CN213748495U

CN213748495U - Overcome ultrasonic sensor of ambient temperature influence

Info

Publication number: CN213748495U
Application number: CN202023251515.9U
Authority: CN
Inventors: 李�浩; 李铭
Original assignee: Chengdu Yingsa Sensing Technology Research Co ltd
Current assignee: Chengdu Yingsa Sensing Technology Research Co ltd
Priority date: 2020-12-29
Filing date: 2020-12-29
Publication date: 2021-07-20
Anticipated expiration: 2030-12-29

Abstract

The utility model discloses an overcome ultrasonic sensor of ambient temperature influence belongs to the ultrasonic sensing field. The utility model relates to a sensor, which comprises a sensor, a positioning ear and a heat insulation layer, wherein the positioning ear is arranged on the outer wall of a cavity of the sensor; the heat insulation layer is provided with positioning holes matched with the positioning lugs in position and size; the sensor is arranged in the heat insulation layer; meanwhile, the shell of the sensor is of a hollow structure and is filled with heat insulation materials. The utility model discloses the setting up of mesophragma layer can effectual isolated external environment temperature, prevents that external temperature is too high and influence the normal use of sensor and the use accuracy that reduces the sensor.

Description

Overcome ultrasonic sensor of ambient temperature influence

Technical Field

The utility model relates to an ultrasonic sensing field, concretely relates to overcome ultrasonic sensor of ambient temperature influence.

Background

The ultrasonic sensor usually comprises a metal shell and a piezoelectric ceramic plate bonded in the metal shell, and the excitation of an alternating current signal can be that the piezoelectric ceramic plate generates mechanical vibration with the same frequency so as to emit ultrasonic waves; or the piezoelectric ceramic plate generates an electric signal with a corresponding frequency under external mechanical vibration with a certain frequency, so that the piezoelectric ceramic plate is used as a receiver of ultrasonic waves. The ultrasonic wave has extremely strong penetrability to liquid and solid, and can penetrate the depth of dozens of meters especially in opaque solid. Ultrasonic waves hitting impurities or interfaces can generate significant reflection to form reflection echoes, and hitting moving objects can generate Doppler effect. The ultrasonic sensor can be widely applied to the related fields of level (liquid level) monitoring, robot collision prevention, various ultrasonic proximity switches and anti-theft alarm lamps. The device has the advantages of reliable work, convenient installation, smaller launcher and high sensitivity, and is convenient to be connected with an industrial display instrument. In the use process of the ultrasonic sensor, when the environment temperature of the sensor is too high, the accuracy of the sensor is affected, and meanwhile, the service life of the sensor is shortened.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that ambient temperature is too high to influence the precision of sensor and shorten sensor life, aim at provides the ultrasonic sensor who overcomes the ambient temperature influence that can effectively solve above-mentioned problem.

The utility model discloses a following technical scheme realizes:

an ultrasonic sensor for overcoming the influence of external temperature comprises a sensor, a positioning lug and a heat insulation layer, wherein the positioning lug is arranged on the outer wall of a cavity of the sensor;

the heat insulation layer is provided with positioning holes matched with the positioning lugs in position and size; the positioning lug is matched with the positioning hole, so that the sensor can be effectively fixed in the heat insulation layer, and a good heat insulation effect is achieved.

The sensor is mounted within the insulating layer. The utility model discloses a set up the insulating layer and wrap up the sensor in it, reach isolated ambient temperature's purpose, can reduce the influence of ambient temperature to sensor normal use, and then can improve the precision of sensor, the high accuracy nature of guarantee sensor.

The further technical scheme is as follows:

the sensor comprises a shell and a supporting seat, wherein the supporting seat is installed inside the shell, and the supporting seat is attached to the shell.

Further: the shell is of a hollow structure and is filled with a heat insulating material. The hollow shell filled with the heat insulation material can further isolate the inner space of the sensor from the outside, and the influence of the ambient temperature on the use precision of the sensor is reduced.

Further: the sensor also comprises an upper piezoelectric wafer, a lower piezoelectric wafer and a support rod, wherein one end of the support rod is connected with the support seat, and the other end of the support rod is connected with the bottom of the lower piezoelectric wafer;

further: the upper piezoelectric wafer is stacked above the lower piezoelectric wafer.

Further: the sensor further comprises a resonant disk mounted on top of the upper piezoelectric wafer.

Further: the sensor further comprises a wiring terminal, and the wiring terminal penetrates through the shell and the supporting seat from the bottom of the shell upwards. The joint between the wiring terminal and the shell needs to be sealed to ensure the accuracy and normal use of the sensor.

Further: one of the wiring terminals is connected with the upper piezoelectric wafer through a wire, and the other wiring terminal is connected with the lower piezoelectric wafer through a wire.

Compared with the prior art, the utility model, following advantage and beneficial effect have:

1. the utility model relates to an overcome ultrasonic sensor of ambient temperature influence, the add of insulating layer can effectual isolated external environment temperature, prevent that the ambient temperature is too high and influence the normal use of sensor and the use accuracy that reduces the sensor.

Drawings

The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic diagram of the sensor structure of the present invention.

Reference numbers and corresponding part names in the drawings:

1-sensor, 2-positioning lug, 3-positioning hole, 11-shell, 12-supporting seat, 13-wiring terminal, 14-wire, 15-lower piezoelectric wafer, 16-upper piezoelectric wafer, 17-resonance plate and 18-supporting rod.

Detailed Description

To make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the following examples and drawings, and the exemplary embodiments and descriptions thereof of the present invention are only used for explaining the present invention, and are not intended as limitations of the present invention.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to one of ordinary skill in the art that: it is not necessary to employ these specific details to practice the invention. In other instances, well-known structures, materials, or methods are not specifically described in order to avoid obscuring the present invention.

Throughout the specification, reference to "one embodiment," "an embodiment," "one example," or "an example" means: the particular features, structures, or characteristics described in connection with the embodiment or example are included in at least one embodiment of the present invention. Thus, the appearances of the phrases "one embodiment," "an embodiment," "one example" or "an example" in various places throughout this specification are not necessarily all referring to the same embodiment or example. Furthermore, the particular features, structures, or characteristics may be combined in any suitable combination and/or sub-combination in one or more embodiments or examples. Further, those of ordinary skill in the art will appreciate that the illustrations provided herein are for illustrative purposes and are not necessarily drawn to scale. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Example 1:

as shown in fig. 1 or fig. 2, the ultrasonic sensor of the present invention for overcoming the influence of external temperature includes a sensor 1, a positioning ear 2 and a heat insulation layer 3, wherein the positioning ear is disposed on the outer wall of the cavity of the sensor 1; the heat insulation layer 3 is provided with positioning holes matched with the positioning lugs 2 in position and size; the sensor 1 is mounted within a thermally insulating layer 3.

The sensor 1 comprises a shell 11 and a supporting seat 12, wherein the supporting seat 12 is installed inside the shell 11, and the supporting seat is attached to the shell 11.

The housing 11 has a hollow structure and is filled with a heat insulating material.

The sensor 1 further comprises an upper piezoelectric wafer 16, a lower piezoelectric wafer 15 and a support rod 18, wherein one end of the support rod 18 is connected with the support seat 12, and the other end of the support rod 18 is connected with the bottom of the lower piezoelectric wafer 15;

the upper piezoelectric wafer 16 is stacked above the lower piezoelectric wafer 15.

The sensor 1 further comprises a resonator disc 17, the resonator disc 17 being mounted on top of the upper piezo-electric wafer 16.

The sensor 1 further comprises a connecting terminal 13, wherein the connecting terminal 13 penetrates through the shell 11 and the supporting seat 12 from the bottom of the shell 11 upwards.

One of the terminals 13 is connected to the upper piezoelectric wafer 16 by a wire 14, and the other terminal 13 is connected to the lower piezoelectric wafer 15 by a wire.

The above-mentioned embodiments, further detailed description of the objects, technical solutions and advantages of the present invention, it should be understood that the above description is only the embodiments of the present invention, and is not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. The ultrasonic sensor capable of overcoming the influence of the external temperature is characterized by comprising a sensor (1), a positioning lug (2) and a heat insulation layer (3), wherein the positioning lug is arranged on the outer wall of a cavity of the sensor (1);

the heat insulation layer (3) is provided with positioning holes matched with the positioning lugs (2) in position and size;

the sensor (1) is arranged in the heat insulation layer (3).

2. An ultrasonic sensor against the influence of external temperature according to claim 1, characterized in that the sensor (1) comprises a housing (11) and a support (12), the support (12) is installed inside the housing (11), and the support is attached to the housing (11).

3. An ultrasonic sensor against the influence of external temperature according to claim 2, characterized in that the housing (11) is hollow and filled with a heat insulating material.

4. An ultrasonic sensor against the influence of external temperature according to claim 1, wherein the sensor (1) further comprises an upper piezoelectric wafer (16), a lower piezoelectric wafer (15) and a support rod (18), one end of the support rod (18) is connected with the supporting base (12), and the other end is connected with the bottom of the lower piezoelectric wafer (15);

the upper piezoelectric wafer (16) is stacked above the lower piezoelectric wafer (15).

5. An ultrasonic sensor against the influence of external temperature according to claim 4, characterized in that the sensor (1) further comprises a resonance disk (17), the resonance disk (17) being mounted on top of the upper piezoelectric wafer (16).

6. An ultrasonic sensor against the influence of external temperature according to claim 5, characterized in that the sensor (1) further comprises a terminal (13), and the terminal (13) penetrates the housing (11) and the supporting base (12) from the bottom of the housing (11) upwards.

7. An ultrasonic sensor against the influence of external temperature according to claim 6, characterized in that one of said terminals (13) is connected to the upper piezoelectric wafer (16) by a wire (14), and the other of said terminals (13) is connected to the lower piezoelectric wafer (15) by a wire.