points of view and applications without departing from the spirit of the present invention. It should be noted that the drawings of the present invention are merely schematic illustrations and are not drawn to actual dimensions. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.
It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or from one signal to another signal. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.
[ example one ]
Please refer to fig. 1 to 4, which illustrate a first embodiment of the present invention. The present embodiment discloses a system 100 for rotary forming of a transfer roller, so that any forming system that is not "transfer roller" or "rotary" is different from the system 100 for rotary forming of a transfer roller in the present embodiment. The system 100 includes an ion etching apparatus 1 and a metal transfer roller 2 detachably disposed in the ion etching apparatus 1.
It should be further noted that the rotary forming system 100 of the transfer roller in this embodiment is limited to the one in which the ion etching apparatus 1 directly recesses the outer surface 21 of the metal transfer roller 2 (by the patterned photoresist layer thereon) to form a transfer microstructure layer 22, so that any forming system that cannot recess the outer surface of the metal roller is different from the rotary forming system 100 of the transfer roller in this embodiment.
In addition, the ion etching apparatus 1 is a dry etching apparatus in the embodiment, and is described in conjunction with the metal transfer roller 2, but the invention is not limited thereto. For example, in other embodiments not shown in the present disclosure, the ion etching apparatus 1 may be used alone (e.g., for sale) or in combination with other components. The configuration of the ion etching apparatus 1 will be explained first, and then the connection relationship between the ion etching apparatus 1 and the metal transfer roller 2 will be described.
The ion etching apparatus 1 includes a dust-free chamber 11, a linear ion etcher 12, a support member 13, a rotation mechanism 14, and a power supply module 15. Wherein the linear ion etcher 12, the supporting member 13 and the rotating mechanism 14 are all installed in the dust-free chamber 11; the power supply module 15 is connected to the linear ion etcher 12 and is configured to apply a positive voltage to the linear ion etcher, and the power supply module 15 is connected to the metal transfer roller 2 and is configured to apply a negative voltage to the metal transfer roller. In other words, the metal transfer roller 2 is used as an electrode of the linear ion etcher 12.
The clean chamber 11 is preferably a clean chamber of Class100, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the clean chamber 11 can be adjusted to other levels (e.g. class10 or class 1000) of clean chamber 11 according to design requirements. Further, the clean chamber 11 is formed with a work piece space 111 and an etcher space 112 communicating with each other, and the etcher space 112 in the clean chamber 11 is communicated with the work piece space 111. In the embodiment, the dust-free chamber 11 further defines the workpiece space 111 as a workpiece space of Class100, but the invention is not limited thereto.
Further, the linear ion etcher 12 is located in the etcher space 112, and the linear ion etcher 12 has a linear driving surface 121 facing the workpiece space 111, the linear driving surface 121 defining a longitudinal direction L. That is, the ion etching apparatus 1 does not employ any etcher other than the "straight line type" in the present embodiment.
It should be noted that, in the present embodiment, the linear ion etcher 12 may adopt a linear Transformer Coupled Plasma (TCP) etcher, a linear Reactive Ion Etcher (RIE) or a linear High Density Plasma (HDP), but the present invention is not limited thereto.
The supporting member 13 (e.g., a supporting frame) is provided corresponding to the work space 111 so that the metal transfer roller 2 is detachably provided to the supporting member 13. The metal transfer roller 2 is disposed in the supporting member 13 through two ends thereof and located in the workpiece space 111, the metal transfer roller 2 has a central axis C parallel to the length direction L, and the outer surface 21 of the metal transfer roller 2 and the linear driving surface 121 are disposed opposite to each other at an interval, but the present invention is not limited thereto.
Further, the linear driving surface 121 and the outer surface 21 of the metal transfer roller 2 are preferably spaced apart by a distance G of 1 mm to 39 mm. In the present embodiment, the linear driving surface 121 and the outer surface 21 of the metal transfer roller 2 are spaced apart by the same distance G, but the present invention is not limited thereto. For example, in another embodiment not shown in the present invention, the central axis C of the metal transfer roller 2 may have an acute angle with the longitudinal direction, so that the linear driving surface 121 and the outer surface 21 of the metal transfer roller 2 may be spaced apart by different distances.
The rotating mechanism 14 (e.g., a motor and a linkage assembly) can drive the linear ion etcher 12 and the metal transfer roller 2 to rotate relatively along a rotating direction R, so that the linear driving surface 121 can rotate relatively across the entire outer surface 21 of the metal transfer roller 2, and further, the metal transfer roller 2 is recessed with a transfer microstructure layer 22 formed on the outer surface 21 by etching ions formed between the linear driving surface 121 and the metal transfer roller 2. That is, the etching ions can directly dry-etch the outer surface 21 of the metal transfer roller 2 to form the transfer microstructure layer 22.
In this embodiment, the rotating mechanism 14 is connected to (two ends of) the metal transfer roller 2, and the rotating mechanism 14 can drive the metal transfer roller 2 to rotate at least one turn along the rotating direction R with the central axis C as an axis. In the present embodiment, the rotational forming system 100 of the transfer roller can adjust the number of rotations of the metal transfer roller 2 required for forming the transfer microstructure layer 22 according to design requirements.
For example, if the design requirement is a high throughput, the output of the linear ion etcher 12 may be increased, so that after the metal transfer roller 2 rotates one turn, the etching ions may form the transfer microstructure layer 22 on the outer surface 21 of the metal transfer roller 2. Alternatively, if the design requirement is high precision, the output power of the linear ion etcher 12 may be reduced, so that after the metal transfer roller 2 rotates for a predetermined number of turns (e.g., at least two turns), the etching ions may form the transfer microstructure layer 22 on the outer surface 21 of the metal transfer roller 2.
It should be additionally noted that, the metal transfer roller 2 is elongated in the present embodiment and has a circular cross section perpendicular to the central axis C, a diameter of the circular cross section may be 3 cm to 4 cm, and a length of the metal transfer roller 2 is greater than the diameter of the circular cross section and may be 90 cm to 150 cm, which is not limited herein. For example, in other embodiments not shown in the present disclosure, the length of the metal transfer roller 2 may be smaller than the diameter of the circular section.
[ example two ]
Please refer to fig. 5 to 8, which illustrate a second embodiment of the present invention. Since this embodiment is similar to the first embodiment, the same points of the two embodiments are not described again, and the differences between this embodiment and the first embodiment are roughly described as follows:
in this embodiment, the rotating mechanism 14 is connected to the linear ion etcher 12, and the rotating mechanism 14 can drive the linear ion etcher 12 to rotate at least one turn around the metal transfer roller 2 along the rotating direction R with the central axis C as an axis. In the present embodiment, the number of rotations of the linear ion etcher 12 required for forming the transfer microstructure layer 22 can also be adjusted according to design requirements by the rotating forming system 100 of the transfer roller.
For example, if the design requirement is a high throughput, the output of the linear ion etcher 12 can be increased, so that after one rotation of the linear ion etcher 12, the etching ions can form the transfer microstructure layer 22 on the outer surface 21 of the metal transfer roller 2. Alternatively, if the design requirement is high precision, the output power of the linear ion etcher 12 may be reduced, so that after the linear ion etcher 12 rotates for a predetermined number of turns (e.g., at least two turns), the etching ions may form the transfer microstructure layer 22 on the outer surface 21 of the metal transfer roller 2.
[ technical effects of the embodiments of the present invention ]
To sum up, the embodiment of the present invention discloses a rotary forming system and an ion etching apparatus for a transfer roller, which can rotate relative to a metal transfer roller through the cooperation between the dust-free chamber and each component (e.g., the linear ion etcher, the supporting member, and the rotating mechanism), and further can form a transfer microstructure layer on the outer surface of the metal transfer roller through the linear driving surface, thereby effectively reducing the cost and improving the yield.
In addition, the embodiment of the present invention discloses a rotary forming system of a transfer roller, which can further effectively form the transfer microstructure layer on the outer surface of the metal transfer roller by the detailed structure design of the ion etching apparatus (e.g., the clean chamber is further defined as a Class100 clean chamber, and/or the linear driving surface is spaced from the outer surface of the metal transfer roller by a distance of 1 mm to 39 mm).
In addition, the present invention discloses a rotary forming system for a transfer roller, which can adopt different configurations of the ion etching apparatus according to design requirements (e.g., embodiment one and embodiment two). For example, when the rotating mechanism can rotate the metal transfer roller at a uniform speed, the rotating mechanism can drive the metal transfer roller to rotate in the rotating direction with the central axis as an axis, so as to form the transfer microstructure layer on the outer surface of the metal transfer roller in a concave manner; or, when the metal transfer roller is heavy and hard to rotate at a uniform speed, the ion etching apparatus may drive the linear ion etcher to rotate around the metal transfer roller in the rotation direction with the central axis as an axis by the rotation mechanism, so as to form the transfer microstructure layer on the outer surface of the metal transfer roller in a concave manner.
The above disclosure is only a preferred and practical embodiment of the present invention, and is not intended to limit the scope of the present invention, so that all the modifications of the equivalent technologies made by the disclosure and the drawings are included in the scope of the present invention.

Claims (9)

1. A rotary forming system for a transfer roller, comprising:
an ion etching apparatus, comprising:
a dust-free chamber, which is formed with a workpiece space and an etcher space communicated with each other;
a linear ion etcher mounted in the clean room and located in the etcher space, the linear ion etcher having a linear driving surface facing the work piece space;
the supporting member is arranged in the dust-free cavity and corresponds to the workpiece space; and
the rotating mechanism is arranged in the dust-free cavity; and
the metal transfer printing roller is detachably arranged on the supporting member and positioned in the workpiece machining space, and the outer surface of the metal transfer printing roller and the linear driving surface are oppositely arranged at intervals; the linear ion etcher and the metal transfer printing roller can be driven by the rotating mechanism to relatively rotate along a rotating direction, so that the linear driving surface can relatively rotate to pass through the whole outer surface of the metal transfer printing roller, and the metal transfer printing roller is concavely provided with a transfer printing microstructure layer on the outer surface through etching ions formed between the linear driving surface and the metal transfer printing roller.
2. The rotary forming system of claim 1, wherein the linear drive surface defines a longitudinal direction, and the metal transfer roller has a central axis parallel to the longitudinal direction; the rotating forming system of the transfer roller further comprises a power supply module, wherein the power supply module is connected with the linear ion etcher and is used for applying a positive voltage to the linear ion etcher, and the power supply module is connected with the metal transfer roller and is used for applying a negative voltage to the metal transfer roller.
3. The rotary forming system of claim 2, wherein the rotating mechanism is coupled to the metal transfer roller and is capable of driving the metal transfer roller to rotate at least one turn in the rotation direction about the central axis.
4. The system of claim 2, wherein the rotation mechanism is coupled to the linear ion etcher and is configured to rotate the linear ion etcher about the metal transfer roller in the rotational direction at least one rotation about the central axis.
5. The rotary forming system of claim 1, wherein the linear drive surface is spaced from the outer surface of the metal transfer roller by a distance in a range of 1 mm to 39 mm.
6. The rotary forming system of claim 1, wherein the linear ion etcher is further defined as a linear transformer coupled plasma etcher, a linear reactive ion etcher, or a linear high density plasma etcher.
7. An ion etching apparatus for forming a transfer microstructure layer on an outer surface of a metal transfer roller, comprising:
a dust-free chamber, which is formed with a workpiece space and an etcher space communicated with each other;
a linear ion etcher mounted in the clean room and located in the etcher space, the linear ion etcher having a linear driving surface facing the work piece space;
the supporting member is arranged in the dust-free cavity and corresponds to the workpiece space; the supporting component is used for arranging the metal transfer printing roller and receiving the metal transfer printing roller in the workpiece space, so that the outer surface of the metal transfer printing roller and the linear driving surface are oppositely arranged at intervals; and
and the rotating mechanism is arranged in the dust-free cavity and is used for driving the linear ion etcher and the metal transfer printing roller to relatively rotate along a rotating direction.
8. The ion etching apparatus of claim 7, wherein the linear drive surface is spaced from the outer surface of the metal transfer roller by a distance in a range of 1 mm to 39 mm.
9. The ion etching apparatus of claim 7, wherein the linear ion etcher is further defined as a linear transformer coupled plasma etcher, a linear reactive ion etcher, or a linear high density plasma etcher.
CN202022096109.3U 2020-09-22 2020-09-22 Rotary forming system of transfer roller and ion etching equipment Active CN213798617U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022096109.3U CN213798617U (en) 2020-09-22 2020-09-22 Rotary forming system of transfer roller and ion etching equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022096109.3U CN213798617U (en) 2020-09-22 2020-09-22 Rotary forming system of transfer roller and ion etching equipment

Publications (1)

Publication Number Publication Date
CN213798617U true CN213798617U (en) 2021-07-27

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Country Status (1)

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CN (1) CN213798617U (en)

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