CN213754953U

CN213754953U - Micro-electromechanical structure, electronic cigarette switch and electronic cigarette

Info

Publication number: CN213754953U
Application number: CN202022169219.8U
Authority: CN
Inventors: 荣根兰; 孟燕子; 孙恺; 胡维
Original assignee: Memsensing Microsystems Suzhou China Co Ltd
Current assignee: Memsensing Microsystems Suzhou China Co Ltd
Priority date: 2020-09-28
Filing date: 2020-09-28
Publication date: 2021-07-20
Anticipated expiration: 2030-09-28
Also published as: WO2022062986A1

Abstract

The application discloses a micro-electromechanical structure, an electronic cigarette switch and an electronic cigarette, wherein the micro-electromechanical structure comprises a substrate and a cavity; the vibrating membrane is positioned on the substrate and covers the cavity; and the back plate is positioned on the vibrating membrane, and a gap is reserved between the back plate and the vibrating membrane, wherein the back plate comprises an electrode plate and an insulating layer for coating the electrode plate, and the electrode plate and the vibrating membrane are at least electrically isolated by the insulating layer. According to the micro-electromechanical structure, the insulating layer for coating the electrode plate is arranged in the back plate, so that the problem of short circuit between the back plate and the vibrating membrane in the micro-electromechanical structure caused by pollutants such as oil stains is solved.

Description

Micro-electromechanical structure, electronic cigarette switch and electronic cigarette

Technical Field

The present application relates to the field of semiconductor device manufacturing, and more particularly, to a micro-electromechanical structure, an electronic cigarette switch, and an electronic cigarette.

Background

Devices manufactured based on Micro Electro Mechanical Systems (MEMS) are called MEMS devices, which mainly include a diaphragm and a backplate with a gap therebetween. The change of the air pressure can cause the vibration membrane to deform, and the capacitance value between the vibration membrane and the electrode plate is changed, so that the vibration membrane is converted into an electric signal to be output.

In the prior art, the MEMS device is applied in some special environments, for example, there are contaminants such as oil stains in the environment, and if these contaminants enter the gap between the diaphragm and the back plate, these contaminants are very likely to cause the problem of short circuit between the diaphragm and the electrode plate, and further cause the MEMS device to fail.

Accordingly, it is desirable to provide an improved microelectromechanical structure to improve the performance of the product.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a modified micro-electromechanical structure, electron cigarette switch and electron cigarette through set up the insulating layer of cladding electrode board in the backplate to the problem of backplate and vibrating diaphragm short circuit among the micro-electromechanical structure has been improved because pollutants such as greasy dirt leads to.

According to the utility model discloses an aspect provides a micro electromechanical structure, include: a substrate having a cavity; the vibrating membrane is positioned on the substrate and covers the cavity; and the back plate is positioned on the vibrating membrane, a gap is reserved between the back plate and the vibrating membrane, the back plate comprises an electrode plate and an insulating layer wrapping the electrode plate, and the electrode plate and the vibrating membrane are at least electrically isolated by the insulating layer.

Optionally, the gap and the cavity are separated by the diaphragm.

Optionally, the insulating layer comprises a first insulating layer and a second insulating layer, the electrode plate is sandwiched between the first insulating layer and the second insulating layer,

the first insulating layer is positioned on the first surface, close to the vibrating membrane, of the electrode plate and provided with a plurality of first through holes; the electrode plate has a plurality of second through holes, each of which is aligned with a corresponding one of the first through holes; the second insulating layer covers the second surface of the electrode plate, the side wall of each first through hole and the side wall of each second through hole, the first surface of the electrode plate is opposite to the second surface, and the back plate further comprises a plurality of air holes surrounded by the second insulating layer covering the side walls of the first through holes and the second through holes.

Optionally, the pore size of each pore is in a range of 1 to 50 μm and/or the pitch of adjacent pores is in a range of 2 to 100 μm.

Optionally, the vibration isolation structure further comprises a plurality of anti-sticking structures, wherein the anti-sticking structures are positioned between the first insulating layer and the vibration membrane and fixed on the first insulating layer.

Optionally, the method further comprises: a first supporting layer between the diaphragm and the first insulating layer; and a barrier layer covering sidewalls of the first support layer.

Optionally, a second support layer is further included, between the first insulating layer and the substrate.

Optionally, the insulating layer is a silicon nitride layer.

According to a second aspect of embodiments of the present invention, there is provided an electronic cigarette switch comprising a micro electromechanical structure as described above.

According to a third aspect of the embodiments of the present invention, there is provided an electronic cigarette, comprising the electronic cigarette switch as described above.

The embodiment of the utility model provides a micro-electromechanical structure has set up the insulating layer of cladding plate electrode in the backplate, even the greasy dirt has got into the clearance between backplate and the vibrating diaphragm, plate electrode in the backplate is kept apart by insulating layer electricity at least with the vibrating diaphragm to the problem of backplate and vibrating diaphragm short circuit in leading to micro-electromechanical structure because pollutants such as greasy dirt has been improved.

Furthermore, the vibrating membrane separates the gap from the cavity in the substrate, so that the path of oil contamination entering the gap from the cavity of the substrate is sealed, and the probability of the oil contamination entering the gap is reduced.

Furthermore, the total number of the air holes is controlled by controlling the distance between the adjacent air holes on the back plate so as to reduce the probability that the oil stain enters the gap through the air holes; or the aperture of each air hole is controlled, so that the probability that the oil stain enters the gap through the air holes is reduced.

Therefore, the utility model provides a micro-electromechanical structure, electron cigarette switch and electron cigarette can improve the performance of product greatly.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings of the embodiments will be briefly introduced below, and it is apparent that the drawings in the following description only relate to some embodiments of the present application and are not limiting on the present application.

Fig. 1 shows a schematic perspective structure diagram of a micro electromechanical structure according to an embodiment of the present invention.

Fig. 2 shows a cross-sectional view of a micro-electromechanical structure according to an embodiment of the present invention.

Fig. 3 shows an enlarged schematic diagram of the structure outlined in dashed lines in fig. 2.

Fig. 4 shows a schematic structural diagram of an electronic cigarette switch according to an embodiment of the present invention.

Detailed Description

The invention will be described in more detail below with reference to the accompanying drawings. Like elements in the various figures are denoted by like reference numerals. For purposes of clarity, the various features in the drawings are not necessarily drawn to scale. In addition, certain well known components may not be shown. For simplicity, the semiconductor structure obtained after several steps can be described in one figure.

It will be understood that when a layer or region is referred to as being "on" or "over" another layer or region in describing the structure of the device, it can be directly on the other layer or region or intervening layers or regions may also be present. And, if the device is turned over, that layer, region, or regions would be "under" or "beneath" another layer, region, or regions.

If for the purpose of describing the situation directly on another layer, another area, the expressions "directly on … …" or "on … … and adjacent thereto" will be used herein.

Numerous specific details of the invention, such as structure, materials, dimensions, processing techniques and techniques of the devices are described below in order to provide a more thorough understanding of the invention. However, as will be understood by those skilled in the art, the present invention may be practiced without these specific details.

The present invention may be presented in a variety of forms, some of which are described below.

Fig. 1 shows a schematic perspective structure diagram of a micro electromechanical structure according to an embodiment of the present invention, fig. 2 shows a cross-sectional view of the micro electromechanical structure according to an embodiment of the present invention, and fig. 3 shows an enlarged schematic structural diagram of a virtual frame in fig. 2.

As shown in fig. 1 to 3, the micro-electromechanical structure 100 of the present invention includes: a substrate 110, a diaphragm 130, and a backplate 160. The substrate 110 has a cavity 101, and the diaphragm 130 is located on the substrate 110 and covers the cavity 101. The backplate 160 is positioned on the diaphragm 130 with a gap 102 therebetween. The backplate 160 includes an electrode plate 163 and an insulating layer covering the electrode plate 163, and the electrode plate 163 and the diaphragm 130 are electrically isolated by the insulating layer. In some embodiments, the diaphragm 130 is a single film layer without any through-hole structure, such that the cavity 101 and the gap 102 are separated by the diaphragm 130. In the present embodiment, the material of the diaphragm 130 includes polysilicon or other conductive material, and the thickness of the diaphragm 130 ranges between 0 and 5 μm. However, the embodiments of the present invention are not limited thereto, and those skilled in the art may make other arrangements to the size and material of the diaphragm 130 as needed.

In some other embodiments, the back plate 160 further includes a plurality of air holes 164, the insulating layer includes a first insulating layer 161 and a second insulating layer 162, and the electrode plate 163 is sandwiched between the first insulating layer 161 and the second insulating layer 162. The first insulating layer 161 is located on the first surface of the electrode plate 163 near the diaphragm 130. The first insulating layer 161 has a plurality of first through holes 161a, and the electrode plate 163 has a plurality of second through holes 163a, each of the second through holes 163a being aligned with a corresponding one of the first through holes 161 a. The second insulating layer 162 covers the second surface of the electrode plate 163, the sidewall of each first via hole 161a, and the sidewall of each second via hole 163 a. The first surface of the electrode plate 163 is opposite to the second surface. The plurality of air holes 164 are defined by being surrounded by the second insulating layer 162 covering sidewalls of the first and second through

holes

161a and 163 a. Each air hole 164 is concentric with the first through hole 161a or the second through hole 163a, an aperture d2 of each air hole 164 is smaller than the aperture d1 of the corresponding first through hole 161a or the second through hole 163a, and an aperture d2 of each air hole 164 ranges from 1 to 50 μm. The pitch range of the adjacent air holes 164 includes 2 to 100 μm. The insulating layer formed of the first insulating layer 161 and the second insulating layer 162 is a silicon nitride layer. However, the embodiments of the present invention are not limited thereto, and other configurations of the aperture, the interval and the material of the insulating layer of each air hole 164 may be performed by those skilled in the art as needed, and the shape of the air hole 164 includes, but is not limited to, a circular hole.

The microelectromechanical structure 100 also includes: a first support layer 140, a second support layer 120, a barrier layer 150, a pad 171, and a pad 172. The first supporting layer 140 is located between the diaphragm 130 and the first insulating layer 161. The

pads

171 and 172 are located on the backplate 160, the

pads

171 and 160 are electrically connected, and the pads 172 and the diaphragm 130 are electrically connected.

The second support layer 120 is a portion left on the substrate 110 after the sacrificial layer is released, the second support layer 120 is located on a peripheral edge of the substrate 110, and the diaphragm 130 located above the second support layer 120 is supported on the substrate 110 in a manner that the peripheral edge is fully clamped. The first support layer 140 is a portion left on the diaphragm 130 after the sacrificial layer is released, wherein the barrier layer 150 covers the sidewall of the first support layer 140 for preventing the first support layer 140 from being damaged in the releasing step. The first support layer 140 corresponds to the second support layer 120, the first support layer 140 is located on the peripheral edge of the diaphragm 120, and the back plate 160 located above the first support layer 140 is supported on the substrate 110 and the diaphragm 130 in a manner that the peripheral edge is completely clamped, so that a predetermined distance is spaced between the part of the back plate 160 not in contact with the first support layer 140 and the diaphragm 130. The material of the second support layer 120 and the first support layer 140 includes silicon oxide, and the material of the barrier layer 150 includes silicon nitride. However, the embodiments of the present invention are not limited thereto, and those skilled in the art may make other arrangements as needed for the materials of the second support layer 120, the first support layer 140, and the barrier layer 150 and the supporting and fixing manner among the substrate 110, the diaphragm 130, and the backplate 120.

In some preferred embodiments, the mems structure 100 further comprises a plurality of anti-adhesion structures 170 for preventing the back plate 160 from adhering to the diaphragm 130. The plurality of anti-sticking structures 170 are positioned between the first insulating layer 161 and the diaphragm 130, and are fixed on the first insulating layer 161. In some specific embodiments, the material of the plurality of anti-adhesion structures 170 comprises silicon nitride, the plurality of anti-adhesion structures 170 are triangular pyramid or cylinder structures with a radius of the bottom surface ranging from 0.5 μm to 5 μm, a height ranging from 0 μm to 5 μm, and a spacing between adjacent anti-adhesion structures 170 ranging from 5 μm to 100 μm. However, embodiments of the present invention are not limited thereto, and other arrangements of the material and dimensions of the anti-adhesion structure 170 may be implemented by those skilled in the art as desired.

As shown in fig. 4, the electronic cigarette switch includes: micro-electromechanical structure 100, chip structure 200, substrate 300, shell 400. The micro-electromechanical structure 100 according to the embodiment of the present invention can refer to the descriptions of fig. 1 to fig. 3, which are not described herein again, the chip structure 200 is, for example, an ASIC chip, and the substrate 300 is, for example, a lead frame or a PCB circuit board. In the embodiment, the micro-electromechanical structure 100 and the chip structure 200 are electrically connected through the

pads

171 and 172, the substrate 300 and the housing 400 are used to form an accommodating cavity, and the micro-electromechanical structure 100 and the chip structure 200 are located in the accommodating cavity.

The utility model also provides an electron cigarette, include as above electron cigarette switch, wherein, the atomizing circuit or the heating circuit in base plate 300 and the electron cigarette are connected. In the process of user's suction, because the change of atmospheric pressure can lead to micro electromechanical structure 100's vibrating diaphragm to warp, the capacitance value between vibrating diaphragm and the plate electrode changes to convert the signal of telecommunication output into, the electronic cigarette switch judges whether start the atomizing circuit or the heating circuit in the electronic cigarette through this signal of telecommunication.

Therefore, the utility model provides a micro-electromechanical structure, electron cigarette switch and electron cigarette can improve the performance of product greatly. Especially in the electron cigarette use or under the condition that appears the oil leak phenomenon after storing a period, adopt the utility model provides a micro electromechanical structure can effectively prevent the product inefficacy problem that the greasy dirt pollution brought.

In the above description, the technical details of patterning, etching, and the like of each layer are not described in detail. It will be appreciated by those skilled in the art that layers, regions, etc. of the desired shape may be formed by various technical means. In addition, in order to form the same structure, those skilled in the art can also design a method which is not exactly the same as the method described above. In addition, although the embodiments are described separately above, this does not mean that the measures in the embodiments cannot be used in advantageous combination.

The embodiments of the present invention have been described above. However, these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof. Various alternatives and modifications can be devised by those skilled in the art without departing from the scope of the present invention, and these alternatives and modifications are intended to fall within the scope of the present invention.

Claims

1. A microelectromechanical structure, comprising:

a substrate having a cavity;

the vibrating membrane is positioned on the substrate and covers the cavity; and

a back plate on the diaphragm with a gap therebetween,

the back plate comprises an electrode plate and an insulating layer wrapping the electrode plate, and the electrode plate and the vibrating membrane are at least electrically isolated by the insulating layer.

2. A microelectromechanical structure of claim 1, characterized in that the gap and the cavity are separated by the diaphragm.

3. The microelectromechanical structure of claim 1, characterized in that the insulating layer comprises a first insulating layer and a second insulating layer, the electrode plate being sandwiched between the first insulating layer and the second insulating layer,

the first insulating layer is positioned on the first surface, close to the vibrating membrane, of the electrode plate and provided with a plurality of first through holes; the electrode plate has a plurality of second through holes, each of which is aligned with a corresponding one of the first through holes; the second insulating layer covers a second surface of the electrode plate, a sidewall of each of the first through holes, and a sidewall of each of the second through holes, the first surface of the electrode plate being opposite to the second surface,

the backplate also includes a plurality of air holes surrounded by the second insulating layer covering the sidewalls of the first and second through holes.

4. A microelectromechanical structure of claim 3, characterized in that the pore size range of each air hole comprises 1 to 50 μm and/or the pitch range of adjacent air holes comprises 2 to 100 μm.

5. The microelectromechanical structure of claim 3, further comprising a plurality of anti-sticking structures positioned between the first insulating layer and the diaphragm and secured to the first insulating layer.

6. The microelectromechanical structure of any of claims 3 to 5, characterized by further comprising:

a first supporting layer between the diaphragm and the first insulating layer; and

and the barrier layer covers the side wall of the first support layer.

7. The microelectromechanical structure of claim 6, further comprising a second support layer positioned between the first insulating layer and the substrate.

8. A microelectromechanical structure of any of claims 1 to 5, characterized in that the insulating layer is a silicon nitride layer.

9. An electronic cigarette switch comprising a microelectromechanical structure of any of claims 1 to 8.

10. An electronic cigarette comprising the electronic cigarette switch of claim 9.