CN213797457U

CN213797457U - Engraving and milling machine for processing silicon wafers

Info

Publication number: CN213797457U
Application number: CN202022667020.8U
Authority: CN
Inventors: 徐以中
Original assignee: Sbr Cnc Machine Tool Wuxi Co ltd
Current assignee: Sbr Cnc Machine Tool Wuxi Co ltd
Priority date: 2020-11-17
Filing date: 2020-11-17
Publication date: 2021-07-27
Anticipated expiration: 2030-11-17

Abstract

The utility model belongs to the technical field of silicon chip processing and specifically relates to a carving mills machine for silicon chip processing, which comprises a bod, the inside bottom surface of organism extends there is the fixed block, the front end of fixed block extends there is the hexagonal guide pillar, the outside slidable mounting of hexagonal guide pillar has the guide block, the rear end face of guide block compresses tightly in the preceding terminal surface of fixed block, the side of guide block extends there is the workstation, the upper end of fixed block extends there is the layer board, the upper end of layer board extends there is L shape frame, the up end of L shape frame runs through slidable mounting has the compression leg, the coaxial extension of lower tip of compression leg has the pressure disk, the outside winding of compression leg has the pressure spring, the pressure spring is located between the up end of pressure disk and the lower terminal surface of L shape frame, the utility model discloses convenience when can improving convenience degree and dismouting silicon chip when using.

Description

Engraving and milling machine for processing silicon wafers

Technical Field

The utility model relates to a silicon chip processing field especially relates to a silicon chip processing is with carving mills machine.

Background

The engraving and milling machine is one of numerical control machine tools, generally, the engraving and milling machine is a numerical control milling machine using a small cutter, a high-power and a high-speed spindle motor, the engraving and milling machine has the advantages of engraving, if the hardness of a processing material is high, the engraving and milling machine can be too forceful, the blank between the engraving and milling machine and the high-power and high-speed spindle motor can be filled, the engraving and milling machine can engrave and mill, the engraving and milling machine is a high-efficiency and high-precision numerical control machine tool, the engraving and milling machine is particularly and widely used for processing a silicon wafer, and the engraving and milling machine for processing the silicon wafer in the prior art is not convenient enough when in use and is not convenient enough when the silicon wafer is disassembled and assembled.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defect of low efficiency in the prior art and providing a carving and milling machine for processing silicon wafers.

In order to achieve the above purpose, the utility model adopts the technical scheme that: a carving and milling machine for processing silicon wafers comprises a machine body, wherein a fixed block extends from the bottom surface inside the machine body, a hexagonal guide post extends from the front end of the fixed block, a guide block is slidably mounted on the outer side of the hexagonal guide post, the rear end surface of the guide block is tightly pressed against the front end surface of the fixed block, a workbench extends from the side surface of the guide block, a supporting plate extends from the upper end of the fixed block, an L-shaped frame extends from the upper end of the supporting plate, a pressing post penetrates through the upper end surface of the L-shaped frame and is slidably mounted, a pressing plate coaxially extends from the lower end surface of the pressing post, a pressing spring is wound on the outer side of the pressing post and is positioned between the upper end surface of the pressing plate and the lower end surface of the L-shaped frame, a position blocking plate extends from the lower end of the pressing plate and penetrates through the upper end surface of the supporting plate in a sliding manner, the rear end surface of the position blocking plate is attached to the front end surface of the guide block, and a position limiting part is embedded in the outer side of the position blocking plate, the locating part compresses tightly in the up end of layer board, the side of organism rotates installs the balladeur train, the lower extreme slidable mounting of balladeur train has the magnetism firmware.

Preferably, a control panel is embedded in the edge of the front end face of the machine body, and a machine door is slidably mounted in the middle of the front end face of the machine body.

Preferably, the limiting part comprises limiting plates embedded at the front end and the rear end of the position blocking plate, the limiting plates and the position blocking plate are integrally formed, and the lower end face of each limiting plate is pressed on the upper end face of the supporting plate.

Preferably, a groove block extends from the upper part of the side face of the machine body, a rotating block can be fixedly installed in the groove block in a rotating mode, and the end part of the sliding frame is fixedly connected with the rear end face of the rotating block.

Preferably, the upper end face of the groove block is embedded with a bearing body in a penetrating mode, the bearing body is embedded in the rotating block in a penetrating mode, elastic rubber pads extend from the upper end face to the lower end face of the rotating block, and the elastic rubber pads are tightly pressed on the upper end face and the lower end face of the inner portion of the groove block.

Preferably, the magnetic firmware includes the slide of slidable mounting in the inside of balladeur train, the lower extreme extension of slide has the extension board, extension board and slide integrated into one piece, the side adsorption of extension board has the magnetic path, the outside of magnetic path is inlayed and is had the drawing disc.

Compared with the prior art, the utility model discloses following beneficial effect has: the utility model can pull the compression leg to enable the blocking plate to move upwards to be separated from the front end of the guide block, so that the guide block can move, then the guide block is pushed to drive the workbench to move, so that the workbench can be drawn out from the machine body to disassemble and assemble the silicon wafer on the workbench, thereby avoiding the phenomenon that the upper half body of a user can enter the machine body to disassemble and assemble the silicon wafer due to the blocking of the machine body, the phenomenon that the silicon wafer on the workbench is inconvenient to disassemble and assemble is caused, so that the silicon wafer disassembling and assembling device has the advantage of more convenience in disassembling and assembling the silicon wafer, the drawing used for processing the silicon wafer can be placed on the extension board, the drawing is fixed by the adsorption of the magnetic block and the extension plate, so that the complicated step of unfolding and taking the drawing independently is not needed when the control panel is operated, the use convenience is improved, meanwhile, the drawing board can be suitable for drawings of different sizes by pushing the extension board to drive the sliding plate to slide in the sliding frame.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a fixed view of the working table of the present invention;

fig. 3 is a half sectional view showing the connection of the magnetic fixing member of the present invention.

In the figure: 1. a body; 2. a machine door; 3. a control panel; 4. a groove block; 5. a carriage; 6. a work table; 7. a hexagonal guide post; 8. a fixed block; 9. a guide block; 10. a support plate; 11. an L-shaped frame; 12. pressing the column; 13. a platen; 14. pressing the spring; 15. a limiting plate; 16. rotating the block; 17. a bearing body; 18. an elastic rubber pad; 19. a slide plate; 20. a stretching plate; 21. pulling the disc; 22. a magnetic block; 23. a position blocking plate.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art.

As shown in fig. 1-3, an engraving and milling machine for processing silicon wafers comprises a machine body 1, a fixed block 8 extends from the inner bottom surface of the machine body 1, a hexagonal guide post 7 extends from the front end of the fixed block 8, a guide block 9 is slidably mounted on the outer side of the hexagonal guide post 7, the rear end surface of the guide block 9 is pressed against the front end surface of the fixed block 8, a worktable 6 extends from the side surface of the guide block 9, a support plate 10 extends from the upper end of the fixed block 8, an L-shaped frame 11 extends from the upper end of the support plate 10, a compression post 12 slidably mounted on the upper end surface of the L-shaped frame 11, a pressure plate 13 coaxially extends from the lower end of the compression post 12, a compression spring 14 is wound on the outer side of the compression post 12, the compression spring 14 is located between the upper end surface of the pressure plate 13 and the lower end surface of the L-shaped frame 11, a position-blocking plate 23 extends from the lower end of the pressure plate 13, the position-blocking plate 23 slidably extends through the upper end surface of the support plate 10, the rear end surface of the position-blocking plate 23 is attached to the front end surface of the guide block 9, hinder the outside of position board 23 and inlay there is the locating part, the locating part compresses tightly in the up end of layer board 10, the side of organism 1 is rotated and is installed balladeur train 5, balladeur train 5's lower extreme slidable mounting has the magnetic firmware, can fix hexagonal guide pillar 7 through the fixed block 8 that sets up, hexagonal guide pillar 7 can lead to guide block 9, layer board 10 can fix L shape frame 11, L shape frame 11 can restrict compression leg 12, pressure movable spring 14 can compress tightly fixedly to hindering position board 23.

The front end face edge of organism 1 inlays and has control panel 3, and the front end face middle part slidable mounting of organism 1 has quick-witted door 2, can seal organism 1 through the quick-witted door 2 that sets up in order to guarantee the security of adding man-hour, and control panel 3 can control organism 1.

The locating part is including inlaying limiting plate 15 at the front and back both ends that hinder position board 23, limiting plate 15 with hinder position board 23 integrated into one piece, limiting plate 15's lower terminal surface compresses tightly in the up end of layer board 10, can restrict the distance that moves down that hinders position board 23 through the limiting plate 15 that sets up, layer board 10 can be consolidated hindering position board 23 after moving down.

The upper portion of the side of the machine body 1 extends to form a groove block 4, a rotating block 16 can be fixedly installed in the groove block 4 in a rotating mode, the end portion of the sliding frame 5 is fixedly connected with the rear end face of the rotating block 16, and the sliding frame 5 can be connected and rotated through the arranged groove block 4 and the rotating block 16.

The up end of groove piece 4 runs through to inlay has bearing body 17, and bearing body 17 runs through to inlay in the inside of turning block 16, and the upper and lower terminal surface of turning block 16 extends flexible rubber pad 18, and flexible rubber pad 18 compresses tightly terminal surface about the inside of groove piece 4, can guarantee the stable rotation of turning block 16 through the bearing body 17 that sets up, and flexible rubber pad 18 can increase the frictional force between turning block 16 and the groove piece 4, makes its turning block 16 can fix after rotating.

Magnetic firmware includes the slide 19 of slidable mounting in balladeur train 5's inside, slide 19's lower extreme extends there is extension board 20, extension board 20 and slide 19 integrated into one piece, extension board 20's side adsorbs there is magnetic path 22, magnetic path 22's the outside is inlayed and is had drawing disc 21, slide 19 and balladeur train 5 through the setting can remove extension board 20 to adapt to the not drawing of equidimension, magnetic path 22 can be fixed the drawing, drawing disc 21 can be convenient for pull magnetic path 22.

During the use, the user can stimulate compression leg 12, make it block the front end that the board 23 can shift up and break away from guide block 9, make its guide block 9 can move about, the user promotes guide block 9 afterwards in order to drive workstation 6 and remove, make its workstation 6 can be taken out from organism 1's inside, the user presss from both sides the dress with the silicon chip on workstation 6 afterwards, and reset workstation 6, the user places the drawing that the processing silicon chip used on extension board 20 afterwards, and adsorb the drawing through magnetic path 22 and extension board 20 mutually and fix the drawing, the user can watch the drawing and operate its organism 1 operation to process the silicon chip to control panel 3 afterwards.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the principles of the present invention may be applied to any other embodiment without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The engraving and milling machine for processing the silicon wafers comprises a machine body (1) and is characterized in that a fixed block (8) extends from the bottom surface inside the machine body (1), a hexagonal guide post (7) extends from the front end of the fixed block (8), a guide block (9) is slidably mounted on the outer side of the hexagonal guide post (7), the rear end face of the guide block (9) is pressed against the front end face of the fixed block (8), a workbench (6) extends from the side face of the guide block (9), a supporting plate (10) extends from the upper end of the fixed block (8), an L-shaped frame (11) extends from the upper end of the supporting plate (10), a pressing column (12) penetrates through the upper end face of the L-shaped frame (11) and is slidably mounted, a pressing disc (13) coaxially extends from the lower end of the pressing column (12), a pressing spring (14) is wound on the outer side of the pressing column (12), and the pressing spring (14) is located between the upper end face of the pressing disc (13) and the lower end face of the L-shaped frame (11), the lower extreme of pressure disk (13) extends to have and hinders position board (23), hinder position board (23) and slide and run through in the up end of layer board (10), the rear end face that hinders position board (23) is laminated in the preceding terminal surface of guide block (9), the outside that hinders position board (23) is inlayed and is had the locating part, the locating part compresses tightly in the up end of layer board (10), the side of organism (1) is rotated and is installed balladeur train (5), the lower extreme slidable mounting of balladeur train (5) has the magnetic firmware.

2. The engraving and milling machine for processing the silicon wafers as claimed in claim 1, wherein a control panel (3) is embedded at the edge of the front end face of the machine body (1), and a machine door (2) is slidably mounted in the middle of the front end face of the machine body (1).

3. The engraving and milling machine for processing the silicon wafers as claimed in claim 1, wherein the limiting members comprise limiting plates (15) embedded at the front end and the rear end of the position blocking plate (23), the limiting plates (15) and the position blocking plate (23) are integrally formed, and the lower end faces of the limiting plates (15) are pressed against the upper end faces of the supporting plates (10).

4. The silicon wafer processing engraving and milling machine according to claim 1, wherein a slot block (4) extends from the upper side of the machine body (1), a rotating block (16) can be fixedly installed inside the slot block (4) in a rotating mode, and the end portion of the sliding frame (5) is fixedly connected with the rear end face of the rotating block (16).

5. The silicon wafer processing engraving and milling machine according to claim 4, wherein the upper end surface of the slot block (4) is embedded with a bearing body (17) in a penetrating manner, the bearing body (17) is embedded in the rotating block (16) in a penetrating manner, elastic rubber pads (18) extend from the upper end surface and the lower end surface of the rotating block (16), and the elastic rubber pads (18) are pressed on the upper end surface and the lower end surface of the inner part of the slot block (4).

6. The engraving and milling machine for processing the silicon wafers as claimed in claim 1, wherein the magnetic fixing member comprises a sliding plate (19) slidably mounted inside the sliding frame (5), a stretching plate (20) extends from the lower end of the sliding plate (19), the stretching plate (20) is integrally formed with the sliding plate (19), a magnetic block (22) is adsorbed on the side surface of the stretching plate (20), and a pull disc (21) is embedded on the outer side of the magnetic block (22).