CN213782010U - Discrete semiconductor device with heat dissipation performance - Google Patents

Abstract

The utility model discloses a semiconductor discrete device with thermal diffusivity, including the semiconductor discrete device plastic-sealed body, semiconductor discrete device plastic-sealed body bottom outer wall fixed mounting has three group's stitchs, semiconductor discrete device plastic-sealed body right side outer wall is provided with the first heat dissipation mechanism that can dismantle, semiconductor discrete device plastic-sealed body left side outer wall is provided with the second and can dismantle heat dissipation mechanism, the first heat dissipation mechanism that can dismantle and the second can dismantle embedded installation between the heat dissipation mechanism and the semiconductor discrete device plastic-sealed body. A discrete semiconductor device with thermal diffusivity, through the fixed establishment that can dismantle that sets up for the dismouting between heat dissipation mechanism can be dismantled more conveniently to first heat dissipation machine of dismantling and the second, can dismantle heat dissipation mechanism with the second through the first heat dissipation mechanism of dismantling that sets up, makes the radiating effect promote greatly, has improved discrete semiconductor device's life, brings better use prospect.

Description

Discrete semiconductor device with heat dissipation performance

Technical Field

The utility model relates to a discrete semiconductor device field specifically is a discrete semiconductor device with thermal diffusivity.

Background

The semiconductor discrete device is a semiconductor crystal diode, a semiconductor triode, a triode for short, and a semiconductor special device, the electronic product is divided into a conductor and an insulator semiconductor between the conductor and the insulator according to the conductive performance, and the semiconductor component is divided into a discrete component and an integrated component in a packaging form, such as: diodes, transistors, etc.

When the existing discrete semiconductor device is installed and used, a large amount of heat is generated, the heat dissipation effect is poor, the service life of the discrete semiconductor device is seriously influenced, certain adverse effect is brought to the use process of people, and therefore the discrete semiconductor device with the heat dissipation performance is provided.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides a discrete semiconductor device with thermal diffusivity possesses efficient heat dispersion, and the problem in the background art can effectively be solved to advantages such as dismouting is convenient.

(II) technical scheme

In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a discrete semiconductor device with thermal diffusivity, includes the discrete semiconductor device plastic-sealed body, discrete semiconductor device plastic-sealed body bottom outer wall fixed mounting has three group's stitchs, discrete semiconductor device plastic-sealed body right side outer wall is provided with the first heat dissipation mechanism of dismantling, discrete semiconductor device plastic-sealed body left side outer wall is provided with the second and can dismantle heat dissipation mechanism, the embedded discrete semiconductor device plastic-sealed body that installs between heat dissipation mechanism can be dismantled to the first heat dissipation mechanism of dismantling and the second.

Preferably, the first detachable heat dissipation mechanism comprises a first heat dissipation mechanism support shell, a first plastic package body placing groove, a fixing pin, a first heat conducting fin, a first spring, a heat dissipation copper sheet, a first heat dissipation fin avoiding groove and a first heat dissipation grid.

Preferably, first plastic-sealed body standing groove has been seted up to first heat dissipation mechanism support housing bottom outer wall, first fin has been seted up at the middle part of first plastic-sealed body standing groove top inner wall and has been dodged the groove, first plastic-sealed body standing groove top fixed mounting has four first springs of group, four groups first spring bottom outer wall fixed mounting has first conducting strip, the middle part fixed mounting of first conducting strip top outer wall has the heat dissipation copper sheet, first fin dodges the groove top inner wall and has seted up first heat dissipation grid, both sides fixed mounting has two sets of fixed pins around first heat dissipation mechanism support housing bottom outer wall.

Preferably, the second detachable heat dissipation mechanism comprises a second heat dissipation mechanism support shell, a detachable fixing mechanism, a second plastic package body placing groove, a fixing mechanism mounting groove, a second heat dissipation fin avoiding groove, a second heat dissipation grid, a third spring, a heat dissipation fin and a second heat conduction fin.

Preferably, the fixed establishment mounting groove has been seted up to the left and right sides of second heat dissipation mechanism support casing top outer wall, fixed establishment mounting groove inner wall fixed mounting has detachable fixed establishment, the second plastic-sealed body standing groove has been seted up at the middle part of second heat dissipation mechanism support casing top outer wall, the second fin has been seted up at the middle part of second plastic-sealed body standing groove bottom inner wall and has been dodged the groove, fixed mounting all around of second plastic-sealed body standing groove bottom inner wall has four groups of third springs, four groups third spring top fixed mounting has the second conducting strip, the middle part fixed mounting of second conducting strip bottom outer wall has the fin, the second fin dodges the tank bottom inner wall and has seted up second heat dissipation grid.

Preferably, can dismantle fixed establishment and include that fixed establishment supporter, activity spacing groove, second spring, activity stopper, fixed mounting groove, fixed pin dodge hole, fixed slot, spacing groove and fixed block, the spacing groove has been seted up to fixed establishment supporter left side outer wall, the inside activity spacing groove of having seted up of fixed establishment supporter, the activity spacing groove link up with the spacing groove each other, fixed mounting groove has been seted up to fixed establishment supporter top outer wall, spacing inslot portion inner wall has been seted up the fixed pin and has been dodged the hole, activity spacing groove right side inner wall fixed mounting has the second spring, second spring left side outer wall fixed mounting has the activity stopper, activity stopper left side outer wall fixed mounting has the fixed block, the fixed slot has been seted up to fixed block top outer wall.

(III) advantageous effects

Compared with the prior art, the utility model provides a discrete semiconductor device with thermal diffusivity possesses following beneficial effect:

1. the semiconductor discrete device with heat dissipation performance is characterized in that a semiconductor discrete device plastic package body is placed in a second plastic package body placing groove on a second detachable heat dissipation mechanism through a detachable fixing mechanism, a first detachable heat dissipation mechanism is downwards moved and pressed by aligning to a fixing mounting groove on the second detachable heat dissipation mechanism through a fixing pin, because the bottom of the fixing pin is of a round platform structure, when the fixing pin moves downwards, an inclined plane of a fixing pin round platform surface is abutted against a fixing groove on the fixing block, the fixing block moves towards the inside of a fixing mechanism supporting body, a movable limiting block on the fixing block correspondingly compresses a second spring at the rear part to move inwards while the fixing block moves inwards until the round platform structure of the fixing pin moves into a fixing pin avoiding hole, the second spring rebounds to drive the movable limiting block to move backwards, and meanwhile, the fixing block on the movable limiting block correspondingly moves backwards, make spacing inslot wall on the fixed mounting groove support the fixed pin and make it fixed, accomplish first heat dissipation mechanism and the second can be dismantled heat dissipation mechanism fixed mounting so far, only need press the fixed block inwards when demolising, upwards extract first heat dissipation mechanism can of dismantling, this mechanism dismouting is convenient, is convenient for install and change.

2. The semiconductor discrete device with heat dissipation performance is characterized in that a first detachable heat dissipation mechanism and a second detachable heat dissipation mechanism are arranged, a first heat conducting strip and a second heat conducting strip in the first detachable heat dissipation mechanism and the second detachable heat dissipation mechanism are tightly attached to a semiconductor discrete device plastic package body at the same time of the closed installation of the first detachable heat dissipation mechanism and the second detachable heat dissipation mechanism, when the first detachable heat dissipation mechanism and the second detachable heat dissipation mechanism are mutually closed and moved, the first heat conducting strip moves towards the inside of the first detachable heat dissipation mechanism to compress a first spring at the rear part of the first detachable heat dissipation mechanism, the second heat conducting strip moves towards the inside of the second detachable heat dissipation mechanism to compress a third spring at the rear part of the second detachable heat dissipation mechanism, and when the first detachable heat dissipation mechanism and the second detachable heat dissipation mechanism are completely closed, the resilience force of the springs causes the first heat conducting strip and the second heat conducting strip to be tightly attached to the outer wall of the semiconductor discrete device plastic package body, the effective contact area is improved, so that heat inside the semiconductor discrete device plastic package body is better conducted to the first heat conducting strip and the second heat conducting strip, then the first heat conducting strip and the second heat conducting strip are conducted to the heat dissipation copper sheet and the heat dissipation strip respectively, the heat is conducted to the air quickly, and the heat dissipation effect is greatly improved.

Drawings

Fig. 1 is a schematic diagram of an overall structure of a discrete semiconductor device having heat dissipation properties according to the present invention.

Fig. 2 is an exploded view of a discrete semiconductor device with heat dissipation according to the present invention.

Fig. 3 is a schematic diagram of an internal structure of a first detachable heat dissipation mechanism of a discrete semiconductor device having heat dissipation characteristics according to the present invention.

Fig. 4 is a schematic diagram of an internal structure of a second detachable heat dissipation mechanism of a discrete semiconductor device having a heat dissipation property according to the present invention.

Fig. 5 is a schematic diagram of an internal structure of a detachable fastening mechanism of a discrete semiconductor device having heat dissipation properties according to the present invention.

In the figure: 1. a semiconductor separator plastic package body; 2. a first detachable heat dissipation mechanism; 201. the first heat dissipation mechanism supports the housing; 202. a first plastic package body placing groove; 203. a fixing pin; 204. a first thermally conductive sheet; 205. a first spring; 206. a heat dissipation copper sheet; 207. the first heat sink avoiding groove; 208. a first heat dissipation grid; 3. a second detachable heat dissipation mechanism; 301. the second heat dissipation mechanism supports the shell; 302. a detachable fixing mechanism; 3021. a fixed mechanism support; 3022. a movable limiting groove; 3023. a second spring; 3024. a movable limiting block; 3025. fixing the mounting groove; 3026. a fixed pin avoiding hole; 3027. fixing grooves; 3028. a limiting groove; 3029. a fixed block; 303. a second plastic package body placing groove; 304. a fixed mechanism mounting groove; 305. the second heat radiating fin avoiding groove; 306. a second heat dissipation grid; 307. a third spring; 308. a heat sink; 309. a second thermally conductive sheet; 4. and (4) stitching.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

As shown in fig. 1-5, a discrete semiconductor device with heat dissipation performance includes a discrete semiconductor device plastic package body 1, three sets of pins 4 are fixedly installed on the outer wall of the bottom of the discrete semiconductor device plastic package body 1, a first detachable heat dissipation mechanism 2 is installed on the outer wall of the right side of the discrete semiconductor device plastic package body 1, a second detachable heat dissipation mechanism 3 is installed on the outer wall of the left side of the discrete semiconductor device plastic package body 1, and the discrete semiconductor device plastic package body 1 is installed between the first detachable heat dissipation mechanism 2 and the second detachable heat dissipation mechanism 3 in an embedded manner.

Further, the first detachable heat dissipation mechanism 2 includes a first heat dissipation mechanism support housing 201, a first plastic package body placement groove 202, a fixing pin 203, a first heat conduction fin 204, a first spring 205, a heat dissipation copper sheet 206, a first heat dissipation fin avoiding groove 207 and a first heat dissipation grid 208, and the heat on the semiconductor discrete device plastic package body 1 can be quickly absorbed through the first heat conduction fin 204 for heat conduction and heat dissipation.

Further, a first plastic package body placing groove 202 is formed in the outer wall of the bottom of the first heat dissipation mechanism supporting shell 201, a first heat dissipation fin avoiding groove 207 is formed in the middle of the inner wall of the top of the first plastic package body placing groove 202, four groups of first springs 205 are fixedly mounted on the periphery of the top of the first plastic package body placing groove 202, first heat conduction fins 204 are fixedly mounted on the outer walls of the bottoms of the four groups of first springs 205, heat dissipation copper sheets 206 are fixedly mounted in the middle of the outer wall of the top of the first heat conduction fins 204, a first heat dissipation grating 208 is formed in the inner wall of the top of the first heat dissipation mechanism supporting shell 207, two groups of fixing pins 203 are fixedly mounted on the front side and the rear side of the outer wall of the bottom of the first heat dissipation mechanism supporting shell 201, and the first springs 205 are arranged on the front side and the rear side of the outer wall of the bottom of the first heat conduction fins 204 and the semiconductor discrete device plastic package body 1, so that the first heat conduction fins 204 and the semiconductor discrete device are attached to each other.

Further, the second detachable heat dissipation mechanism 3 includes a second heat dissipation mechanism support housing 301, a detachable fixing mechanism 302, a second plastic package placing groove 303, a fixing mechanism mounting groove 304, a second heat dissipation fin avoiding groove 305, a second heat dissipation grid 306, a third spring 307, a heat dissipation fin 308, and a second heat conduction fin 309, and the second heat dissipation grid 306 is arranged to enable the air inside the second detachable heat dissipation mechanism 3 to contact with the outside air, so that heat is conducted in the air, and the heat dissipation efficiency is accelerated.

Further, the left and right sides of the outer wall of the top of the second heat dissipation mechanism support housing 301 are provided with fixing mechanism mounting grooves 304, the inner wall of the fixing mechanism mounting groove 304 is fixedly provided with a detachable fixing mechanism 302, the middle part of the outer wall of the top of the second heat dissipation mechanism support housing 301 is provided with a second plastic package placing groove 303, the middle part of the inner wall of the bottom of the second plastic package placing groove 303 is provided with a second heat sink avoiding groove 305, the periphery of the inner wall of the bottom of the second plastic package placing groove 303 is fixedly provided with four groups of third springs 307, the tops of the four groups of third springs 307 are fixedly provided with second heat conducting fins 309, the middle part of the outer wall of the bottom of the second heat conducting fins 309 is fixedly provided with heat sinks 308, the inner wall of the bottom of, through the fixed mechanism mounting groove 304 that sets up for the installation between the heat dissipation mechanism 3 and the semiconductor discrete device plastic-sealed body 1 can be dismantled to the second is more convenient.

Further, the detachable fixing mechanism 302 includes a fixing mechanism support 3021, a movable limiting groove 3022, a second spring 3023, a movable limiting block 3024, a fixed mounting groove 3025, a fixed pin avoiding hole 3026, a fixed groove 3027, a limiting groove 3028 and a fixed block 3029, the fixing mechanism support 3021 has a limiting groove 3028 on the outer wall on the left side, the fixing mechanism support 3021 has a movable limiting groove 3022 inside, the movable limiting groove 3022 and the limiting groove 3028 are communicated with each other, the fixing mechanism support 3021 has a fixed mounting groove 3025 on the outer wall on the top portion, the fixed pin avoiding hole 3026 is formed on the inner wall on the bottom portion of the limiting groove 3028, the second spring 3023 is fixedly mounted on the inner wall on the right side of the movable limiting groove 3022, the movable limiting block 3024 is fixedly mounted on the outer wall on the left side of the second spring 3023, the fixed block 3029 has a fixed groove 3027 on the outer wall on the, the second detachable heat dissipation mechanism 3 and the first detachable heat dissipation mechanism 2 can be disassembled and assembled more conveniently.

Principle of operation

The application patent comprises a semiconductor discrete device plastic package body 1, a first detachable heat dissipation mechanism 2, a first heat dissipation mechanism support shell 201, a first plastic package body placing groove 202, a fixing pin 203, a first heat conduction sheet 204, a first spring 205, a heat dissipation copper sheet 206, a first heat dissipation sheet avoiding groove 207, a first heat dissipation grid 208, a second detachable heat dissipation mechanism 3, a second heat dissipation mechanism support shell 301, a detachable fixing mechanism 302, a fixing mechanism 302support body 1, a movable limiting groove 3022, a second spring 3023, a movable limiting block 3024, a fixing mounting groove 3025, a fixing pin avoiding hole 3026, a fixing groove 3027, a limiting groove 3028, a fixing block 3029, a second plastic package body placing groove 303, a fixing mechanism mounting groove 304, a second heat dissipation sheet avoiding groove 305, a second heat dissipation grid 306, a third spring 307, a heat dissipation sheet 308, a second heat conduction sheet 309 and a pin 4, firstly the semiconductor discrete device plastic package body 1 is placed in the second plastic package body placing groove 303 on the second detachable heat dissipation mechanism 3, the first detachable heat dissipation mechanism 2 is aligned with the fixed mounting groove 3025 on the second detachable heat dissipation mechanism 3 to move downwards and press through the fixing pin 203, because the bottom of the fixing pin 203 is in a round table structure, when moving downwards, the inclined surface of the round table surface of the fixing pin 203 abuts against the fixed groove 3027 on the fixed block 3029, so that the fixed block 3029 moves towards the inside of the fixing mechanism support 3021, while the fixed block 3029 moves towards the inside, the second spring 3023 located at the rear of the fixed block 3029 and compressed correspondingly moves inwards until the round table structure of the fixing pin 203 moves into the fixing pin avoiding hole 3026, the second spring 3023 rebounds to drive the movable limiting block 3024 to move backwards, and meanwhile, the fixed block 3029 located on the movable limiting block 3024 also moves backwards correspondingly, so that the inner wall of the limiting groove 3028 on the fixed mounting groove 3025 abuts against the fixing pin 203 to fix the fixed mounting groove, thus completing the fixed mounting of the first detachable heat dissipation mechanism 2 and the second detachable heat dissipation mechanism 3, when the first detachable heat dissipation mechanism 2 and the second detachable heat dissipation mechanism 3 are closed to be installed, the first heat conduction sheet 204 and the second heat conduction sheet 309 in the first detachable heat dissipation mechanism 2 and the second detachable heat dissipation mechanism 3 are tightly attached to the semiconductor discrete device plastic package body 1, when the first detachable heat dissipation mechanism 2 and the second detachable heat dissipation mechanism 3 are closed to move, the first heat conduction sheet 204 moves towards the inside of the first detachable heat dissipation mechanism 2 to compress the first spring 205 at the rear part, the second heat conduction sheet 309 moves towards the inside of the second detachable heat dissipation mechanism 3 to compress the third spring 307 at the rear part, when the first detachable heat dissipation mechanism 2 and the second detachable heat dissipation mechanism 3 are fully closed, because the compression resilience force of the spring enables the first heat conducting strip 204 and the second heat conducting strip 309 to be tightly attached to the outer wall of the semiconductor discrete device plastic package body 1, effective contact area is improved, heat inside the semiconductor discrete device plastic package body 1 is conducted on the first heat conducting strip 204 and the second heat conducting strip 309 better, and then the first heat conducting strip 204 and the second heat conducting strip 309 are conducted to the heat dissipation copper sheet 206 and the heat dissipation fins 308 respectively, so that the heat dissipation effect is greatly improved.

It is noted that, herein, relational terms such as first and second (a, b, etc.) and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (6)

1. A semiconductor discrete device having heat dissipation properties, comprising a semiconductor discrete device molding body (1), characterized in that: semiconductor discrete ware plastic-sealed body (1) bottom outer wall fixed mounting has three group's stitch (4), semiconductor discrete ware plastic-sealed body (1) right side outer wall is provided with first detachable heat dissipation mechanism (2), semiconductor discrete ware plastic-sealed body (1) left side outer wall is provided with the second and can dismantle heat dissipation mechanism (3), embedded installation has semiconductor discrete ware plastic-sealed body (1) between heat dissipation mechanism (3) can be dismantled to first detachable heat dissipation mechanism (2) and second.

2. The semiconductor discrete device with heat dissipation performance according to claim 1, wherein: the first detachable heat dissipation mechanism (2) comprises a first heat dissipation mechanism supporting shell (201), a first plastic package body placing groove (202), a fixing pin (203), a first heat conducting fin (204), a first spring (205), a heat dissipation copper sheet (206), a first heat dissipation fin avoiding groove (207) and a first heat dissipation grid (208).

3. The semiconductor discrete device with heat dissipation performance according to claim 2, wherein: first heat dissipation mechanism supports casing (201) bottom outer wall and has seted up first plastic-sealed body standing groove (202), first fin has been seted up at the middle part of first plastic-sealed body standing groove (202) top inner wall and has been dodged groove (207), fixed mounting has four groups of first spring (205), four groups all around at first plastic-sealed body standing groove (202) top first spring (205) bottom outer wall fixed mounting has first conducting strip (204), the middle part fixed mounting of first conducting strip (204) top outer wall has heat dissipation copper sheet (206), first fin is dodged groove (207) top inner wall and has been seted up first heat dissipation grid (208), both sides fixed mounting has two sets of fixed pins (203) around first heat dissipation mechanism supports casing (201) bottom outer wall.

4. The semiconductor discrete device with heat dissipation performance according to claim 1, wherein: the second detachable heat dissipation mechanism (3) comprises a second heat dissipation mechanism supporting shell (301), a detachable fixing mechanism (302), a second plastic package body placing groove (303), a fixing mechanism mounting groove (304), a second heat dissipation fin avoiding groove (305), a second heat dissipation grid (306), a third spring (307), heat dissipation fins (308) and second heat conduction fins (309).

5. The semiconductor discrete device with heat dissipation performance according to claim 4, wherein: the left side and the right side of the outer wall of the top of the second heat dissipation mechanism supporting shell (301) are provided with fixing mechanism mounting grooves (304), the inner wall of the fixing mechanism mounting groove (304) is fixedly provided with a detachable fixing mechanism (302), a second plastic package body placing groove (303) is formed in the middle of the outer wall of the top of the second heat dissipation mechanism supporting shell (301), a second heat radiating fin avoiding groove (305) is formed in the middle of the inner wall of the bottom of the second plastic package body placing groove (303), four groups of third springs (307) are fixedly arranged on the periphery of the inner wall of the bottom of the second plastic package body placing groove (303), second heat-conducting fins (309) are fixedly arranged on the tops of the four groups of third springs (307), a radiating fin (308) is fixedly arranged in the middle of the outer wall of the bottom of the second heat-conducting fin (309), and a second heat dissipation grid (306) is arranged on the inner wall of the bottom of the second heat dissipation sheet avoiding groove (305).

6. The semiconductor discrete device with heat dissipation performance according to claim 4, wherein: the detachable fixing mechanism (302) comprises a fixing mechanism supporting body (3021), a movable limiting groove (3022), a second spring (3023), a movable limiting block (3024), a fixed mounting groove (3025), a fixed pin avoiding hole (3026), a fixed groove (3027), a limiting groove (3028) and a fixed block (3029), the limiting groove (3028) has been opened on the outer wall of the left side of the fixing mechanism supporting body (3021), the movable limiting groove (3022) has been opened inside the fixing mechanism supporting body (3021), the movable limiting groove (3022) and the limiting groove (3028) have been communicated with each other, the fixed mounting groove (3025) has been opened on the outer wall of the top of the fixing mechanism supporting body (3021), the fixed pin avoiding hole (3026) has been opened on the inner wall of the bottom of the limiting groove (3028), the second spring (3023) has been fixedly mounted on the inner wall of the right side of the movable limiting groove (3022), the movable limiting block (3024) has been fixedly mounted on the outer wall of the left side of the second spring (3023), a fixed block (3029) is fixedly mounted on the outer wall of the left side of the movable limited block (3024), and a fixed groove (3027) is formed in the outer wall of the top of the fixed block (3029).

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