CN213714570U - Semiconductor temperature measuring instrument - Google Patents
Semiconductor temperature measuring instrument Download PDFInfo
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- CN213714570U CN213714570U CN202023144338.4U CN202023144338U CN213714570U CN 213714570 U CN213714570 U CN 213714570U CN 202023144338 U CN202023144338 U CN 202023144338U CN 213714570 U CN213714570 U CN 213714570U
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Abstract
The utility model provides a semiconductor thermoscope solves current semiconductor thermoscope equipment mode, and it is great to have the thermoscope volume, installs and changes the loaded down with trivial details problem of copper double-screw bolt. The temperature measuring instrument comprises a main control circuit board, a power supply circuit board, a first temperature measuring module, a second temperature measuring module and a shell formed by buckling an upper shell, a lower shell and side plates; a first stud, a second stud and a third stud are arranged on the lower bottom plate of the lower shell, the height of the first stud is lower than that of the second stud, and the height of the second stud is lower than that of the third stud; the first temperature measuring module is arranged on the lower bottom plate; the second temperature measuring module is arranged on the first stud, and the second temperature measuring module and the first temperature measuring module are arranged in a staggered mode in the horizontal direction; the power supply circuit board is arranged on the second stud and is positioned above the first temperature measuring module; the main control circuit board is arranged on the third stud and is positioned above the second temperature measuring module; the side plate is provided with a through hole and a first square hole group; the through hole is provided with an adapter; the upper shell is provided with a display screen and a display lamp.
Description
Technical Field
The utility model relates to a semiconductor temperature measurement technique especially relates to a semiconductor thermoscope.
Background
The semiconductor crystal is composed of atoms, energy levels in single atoms are split into energy bands, the energy band corresponding to the valence electron at the outermost layer is called a valence band, the energy at the top of the valence band is Ev, the empty energy band above the valence band and not occupied by the electron is a conduction band, and the energy at the bottom of the conduction band is Ec. The gap between the conduction band bottom and the valence band top is free of electronic energy states and is therefore called the forbidden band, which has a gap width of
Eg＝Ec-Ev
When light is irradiated on a semiconductor material, a part of the light is absorbed, and light attenuation occurs. When the photon energy is large enough, the valence band electron absorbs enough energy to be excited to the conduction band, a process called intrinsic absorption. The critical wavelength λ g of intrinsic absorption of a semiconductor material, also called absorption wavelength, is characterized by the fact that photons with a wavelength less than λ g can be strongly absorbed, photons with a wavelength greater than λ g cannot be absorbed, and λ g has a certain dependence on the temperature T.
λg＝1.24/Eg
When the maximum value of the valence band and the minimum value of the conduction band are at the same point on the K space, the semiconductor material is a straight-gap semiconductor material, electrons cannot influence momentum when jumping from the valence band to the conduction band, and the electrons can directly jump by absorbing enough energy. When the photon energy exceeds Eg, the straight gap transition type semiconductor material strongly absorbs light, and a distinct absorption edge appears on an absorption spectrum. The absorption edge wavelength of the absorption spectrum of the semiconductor crystal shifts to the direction of the long wavelength along with the increase of the temperature, and the characteristic is the theoretical basis of the semiconductor crystal for temperature measurement.
The semiconductor temperature measuring instrument mainly comprises a shell, and a circuit board and a temperature measuring module which are arranged in the shell, wherein the existing semiconductor temperature measuring instrument mainly has two assembling modes, the first mode is that all the circuit board and the temperature measuring module are installed in the shell of the semiconductor temperature measuring instrument in a tiling mode, but the surface area of the circuit board and the temperature measuring module which are integrally formed is too large, so that the volume of the shell is larger, and further the volume of the semiconductor temperature measuring instrument is larger; secondly, the circuit board and the temperature measuring module are stacked and placed in the shell, and from the bottom plate of the shell, adjacent parts (the bottom plate, the circuit board and the temperature measuring module) are fixed through copper studs, but the installation of the method is complicated, and the copper studs are easy to loosen, so that the installation reliability of the circuit board and the temperature measuring module is poor, and the normal work of the semiconductor temperature measuring instrument is influenced; in addition, when the copper stud at the middle or lower layer needs to be replaced, all parts above the copper stud need to be dismantled, and the replacement process is complicated.
SUMMERY OF THE UTILITY MODEL
In order to solve the equipment mode of current semiconductor thermoscope, or there is the semiconductor thermoscope volume great, or there is the installation and to change the copper double-screw bolt loaded down with trivial details, the poor technical problem of circuit board and temperature measurement module installation reliability, the utility model provides a semiconductor thermoscope.
In order to achieve the above purpose, the utility model provides a technical scheme is:
the utility model provides a semiconductor thermoscope, includes main control circuit board, power supply circuit board, temperature measurement module one and temperature measurement module two, its characterized in that:
the shell is formed by buckling an upper shell, a lower shell and side plates;
a plurality of first studs, a plurality of second studs and a plurality of third studs are arranged on the lower bottom plate of the lower shell, the heights of the first studs are lower than those of the second studs, and the heights of the second studs are lower than those of the third studs;
the first temperature measuring module is arranged on the lower bottom plate of the lower shell;
the second temperature measuring module is arranged on the first stud, and the second temperature measuring module and the first temperature measuring module are arranged in a staggered mode in the horizontal direction;
the power supply circuit board is arranged on the second stud and is positioned above the first temperature measuring module;
the main control circuit board is arranged on the third stud and is positioned above the second temperature measuring module;
the side plate is provided with a through hole and a first square hole group for extending out of a port at one side of the main control circuit board;
the through holes are provided with adapters used for being connected with optical fibers, and the number of the adapters is equal to that of the terminals of the first temperature measuring module;
a first notch is arranged on the upper side plate of the upper shell opposite to the side plate, a second notch is arranged on the lower side plate of the lower shell opposite to the side plate, and the first notch and the second notch form a second square hole group for extending out of the port at the other side of the main control circuit board;
and a display screen and a display lamp are arranged on the upper top plate of the upper shell.
Furthermore, a first positioning column is arranged on the upper end face of the lower shell;
the lower end face of the upper shell is provided with a positioning groove matched with the first positioning column.
Furthermore, the upper shell is provided with a threaded blind hole, the lower shell is provided with a first through hole matched with the threaded blind hole, and the upper shell and the lower shell are fixed by passing a screw through the first through hole and the threaded blind hole;
the side plates are fixed with the upper shell and the lower shell in a buckling mode.
Furthermore, grooves are formed in the upper end face and the lower end face of each side plate, and protruding blocks matched with the grooves are arranged on the upper shell and the lower shell;
the side plates are fixed with the upper shell and the lower shell through grooves and lugs in a buckling mode.
Furthermore, the bump is a wedge-shaped bump, and the groove is a wedge-shaped groove.
Furthermore, a plurality of second through holes are formed in the upper shell, and third through holes matched with the second through holes are formed in the lower shell.
Furthermore, protective films are arranged on the outer surface of the upper top plate of the upper shell and the outer surface of the side plate;
the outer surface of the upper side plate of the upper shell, which is opposite to the side plate, and the outer surface of the lower side plate of the lower shell, which is opposite to the side plate, are provided with protective films.
Furthermore, a first sinking groove for sticking a protective film is formed in the outer surface of the upper top plate;
a second sinking groove for sticking a protective film is formed in the outer surface of the upper side plate opposite to the side plate;
and a third sinking groove for sticking a protective film is formed in the outer surface of the lower side plate opposite to the side plate.
Furthermore, the display screen and the display lamp are arranged on an upper top plate of the upper shell through a mounting plate, and an upper shell stud for fixing the mounting plate is arranged on the inner surface of the upper top plate.
Furthermore, a debugging port is arranged on the side plate.
Compared with the prior art, the utility model has the advantages that:
1. the utility model discloses set up the double-screw bolt of different height in inferior valve inside, be high respectively third double-screw bolt, second double-screw bolt and first double-screw bolt, third double-screw bolt installation master control circuit board, second double-screw bolt installation power circuit board, first double-screw bolt installation temperature measurement module two, and install temperature measurement module one directly on the lower plate of inferior valve; the utility model discloses main control circuit board, power supply circuit board, temperature measurement module one and temperature measurement module two adopt the stacked structure for the thermoscope has miniaturized characteristics, and directly installs circuit board or module independence in the casing, and installation stability is good, and the change of circuit board or module or double-screw bolt is convenient.
2. The utility model discloses a casing is formed by epitheca, inferior valve and curb plate lock, and the inferior valve is equipped with first reference column, and the epitheca is equipped with the constant head tank, realizes the location of epitheca, inferior valve through the cooperation of first reference column and constant head tank to through the fix with screw, the mounting means is simple and convenient.
3. The utility model discloses be equipped with the second through-hole on the epitheca, be equipped with the third through-hole on the inferior valve, this second through-hole and third through-hole are the mounting hole that casing and outside other equipment are connected.
Drawings
FIG. 1 is a schematic perspective view of the semiconductor temperature measuring device of the present invention;
FIG. 2 is a top view of the semiconductor temperature measuring device of the present invention;
FIG. 3 is a front view of the semiconductor temperature measuring device of the present invention;
fig. 4 is a rear view of the semiconductor temperature measuring device of the present invention;
FIG. 5 is a schematic view of the structure of the middle and lower casing of the semiconductor temperature measuring device of the present invention;
FIG. 6 is a schematic view of a temperature measurement module I mounted on a middle lower shell of the semiconductor temperature measurement instrument;
FIG. 7 is a schematic view of a first temperature measurement module and a second temperature measurement module mounted on a middle lower shell of the fluorescent semiconductor temperature measurement device;
FIG. 8 is a schematic diagram of the semiconductor temperature measuring device of the present invention, wherein a first temperature measuring module, a second temperature measuring module and a power circuit board are mounted on a lower housing;
FIG. 9 is a schematic diagram of the semiconductor temperature measuring device of the present invention, wherein a first temperature measuring module, a second temperature measuring module, a power circuit board and a main control circuit board are mounted on a lower housing;
fig. 10 is a schematic structural view of an upper case in the semiconductor temperature measuring device of the present invention;
FIG. 11 is a rear view of FIG. 10;
fig. 12 is a schematic structural view of a side plate in the semiconductor temperature measuring device of the present invention;
fig. 13 is a schematic view of the rear view structure of the case in the semiconductor temperature measuring device of the present invention;
wherein the reference numbers are as follows:
1-a main control circuit board, 2-a power supply circuit board, 3-a first temperature measurement module and 4-a second temperature measurement module;
5-shell, 51-upper shell, 511-upper side plate, 512-first sinking groove, 513-upper top plate, 514-locating groove, 515-threaded blind hole, 516-second through hole, 517-upper shell stud, 518-second sinking groove, 519-mounting plate, 52-lower shell, 521-lower bottom plate, 522-first stud, 523-second stud, 524-third stud, 525-lower side plate, 526-first locating column, 527-first through hole, 528-third through hole, 529-second locating column, 520-third sinking groove, 53-side plate, 531-through hole, 532-first square hole group, 533-groove, 534-debugging port, 54-lug and 55-second square hole group;
6-adapter, 7-display screen, 8-display lamp.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
As shown in fig. 1 to 4, a semiconductor temperature measuring instrument includes a main control circuit board 1, a power circuit board 2, a first temperature measuring module 3, a second temperature measuring module 4 and a housing 5; the shell 5 comprises an upper shell 51, a lower shell 52 and side plates 53, wherein the upper shell 51 is used for installing a display panel, studs with different heights are arranged inside the lower shell 52 and used for installing the main control circuit board 1, the power circuit board 2, the temperature measuring module I3 and the temperature measuring module II 4, the side plates 53 are used for installing the adapters 6, optical fibers can be connected independently, and the position is flexible.
As shown in fig. 5, 10 and 11, four corners of the upper end surface of the lower shell 52 are provided with first positioning posts 526, the lower end surface of the upper shell 51 is provided with positioning slots 514 matched with the first positioning posts 526, and the upper shell 51 and the lower shell 52 are matched with the four positioning slots 514 by adopting the four first positioning posts 526, so that the positions of the upper shell 51 and the lower shell 52 in the front, rear, left and right directions are ensured, and the positioning of the upper shell 51 and the lower shell 52 is realized; threaded blind holes 515 are further formed in four corners of the upper shell 51, first through holes 527 matched with the threaded blind holes 515 are formed in the lower shell 52, the upper shell 51 and the lower shell 52 are fixed through screws penetrating through the first through holes 527 and the threaded blind holes 515, and the upper shell 51 and the lower shell 52 are convenient to assemble; the side plates 53 are fixed with the upper shell 51 and the lower shell 52 in a buckling mode, and therefore installation and disassembly are convenient.
A plurality of first studs 522, a plurality of second studs 523 and a plurality of third studs 524 are arranged on the lower bottom plate 521 of the lower shell 52, the height of the first studs 522 is lower than that of the second studs 523, and the height of the second studs 523 is lower than that of the third studs 524; the first temperature measuring module 3 is arranged on the lower bottom plate 521 of the lower shell 52; the second temperature measuring module 4 is arranged on the first stud 522, and the second temperature measuring module 4 and the first temperature measuring module 3 are arranged in a staggered mode in the horizontal direction; the power circuit board 2 is arranged on the second stud 523, and the power circuit board 2 is positioned above the first temperature measuring module 3; the main control circuit board 1 is installed on the third stud 524, and the main control circuit board 1 is located above the temperature measurement module two 4.
In the embodiment, the first temperature measuring module 3 is mounted by tapping on the lower bottom plate 521, and the first temperature measuring module 3 is positioned at one corner of the lower bottom plate 521; the number of the first studs 522 is 2, the temperature measuring module II 4 is installed on the lower bottom plate 521 of the lower shell 52 through the 2 first studs 522, and the temperature measuring module II 4 and the temperature measuring module I3 are arranged side by side along the width direction of the lower bottom plate 521; in order to improve the mounting stability of the temperature measuring module II 4, 2 second positioning columns 529 are arranged between the temperature measuring module II 4 and the lower bottom plate 521, the height of each second positioning column 529 is the same as that of each first stud 522, the 2 first studs 522 and the 2 second positioning columns 529 are distributed in a quadrilateral mode, and the 2 first studs 522 are arranged in a diagonal line; the power circuit board 2 is mounted on the lower bottom plate 521 of the lower shell 52 through four second studs 523, and the four second studs 523 are distributed in a quadrilateral shape and are located at four corners of the power circuit board 2; the main control circuit board 1 and the power circuit board 2 are arranged adjacently, a partial area of the main control circuit board 1 is located above the temperature measuring module II 4, the main control circuit board 1 is of an L-shaped structure, the main control circuit board 1 and the power circuit board 2 are arranged in a staggered mode in the horizontal direction and the height direction, and the main control circuit board 1 is installed on the lower bottom plate 521 of the lower shell 52 through at least 7 third studs 524.
The upper shell 51 is provided with the display screen 7 and the display lamp 8, specifically, the display screen 7 and the display lamp 8 are mounted on the mounting plate 519, the inner surface of the upper top plate 513 is provided with an upper shell stud 517 for fixing the mounting plate 519, and the display screen 7 and the display lamp 8 of the embodiment are arranged on the upper top plate 513 of the upper shell 51 through the mounting plate 519. Accordingly, the upper top plate 513 of the upper case 51 is provided with a light display hole, a display slot of the display screen 7, and a key display hole.
Grooves 533 are formed in the upper end face and the lower end face of the side plate 53, protruding blocks 54 matched with the grooves 533 are arranged on the upper shell 51 and the lower shell 52, and the side plate 53, the upper shell 51 and the lower shell 52 are fixed in a buckling mode through the grooves 533 and the protruding blocks 54; preferably, the protrusion 54 is a wedge-shaped protrusion, and the groove 533 is a wedge-shaped groove, so that the side plate 53 can be conveniently clamped with the upper shell 51 and the lower shell 52, and the assembly stability is improved; a through hole 531, a debugging hole 534 and a first square hole group 532 for extending out of a port on one side of the main control circuit board 1 are arranged on the side plate 53, as can be seen from fig. 12, the first square hole group 532 of the embodiment includes 3 first square holes arranged side by side, an adapter 6 for connecting with an optical fiber is arranged on the through hole 531, the number of the adapters 6 is equal to that of the terminals of the first temperature measuring module 3, and the number of the adapters is 8 in the embodiment; a first notch is formed in the upper side plate 511 of the upper shell 51 opposite to the side plate 53, a second notch is formed in the lower side plate 525 of the lower shell 52 opposite to the side plate 53, the first notch and the second notch form a second square hole group 55 for extending out of the port at the other side of the main control circuit board 1, and as can be seen from fig. 13, the second square hole group 55 of the present embodiment includes 2 second square holes arranged side by side.
In this embodiment, the upper shell 51 is provided with a plurality of second through holes 516, the lower shell 52 is provided with a third through hole 528 which is matched with the plurality of second through holes 516, and the second through hole 516 and the third through hole 528 are used for installing and fixing the temperature measuring instrument and the external device in this embodiment.
In the embodiment, protective films are arranged on the outer surfaces of the upper top plate 513 and the side plates 53 of the upper shell 51; the outer surface of the upper side plate 511 of the upper case 51 opposite to the side plate 53 and the outer surface of the lower side plate 525 of the lower case 52 opposite to the side plate 53 are provided with protective films.
For the convenience of film pasting installation, a first sinking groove 512 for pasting a protective film is arranged on the outer surface of the upper top plate 513, and a second sinking groove 518 for pasting a protective film is arranged on the outer surface of the upper side plate 511 opposite to the side plate 53; a third sinking groove 520 for sticking a protective film is arranged on the outer surface of the lower side plate 525 opposite to the side plate 53; after the side plates 53 are fastened to the upper and lower cases 51 and 52, the outer surfaces of the side plates 53 should be lower than the surfaces of the upper and lower cases 51 and 52, so that a sink for attaching a protective film is formed between the outer surfaces of the side plates 53 and the side walls of the upper and lower cases 51 and 52.
The shell of the embodiment can be machined or die-cast.
In this embodiment, the first temperature measurement module 3 is used for emitting an excitation light source and receiving temperature measurement point light information transmitted back by the optical fiber, the temperature measurement module is used for photoelectric conversion of the light information collected by the first temperature measurement module 3 and transmitting the light information to the main control circuit board 1, the main control circuit board 1 outputs a corresponding temperature value, and the power circuit board 2 provides a working power supply for other components in the temperature measurement instrument.
The assembly process of the thermometer of the present embodiment is as follows:
1) installing the temperature measuring module I3 on the lower bottom plate 521 of the lower shell 52, as shown in FIG. 6;
2) installing the second temperature measuring module 4 on the first stud by using a screw, as shown in FIG. 7;
3) mounting the power circuit board on the second stud 523, as shown in fig. 8;
4) mounting the main control circuit board 1 on the third stud 524, as shown in fig. 9;
5) mounting the adapter on the through hole of the side plate 53;
6) mounting the gland head on the side plate, and mounting the side plate on the bottom plate;
7) fixing the mounting plate provided with the display screen 7 and the display lamp 8 on the upper shell by using screws;
8) the upper shell, the lower shell and the side plates are assembled, the upper shell and the lower shell are fixed by four first positioning columns, the bent part of the side plate is inserted into the inclined part of the upper shell, and the upper shell and the lower shell are fixed on the reverse side of the lower shell by screws.
The above description is only for the preferred embodiment of the present invention, and the technical solution of the present invention is not limited thereto, and any known modifications made by those skilled in the art on the basis of the main technical idea of the present invention belong to the technical scope to be protected by the present invention.
Claims (10)
1. The utility model provides a semiconductor thermoscope, includes main control circuit board (1), power supply circuit board (2), temperature measurement module one (3) and temperature measurement module two (4), its characterized in that:
the shell body (5) is formed by buckling an upper shell (51), a lower shell (52) and a side plate (53);
a plurality of first studs (522), a plurality of second studs (523) and a plurality of third studs (524) are arranged on a lower bottom plate (521) of the lower shell (52), the height of the first studs (522) is lower than that of the second studs (523), and the height of the second studs (523) is lower than that of the third studs (524);
the temperature measuring module I (3) is arranged on the lower bottom plate (521);
the second temperature measuring module (4) is arranged on the first stud (522), and the second temperature measuring module (4) and the first temperature measuring module (3) are arranged in a staggered mode in the horizontal direction;
the power supply circuit board (2) is arranged on the second stud (523), and the power supply circuit board (2) is positioned above the temperature measuring module I (3);
the main control circuit board (1) is arranged on the third stud (524), and the main control circuit board (1) is positioned above the temperature measuring module II (4);
the side plate (53) is provided with a through hole (531) and a first square hole group (532) for extending out of a port at one side of the main control circuit board (1);
the through hole (531) is provided with adapters (6) connected with optical fibers, and the number of the adapters (6) is equal to that of terminals of the temperature measuring module I (3);
a first notch is formed in an upper side plate (511) of the upper shell (51) opposite to the side plate (53), a second notch is formed in a lower side plate (525) of the lower shell (52) opposite to the side plate (53), and the first notch and the second notch form a second square hole group (55) for extending out of an opening in the other side of the main control circuit board (1);
and a display screen (7) and a display lamp (8) are arranged on the upper top plate (513) of the upper shell (51).
2. The semiconductor temperature gauge according to claim 1, wherein: the upper end surface of the lower shell (52) is provided with a first positioning column (526);
the lower end face of the upper shell (51) is provided with a positioning groove (514) matched with the first positioning column (526).
3. The semiconductor temperature gauge according to claim 2, wherein: the upper shell (51) is provided with a threaded blind hole (515), the lower shell (52) is provided with a first through hole (527) matched with the threaded blind hole (515), and the upper shell (51) and the lower shell (52) are fixed by passing a screw through the first through hole (527) and the threaded blind hole (515);
the side plate (53) is fixed with the upper shell (51) and the lower shell (52) in a buckling mode.
4. The semiconductor temperature gauge according to claim 3, wherein: grooves (533) are formed in the upper end face and the lower end face of each side plate (53), and protruding blocks (54) matched with the grooves (533) are arranged on the upper shell (51) and the lower shell (52);
the side plate (53) is fixed with the upper shell (51) and the lower shell (52) through the groove (533) and the bump (54) in a buckling mode.
5. The semiconductor temperature gauge according to claim 4, wherein: the projection (54) is a wedge-shaped projection, and the groove (533) is a wedge-shaped groove.
6. A semiconductor temperature gauge according to any one of claims 1 to 5, wherein: the upper shell (51) is provided with a plurality of second through holes (516), and the lower shell (52) is provided with a third through hole (528) matched with the second through holes (516).
7. The semiconductor temperature gauge according to claim 6, wherein: protective films are arranged on the outer surface of the upper top plate (513) of the upper shell (51) and the outer surface of the side plate (53);
and protective films are arranged on the outer surface of an upper side plate (511) of the upper shell (51) opposite to the side plate (53) and on the outer surface of a lower side plate (525) of the lower shell (52) opposite to the side plate (53).
8. The semiconductor temperature gauge according to claim 7, wherein: a first sinking groove (512) for sticking a protective film is arranged on the outer surface of the upper top plate (513);
a second sinking groove (518) for sticking a protective film is arranged on the outer surface of the upper side plate (511) opposite to the side plate (53);
and a third sinking groove (520) for sticking a protective film is arranged on the outer surface of the lower side plate (525) opposite to the side plate (53).
9. The semiconductor temperature gauge according to claim 1, wherein: the display screen (7) and the display lamp (8) are arranged on an upper top plate (513) of the upper shell (51) through a mounting plate (519), and an upper shell stud (517) used for fixing the mounting plate (519) is arranged on the inner surface of the upper top plate (513).
10. The semiconductor temperature gauge according to claim 1, wherein: the side plate (53) is provided with a debugging port (534).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023144338.4U CN213714570U (en) | 2020-12-23 | 2020-12-23 | Semiconductor temperature measuring instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023144338.4U CN213714570U (en) | 2020-12-23 | 2020-12-23 | Semiconductor temperature measuring instrument |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213714570U true CN213714570U (en) | 2021-07-16 |
Family
ID=76790479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023144338.4U Active CN213714570U (en) | 2020-12-23 | 2020-12-23 | Semiconductor temperature measuring instrument |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213714570U (en) |
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2020
- 2020-12-23 CN CN202023144338.4U patent/CN213714570U/en active Active
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