CN213782934U

CN213782934U - Heat dissipation device for mobile power supply mainboard

Info

Publication number: CN213782934U
Application number: CN202022934952.4U
Authority: CN
Inventors: 易清水
Original assignee: Weihai Antunni Intelligent Electronic Technology Co ltd
Current assignee: Weihai Antunni Intelligent Electronic Technology Co ltd
Priority date: 2020-12-09
Filing date: 2020-12-09
Publication date: 2021-07-23
Anticipated expiration: 2030-12-09

Abstract

The utility model belongs to the technical field of mobile power sources, in particular to a heat dissipation device for a mobile power supply mainboard, comprising a mobile power supply and a heat dissipation device for the mobile power supply mainboard. Adsorbed, then transferred to the cavity by the thermal conduction column, and dissipated to the outside of the mobile power supply through the air-permeable micropores. For the rapid heat dissipation of the mobile power supply, press the pull rod downward, so that the pull rod pushes the rubber ball to move down, and promotes the air to float to the outside of the through hole, so that the suction cup can be adsorbed on the desktop, and vice versa, pull the pull rod upward, and the pull rod lifts the rubber ball upward, As a result, the air enters the suction cup through the through hole, and the suction cup loses its adsorption force, thereby realizing the support for the mobile power supply, preventing the mobile power supply from directly contacting the desktop, and preventing water stains from entering the mobile power supply and causing damage.

Description

Heat dissipation device for mobile power supply mainboard

Technical Field

The utility model relates to a portable power source technical field, concretely relates to heat abstractor of portable power source mainboard.

Background

The portable power source is a portable charger which can be carried about by an individual and can store electric energy, is mainly used for charging consumer electronic products such as handheld mobile equipment and the like, is particularly applied to occasions without external power supply, and mainly comprises a battery used for storing the electric energy and a circuit (a direct current-direct current converter) for stabilizing output voltage, and most of mobile power sources are provided with the charger and are used for charging built-in batteries.

But current portable power source mainboard can send more heat when using for a long time, influences portable power source's life, and when portable power source mainboard was placed on more moist desk, can permeate into portable power source inside with water, can lead to the condition that portable power source can not use even.

Disclosure of Invention

For solving the problem that proposes among the above-mentioned background art, the utility model provides a heat abstractor of portable power source mainboard has the effect of carrying out the rapid dissemination to the portable power source mainboard and has avoided the inside characteristics of intaking of portable power source mainboard simultaneously.

In order to achieve the above object, the utility model provides a following technical scheme: a heat dissipation device for a mobile power supply mainboard comprises a mobile power supply, wherein a base is fixedly connected to the lower end face of the mobile power supply, the mainboard is installed inside the mobile power supply, two cavities are fixedly connected to the upper end face inside the mobile power supply, heat-conducting columns are fixedly connected to the lower end faces of the two cavities, heat-absorbing cavities are fixedly connected to the lower end faces of the two heat-conducting columns, the two heat-absorbing cavities are located above the mainboard, a plurality of uniformly distributed supporting plates are fixedly connected to the lower end face of the mainboard, and heat dissipation blocks are installed inside the supporting plates;

the equal fixedly connected with sucking disc of lower terminal surface of the left and right sides of base, the recess has all been seted up to the inside left and right sides of base, the fixed plate is all installed to the inside of two recesses, the lower terminal surface of two recesses all communicates there is the through-hole, install the rubber ball between two recesses and two through-holes, two pull rods are installed to the up end of base, the lower terminal surface of two pull rods all runs through the base in proper order, recess and fixed plate and extend to the below of fixed plate and with rubber ball fixed connection, the spring is installed to the outer wall of the pull rod that is located the fixed plate up end.

In order to dispel the heat to portable power source, as the utility model relates to a heat abstractor of portable power source mainboard is preferred, and the suction fan is installed to the inside up end of portable power source, and the suction fan is located the left side of two cavitys, and the lower terminal surface intercommunication of suction fan has the air intake, and the air intake is located the top of mainboard.

In order to increase the heat radiating area of mainboard, as the utility model relates to a heat abstractor of portable power source mainboard is preferred, a plurality of heat dissipation lugs that are irregular distribution are installed respectively to the upper and lower both ends face of mainboard, the left and right sides of mainboard respectively and portable power source between fixedly connected with buffering gasbag.

In order to realize the radiating effect to portable power source, as the utility model relates to a portable power source mainboard's heat abstractor is preferred, a plurality of evenly distributed's ventilative micropore is seted up respectively to the inside of two cavitys, and a plurality of louvres have been seted up to portable power source's up end.

In order to make the backup pad be connected more stably with the radiating block, as the utility model relates to a heat abstractor of portable power source mainboard is preferred, all installs the rubber circle between a plurality of backup pads and the radiating block, and the inside in two heat absorption chambeies is all filled there is the rock wool board.

For the convenience of connecting the power supply and charging, conduct the utility model relates to a heat abstractor of portable power source mainboard is preferred, and the switch is installed to portable power source's preceding terminal surface, and input interface and output interface have been seted up on portable power source's right side.

Compared with the prior art, the beneficial effects of the utility model are that:

1. this kind of heat abstractor of portable power source mainboard, when the mainboard produced heat in the course of the work, adsorbed the heat on mainboard surface through the heat absorption chamber, transmitted the cavity for by the heat conduction post again, gived off to portable power source's outside by ventilative micropore, can give off the heat secondary on mainboard surface through the inside radiating block of backup pad simultaneously for it gives off speed, and then has realized the quick heat dissipation to portable power source.

2. This kind of heat abstractor of portable power source mainboard presses the pull rod downwards, makes the pull rod promote the rubber ball and moves down, makes the air fly away to the outside of through-hole, and then can make the sucking disc adsorb on the desktop, upwards stimulates the pull rod otherwise, and the pull rod upwards mentions the rubber ball to make the air pass through the through-hole and enter into the sucking disc, the sucking disc loses the adsorption affinity, and then realized the support to portable power source, prevent portable power source and desktop direct contact, avoid water stain entering portable power source to cause the damage.

In conclusion, this kind of heat abstractor of portable power source mainboard has realized carrying out the effect that gives off fast to the portable power source mainboard and has avoided the portable power source mainboard inside to intake simultaneously to influence the problem of portable power source normal use.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a structural diagram of a heat dissipation device of a mobile power supply main board of the present invention;

fig. 2 is a cross-sectional view of a heat dissipation device of a mobile power supply main board of the present invention;

fig. 3 is an enlarged structural view of a portion a in fig. 2 according to the present invention.

The symbols in the figures indicate:

1. a mobile power supply; 101. heat dissipation holes; 2. a base; 3. a main board; 301. a buffer air bag; 302. a heat dissipating bump; 4. a heat absorption cavity; 401. a heat-conducting column; 402. a cavity; 403. air-permeable micropores; 5. a suction fan; 501. an air inlet; 6. a support plate; 601. a rubber ring; 602. a heat dissipating block; 7. a suction cup; 701. a groove; 702. a through hole; 703. a pull rod; 704. a fixing plate; 705. a rubber ball; 706. a spring; 8. a switch; 801. an input interface; 802. and (6) an output interface.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

Referring to fig. 1-3, the present invention provides the following technical solutions: a heat dissipation device for a mobile power supply mainboard comprises a mobile power supply 1, wherein a base 2 is fixedly connected to the lower end face of the mobile power supply 1, a mainboard 3 is installed inside the mobile power supply 1, two cavities 402 are fixedly connected to the upper end face inside the mobile power supply 1, heat-conducting columns 401 are fixedly connected to the lower end faces of the two cavities 402, heat-absorbing cavities 4 are fixedly connected to the lower end faces of the two heat-conducting columns 401, the two heat-absorbing cavities 4 are located above the mainboard 3, a plurality of uniformly distributed supporting plates 6 are fixedly connected to the lower end face of the mainboard 3, and heat dissipation blocks 602 are installed inside the supporting plates 6;

the equal fixedly connected with sucking disc 7 of lower terminal surface of the left and right sides of base 2, recess 701 has all been seted up to the inside left and right sides of base 2, fixed plate 704 is all installed to the inside of two recesses 701, the lower terminal surface of two recesses 701 all communicates there is through-hole 702, install rubber ball 705 between two recesses 701 and two through-holes 702, two pull rods 703 are installed to the up end of base 2, the lower terminal surface of two pull rods 703 all runs through base 2 in proper order, recess 701 and fixed plate 704 and extend to the below of fixed plate 704 and with rubber ball 705 fixed connection, spring 706 is installed to the outer wall of the pull rod 703 that is located fixed plate 704 up end.

In this embodiment: when the mainboard 3 generates heat in the working process, the heat on the surface of the mainboard 3 is absorbed through the heat absorption cavity 4, then is transferred to the cavity 402 through the heat conduction column 401, and is emitted to the outside of the mobile power supply 1 through the ventilation micropores 403, and meanwhile, the heat on the surface of the mainboard 3 can be emitted for the second time through the heat dissipation block 602 in the supporting plate 6, so that the emission speed is increased, and the rapid heat dissipation of the mobile power supply 1 is realized;

press down pull rod 703, make pull rod 703 promote rubber ball 705 and move down, make the air drift to the outside of through-hole 702, and then can make sucking disc 7 adsorb on the desktop, on the contrary upwards stimulate pull rod 703, pull rod 703 upwards mentions rubber ball 705, thereby make the air enter into sucking disc 7 through-hole 702, sucking disc 7 loses the adsorption affinity, and then realized the support to portable power source 1, prevent portable power source 1 and desktop direct contact, avoid water stain entering portable power source 1 to cause the damage.

As the utility model discloses a technical optimization scheme, suction fan 5 is installed to portable power source 1 inside up end, and suction fan 5 is located the left side of two cavities 402, and suction fan 5's lower terminal surface intercommunication has air intake 501, and air intake 501 is located mainboard 3's top.

In this embodiment: the suction fan 5 is started, so that the suction fan 5 sucks heat in the mobile power supply 1 through the air inlet 501, and then the heat is dissipated to the outside of the mobile power supply 1 through the heat dissipation holes 101, and further the heat of the mobile power supply 1 can be dissipated.

As a technical optimization scheme of the utility model, a plurality of heat dissipation lugs 302 that are irregular distribution are installed respectively to mainboard 3's upper and lower both ends face, mainboard 3's the left and right sides respectively with portable power source 1 between fixedly connected with buffering gasbag 301.

In this embodiment: through other alloy synthetic materials such as heat dissipation lug 302 by aluminium, copper, tin, lead, silicon, silver, gold, can increase mainboard 3 and heat radiation structure's area of contact through these heat dissipation lugs 302, and then increase mainboard 3's heat radiating area, improved portable power source 1's radiating efficiency, can protect the left and right sides of mainboard 3 through buffering gasbag 301, mainboard 3 produces the collision with portable power source 1 and damages mainboard 3 when avoiding dropping.

As a technical optimization scheme of the utility model, a plurality of evenly distributed's ventilative micropore 403 has been seted up respectively to the inside of two cavities 402, and a plurality of louvres 101 have been seted up to portable power source 1's up end.

In this embodiment: through ventilative micropore 403 can distribute away the heat in cavity 402 by louvre 101, and then realized the radiating effect to portable power source 1.

As a technical optimization scheme of the utility model, all install rubber circle 601 between a plurality of backup pads 6 and the radiating block 602, the rock wool board has all been filled to the inside in two heat absorption chambeies 4.

In this embodiment: can make backup pad 6 be connected more stably with radiating block 602 through rubber circle 601, difficult not hard up, the rock wool board can adsorb the heat that mainboard 3 produced.

As the utility model discloses a technical optimization scheme, switch 8 is installed to portable power source 1's preceding terminal surface, and input interface 801 and output interface 802 have been seted up on portable power source 1's right side.

In this embodiment: the use of the mobile power supply 1 can be controlled through the switch 8, and the input interface 801 and the output interface 802 are used for connecting the power supply for charging.

The utility model discloses a theory of operation and use flow: the suction fan 5 is started, so that the suction fan 5 sucks the heat in the mobile power supply 1 through the air inlet 501, then the heat is dissipated to the outside of the mobile power supply 1 through the heat dissipation holes 101, further, the heat of the mobile power supply 1 can be dissipated, when the mainboard 3 generates heat in the working process, the heat on the surface of the mainboard 3 is absorbed through the heat absorption cavity 4, then is transferred to the cavity 402 through the heat conduction column 401, and is dissipated to the outside of the mobile power supply 1 through the ventilation micropores 403, meanwhile, the heat dissipation block 602 in the supporting plate 6 can dissipate the heat on the surface of the motherboard 3 for a second time, so as to increase the dissipation speed, the contact area between the motherboard 3 and the heat dissipation structure can be increased by the heat dissipation bumps 302, and then increase mainboard 3's heat radiating area, improved portable power source 1's radiating efficiency, can protect the left and right sides of mainboard 3 through buffering gasbag 301, mainboard 3 and portable power source 1 produce the collision and damage mainboard 3 when having avoided dropping.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. In addition, in the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A heat dissipation device for a mobile power supply mainboard, comprising a mobile power supply (1), characterized in that: the lower end surface of the mobile power supply (1) is fixedly connected with a base (2), and the internal installation of the mobile power supply (1) There is a main board (3), two cavities (402) are fixedly connected to the upper end surface of the mobile power supply (1), and heat conduction columns (401) are fixedly connected to the lower end surfaces of the two cavities (402), The lower end surfaces of the two heat-conducting columns (401) are fixedly connected with heat-absorbing cavities (4), and the two heat-absorbing cavities (4) are both located above the main board (3), and the lower part of the main board (3) The end faces are fixedly connected with a plurality of evenly distributed support plates (6), and heat dissipation blocks (602) are installed inside the plurality of the support plates (6);

The lower end surfaces of the left and right sides of the base (2) are fixedly connected with suction cups (7), and grooves (701) are provided on the left and right sides of the interior of the base (2). ) is installed with a fixing plate (704) inside, the lower end faces of the two grooves (701) are connected with through holes (702), the two grooves (701) and the two through holes (702) A rubber ball (705) is installed between them, and two pull rods (703) are installed on the upper end surface of the base (2), and the lower end faces of the two pull rods (703) pass through the base (2) and the groove (703) in sequence. 701) and the fixing plate (704) and extending to the bottom of the fixing plate (704) and fixedly connected with the rubber ball (705), the outer wall of the pull rod (703) located on the upper end face of the fixing plate (704) is provided with a spring (706) .

2. The cooling device of a mobile power supply mainboard according to claim 1, characterized in that: a suction fan (5) is installed on the upper end face of the mobile power supply (1), and the suction fan (5) is located at two On the left side of each cavity (402), an air inlet (501) is communicated with the lower end surface of the suction fan (5), and the air inlet (501) is located above the main board (3).

3. The heat dissipation device of a mobile power supply mainboard according to claim 1, characterized in that: a plurality of irregularly distributed heat dissipation bumps (302) are respectively installed on the upper and lower end surfaces of the mainboard (3). A buffer air bag (301) is fixedly connected between the left and right sides of the main board (3) and the mobile power supply (1) respectively.

4. The heat dissipation device of a mobile power supply motherboard according to claim 1, characterized in that: a plurality of uniformly distributed air permeable micro-holes (403) are respectively opened in the interior of the two cavities (402), and the The upper end surface of the mobile power supply (1) is provided with a plurality of heat dissipation holes (101).

5. The heat dissipation device of a mobile power supply motherboard according to claim 1, wherein a rubber ring (601) is installed between the plurality of the support plates (6) and the heat dissipation block (602), and two The interior of the heat-absorbing cavity (4) is filled with rock wool boards.

6. The cooling device of a mobile power supply mainboard according to claim 1, characterized in that: a switch (8) is installed on the front end of the mobile power supply (1), and a right side of the mobile power supply (1) is provided with a switch (8). There are input interface (801) and output interface (802).