CN213725600U - Exhaust gas treatment device - Google Patents

Exhaust gas treatment device Download PDF

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Publication number
CN213725600U
CN213725600U CN202021851152.XU CN202021851152U CN213725600U CN 213725600 U CN213725600 U CN 213725600U CN 202021851152 U CN202021851152 U CN 202021851152U CN 213725600 U CN213725600 U CN 213725600U
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China
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overflow
reaction
chamber
piece
treatment device
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CN202021851152.XU
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Chinese (zh)
Inventor
章文军
杨春水
张坤
宁腾飞
陈彦岗
杨春涛
王继飞
闫萧
蔡传涛
席涛涛
何磊
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Beijing Jingyi Automation Equipment Co Ltd
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Beijing Jingyi Automation Equipment Co Ltd
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Abstract

The utility model relates to a semiconductor manufacturing technical field especially relates to exhaust treatment device, including reaction piece and overflow piece, the cooling chamber of reaction piece's inner structure reaction chamber and being used for circulating the cooling water, the cooling chamber encircles and sets up in the reaction chamber outside, and the inner structure of overflow piece has the overflow chamber, and the overflow piece is connected with the reaction piece to make overflow chamber and reaction chamber intercommunication. Waste gas enters the reaction cavity from external equipment for high-temperature treatment, and circulating water generated by semiconductor manufacturing equipment is introduced into the cooling cavity as cooling water, so that the temperature of the outer wall of the reaction part is reduced, and the device is safe and reliable when the waste gas is treated. The lower extreme of reaction piece is connected the upper end of overflow piece, and waste gas can directly get into the overflow intracavity after reaction in the reaction chamber, handles once more, and the inner wall in overflow chamber all has water to overflow along circumference, and the inner wall of protection overflow piece is not blockked up by the dust that carries in the waste gas.

Description

Exhaust gas treatment device
Technical Field
The utility model relates to a semiconductor manufacturing technical field especially relates to exhaust treatment device.
Background
As semiconductor waste gas is generated in the production process of semiconductors, the gas is not only harmful to human bodies and the environment, but also flammable, explosive and corrosive, and the waste gas is required to be specially treated to eliminate the harmfulness of the waste gas so as to be discharged into the environment from the standpoint of protecting the living environment and continuing the operation. However, due to the limitation of the internal facilities of the semiconductor enterprise, the exhaust gas treatment equipment also needs to meet various requirements.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides an exhaust treatment device, waste gas carry out high temperature process in getting into the reaction chamber by external equipment, and the circulating water that semiconductor manufacturing equipment produced lets in the cooling chamber as the cooling water, reduces the temperature of reaction piece outer wall, makes device safe and reliable when handling waste gas. The lower extreme of reaction piece is connected the upper end of overflow piece, and waste gas can directly get into the overflow intracavity after reaction in the reaction chamber, handles once more, and the inner wall in overflow chamber all has water to overflow along circumference, and the inner wall of protection overflow piece is not blockked up by the dust that carries in the waste gas.
According to the utility model discloses exhaust treatment device of first aspect embodiment, including reaction piece and overflow piece, the internal structure of reaction piece has the reaction chamber and is used for circulating the cooling chamber of cooling water, the cooling chamber surround in the reaction chamber outside sets up, the internal structure of overflow piece has the overflow chamber, the overflow piece with the reaction piece is connected, so that the overflow chamber with the reaction chamber intercommunication.
According to the utility model discloses an embodiment, the overflow piece with the outside cover of the one end that the reaction piece is connected is equipped with the lantern ring, at least one tip of the lantern ring with seal between the outer wall of overflow piece, so that the inboard of the lantern ring with form the annular between the outer wall of overflow piece, the annular with overflow chamber intercommunication.
According to an embodiment of the utility model, the lower extreme of the lantern ring with the outer wall of overflow closes and is connected, the upper end of the lantern ring with open between the outer wall of overflow and form the opening, just the upper end of the lantern ring is higher than it the encirclement the tip of overflow.
According to the utility model discloses an embodiment, the inside of reaction piece still is constructed there is the transition chamber, the transition chamber is located the reaction chamber with between the cooling chamber, just the upper end of transition chamber with the cooling chamber intercommunication, the lower extreme of transition chamber with the annular the opening intercommunication.
According to the utility model discloses an embodiment, the reaction piece includes interior barrel and outer barrel, outer barrel cover is located the outside of interior barrel, outer barrel includes first casing and second casing, first casing cover is located the outside of second casing, the inside of barrel does the reaction chamber, first casing with form between the second casing the cooling chamber, the second casing with form between the interior barrel the transition chamber.
According to an embodiment of the invention, the second housing is connected with the collar.
According to the utility model discloses an embodiment, be equipped with the heat preservation on the inner wall of reaction chamber.
According to an embodiment of the present invention, the overflow member is further provided with a detachable nozzle, said nozzle extending into said overflow chamber.
According to an embodiment of the invention, the reaction member is connected to the overflow member by a flange.
According to the utility model discloses an embodiment, the reaction chamber with be equipped with the baffle between the overflow chamber, utensil intercommunication on the baffle the overflow chamber with the through-hole of reaction chamber.
The embodiment of the utility model provides an in above-mentioned one or more technical scheme, at least, have following technological effect: the utility model discloses exhaust treatment device, the inner structure of reaction piece has reaction chamber and cooling chamber, and the cooling chamber encircles and sets up in the outside of reaction chamber, is the high temperature state in the reaction chamber, and waste gas carries out high temperature treatment in getting into the reaction chamber by external equipment, and the circulating water that semiconductor manufacturing equipment produced lets in the cooling chamber as the cooling water, reduces the temperature of reaction piece outer wall, makes device safe and reliable when handling waste gas. The upper end of overflow spare is connected to the lower extreme of reaction spare, and the inside of overflow spare has the overflow chamber with reaction head pipe intercommunication, and waste gas can directly get into the overflow intracavity after the reaction in the reaction chamber, handles once more, and the inner wall in overflow chamber all has water to spill over along circumference, and the inner wall of protection overflow spare is not blockked up by the dust that carries in the waste gas.
In addition to the technical problems addressed by the present invention, the technical features of the constituent technical solutions, and the advantages brought by the technical features of these technical solutions, which have been described above, other technical features of the present invention and the advantages brought by these technical features will be further described with reference to the accompanying drawings, or can be learned by practice of the present invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural view of an exhaust gas treatment device according to an embodiment of the present invention;
FIG. 2 is a schematic structural view of an exhaust gas treatment device according to an embodiment of the present invention;
fig. 3 is a schematic top view of an exhaust gas treatment device according to an embodiment of the present invention.
Reference numerals:
1: a reaction member; 11: a reaction chamber; 12: a cooling chamber; 13: a transition chamber; 14: an inner cylinder; 15: a first housing; 16: a second housing;
2: an overflow member; 21: an overflow chamber;
3: a collar; 31: a ring groove;
4: a heat-insulating layer;
5: a nozzle;
6: a flange;
7: a partition plate; 71: and a through hole.
Detailed Description
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the embodiments of the present invention can be understood in specific cases by those skilled in the art.
In embodiments of the invention, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of an embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
As shown in fig. 1 and fig. 2, the embodiment of the present invention provides an exhaust treatment device, including reaction piece 1 and overflow piece 2, reaction piece 1's internal structure has reaction chamber 11 and cooling chamber 12 that is used for circulating cooling water, and cooling chamber 12 surrounds the setting in the reaction chamber 11 outside, and overflow piece 2's internal structure has overflow chamber 21, and overflow piece 2 is connected with reaction piece 1 to make overflow chamber 21 and reaction chamber 11 communicate.
The utility model discloses exhaust treatment device, the inner structure of reaction piece 1 has reaction chamber 11 and cooling chamber 12, and cooling chamber 12 encircles and sets up in the outside of reaction chamber 11, is the high temperature state in the reaction chamber 11, and waste gas carries out high temperature treatment in getting into reaction chamber 11 by external equipment, and the circulating water that semiconductor manufacturing equipment produced lets in cooling chamber 12 as the cooling water in, reduces the temperature of 1 outer wall of reaction piece, makes the device safe and reliable when handling waste gas. The upper end of overflow spare 2 is connected to the lower extreme of reaction piece 1, and the inside of overflow spare 2 has the overflow chamber 21 with the reaction head-tube intercommunication, and waste gas can directly get into in the overflow chamber 21 after reaction in reaction chamber 11, handles once more, and the inner wall of overflow chamber 21 all has water to spill over along circumference, and the inner wall of protection overflow spare 2 is not blockked up by the dust that carries in the waste gas.
In this embodiment, water or gas can be introduced into the cooling chamber 12 of the reaction member 1 to lower the temperature of the outer wall of the reaction member 1. When the temperature in the reaction cavity 11 is 1300 ℃, 16 ℃ water flow is 50ml/min is introduced into the cooling cavity 12, and the temperature of the outer wall of the reaction part 1 is lower than 50 ℃.
According to the utility model discloses an embodiment, overflow member 2 is equipped with lantern ring 3 in the outside cover of the one end of being connected with reaction member 1, seals between at least one tip of the lantern ring 3 and the outer wall of overflow member 2 to form annular 31 between the inboard of the lantern ring 3 and the outer wall of overflow member 2, annular 31 and overflow chamber 21 intercommunication. In this embodiment, overflow piece 2 is equipped with lantern ring 3 in the outside encircleing of the one end that is close to reaction piece 1, and lantern ring 3 is connected with overflow piece 2 and is formed annular 31, can hold water in the annular 31, and annular 31 and overflow chamber 21 intercommunication can make the interior rivers outflow of annular 31 to the inner wall in overflow chamber 21, and the inner wall of protection overflow piece 2 is not blockked up by the dust. The cross section of lantern ring 3 is the L type, and the tip of horizontal segment seals with the outer wall of overflow spare 2 to be connected, and vertical section can seal with the outer wall of overflow spare 2 to be connected, also can not seal with the outer wall of overflow spare 2 to be connected. In one embodiment, the water in the annular groove 31 can be provided with a water inlet through the collar 3, the water can be filled into the annular groove 31 from the outside, and the outer wall of the overflow piece 2 can be provided with holes to realize communication with the annular groove 31.
According to the utility model discloses an embodiment, the lower extreme of the lantern ring 3 is connected with the outer wall closure of overflow spare 2, opens between the upper end of the lantern ring 3 and the outer wall of overflow spare 2 and forms the opening, and the upper end of the lantern ring 3 is higher than the tip of its overflow spare 2 that encircles. In this embodiment, the end of the vertical section of the L-shaped collar 3 is not connected to the outer wall of the overflow member 2, so as to form an opening of the ring groove 31, external water can enter the ring groove 31, and the end of the vertical section of the L-shaped collar 3 is higher than the upper end of the overflow member 2, so that the water in the ring groove 31 can overflow from the end of the overflow member 2 to the inner wall of the overflow cavity 21 after accumulating to the upper end of the overflow member 2.
According to the utility model discloses an embodiment, the inside of reaction 1 is still constructed transition chamber 13, and transition chamber 13 is located between reaction chamber 11 and the cooling chamber 12, and the upper end and the cooling chamber 12 intercommunication of transition chamber 13, the lower extreme of transition chamber 13 and the opening intercommunication of annular 31. In this embodiment, a transition cavity 13 is further interposed between the cooling cavity 12 and the reaction cavity 11, which is equivalent to separating the cooling cavity 12 from the reaction cavity 11, so that the influence of the high temperature of the reaction part 1 on the outer wall temperature of the reaction part 11 can be reduced, the influence of the cooling water in the cooling cavity 12 on the high temperature environment of the reaction cavity 11 can also be reduced, and the respective temperature stability of the two cavities can be ensured. Meanwhile, the upper end of the transition cavity 13 is communicated with the cooling cavity 12 through a hole, cooling water in the cooling cavity 12 flows into the transition cavity 13 through a hole, the lower end of the transition cavity 13 is communicated with the opening of the annular groove 31, and the cooling water flows into the annular groove 31 after flowing through the transition cavity 13 and overflows from the annular groove 31 to the inner wall of the overflow cavity 21.
According to the utility model discloses an embodiment, reaction member 1 includes interior barrel 14 and outer barrel, and the outside of barrel 14 is located to outer barrel cover, and outer barrel includes first casing 15 and second casing 16, and the outside of second casing 16 is located to first casing 15 cover, and the inside of interior barrel 14 is reaction chamber 11, forms cooling chamber 12 between first casing 15 and the second casing 16, forms transition chamber 13 between second casing 16 and the interior barrel 14. In this embodiment, the reaction member 1 is composed of an inner cylinder and an outer cylinder, the inner cylinder 14 defines the reaction chamber 11, the outer cylinder defines the cooling chamber 12, and a transition chamber 13 is defined between the inner cylinder 14 and the outer cylinder. Namely, the cooling cavity 12, the transition cavity 13 and the reaction cavity 11 of the reaction member 1 are formed by sequentially passing the first shell 15, the second shell 16 and the inner cylinder 14 from outside to inside.
According to an embodiment of the invention, the second housing 16 is connected with the collar 3. In this embodiment, the second casing 16 is connected to the collar 3 as an inner cylinder of the outer cylinder, the first casing 15 is independently connected to an outer wall of the second casing 16 to form the cooling cavity 12 with the second casing 16, and the transition cavity 13 between the second casing 16 and the inner cylinder 14 inside the second casing is directly opposite to the annular groove 31 formed by the collar 3 and the overflow member 2. That is, the lower end of the second housing 16 is connected to the end of the vertical section of the L-shaped collar 3 of the ring groove 31, so that the reaction member 1 is connected to the overflow member 2.
According to the utility model discloses an embodiment is equipped with heat preservation 4 on the inner wall of reaction chamber 11. In this embodiment, the inner wall of reaction chamber 11 can set up thermal insulation material as heat preservation 4 comprehensively, reduces the calorific loss in reaction chamber 11, makes 11 inside temperatures in reaction chamber high and stable, and the processing exhaust gas speed accelerates, improves device heat preservation effect.
According to an embodiment of the invention, the overflow element 2 is also provided with a detachable nozzle 5, which nozzle 5 extends into the overflow chamber 21. In this embodiment, the middle of the sidewall of the overflow member 2 is provided with a plurality of nozzles 5, which can spray the flowing medium and spray water mist to cool and dissolve the high-temperature treated exhaust gas. In this embodiment, set up the mounting hole on the overflow spare 2, nozzle 5 inserts the mounting hole mouth and passes through flange 6 to be connected on overflow spare 2, the dismouting of being convenient for, the inspection maintenance is changed. According to an embodiment of the present invention, the reaction member 1 is connected to the overflow member 2 via a flange 6. In this embodiment, the second housing 16 of the reaction member 1 and the flange 6 on the collar 3 of the overflow member 2 are both caliper flanges, so that the installation and connection are convenient.
As shown in fig. 3, according to an embodiment of the present invention, a partition 7 is disposed between the reaction chamber 11 and the overflow chamber 21, and the partition 7 has a through hole 71 communicating the overflow chamber 21 and the reaction chamber 11. In this embodiment, be equipped with baffle 7 between the reaction chamber 11 of reaction piece 1 and the overflow chamber 21 of overflow piece 2, set up through-hole 71 on the baffle 7, waste gas accessible through-hole 71 in the reaction chamber 11 gets into overflow chamber 21, baffle 7 can intercept waste gas, the dwell time of extension waste gas in reaction chamber 11 makes waste gas try hard or must fully react in reaction chamber 11, also can separate the temperature that influences overflow chamber 21 that digs the high temperature in the reaction chamber 11 simultaneously, promote reaction chamber 11 temperature, also reduce overflow portion temperature.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims (10)

1. An exhaust gas treatment device, characterized in that: including reaction piece and overflow piece, the inner construction of reaction piece has the reaction chamber and is used for the cooling chamber of circulation cooling water, the cooling chamber encircle in the reaction chamber outside sets up, the inner construction of overflow piece has the overflow chamber, the overflow piece with the reaction piece is connected, so that the overflow chamber with the reaction chamber intercommunication.
2. The exhaust gas treatment device according to claim 1, characterized in that: the overflow piece with the outside cover of the one end that the reaction piece is connected is equipped with the lantern ring, at least one tip of the lantern ring with seal between the outer wall of overflow piece, so that the inboard of the lantern ring with form the annular between the outer wall of overflow piece, the annular with the overflow chamber intercommunication.
3. The exhaust gas treatment device according to claim 2, characterized in that: the lower end of the lantern ring is connected with the outer wall of the overflow piece in a closed mode, an opening is formed between the upper end of the lantern ring and the outer wall of the overflow piece in an open mode, and the upper end of the lantern ring is higher than the end portion of the surrounded overflow piece.
4. The exhaust gas treatment device according to claim 3, characterized in that: the inside of reaction piece still is constructed there is the transition chamber, the transition chamber is located the reaction chamber with between the cooling chamber, just the upper end of transition chamber with the cooling chamber intercommunication, the lower extreme of transition chamber with the annular the opening intercommunication.
5. The exhaust gas treatment device according to claim 4, characterized in that: the reaction piece includes interior barrel and outer barrel, outer barrel cover is located the outside of interior barrel, outer barrel includes first casing and second casing, first casing cover is located the outside of second casing, the inside of barrel does the reaction chamber, first casing with form between the second casing the cooling chamber, the second casing with form between the interior barrel the transition chamber.
6. The exhaust gas treatment device according to claim 5, characterized in that: the second housing is connected to the collar.
7. The exhaust gas treatment device according to claim 1, characterized in that: and the inner wall of the reaction cavity is provided with a heat-insulating layer.
8. The exhaust gas treatment device according to claim 1, characterized in that: the overflow piece is also provided with a detachable nozzle which extends into the overflow cavity.
9. The exhaust gas treatment device according to claim 1, characterized in that: the reaction part is connected with the overflow part through a flange.
10. The exhaust gas treatment device according to any one of claims 1 to 9, characterized in that: a partition plate is arranged between the reaction cavity and the overflow cavity, and a through hole for communicating the overflow cavity and the reaction cavity is formed in the partition plate.
CN202021851152.XU 2020-08-28 2020-08-28 Exhaust gas treatment device Active CN213725600U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021851152.XU CN213725600U (en) 2020-08-28 2020-08-28 Exhaust gas treatment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021851152.XU CN213725600U (en) 2020-08-28 2020-08-28 Exhaust gas treatment device

Publications (1)

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CN213725600U true CN213725600U (en) 2021-07-20

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CN202021851152.XU Active CN213725600U (en) 2020-08-28 2020-08-28 Exhaust gas treatment device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115350577A (en) * 2022-07-29 2022-11-18 北京京仪自动化装备技术股份有限公司 Waste gas treatment reaction device and semiconductor waste gas treatment system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115350577A (en) * 2022-07-29 2022-11-18 北京京仪自动化装备技术股份有限公司 Waste gas treatment reaction device and semiconductor waste gas treatment system
CN115350577B (en) * 2022-07-29 2024-02-02 北京京仪自动化装备技术股份有限公司 Exhaust gas treatment reaction device and semiconductor exhaust gas treatment system

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