CN213718368U - Casing subassembly, electronic equipment and intelligent glasses - Google Patents

Abstract

The application provides a casing subassembly, electronic equipment and intelligent glasses relates to electronic equipment technical field, can improve the sealing performance of the joint gap department between each component of electronic equipment's casing, improves electronic equipment's waterproof performance. The shell assembly comprises a bottom shell, a cover body and a sealing ring, wherein an accommodating cavity is arranged in the bottom shell, an opening is formed in the bottom shell and communicated with the accommodating cavity, and a first annular surface region and a second annular surface region are formed in the edge of the bottom shell where the opening is located; the cover body is used for covering the opening, the edge of the cover body is provided with a third annular surface area and a fourth annular surface area, the third annular surface area is used for being opposite to the first annular surface area and being bonded through sealing glue, and the fourth annular surface area is used for being opposite to the second annular surface area; the seal ring is configured to be disposed between the fourth annular surface region and the second annular surface region. The application provides a housing assembly is used for carrying out water proof protection to circuit assembly.

Description

Casing subassembly, electronic equipment and intelligent glasses

Technical Field

The application relates to the technical field of electronic equipment, in particular to a shell assembly, electronic equipment and intelligent glasses.

Background

Along with the diversification of the use scenes of electronic equipment such as base stations, the glasses legs of intelligent glasses, recording pens, routers and the like, the waterproof performance of the electronic equipment is required to be higher and higher. Electronic equipment includes the casing and sets up the circuit assembly in the casing, and the casing is connected by a plurality of components and is formed, and the sealing performance of the joint gap department between this a plurality of components has directly influenced electronic equipment's waterproof performance, and the sealing performance of joint gap department is better, and electronic equipment's waterproof performance is higher.

At present, joint gaps between all components of a shell of electronic equipment are sealed and bonded through sealant, the sealant arranged at the joint gaps is easy to generate pores due to aging, uneven coating, bubbles in the inside and other reasons, and the pores can permeate partial water vapor, so that the current electronic equipment cannot meet the higher and higher waterproof requirement.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a casing subassembly, electronic equipment and intelligent glasses, can improve the sealing performance of the joint gap department between each component of electronic equipment's casing, improves electronic equipment's waterproof performance.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:

in a first aspect, some embodiments of the present application provide a housing assembly including a bottom shell, a cover, and a sealing ring; an accommodating cavity is arranged in the bottom shell, an opening is formed in the bottom shell and is communicated with the accommodating cavity, a first annular surface area and a second annular surface area are arranged on the edge of the bottom shell where the opening is located, and the first annular surface area and the second annular surface area are arranged around the opening; the cover body is used for covering the opening, the edge of the cover body is provided with a third annular surface area and a fourth annular surface area, the third annular surface area and the fourth annular surface area are arranged around the edge of the cover body, the third annular surface area is used for being opposite to the first annular surface area and being bonded through sealant, and the fourth annular surface area is used for being opposite to the second annular surface area; the seal ring is configured to be disposed between the fourth annular surface region and the second annular surface region.

When the housing assembly provided in the embodiments of the present application is applied to an electronic device, a circuit assembly is installed in an accommodating cavity of a bottom case of the housing assembly, a cover of the housing assembly covers an opening of the bottom case, a third annular surface region of the cover is opposite to a first annular surface region of the bottom case and is bonded by a sealant, a fourth annular surface region of the cover is opposite to a second annular surface region of the bottom case, and a sealing ring of the housing assembly is disposed between the fourth annular surface region and the second annular surface region to seal a gap between the fourth annular surface region and the second annular surface region. Like this, the casing subassembly assembly forms confined casing in order to carry out water proof to circuit assembly, and sealed while adopting sealed glue between drain pan and the lid, still utilize the sealing washer to carry out secondary seal, consequently can improve the sealing performance of junction between drain pan and the lid, increase electronic equipment's waterproof performance.

Optionally, the first annular surface region is located on a side of the second annular surface region proximate to the opening; the third annular surface area is located on a side of the fourth annular surface area proximate a center of the cap. Like this, casing assembly forms the casing after the assembly, and the sealing washer is located sealed outside of gluing, at the in-process of assembly drain pan and lid in order to form the casing, the sealing washer can prevent sealed glue to spill over to the casing, avoids subsequent frictioning operation, guarantees electronic equipment's outward appearance aesthetic property.

Optionally, the first annular surface region is located on a side of the second annular surface region remote from the opening and the third annular surface region is located on a side of the fourth annular surface region remote from a center of the cover. Like this, casing assembly forms the casing after the assembly, and the sealing washer is located sealed inboard, and at the in-process of assembly drain pan and lid in order to form the casing, the sealing washer can prevent sealed glue in overflowing the casing, avoids causing the pollution to the circuit subassembly in the casing.

Optionally, the first annular surface region is parallel to the plane of the opening and the second annular surface region is perpendicular to the plane of the opening. Thus, in the first aspect, since the first annular surface region is parallel to the surface on which the opening is located, application of the sealant on the first annular surface region is facilitated. In the second aspect, because the first annular surface area is parallel to the surface where the opening is located, and the second annular surface area is perpendicular to the surface where the opening is located, the first annular surface area is perpendicular to the second annular surface area, the direction of the rebound force generated by compression of the sealing ring is perpendicular to the direction of the bonding force applied by the sealing glue to the bottom shell and the cover body, and the increased sealing ring does not influence the bonding stability between the bottom shell and the cover body. In a third aspect, because the second annular surface region is perpendicular to the surface where the opening is located, the second annular surface region is a cylindrical surface, the sealing ring is located between the second annular surface region and the fourth annular surface region, and a static friction force exists between the sealing ring and the second annular surface region and/or between the sealing ring and the fourth annular surface region, and the static friction force can prevent the cover from being separated from the bottom case, thereby further ensuring the connection stability between the bottom case and the cover.

Optionally, the first annular surface region and the second annular surface region are both parallel to the plane in which the opening is located. Therefore, the bottom shell is regular in structural shape and convenient to process.

Optionally, the first annular surface region is provided with a first annular glue guiding groove, and the first annular glue guiding groove is arranged around the opening. Thus, in the first aspect, in the process of assembling the bottom shell and the cover body to form the shell, the liquid sealant can be coated on the first annular surface area, and the liquid sealant can be uniformly diffused along the circumferential direction of the first annular surface area under the guiding action of the first annular glue guide groove, so that the sealing uniformity can be improved. In the second aspect, the first annular glue guide groove can store the sealant, so that the amount of the sealant overflowing out of the shell or in the shell is reduced. In a third aspect, the first annular glue guiding groove can store the sealant, so that more sealant is kept between the first annular surface region and the third annular surface region, and the bonding strength and the sealing performance between the bottom shell and the cover body are improved.

Optionally, the third annular surface region is provided with a second annular glue guide groove, and the second annular glue guide groove is arranged around the periphery of the cover body. Thus, in the first aspect, in the process of assembling the bottom shell and the cover body to form the shell, the liquid sealant can be coated on the third annular surface area, and the liquid sealant can be uniformly diffused along the circumferential direction of the third annular surface area under the guiding action of the second annular sealant guide groove, so that the sealing uniformity can be improved. In the second aspect, the second annular glue guide groove can store the sealant, so that the amount of the sealant overflowing out of the shell or in the shell is reduced. In the third aspect, the second annular glue guide groove can store the sealant, so that more sealant is kept between the first annular surface region and the third annular surface region, and the bonding strength and the sealing performance between the bottom shell and the cover body are improved.

Optionally, the sealing ring is fixedly connected to the second annular surface region. In this way, the relative position between the sealing ring and the second annular surface region can be fixed to prevent misalignment of the sealing ring.

Optionally, the sealing ring is integrally formed with the bottom shell. Therefore, the shell assembly is simple in structure and convenient to assemble to form the shell.

Alternatively, the gasket and the bottom case may be integrally formed through a double injection molding process.

Optionally, the sealing ring is fixedly connected to the fourth annular surface region. In this way, the relative position between the seal ring and the fourth annular surface region can be fixed to prevent misalignment of the seal ring.

Optionally, the sealing ring is integrally formed with the cover. Therefore, the shell assembly is simple in structure and convenient to assemble to form the shell.

Alternatively, the sealing ring and the cover body may be integrally formed by a two-shot injection molding process.

Optionally, the sealing ring is an independent structural member, the second annular surface region is provided with a first annular sealing groove, the first annular sealing groove is arranged around the opening, and the sealing ring is embedded in the first annular sealing groove. In this way, the relative position between the seal ring and the second annular surface region is fixed by the first annular seal groove, preventing the seal ring from being misaligned.

Optionally, the fourth annular surface region is provided with a second annular seal groove, the second annular seal groove is arranged around the edge of the cover body, and the seal ring is embedded in the second annular seal groove. In this way, the relative position between the seal ring and the fourth annular surface region is fixed by the second annular seal groove, preventing the seal ring from being dislocated.

In a second aspect, some embodiments of the present application provide an electronic device comprising a housing assembly and a circuit assembly; the shell assembly comprises the shell assembly of any claim in the first aspect; the circuit assembly is installed in an accommodating cavity of a bottom shell of the shell assembly, a cover body of the shell assembly covers an opening of the bottom shell, a third annular surface area of the cover body is opposite to a first annular surface area of the bottom shell and is bonded through sealant, a fourth annular surface area of the cover body is opposite to a second annular surface area of the bottom shell, and a sealing ring of the shell assembly is arranged between the fourth annular surface area and the second annular surface area.

Because the casing subassembly that the electronic equipment that this application embodiment provided included includes any one technical scheme in the first aspect casing subassembly, the sealing performance of the casing that consequently casing subassembly assembly formed is better, can effectively prevent steam entering circuit assembly, electronic equipment's waterproof performance is better.

Optionally, the circuit component includes an input module, a motherboard and a functional module, the input module and the functional module are both electrically connected to the motherboard, the input module is used for inputting instructions or data, and the motherboard is used for controlling the functional module to implement corresponding functions according to the instructions or data input by the input module.

Optionally, the input module comprises mechanical keys or touch keys.

Optionally, the input module includes a wireless receiving module, and the wireless receiving module is configured to establish a connection with the terminal to receive an instruction or data sent by the terminal.

Optionally, the functional module comprises a speaker, a camera, an earpiece or a sound recorder.

Optionally, the electronic device comprises a temple of smart glasses.

In a third aspect, some embodiments of the present application provide smart glasses, where the smart glasses include a frame, a lens, a first temple and a second temple, the lens is installed in the frame, the first temple and/or the second temple include the electronic device described in the second aspect, and the first temple and the second temple are respectively connected to two ends of the frame.

Because the first mirror leg and/or the second mirror leg that the intelligent glasses that this application embodiment provided included include the electronic equipment of the second aspect, therefore intelligent glasses's waterproof performance is better.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to some embodiments of the present application;

FIG. 2 is a cross-sectional structural diagram of a housing of the electronic device shown in FIG. 1;

FIG. 3 is an enlarged view of area I of the electronic device of FIG. 2;

fig. 4 is a schematic cross-sectional structure diagram of a housing of an electronic device according to further embodiments of the present application;

fig. 5 is a schematic cross-sectional structure diagram of a housing of an electronic device according to further embodiments of the present application;

fig. 6 is a schematic cross-sectional structure diagram of a housing of an electronic device according to further embodiments of the present application;

fig. 7 is a schematic cross-sectional structure diagram of a housing of an electronic device according to further embodiments of the present application;

fig. 8 is a schematic cross-sectional structure view of a housing of an electronic device according to further embodiments of the present application;

fig. 9 is a schematic cross-sectional structure view of a housing of an electronic device according to further embodiments of the present application;

fig. 10 is a schematic cross-sectional structure view of a housing of an electronic device according to further embodiments of the present application;

fig. 11 is a schematic cross-sectional structure view of a housing of an electronic device according to further embodiments of the present application;

fig. 12 is a schematic cross-sectional structure view of a housing of an electronic device according to further embodiments of the present application;

fig. 13 is a schematic cross-sectional view of a housing of an electronic device according to further embodiments of the present application;

fig. 14 is a schematic structural diagram of an electronic device according to further embodiments of the present application;

FIG. 15 is a schematic structural diagram of a housing assembly of the electronic device shown in FIG. 14;

FIG. 16 is a schematic view of a bottom housing of the housing assembly of FIG. 15;

FIG. 17 is a schematic view of a cover of the housing assembly shown in FIG. 15;

FIG. 18 is a schematic view of the assembled housing of the housing assembly of FIG. 15;

FIG. 19 is a cross-sectional view taken along A-A of the housing of FIG. 18;

FIG. 20 is an enlarged view of area II of the cross-sectional structural view of the housing of FIG. 19 taken along line A-A;

fig. 21 is a schematic structural diagram of smart glasses according to some embodiments of the present application.

Reference numerals:

1-an electronic device; 11-a housing; 111-a bottom shell; 10-a containment chamber; 20-opening; 112-a cover; 113-sealing glue; 114-a sealing ring; 115-a first annular glue guide groove; 116-a second annular glue guiding groove; 117-first annular seal groove; 118-a second annular seal groove; 119-support ribs; 100-mirror frame; 200-a lens; 300-a first temple arm; 400-second temple.

Detailed Description

In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

Along with the diversification of the use scenes of electronic equipment such as base stations, the glasses legs of intelligent glasses, recording pens, routers and the like, higher requirements are put forward on the waterproof performance of the electronic equipment. For example, for the glasses legs of the smart glasses, if the waterproof performance does not meet the requirements, when the user wears the smart glasses to move, sweat generated by the cheeks easily penetrates through the glasses leg shell and permeates into the inside of the glasses legs, so that short circuit occurs in a circuit inside the glasses legs.

In order to improve electronic equipment's waterproof performance, this application provides an electronic equipment, this electronic equipment includes but not limited to base station, intelligent glasses's mirror leg, recording pen, router, intelligent bracelet and wrist-watch.

Fig. 1 is a perspective view of an electronic device provided in some embodiments of the present application. As shown in fig. 1, the electronic apparatus 1 includes a housing 11 and a circuit assembly (not shown in the figure) mounted in the housing 11.

The circuit component is a component that realizes an electrical function of the electronic device. The structural style of circuit assembly has the multiple, for example circuit assembly is for realizing the circuit assembly of the wireless signal transmit-receive function of basic station, for example circuit assembly is for realizing the circuit assembly of the recording function of recording pen again, still for example circuit assembly is for realizing the circuit assembly of the vital sign data acquisition function of intelligent bracelet, specifically, circuit assembly's structural component can design according to electronic equipment's function.

The housing 11 serves to prevent moisture from entering the circuit assembly to prevent shorting of the circuit assembly. The material of the housing 11 includes, but is not limited to, plastic, silicon, ceramic, glass, aluminum alloy, magnesium aluminum alloy, titanium alloy, and the like. The housing 11 is formed by assembling housing components. In some embodiments, fig. 2 is a schematic cross-sectional view of a housing of the electronic device shown in fig. 1, and as shown in fig. 2, the housing assembly includes a bottom case 111 and a cover 112. The bottom shell 111 is provided with an accommodating cavity 10, and the bottom shell 111 is provided with an opening 20, wherein the opening 20 is communicated with the accommodating cavity 10. The cover 112 covers the opening 20, and a periphery of the edge of the cover 112 is hermetically connected with a periphery of the edge of the bottom case 111 at the opening 20.

The number of the openings 20 provided in the bottom case 111 may be one or more, and is not particularly limited herein. Fig. 2 shows only one example of the number of the openings 20 provided in the bottom case 111, and is not to be considered as a specific limitation of the number of the openings 20. When the number of the openings 20 disposed on the bottom case 111 is plural, the number of the covers 112 included in the housing assembly is also plural, the number of the plural covers 112 is equal to the number of the plural openings 20, the plural covers 112 correspond to the plural openings 20 one by one, and each cover 112 covers the opening 20 corresponding to the cover 112.

The bottom case 111 and the cover 112 are solid structures, water vapor is not easy to enter the accommodating cavity 10 through the bottom case 111 or the cover 112, the sealing joint between the bottom case 111 and the cover 112 is a key part affecting the waterproof performance of the electronic device, the better the sealing performance of the sealing joint is, and the higher the waterproof performance of the electronic device is. Therefore, the waterproof performance of the electronic device is improved by optimally designing the sealing connection structure between the bottom case 111 and the cover 112.

On this basis, in some embodiments, fig. 3 is an enlarged view of the region I in the housing assembly shown in fig. 2, and as shown in fig. 2 and 3, the edge of the bottom case 111 where the opening 20 is located has a first annular surface area a and a second annular surface area B, both of which are disposed around a circumference of the opening 20.

The rim of the cover 112 has a third annular surface region C and a fourth annular surface region D, each disposed around the periphery of the rim of the cover 112.

The first annular surface area a is opposite the third annular surface area C and is bonded by a sealant 113, and the second annular surface area B is opposite the fourth annular surface area D. The housing assembly further comprises a sealing ring 114, which sealing ring 114 is arranged between the second annular surface area B and the fourth annular surface area D to seal a gap between the second annular surface area B and the fourth annular surface area D.

The sealant 113 includes, but is not limited to, polyurethane, silicone rubber, polysulfide rubber, neoprene, butyl rubber, epoxy sealant, and styrene-butadiene rubber. The seal rings 114 include, but are not limited to, nitrile rubber seal rings, silicone rubber seal rings, fluorine silicone rubber seal rings, ethylene propylene diene monomer seal rings, chloroprene rubber seal rings, butyl rubber seal rings, and acrylate rubber seal rings.

In this way, the bottom case 111 and the cover 112 are sealed by the sealant 113, and the sealing ring 114 is used for secondary sealing, so that the sealing performance of the joint between the bottom case 111 and the cover 112 can be improved, and the waterproof performance of the electronic device can be improved. While maintaining the same waterproof performance as the related art, the width of the first annular surface region a and the width of the third annular surface region C may be designed to be narrower, so as to reduce the thickness of the bottom case 111, to increase the internal space of the electronic device or to reduce the size of the electronic device.

In the above-described embodiments, the relative positional relationship between the first annular surface region a and the second annular surface region B, and the relative positional relationship between the third annular surface region C and the fourth annular surface region D may have the following two embodiments (embodiment one and embodiment two described below, respectively).

In the first embodiment, as shown in fig. 3, the first annular surface area a is located on the side of the second annular surface area B close to the opening 20, and the third annular surface area C is located on the side of the fourth annular surface area D close to the center of the cover 112.

Thus, the sealing ring 114 is located outside the sealing glue 113, and in the process of assembling the bottom case 111 and the cover 112 to form the casing 11, the sealing ring 114 can prevent the sealing glue 113 from overflowing out of the casing 11, thereby avoiding subsequent glue wiping operation and ensuring the appearance attractiveness of the electronic device.

On this basis, the first annular surface region a and the second annular surface region B may be parallel to the plane where the opening 20 is located, may be perpendicular to the plane where the opening 20 is located, and may be disposed to be inclined with respect to the plane where the opening 20 is located, which is not specifically limited herein.

In some embodiments, as shown in fig. 3, the first annular surface area a is parallel to the plane of the opening 20 and the second annular surface area B is perpendicular to the plane of the opening 20.

Thus, in the first aspect, since the first annular surface area a is parallel to the surface where the opening 20 is located, the application of the sealant 113 on the first annular surface area a is facilitated. In the second aspect, since the first annular surface area a is parallel to the surface where the opening 20 is located, and the second annular surface area B is perpendicular to the surface where the opening 20 is located, the first annular surface area a is perpendicular to the second annular surface area B, the direction of the resilient force generated by the compression of the sealing ring 114 is perpendicular to the direction of the adhesive force applied by the sealing adhesive 113 to the bottom case 111 and the cover 112, and the added sealing ring 114 does not affect the adhesion stability between the bottom case 111 and the cover 112. In the third aspect, since the second annular surface region B is perpendicular to the surface where the opening 20 is located, the second annular surface region B is a cylindrical surface, the sealing ring 114 is located between the second annular surface region B and the fourth annular surface region D, between the sealing ring 114 and the second annular surface region B, and/or between the sealing ring 114 and the fourth annular surface region D, a static friction force exists, and the static friction force can prevent the cover 112 from being separated from the bottom case 111, thereby further ensuring the connection stability between the bottom case 111 and the cover 112.

In still other embodiments, fig. 4 is a schematic cross-sectional structure view of a housing of an electronic device according to still other embodiments of the present disclosure, as shown in fig. 4, a first annular surface region a and a second annular surface region B are parallel to a plane where the opening 20 is located. Thus, the bottom case 111 has a regular structural shape, which facilitates processing.

In still other embodiments, fig. 5 is a schematic cross-sectional structure view of a housing of an electronic device according to still other embodiments of the present disclosure, as shown in fig. 5, a first annular surface region a and a second annular surface region B are disposed obliquely with respect to a plane where the opening 20 is located, and a sealant 113 is disposed between the first annular surface region a and the third annular surface region C.

In this way, the first annular surface area a and the second annular surface area B guide the cover 112, which is beneficial to improving the installation efficiency of the cover 112 on the bottom case 111.

Second embodiment, fig. 6 is a schematic cross-sectional structure view of a housing of an electronic device according to still other embodiments of the present disclosure, as shown in fig. 6, a first annular surface region a is located on a side of a second annular surface region B away from an opening 20, and a third annular surface region C is located on a side of a fourth annular surface region D away from a center of a cover 112.

Thus, the sealing ring 114 is located at the inner side of the sealing compound 113, and in the process of assembling the bottom case 111 and the cover 112 to form the housing 11, the sealing ring 114 can prevent the sealing compound 113 from overflowing into the housing 11, so as to avoid polluting circuit components in the housing 11.

On this basis, the first annular surface region a and the second annular surface region B may be parallel to the plane where the opening 20 is located, may be perpendicular to the plane where the opening 20 is located, and may be disposed to be inclined with respect to the plane where the opening 20 is located, which is not specifically limited herein. Fig. 6 only shows an example in which the first annular surface area a is parallel to the plane in which the opening 20 is located and the second annular surface area B is perpendicular to the plane in which the opening 20 is located, and is not to be considered as a limitation to the present disclosure.

It is to be understood that, in addition to the first and second embodiments, fig. 7 is a schematic cross-sectional structure diagram of a housing of an electronic device provided by further embodiments of the present application, and as shown in fig. 7, the second annular surface region B is located in the first annular surface region a, and the fourth annular surface region D is located in the third annular surface region C. And is not particularly limited herein.

In order to ensure the sealing performance of the sealing adhesive 113, fig. 8 is a schematic cross-sectional structure diagram of a housing of an electronic device according to still other embodiments of the present disclosure, and as shown in fig. 8, the first annular surface region a is provided with a first annular adhesive guiding groove 115, and the first annular adhesive guiding groove 115 is disposed around a circumference of the opening 20.

Thus, in the first aspect, in the process of assembling the bottom case 111 and the cover 112 to form the housing 11, the liquid sealant may be applied on the first annular surface area a, and the liquid sealant may be uniformly spread in the circumferential direction of the first annular surface area a under the guiding action of the first annular sealant guiding groove 115, thereby improving the uniformity of sealing. In the second aspect, the first annular sealant guiding groove 115 can store the sealant 113, so as to reduce the amount of the sealant overflowing out of the housing 11 or into the housing 11. In the third aspect, the first annular sealant guiding groove 115 can store the sealant 113, so that more sealant 113 is kept between the first annular surface area a and the third annular surface area C, which is beneficial to improving the bonding strength and the sealing performance between the bottom case 111 and the cover 112.

On the basis, the first annular glue guiding groove 115 may be disposed at an end of the first annular surface area a close to the opening 20, may also be disposed at an end of the first annular surface area a far from the opening 20, and may also be disposed in a middle of the first annular surface area a, which is not limited herein. Fig. 8 only shows an example in which the first annular glue guiding groove 115 is arranged at an end of the first annular surface area a remote from the opening 20, and is not to be considered as limiting the composition of the present application.

In other embodiments, fig. 9 is a schematic cross-sectional structural view of a housing of an electronic device according to still other embodiments of the present disclosure, and as shown in fig. 9, a second annular glue guiding groove 116 is formed in the third annular surface region C, and the second annular glue guiding groove 116 is formed around a periphery of the cover 112.

Thus, in the first aspect, in the process of assembling the bottom case 111 and the cover 112 to form the housing 11, the liquid sealant may be applied on the third annular surface region C, and the liquid sealant may be uniformly spread in the circumferential direction of the third annular surface region C under the guiding action of the second annular sealant guiding groove 116, so that the uniformity of sealing can be improved. In the second aspect, the second annular sealant guiding groove 116 can store the sealant 113, so as to reduce the amount of the sealant overflowing out of the housing 11 or into the housing 11. The second annular sealant guiding groove 116 of the third aspect can store the sealant 113, so that more sealant 113 is kept between the first annular surface area a and the third annular surface area C, which is beneficial to improve the bonding strength and the sealing performance between the bottom case 111 and the cover 112.

On the basis of the above, the second annular glue guiding groove 116 may be disposed at an end of the third annular surface area C close to the center of the cover 112, may also be disposed at an end of the third annular surface area C far from the center of the cover 112, and may also be disposed at a middle portion of the third annular surface area C, which is not limited herein. Fig. 9 only shows an example in which the second annular glue guiding groove 116 is provided in the middle of the third annular surface area C, and is not to be considered as limiting the present invention.

It is understood that, in order to ensure the sealing performance of the sealant 113, a first annular sealant guiding groove 115 may be provided on the first annular surface area a, and a second annular sealant guiding groove 116 may be provided on the third annular surface area C, so that more sealant 113 is retained between the first annular surface area a and the third annular surface area C, which is beneficial to improve the bonding strength and the sealing performance between the bottom case 111 and the cover 112.

The seal ring 114 is disposed between the second annular surface region B and the fourth annular surface region D. To fix the relative position between the seal ring 114 and the second annular surface region B, or between the seal ring 114 and the fourth annular surface region D, to prevent misalignment of the seal ring 114, in some embodiments, the seal ring 114 is fixedly attached to the second annular surface region B, which may prevent misalignment of the seal ring 114. In particular, the sealing ring 114 may be fixed to the second annular surface area B by gluing, snapping, integral molding, or the like. In some embodiments, fig. 10 is a schematic cross-sectional structure view of a housing of an electronic device according to still other embodiments of the present disclosure, as shown in fig. 10, a sealing ring 114 is fixedly connected to the second annular surface region B by an integral molding, that is, the sealing ring 114 is integrally formed with the bottom case 111, and specifically, the sealing ring 114 and the bottom case 111 can be integrally formed by a two-shot injection molding process. Thus, the housing assembly has a simple structure and is easy to assemble to form the housing 11.

In still other embodiments, the seal ring 114 is fixedly attached to the fourth annular surface region D, which also prevents misalignment of the seal ring 114. In particular, the sealing ring 114 may be fixed to the fourth annular surface region D by gluing, clipping, integral forming or the like. Fig. 11 is a schematic cross-sectional structure view of a housing of an electronic device according to still other embodiments of the present disclosure, as shown in fig. 11, a sealing ring 114 is fixedly connected to a fourth annular surface region D by way of integral molding, that is, the sealing ring 114 and a cover 112 are integrally molded, and specifically, the sealing ring 114 and the cover 112 can be integrally molded by a two-shot injection molding process. Thus, the housing assembly has a simple structure and is easy to assemble to form the housing 11.

In still other embodiments, the sealing ring 114 is a separate structural member. Fig. 12 is a schematic cross-sectional structural view of a housing of an electronic device according to still other embodiments of the present disclosure, and as shown in fig. 12, the second annular surface region B is provided with a first annular seal groove 117, the first annular seal groove 117 is disposed around a circumference of the opening 20, and the sealing ring 114 is embedded in the first annular seal groove 117. In this way, the relative position between the seal ring 114 and the second annular surface region B is fixed by the first annular seal groove 117, preventing misalignment of the seal ring 114.

In still other embodiments, the sealing ring 114 is a separate structural member. Fig. 13 is a schematic cross-sectional view of a housing of an electronic device according to still other embodiments of the present disclosure, as shown in fig. 13, a second annular sealing groove 118 is disposed on the fourth annular surface region D, the second annular sealing groove 118 is disposed around the edge of the cover 112, and the sealing ring 114 is embedded in the second annular sealing groove 118. Thus, the relative position of the seal ring 114 and the fourth annular surface region D is fixed by the second annular seal groove 118, preventing misalignment of the seal ring 114.

In some embodiments, a support rib is disposed in the accommodating cavity 10, the support rib is fixed to the bottom case 111, and one end of the support rib is located in the opening 20. Thus, the cover 112 can be supported by the support ribs to prevent the cover 112 from being deformed due to an external force.

In the above embodiment, the support ribs and the bottom case 111 may be fixed by clamping, gluing, integral molding, and the like, which is not limited herein.

In some embodiments, the number of the supporting ribs is multiple, and the supporting ribs are uniformly arranged in the accommodating cavity 10. Thus, the support effect of the support rib is better, and the structural stability of the shell 11 is better.

In the above embodiments, the shape of the housing 11 may be a rectangular parallelepiped shape, a square shape, an ellipsoid shape, a glasses leg shape, etc., fig. 1 only shows an example that the shape of the housing 11 is a rectangular parallelepiped shape, and it cannot be considered that the shape of the housing 11 is specially limited, and the different shapes of the housing 11 will cause different functions of the electronic device. For example, fig. 14 is a schematic structural diagram of an electronic device according to still other embodiments of the present application. As shown in fig. 14, the housing 11 of the electronic device 1 is shaped like a glasses leg, and the housing 11 has a profile design for hanging on the ear of the user, so as to hang on the ear of the user. In this way, the electronic device constitutes a temple of the glasses, and can be applied to smart glasses to play a role in fixing the relative position between the lenses of the smart glasses and the eyes of the user.

With continued reference to fig. 14, the housing 11 is formed by the assembly of housing components. Fig. 15 is a schematic structural diagram of a housing assembly of the electronic device shown in fig. 14, and as shown in fig. 15, the housing assembly includes a bottom case 111 and a cover 112. The bottom shell 111 is provided with an accommodating cavity 10, and the bottom shell 111 is provided with an opening 20, wherein the opening 20 is communicated with the accommodating cavity 10. Fig. 16 is a schematic structural diagram of the bottom case in the housing assembly shown in fig. 15, and as shown in fig. 16, the edge of the bottom case 111 where the opening 20 is located has a first annular surface area a and a second annular surface area B, and the first annular surface area a and the second annular surface area B are both disposed around a circumference of the opening 20. Fig. 17 is a schematic view of the structure of the cover in the housing assembly shown in fig. 15. as shown in fig. 17, the rim of the cover 112 has a third annular surface region C and a fourth annular surface region D, both of which are disposed around the rim of the cover 112. Fig. 18 is a structural view of a housing assembled by the housing assembly shown in fig. 15, fig. 19 is a sectional view of the housing shown in fig. 18 taken along a-a direction, and fig. 20 is an enlarged view of a region II in the sectional view of the housing shown in fig. 19 taken along the a-a direction. As shown in fig. 19 and 20, the first annular surface area a is opposite the third annular surface area C and is bonded thereto by a sealant (not shown in fig. 19 and 20), and the second annular surface area B is opposite the fourth annular surface area D. The housing assembly further includes a seal ring 114, as shown in fig. 19 and 20, the seal ring 114 being disposed between the second and fourth annular surface regions B, D to seal a gap therebetween. Therefore, the sealing performance of the joint between the bottom case 111 and the cover 112 is improved, and the waterproof performance of the electronic device is increased. In some embodiments, as shown in fig. 16, support ribs 119 are provided in the bottom case 111, the number of the support ribs 119 is 11, and the distance between two adjacent support ribs 119 along the length direction of the temple is 12mm to 35 mm.

In the electronic device shown in fig. 14, the circuit components have various structural forms, and in some embodiments, the circuit components include an input module, a main board, and a functional module. The input module is used for inputting instructions or data, and the input module includes but is not limited to mechanical keys, touch keys and a wireless receiving module. The wireless receiving module comprises but is not limited to a frequency modulation wireless module, an infrared wireless module, a bluetooth wireless module and a wireless-fidelity (Wi-Fi) module, and is used for establishing connection with a mobile phone, a tablet computer and other terminals so as to receive instructions or data sent by the terminals. The functional module is used for implementing one or more functions of the electronic device, and the functional module includes but is not limited to Speakers (SPKs), a camera, an earphone and a recorder. Illustratively, the functional module is a speaker, and the functional module can realize the function of music playing of the electronic device. Further illustratively, the functional module is a sound recorder, and the functional module is capable of realizing a sound recording function of the electronic device. The input module and the functional module are electrically connected with the mainboard, and the mainboard is used for controlling the functional module to realize corresponding functions according to instructions or data input by the input module.

Therefore, the glasses legs have the functions of fixing the relative positions of the lenses of the intelligent glasses and the eyes of the user, and also have the electric functions of playing music, answering a call, taking a video/picture or recording and the like.

This application still provides an intelligent glasses, and this intelligent glasses is used for wearing to user's eye to play and improve eyesight, protection eyes, effect such as decoration, simultaneously, intelligent glasses can also play the effect of broadcast music, answer a call, shoot video/photo or recording.

Fig. 21 is a schematic structural diagram of smart glasses according to some embodiments of the present application. As shown in fig. 21, the smart glasses include a frame 100, lenses 200, a first temple 300, and a second temple 400.

The lenses 200 are mounted in the frame 100, and the lenses 200 are arranged in front of the eyes of the user. The lenses 200 include, but are not limited to, myopic lenses, hyperopic lenses, reading lenses, astigmatic lenses, plano lenses, computer goggles lenses, swimming lenses, night vision lenses, electronic game goggles lenses, sunglass lenses, and ultraviolet protection lenses.

The first and/or second temples 300 and 400 are the electronic device 1 shown in fig. 14, and the first and second temples 300 and 400 are respectively connected to both ends of the frame 100. The first and second temples 300 and 400 are used to be hung on the ears of a user to fix the lenses 200 in front of the eyes of the user, while the first and/or second temples 300 and 400 are also used to play music, receive a call, take video/photos or record a sound.

The first temple 300 and the frame 100, and the second temple 400 and the frame 100 may be fixedly connected or rotatably connected, and are not particularly limited herein. In some embodiments, the first temple 300 and the frame 100, and the second temple 400 and the frame 100 are rotatably connected, such that both the first temple 300 and the second temple 400 can rotate with respect to the frame 100 to enable folding of the smart glasses.

In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims (18)

1. A housing assembly, comprising:

the bottom shell is internally provided with an accommodating cavity, an opening is formed in the bottom shell and is communicated with the accommodating cavity, the edge of the bottom shell where the opening is located is provided with a first annular surface area and a second annular surface area, and the first annular surface area and the second annular surface area are arranged around the periphery of the opening;

the cover body is used for covering the opening, the edge of the cover body is provided with a third annular surface area and a fourth annular surface area, the third annular surface area and the fourth annular surface area are arranged around the edge of the cover body in a circle, the third annular surface area is used for being opposite to the first annular surface area and being bonded through a sealant, and the fourth annular surface area is used for being opposite to the second annular surface area;

a seal ring for disposition between the fourth annular surface region and the second annular surface region.

2. The housing assembly of claim 1 wherein the first annular surface region is located on a side of the second annular surface region proximate the opening;

the third annular surface region is located on a side of the fourth annular surface region proximate a center of the cap.

3. The housing assembly of claim 2 wherein the first annular surface region is parallel to a plane in which the opening is located and the second annular surface region is perpendicular to the plane in which the opening is located.

4. The housing assembly of claim 1 wherein the first annular surface region is provided with a first annular glue-guiding groove disposed around a circumference of the opening.

5. The housing assembly of claim 1 wherein the third annular surface region defines a second annular glue channel disposed around a perimeter of the cover.

6. The housing assembly of any of claims 1-5, wherein the seal ring is fixedly attached to the second annular surface region.

7. The housing assembly of claim 6, wherein the gasket is integrally formed with the bottom shell.

8. The housing assembly of any of claims 1-5, wherein the seal ring is fixedly attached to the fourth annular surface region.

9. The housing assembly of claim 8, wherein the seal ring is integrally formed with the cover.

10. The housing assembly of any of claims 1-5, wherein the second annular surface region is provided with a first annular seal groove disposed around a circumference of the opening, the seal ring being embedded within the first annular seal groove.

11. The housing assembly of any of claims 1-5, wherein the fourth annular surface region defines a second annular seal groove disposed circumferentially around the rim of the cover, the seal ring being embedded within the second annular seal groove.

12. An electronic device, comprising:

a housing assembly comprising the housing assembly of any one of claims 1-11;

the circuit assembly is installed in the accommodating cavity of the bottom shell of the shell assembly, the cover body of the shell assembly covers the opening of the bottom shell, the third annular surface area of the cover body is opposite to the first annular surface area of the bottom shell and is bonded through a sealant, the fourth annular surface area of the cover body is opposite to the second annular surface area of the bottom shell, and the sealing ring of the shell assembly is arranged between the fourth annular surface area and the second annular surface area.

13. The electronic device according to claim 12, wherein the circuit assembly includes an input module, a motherboard, and a function module, the input module and the function module are electrically connected to the motherboard, the input module is configured to input instructions or data, and the motherboard is configured to control the function module to implement a corresponding function according to the instructions or data input by the input module.

14. The electronic device of claim 13, wherein the input module comprises a mechanical key or a touch key.

15. The electronic device of claim 13, wherein the input module comprises a wireless receiving module, and the wireless receiving module is configured to establish a connection with a terminal to receive an instruction or data sent by the terminal.

16. The electronic device of any of claims 13-15, wherein the functional module comprises a speaker, a camera, an earpiece, or a sound recorder.

17. The electronic device of any of claims 12-15, wherein the electronic device comprises a temple of smart glasses.

18. Smart glasses comprising a frame, a lens, a first temple and a second temple, wherein the lens is mounted in the frame, wherein the first temple and/or the second temple comprise an electronic device according to any of claims 12-17, wherein the first temple and the second temple are connected to two ends of the frame, respectively.

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