CN213752016U - Polyimide enameled round copper wire for mobile phone - Google Patents

Polyimide enameled round copper wire for mobile phone Download PDF

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Publication number
CN213752016U
CN213752016U CN202022974215.7U CN202022974215U CN213752016U CN 213752016 U CN213752016 U CN 213752016U CN 202022974215 U CN202022974215 U CN 202022974215U CN 213752016 U CN213752016 U CN 213752016U
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CN
China
Prior art keywords
layer
heat dissipation
copper line
carbon black
line body
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202022974215.7U
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Chinese (zh)
Inventor
赵超超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ruian Xiandeng Copper Co ltd
Original Assignee
Ruian Xiandeng Copper Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ruian Xiandeng Copper Co ltd filed Critical Ruian Xiandeng Copper Co ltd
Priority to CN202022974215.7U priority Critical patent/CN213752016U/en
Application granted granted Critical
Publication of CN213752016U publication Critical patent/CN213752016U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a polyimide enameled round copper line for cell-phone, including copper line body, the outer wall of copper line body is provided with the protective layer, the inside of copper line body is provided with insulating layer, heat dissipation layer, white carbon black layer and waterproof layer, the heat dissipation level is in the lower extreme surface of insulating layer, the white carbon black level is in the lower extreme surface on heat dissipation layer, the waterproof layer is located the lower extreme surface on white carbon black layer, the inside of protective layer is provided with non-conductive layer and anticorrosive coating. A polyimide enameled round copper line for cell-phone, through insulating layer, heat dissipation layer, white carbon black layer and the waterproof layer that sets up, be favorable to improving the practicality of copper line body, through protective layer, non-conductive layer and the anti-corrosion coating that sets up, be favorable to improving the life of copper line body to be favorable to improving its practicality, this equipment is simple structure not only, convenient operation brings better use prospect moreover.

Description

Polyimide enameled round copper wire for mobile phone
Technical Field
The utility model relates to a polyimide enameled round copper line field, in particular to polyimide enameled round copper line for cell-phone.
Background
In life, practical copper wires are used as leads. The high-plasticity copper alloy has good electrical conductivity, is widely used for manufacturing electric wires, cables, electric brushes and the like, has good thermal conductivity, is commonly used for manufacturing magnetic instruments and meters needing anti-magnetic interference, such as compasses, aviation instruments and the like, has good plasticity, is easy for hot-pressing and cold-pressing processing, can be made into copper materials such as pipes, rods, wires, strips, belts, plates, foils and the like, and can be made into two types of smelting products and processed products.
There is certain drawback when using in current polyimide enameled round copper line, at first in the use, current polyimide enameled round copper line protective properties is relatively poor, is unfavorable for the use, and current polyimide enameled round copper line practicality is lower moreover, and polyimide enameled round copper line life is lower, and the use of giving people has brought certain adverse effect, for this reason, we propose a polyimide enameled round copper line for cell-phone.
Disclosure of Invention
The utility model aims to provide a polyimide enameled round copper wire for mobile phone can effectively solve the problem in the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a polyimide enameled round copper line for cell-phone, includes the copper line body, the outer wall of copper line body is provided with the protective layer, the inside of copper line body is provided with insulating layer, heat dissipation layer, white carbon black layer and waterproof layer, the heat dissipation layer is located the lower extreme surface of insulating layer, the white carbon black level is located the lower extreme surface on heat dissipation layer, the waterproof layer is located the lower extreme surface on white carbon black layer, the inside of protective layer is provided with nonconducting layer and anti-corrosion coating, anti-corrosion coating is located the lower extreme surface on nonconducting layer.
Preferably, the inside spraying of insulating layer has the insulated paint, the inside on heat dissipation layer is provided with natural graphite heat dissipation film, the inside spraying of waterproof layer has the oleamen.
Preferably, the inside of the non-conductive layer is provided with glass fiber reinforced plastics, and the inside of the anti-corrosion layer is sprayed with epoxy anticorrosive paint.
Preferably, the outer wall of the copper wire body and the outer surface of the protective layer are processed by mechanical equipment.
Compared with the prior art, the utility model discloses following beneficial effect has: through the insulating layer that sets up, the heat dissipation layer, white carbon black layer and waterproof layer, improve its insulating nature through the inside insulating varnish of insulating layer, effectually prevent the electric current, the natural graphite heat dissipation membrane of rethread heat dissipation in-situ portion improves the thermal diffusivity of copper line body, natural graphite heat dissipation membrane has higher heat dispersion, the intensity of copper line body is improved through white carbon black layer, the waterproof performance of copper line body is improved to the factice of rethread waterproof layer inside, the factice has good cohesiveness, plasticity, water resistance, corrosion resistance and durability, overall structure is favorable to improving the practicality of copper line body, through the protective layer that sets up, non-conductive layer and anti-corrosion coating, process the protective layer on copper line body, the protectiveness of copper line body is improved through non-conductive layer, the inside of non-conductive layer has glass steel, glass steel has light weight, high strength, corrosion resistance is good, Good insulating properties, heat resistance are good, formability characteristics such as good, the inside epoxy anticorrosion coating of rethread anticorrosion coating improves the corrosivity that copper line body, and overall structure is favorable to improving the life of copper line body to be favorable to improving its practicality, a whole polyimide enameled round copper line for cell-phone simple structure, convenient operation, the effect of use is better for traditional mode.
Drawings
Fig. 1 is a schematic view of the overall structure of a polyimide enameled round copper wire for a mobile phone according to the present invention;
fig. 2 is a schematic structural diagram of a copper wire body 1 in a polyimide enameled round copper wire diagram 1 for a mobile phone according to the present invention;
fig. 3 is a schematic structural diagram of a protective layer 2 in a polyimide enameled round copper wire drawing 1 for a mobile phone according to the present invention;
fig. 4 is the utility model relates to a polyimide enameled round copper wire drawing 3 for cell-phone A's enlarged structure schematic diagram.
In the figure: 1. a copper wire body; 2. a protective layer; 3. an insulating layer; 4. a heat dissipation layer; 5. a white carbon black layer; 6. a waterproof layer; 7. a non-conductive layer; 8. and an anti-corrosion layer.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1-4, a polyimide enameled round copper wire for mobile phones comprises a copper wire body 1, wherein a protective layer 2 is arranged on the outer wall of the copper wire body 1, an insulating layer 3, a heat dissipation layer 4, a white carbon black layer 5 and a waterproof layer 6 are arranged inside the copper wire body 1, the heat dissipation layer 4 is located on the outer surface of the lower end of the insulating layer 3, the white carbon black layer 5 is located on the outer surface of the lower end of the heat dissipation layer 4, the waterproof layer 6 is located on the outer surface of the lower end of the white carbon black layer 5, a non-conductive layer 7 and an anti-corrosion layer 8 are arranged inside the protective layer 2, and the anti-corrosion layer 8 is located on the outer surface of the lower end of the non-conductive layer 7.
Further, insulating varnish has been sprayed to the inside of insulating layer 3, the inside of heat dissipation layer 4 is provided with natural graphite heat dissipation film, the inside spraying of waterproof layer 6 has the oleamen, when using, insulating layer 3 through the setting, heat dissipation layer 4, white carbon black layer 5 and waterproof layer 6, insulating varnish through the inside of insulating layer 3 improves its insulating nature, effectually prevent the electric current, the inside natural graphite heat dissipation film of rethread heat dissipation layer 4 improves copper line body 1's thermal diffusivity, natural graphite heat dissipation film has higher heat dispersion, rethread white carbon black layer 5 improves copper line body 1's intensity, rethread waterproof layer 6 inside oleamen improves copper line body 1's waterproof performance, the oleamen has good cohesiveness, plasticity, water resistance, corrosion resistance and durability, overall structure is favorable to improving copper line body 1's practicality.
Further, the inside of non-conducting layer 7 is provided with the glass steel, the inside spraying of anti-corrosion coating 8 has epoxy anticorrosive paint, when using, protective layer 2 through setting up, non-conducting layer 7 and anti-corrosion coating 8, process protective layer 2 on copper line body 1, rethread non-conducting layer 7 improves the protectiveness of copper line body 1, there is the glass steel inside of non-conducting layer 7, the glass steel has light weight and excels in, corrosion resisting property is good, good insulating properties, heat resistance is good, formability characteristics such as good, rethread anti-corrosion coating 8 inside improves the corrosion protection of copper line body 1, overall structure is favorable to improving the life of copper line body 1, and be favorable to improving its practicality.
Further, the outer wall of copper line body 1 forms through the mechanical equipment processing with the surface of protective layer 2, and protective layer 2 is favorable to protecting copper line body 1.
It should be noted that, the utility model relates to a polyimide enameled round copper wire for mobile phone, before using, through the insulating layer 3, the heat dissipation layer 4, the white carbon black layer 5 and the waterproof layer 6, the insulating property is improved through the insulating varnish inside the insulating layer 3, the current is effectively stopped, the heat dissipation property of the copper wire body 1 is improved through the natural graphite heat dissipation film inside the heat dissipation layer 4, the natural graphite heat dissipation film has higher heat dissipation property, the strength of the copper wire body 1 is improved through the white carbon black layer 5, the waterproof property of the copper wire body 1 is improved through the factice inside the waterproof layer 6, the factice has good cohesiveness, plasticity, water resistance, corrosion resistance and durability, the whole structure is favorable for improving the practicability of the copper wire body 1, through the protective layer 2, the non-conductive layer 7 and the corrosion-proof layer 8, the protective layer 2 is processed on the copper wire body 1, the protection performance of the copper wire body 1 is improved through the non-conducting layer 7, the glass fiber reinforced plastic is arranged inside the non-conducting layer 7, the glass fiber reinforced plastic has the advantages of being light in weight, high in strength, good in corrosion resistance, excellent in insulating performance, good in heat resistance, good in formability and the like, the epoxy anticorrosive paint inside the anti-corrosion layer 8 improves the corrosion resistance of the copper wire body 1, the whole structure is favorable for prolonging the service life of the copper wire body 1, and the practicability and practicability of the copper wire body 1 are improved.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (4)

1. The utility model provides a polyimide enameled round copper line for cell-phone, includes copper line body (1), its characterized in that: the outer wall of copper line body (1) is provided with protective layer (2), the inside of copper line body (1) is provided with insulating layer (3), heat dissipation layer (4), white carbon black layer (5) and waterproof layer (6), heat dissipation layer (4) are located the lower extreme surface of insulating layer (3), white carbon black layer (5) are located the lower extreme surface of heat dissipation layer (4), waterproof layer (6) are located the lower extreme surface of white carbon black layer (5), the inside of protective layer (2) is provided with non-conducting layer (7) and anti-corrosion coating (8), anti-corrosion coating (8) are located the lower extreme surface of non-conducting layer (7).
2. The polyimide enameled round copper wire for the mobile phone according to claim 1 is characterized in that: insulating paint is sprayed on the inner portion of the insulating layer (3), a natural graphite heat dissipation film is arranged on the inner portion of the heat dissipation layer (4), and factice is sprayed on the inner portion of the waterproof layer (6).
3. The polyimide enameled round copper wire for the mobile phone according to claim 1 is characterized in that: the glass fiber reinforced plastic is arranged inside the non-conductive layer (7), and epoxy anticorrosive paint is sprayed inside the anticorrosive layer (8).
4. The polyimide enameled round copper wire for the mobile phone according to claim 1 is characterized in that: the outer wall of the copper wire body (1) and the outer surface of the protective layer (2) are processed through mechanical equipment.
CN202022974215.7U 2020-12-12 2020-12-12 Polyimide enameled round copper wire for mobile phone Expired - Fee Related CN213752016U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022974215.7U CN213752016U (en) 2020-12-12 2020-12-12 Polyimide enameled round copper wire for mobile phone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022974215.7U CN213752016U (en) 2020-12-12 2020-12-12 Polyimide enameled round copper wire for mobile phone

Publications (1)

Publication Number Publication Date
CN213752016U true CN213752016U (en) 2021-07-20

Family

ID=76834492

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022974215.7U Expired - Fee Related CN213752016U (en) 2020-12-12 2020-12-12 Polyimide enameled round copper wire for mobile phone

Country Status (1)

Country Link
CN (1) CN213752016U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20210720

Termination date: 20211212