CN213741928U

CN213741928U - Assembled wave resin tile plate

Info

Publication number: CN213741928U
Application number: CN202022226109.0U
Authority: CN
Inventors: 林金顺
Original assignee: Fujian Yongchun Jiawei Plastic Packaging Products Co ltd
Current assignee: Fujian Yongchun Jiawei Plastic Packaging Products Co ltd
Priority date: 2020-10-09
Filing date: 2020-10-09
Publication date: 2021-07-20
Anticipated expiration: 2030-10-09

Abstract

The utility model discloses a pin-connected panel wave resin tile, including the resin tile body, the one end of resin tile body is provided with the sealed pad of buffering one, the other end of resin tile body is provided with the sealed pad of buffering two, the one end of resin tile body bottom is provided with a plurality of connecting plates one, the draw-in groove has been seted up on the connecting plate one, the one end of resin tile body bottom is provided with a plurality of connecting plates two, the one end of connecting plate two bottoms is provided with the dop, the both ends at resin tile body top all are provided with a plurality of spacing dops respectively, two liang the top of resin tile body junction all is provided with rain-proof apron respectively, the both ends of rain-proof apron bottom all are provided with a plurality of spacing draw-in grooves respectively. The utility model discloses an adopt pin-connected panel structure wave resin tile board, can change the damage position alone, it is all convenient to install and dismantle, has better rain-proof and thermal-insulated thermal insulation performance in addition.

Description

Assembled wave resin tile plate

Technical Field

The utility model relates to a resin tile board technical field particularly, relates to a pin-connected panel wave resin tile board.

Background

At present, most of the existing resin tiles on the market are synthetic, the synthetic resin tiles have the advantages of lasting color, light weight, self-water resistance, toughness, heat preservation and heat insulation, sound insulation, corrosion resistance, wind and shock resistance, hail resistance, pollution resistance, environmental protection, fire prevention, insulation, convenience in installation and the like, the appearance is attractive, the stereoscopic impression is strong, the color has Chinese elements, and the synthetic resin tiles are widely applied to various permanent building roof decorations.

However, in the synthetic resin tile, the thermoplastic plastic is used as the skeleton layer, and due to the inherent expansion and contraction characteristics of the PVC material and the limitation of the mechanical strength of the PVC material, the large-area synthetic resin tile is easy to collapse, deform, crack and leak water in hot weather, and in cold weather, when the tile is impacted by external force, even if a layer of glass fiber is compounded on the bottom surface, the tile still does not contribute to the fracture of the surface when the tile is impacted. There are defects such as structural strength is low, rain-proof effect is poor, life is short, moreover, current resin shingle has assembles insecure scheduling problem, uses inconveniently.

An effective solution to the problems in the related art has not been proposed yet.

SUMMERY OF THE UTILITY MODEL

To the problem in the correlation technique, the utility model provides a pin-connected panel wave resin tile board to overcome the above-mentioned technical problem that current correlation technique exists.

Therefore, the utility model discloses a specific technical scheme as follows:

an assembled wave resin tile plate comprises a resin tile plate body, wherein one end of the resin tile plate body is provided with a first buffer sealing gasket, the other end of the resin tile plate body is provided with a second buffer sealing gasket matched with the first buffer sealing gasket, one end of the bottom of the resin tile plate body, which is close to the first buffer sealing gasket, is provided with a plurality of first connecting plates, the first connecting plate is provided with a clamping groove, one end of the bottom of the resin tile plate body, which is close to the second buffer sealing gasket, is provided with a plurality of second connecting plates, one end of the bottom of the connecting plate II is provided with a clamping head matched with the clamping groove, two ends of the top of the resin tile plate body are respectively provided with a plurality of limiting clamping heads, the top end of the joint of every two resin tile plate bodies is respectively provided with a rainproof cover plate, the two ends of the bottom of the rainproof cover plate are respectively provided with a plurality of limiting clamping grooves matched with the limiting clamping heads.

Furthermore, the first connecting plate, the second connecting plate and the rain-proof cover plate are made of flexible metal materials respectively.

Furthermore, a sealing gasket is arranged at the bottom end of the rainproof cover plate.

Furthermore, the limiting clamping head and the limiting clamping groove are of inclined structures respectively, and the inclination angle of the limiting clamping head and the inclination angle of the limiting clamping groove are 45 degrees.

Further, the resin tile board body comprises an outer layer of rainproof resin, an inner layer of rainproof resin, a heat insulation layer and a reinforcing layer, wherein the heat insulation layer is located at the outer bottom end of the rainproof resin, the reinforcing layer is located at the bottom end of the heat insulation layer, and the inner layer of rainproof resin is located at the bottom end of the reinforcing layer.

Furthermore, the heat insulation layer is a heat insulation foam board, and the reinforcing layer is made of metal.

The utility model has the advantages that: through the pin-connected panel wave resin tile board that sets up to seal by the cushion pad one, the cushion pad two, connecting plate one, the draw-in groove, connecting plate two, the dop, spacing dop, rain-proof apron, spacing draw-in groove, seal gasket, rain-proof resin skin, rain-proof resin inlayer, thermal-insulated heat preservation and enhancement layer constitute to can change the damage position alone, the installation is convenient with the dismantlement, has better rain-proof and thermal-insulated heat preservation performance in addition.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an assembled wave resin tile according to an embodiment of the present invention;

FIG. 2 is an enlarged view of a portion of FIG. 1 at A;

fig. 3 is a schematic layer structure diagram of an assembled wave resin tile according to the embodiment of the present invention.

In the figure:

1. a resin tile body; 2. a first buffer sealing gasket; 3. a second buffer sealing gasket; 4. a first connecting plate; 5. a card slot; 6. a second connecting plate; 7. clamping a head; 8. a limiting chuck; 9. a rain-proof cover plate; 10. a limiting clamping groove; 11. sealing gaskets; 12. an outer layer of rain-proof resin; 13. a rain-proof resin inner layer; 14. a heat insulation layer; 15. and a reinforcing layer.

Detailed Description

For further explanation of the embodiments, the drawings are provided as part of the disclosure and serve primarily to illustrate the embodiments and, together with the description, to explain the principles of operation of the embodiments, and to provide further explanation of the invention and advantages thereof, it will be understood by those skilled in the art that various other embodiments and advantages of the invention are possible, and that elements in the drawings are not to scale and that like reference numerals are generally used to designate like elements.

According to the utility model discloses an embodiment provides a pin-connected panel wave resin tile board.

The first embodiment is as follows:

as shown in figures 1-3, the assembled wave resin tile plate according to the embodiment of the invention comprises a resin tile plate body 1, one end of the resin tile plate body 1 is provided with a first buffer sealing gasket 2, the other end of the resin tile plate body 1 is provided with a second buffer sealing gasket 3 matched with the first buffer sealing gasket 2, one end of the bottom of the resin tile plate body 1 close to the first buffer sealing gasket 2 is provided with a plurality of first connecting plates 4, the first connecting plates 4 are provided with clamping grooves 5, one end of the bottom of the resin tile plate body 1 close to the second buffer sealing gasket 3 is provided with a plurality of second connecting plates 6, one end of the bottom of the second connecting plates 6 is provided with a clamping head 7 matched with the clamping grooves 5, two ends of the top of the resin tile plate body 1 are respectively provided with a plurality of limiting clamping heads 8, and the top end of the joint of every two resin tile plate bodies 1 is respectively provided with a rainproof cover plate 9, the two ends of the bottom of the rainproof cover plate 9 are respectively provided with a plurality of limiting clamping grooves 10 matched with the limiting clamping heads 8.

With the aid of the above technical scheme, through setting up by cushion pad one 2, cushion pad two 3, connecting plate one 4, draw-in groove 5, connecting plate two 6, dop 7, spacing dop 8, rain-proof apron 9, spacing draw-in groove 10, seal gasket 11, rain-proof resin skin 12, rain-proof resin inlayer 13, the pin-connected panel wave resin tile board that thermal-insulated heat preservation 14 and enhancement layer 15 constitute, thereby can change the damage position alone, the installation is convenient with the dismantlement, better rain-proof and thermal-insulated heat preservation performance has in addition.

Example two:

as shown in fig. 1-3, the first connecting plate 4, the second connecting plate 6 and the rain-proof cover plate 9 are made of flexible metal respectively, a sealing gasket 11 is arranged at the bottom end of the rain-proof cover plate 9, the limiting clamping head 8 and the limiting clamping groove 10 are both of an inclined structure respectively, the inclination angle of the limiting clamping head 8 and the limiting clamping groove 10 is 45 degrees, the resin tile body 1 is composed of a rain-proof resin outer layer 12, a rain-proof resin inner layer 13, a heat insulation layer 14 and a reinforcing layer 15, the heat insulation layer 14 is located at the bottom end of the rain-proof resin outer layer 12, the reinforcing layer 15 is located at the bottom end of the heat insulation layer 14, the rain-proof resin inner layer 13 is located at the bottom end of the reinforcing layer 15, the heat insulation layer 14 is a.

As can be seen from fig. 1-3, a sealing gasket 11 is disposed at the bottom end of the rainproof cover plate 9, the limiting chuck 8 and the limiting clamping groove 10 are both of an inclined structure, the inclination angle of the limiting chuck 8 and the limiting clamping groove 10 is 45 °, the resin tile body 1 is composed of a rainproof resin outer layer 12, a rainproof resin inner layer 13, a heat insulation layer 14 and a reinforcing layer 15, and the design of the sealing gasket 11 is conventional and therefore will not be described in detail.

For the convenience of understanding the technical solution of the present invention, the following detailed description is made on the working principle or the operation mode of the present invention in the practical process.

When actually using, during assembling, with two butt joints of resin shingle body 1 for draw-in groove 5 and dop 7 block, then with rain-proof apron 9 lid on the top of junction, press hard make spacing draw-in groove 10 with spacing dop 8 block can, the dismantlement formula is torn open rain-proof apron 9 earlier, then with two resin shingle body 1 separately can.

To sum up, with the help of the above technical scheme of the utility model, through setting up by cushion seal pad one 2, cushion seal pad two 3, connecting plate one 4, draw-in groove 5, connecting plate two 6, dop 7, spacing dop 8, rain-proof apron 9, spacing draw-in groove 10, seal gasket 11, rain-proof resin skin 12, rain-proof resin inlayer 13, the pin-connected panel wave resin tile board that thermal-insulated heat preservation 14 and enhancement layer 15 constitute to can change the damage position alone, the installation is convenient with the dismantlement, better rain-proof and thermal-insulated thermal insulation performance have in addition.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The assembled wave resin tile plate is characterized by comprising a resin tile plate body (1), wherein one end of the resin tile plate body (1) is provided with a first buffer sealing gasket (2), the other end of the resin tile plate body (1) is provided with a second buffer sealing gasket (3) matched with the first buffer sealing gasket (2), one end, close to the first buffer sealing gasket (2), of the bottom of the resin tile plate body (1) is provided with a plurality of first connecting plates (4), a clamping groove (5) is formed in each first connecting plate (4), one end, close to the second buffer sealing gasket (3), of the bottom of the resin tile plate body (1) is provided with a plurality of second connecting plates (6), one end, close to the bottom of each second connecting plate (6), of each second connecting plate (6) is provided with a clamping head (7) matched with the clamping groove (5), and two ends of the top of the resin tile plate body (1) are respectively provided with a plurality of limiting clamping heads (8), two liang the top of resin shingle body (1) junction all is provided with rain-proof apron (9) respectively, the both ends of rain-proof apron (9) bottom all be provided with a plurality of with spacing draw-in groove (10) of spacing dop (8) assorted respectively.

2. The assembled wavy resin tile plate according to claim 1, wherein the first connecting plate (4), the second connecting plate (6) and the rain-proof cover plate (9) are made of flexible metal respectively.

3. The assembled wave resin tile according to claim 1, wherein the bottom end of the rain-proof cover plate (9) is provided with a sealing gasket (11).

4. The assembled wave resin tile plate according to claim 1, wherein the limiting chucks (8) and the limiting clamping grooves (10) are respectively of an inclined structure, and the inclination angles of the limiting chucks (8) and the limiting clamping grooves (10) are 45 degrees.

5. The assembled wave resin tile according to claim 1, wherein the resin tile body (1) is composed of an outer rain-proof resin layer (12), an inner rain-proof resin layer (13), a heat insulating layer (14) and a reinforcing layer (15), the heat insulating layer (14) is located at the bottom end of the outer rain-proof resin layer (12), the reinforcing layer (15) is located at the bottom end of the heat insulating layer (14), and the inner rain-proof resin layer (13) is located at the bottom end of the reinforcing layer (15).

6. The assembled corrugated resin tile according to claim 5, wherein the heat insulating layer (14) is a heat insulating foam board, and the reinforcing layer (15) is made of metal.