CN213694315U

CN213694315U - Bottom plate for PCB packaging

Info

Publication number: CN213694315U
Application number: CN202022738439.8U
Authority: CN
Inventors: 张加超; 鹿焕伟
Original assignee: Weifang Goertek Microelectronics Co Ltd
Current assignee: Weifang Goertek Microelectronics Co Ltd
Priority date: 2020-11-23
Filing date: 2020-11-23
Publication date: 2021-07-13
Anticipated expiration: 2030-11-23

Abstract

The utility model discloses a bottom plate for PCB encapsulation, one side of bottom plate is seted up flutedly, the recess certainly the surface of bottom plate is inside sunken, the recess supplies PCB's components and parts stretch into, in order to dodge components and parts, on the bottom plate the suction hole has still been seted up to one side at recess place, the suction hole with the recess dislocation distribution. In the packaging process, components of the PCB can extend into the grooves of the base plate, so that the components are avoided, and the fitting degree of the PCB and the base plate is ensured. The bottom plate is vacuumized, the PCB is adsorbed on the bottom plate through the air suction holes, the laminating degree of the PCB and the bottom plate is further guaranteed, packaging and manufacturing are facilitated, the air suction holes and the grooves are distributed in a staggered mode, the air suction holes and the grooves do not interfere with each other, and the use requirements of the PCB and the grooves are met. The bottom plate is suitable for the packaging and manufacturing of the PCB with the flat back, the packaging and manufacturing of the PCB with the uneven back and components, and the bottom plate can be used as an equipment bottom plate in other processes of a packaging section, and is good in compatibility and wide in application range.

Description

Bottom plate for PCB packaging

Technical Field

The utility model relates to an electronic equipment technical field, in particular to a bottom plate for PCB encapsulation.

Background

The operation area in the track of the MEMS MIC packaging section equipment can be borne by a bottom plate, the bottom plate requires extremely high flatness, and the levelness of a processed material after being attached to the bottom plate can be ensured.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a bottom plate for PCB encapsulation, aim at solving the problem that the bottom plate among the prior art can not be suitable for the PCB encapsulation of back structure unevenness.

In order to achieve the above object, the utility model provides a bottom plate for PCB encapsulation, one side of bottom plate is seted up flutedly, the recess certainly the surface of bottom plate is inwards sunken, the recess supplies PCB's components and parts stretch into, in order to dodge components and parts, on the bottom plate the suction hole has still been seted up to one side at recess place, the suction hole with the recess dislocation distribution.

Preferably, the shape of the groove is matched with that of the component, and the depth of the groove is larger than or equal to the thickness of the component.

Preferably, the width of the groove is 0.5 mm-4 mm; the depth of the groove is 0.5 mm-2 mm.

Preferably, the distance between the two side walls of the groove is arranged in the direction from the notch of the groove to the groove bottom in an equal width or gradually narrowed.

Preferably, the bottom plate is rectangular, the number of the grooves is multiple, the grooves are arranged at intervals along the width direction of the bottom plate, and each groove extends along the length direction of the bottom plate.

Preferably, the distance between any two adjacent grooves is 2 mm-6 mm.

Preferably, the number of the air suction holes is multiple, the air suction holes are arranged at intervals along the width direction of the bottom plate, and at least one air suction hole is distributed between any two adjacent grooves.

Preferably, a suction passage is formed in the bottom plate, the suction passage extending in a width direction of the bottom plate; the plurality of air suction holes are arranged at intervals along the width direction of the bottom plate in a linear mode to form a row of air suction hole groups, and each air suction hole is communicated with the air suction channel.

Preferably, the number of the suction hole groups is at least two, the at least two suction hole groups are arranged at intervals along the length direction of the bottom plate, and each row of the suction hole groups is correspondingly provided with one suction channel; an air inlet channel is formed in the bottom plate and communicated with all the air suction channels.

Preferably, a fastening structure is arranged on one side of the bottom plate, which is far away from the groove, and the fastening structure protrudes from the bottom plate to the direction far away from the groove.

The technical scheme of the utility model, in the in-process that carries out the encapsulation at MEMS MIC, arrange PCB in on the bottom plate, to the PCB that has components and parts at the back, PCB's components and parts can stretch into the utility model discloses in the recess of bottom plate to form dodging to components and parts, guarantee the laminating degree of PCB and bottom plate. And, the bottom plate is provided with the air suction holes, the bottom plate is vacuumized, the PCB can be adsorbed on the bottom plate through the air suction holes, the laminating degree of the PCB and the bottom plate is further guaranteed, the laminating levelness of the PCB and the bottom plate is improved, packaging manufacture is facilitated, the air suction holes and the grooves are distributed in a staggered mode, the PCB and the grooves do not interfere with each other, and respective use requirements are met. And when the PCB passes through the bottom plate, the components of the PCB can step along the grooves on the bottom plate, so that the friction between the components and the bottom plate is avoided, the components are protected from being damaged, and the reliability is good. The utility model discloses the bottom plate both had been applicable to the smooth PCB's in the back encapsulation preparation, can be applicable to the back again and have components and parts and the PCB's of unevenness encapsulation preparation, can also regard as the equipment bottom plate to use in other processes of encapsulation section, and is compatible good, and the range of application is wide.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a right side view schematically illustrating a bottom plate for PCB packaging according to an embodiment of the present invention;

fig. 2 is a schematic side view of a bottom plate for PCB packaging according to an embodiment of the present invention;

fig. 3 is a partially enlarged side view of a bottom plate for PCB packaging according to an embodiment of the present invention;

fig. 4 is a left side view of a bottom plate for PCB encapsulation according to an embodiment of the present invention;

fig. 5 is a schematic perspective view of a PCB according to an embodiment of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				10	Base plate	13	Air suction channel
11	Groove	14	Air inlet channel
				111	Notch opening	15	Buckle structure
112	Tank bottom	20	PCB
				113	Side wall	21	Component and device
12	Air suction hole

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

The present invention is described in the directions "up", "down", "left", "right", etc. with reference to the direction shown in fig. 1, and is only used to explain the relative positional relationship between the components in the posture shown in fig. 1, and if the specific posture is changed, the directional indication is also changed accordingly.

The utility model provides a bottom plate for PCB encapsulation.

As shown in fig. 1 to 5, in the bottom plate 10 for PCB20 package of the present embodiment, a groove 11 is formed on one side of the bottom plate 10, the groove 11 is recessed inward from the surface of the bottom plate 10, the groove 11 is used for the component 21 of the PCB20 to extend into so as to avoid the component 21, a suction hole 12 is further formed on one side of the bottom plate 10 where the groove 11 is located, and the suction hole 12 and the groove 11 are distributed in a staggered manner. As shown in fig. 1 to 3, the groove 11 is located at one side of the base plate 10, and the groove 11 is recessed inward from the side surface of the base plate 10. The PCB20 has components 21 on its back surface, which have an uneven surface. In the process of packaging the MEMS MIC, the PCB20 is arranged on the bottom plate 10, and for the PCB20 with the component 21 on the back, the component 21 of the PCB20 can extend into the groove 11, so that the component 21 is avoided, and the attaching degree of the PCB20 and the bottom plate 10 is ensured. And, the bottom plate 10 is last to have suction hole 12, carries out the evacuation to bottom plate 10, and accessible suction hole 12 adsorbs PCB20 on bottom plate 10, further guarantees PCB20 and bottom plate 10's laminating degree, and improves the levelness of both laminatings, does benefit to the encapsulation preparation, and suction hole 12 and recess 11 staggered distribution, and both mutually noninterfere satisfy user demand separately. Moreover, when the PCB20 passes through the bottom plate 10, the components 21 can step along the grooves 11 on the bottom plate 10, so that the components 21 are prevented from rubbing against the bottom plate 10, the components 21 are protected from being damaged, and the reliability is good. The bottom plate 10 of the embodiment is suitable for the packaging and manufacturing of the PCB20 with a flat back surface, is also suitable for the packaging and manufacturing of the PCB20 with the uneven back surface having the component 21, and can be used as the bottom plate 10 of the device in other processes of a packaging section, so that the compatibility is good, and the application range is wide.

Further, the shape of the recess 11 matches the shape of the component 21, and the depth of the recess 11 is greater than or equal to the thickness of the component 21. The shape of the recess 11 can be flexibly adjusted according to the shape of the component 21 on the PCB20, for example, as shown in fig. 5, if the component 21 on the PCB20 is rectangular, the recess 11 is a rectangular recess 11, and if the component 21 on the PCB20 is other shapes, the recess 11 can be configured to match the shape of the component 21. And, the depth of recess 11 is greater than or equal to the thickness of components and parts 21 to components and parts 21 can wholly stretch into in the recess 11, guarantees the laminating degree of PCB20 and bottom plate 10.

The width and the degree of depth setting of recess 11 are in suitable within range with this embodiment, specifically, the width of recess 11 is 0.5mm ~ 4mm, and the degree of depth of recess 11 is 0.5mm ~ 2mm, both applicable in the great PCB 20's of components and parts 21 size encapsulation preparation, can be applicable to the less PCB 20's of components and parts 21 size encapsulation preparation again, and then the encapsulation preparation of compatible multiple model PCB20, and the range of application is wide.

In the present embodiment, the distance between the two sidewalls 113 of the groove 11 is set to be equal in width or gradually narrowed from the notch 111 of the groove 11 to the groove bottom 112. As shown in fig. 2 and 3, the two side walls 113 of the groove 11 are an upper side wall and a lower side wall, respectively, and the notch 111 of the groove 11 is located rightward of the groove bottom 112. In an embodiment, the cross section of the groove 11 may be rectangular, that is, the distance between the upper sidewall and the lower sidewall of the groove 11 is set to be equal in width from right to left, which is suitable for the case that the component 21 on the PCB20 is rectangular. In another embodiment, the cross section of the groove 11 may be an isosceles trapezoid, that is, the distance between the upper sidewall and the lower sidewall of the groove 11 gradually narrows from right to left, which is suitable for the case where the component 21 on the PCB20 is an isosceles trapezoid. The utility model discloses recess 11's shape, size can be adjusted according to actual conditions is nimble, the utility model discloses do not do the restriction to recess 11's shape, size.

In this embodiment, the bottom plate 10 is rectangular, the number of the grooves 11 is multiple, the multiple grooves 11 are arranged at intervals along the width direction of the bottom plate 10, and each groove 11 extends along the length direction of the bottom plate 10. As shown in fig. 1, the length direction of the bottom plate 10 of the present embodiment is the left-right direction, the width direction is the up-down direction, the number of the grooves 11 is plural, the plural grooves 11 are arranged at intervals in the up-down direction, and each of the grooves 11 extends in the left-right direction. It should be noted that the PCB20 shown in fig. 5 is a unit, during the packaging process, a plurality of PCBs 20 are connected to each other to form a whole board, the shape and size of the whole board can be matched with the shape and size of the bottom board 10, and a plurality of PCBs 20 on the whole board are arranged in an array along the left-right direction and the up-down direction, that is, a plurality of PCBs 20 on the whole board are arranged in a horizontal-vertical array, and each groove 11 can correspond to a horizontal row of PCBs 20, so that the packaging and manufacturing of a plurality of PCBs 20 can be realized through one bottom board 10, and the production efficiency is improved.

The distance between any two adjacent grooves 11 is set in a suitable range in the present embodiment, specifically, the distance between any two adjacent grooves 11 is 2mm to 6mm, so as to adapt to the distance between any two adjacent transverse PCBs 20.

In this embodiment, the number of the air suction holes 12 is plural, the plural air suction holes 12 are arranged at intervals along the width direction of the bottom plate 10, and at least one air suction hole 12 is distributed between any two adjacent grooves 11. Specifically, as shown in fig. 1, a plurality of air suction holes 12 are arranged at intervals along the up-down direction of the base plate 10, and at least one air suction hole 12 is distributed between any two adjacent grooves 11. The setting of a plurality of suction holes 12 does benefit to diversified adsorbing PCB20, improves the adsorption affinity between bottom plate 10 and the PCB20, improves PCB20 and bottom plate 10's laminating degree greatly.

In this embodiment, a suction passage 13 is formed in the base plate 10, and the suction passage 13 extends in the width direction of the base plate 10; a plurality of suction holes 12 arranged at intervals in the width direction of the base plate 10 are arranged in a linear array and form a row of groups of suction holes 12, and each suction hole 12 is communicated with a suction passage 13. As shown in fig. 1, in order to facilitate the vacuum-pumping process, a suction channel 13 is formed in the bottom plate 10, the suction channel 13 extends in the vertical direction, the suction holes 12 arranged at intervals in the vertical direction are arranged in a linear array and form a row of suction hole 12 groups, and the plurality of suction holes 12 arranged in the row of suction hole 12 groups are all communicated with the suction channel 13, so that the plurality of suction holes 12 can be synchronously vacuum-pumped by the vacuum-pumping of the suction channel 13, which is simple and convenient.

Further, as shown in fig. 1, the number of the groups of the air suction holes 12 is at least two, at least two rows of the groups of the air suction holes 12 are arranged at intervals along the length direction of the base plate 10, and each row of the groups of the air suction holes 12 is correspondingly provided with an air suction channel 13; the base plate 10 also has an intake passage 14 formed therein, and the intake passage 14 communicates with all the intake passages 13. The two rows of the air suction holes 12 are explained, the two rows of the air suction holes 12 are arranged at intervals in the left-right direction, each row of the air suction holes 12 is correspondingly provided with one air suction channel 13, namely, the number of the air suction channels 13 is two, and the two air suction channels 13 are arranged in one-to-one correspondence with the two rows of the air suction holes 12. In addition, an air inlet channel 14 is further formed in the bottom plate 10 of the present embodiment, the air inlet channel 14 is transversely arranged, each air inlet channel 13 is vertically arranged, and the two air inlet channels 13 are communicated through the air inlet channel 14, so that the two air inlet channels 13 can be vacuumized through one air inlet channel 14, and further, the whole air inlet holes 12 can be vacuumized synchronously through one air inlet channel 14.

For convenience of manufacture, the bottom plate 10 of the present embodiment may be made of stainless steel, and the thickness of the bottom plate may be in a range of 7mm to 8 mm. The air suction channel 13 and the air suction channel 14 can be circular channels or rectangular channels, the width of the air suction channel is within the range of 1.5 mm-2 mm, the air suction holes 12 can be circular through holes, oval through holes, rectangular through holes or other special-shaped through holes, and the size of the air suction holes 12 is within the range of 0.8 mm-1.2 mm. In addition, in order to protect the PCB20 from damage, the base plate 10 is deburred to ensure the smoothness of the surface of the base plate 10.

One side of the bottom plate 10 deviating from the groove 11 of this embodiment is provided with a snap structure 15, and the snap structure 15 protrudes from the bottom plate 10 to a direction away from the groove 11. As shown in fig. 2 and 4, the number of the fastening structures 15 is multiple, the fastening structures 15 are arranged at intervals, and in the packaging process, the fastening structures 15 on the base plate 10 can be fastened with corresponding structures on the packaging device, so that the base plate 10 and the packaging device can be detachably assembled, and the operation is easy.

The above is only the preferred embodiment of the present invention, not so limiting the patent scope of the present invention, all of which are in the utility model discloses a conceive, utilize the equivalent structure transform that the content of the specification and the attached drawings did, or directly/indirectly use all to include in other relevant technical fields the patent protection scope of the present invention.

Claims

1. The utility model provides a bottom plate for PCB encapsulation, its characterized in that, one side of bottom plate is seted up flutedly, the recess certainly the surface of bottom plate is inwards sunken, the recess supplies PCB's components and parts stretch into to dodge components and parts, on the bottom plate one side at recess place has still seted up the suction hole, the suction hole with the recess dislocation distribution.

2. The chassis for PCB packaging of claim 1, wherein the shape of the recess matches the shape of the component, and the depth of the recess is greater than or equal to the thickness of the component.

3. The chassis for PCB packaging of claim 2, wherein the width of the groove is 0.5mm to 4 mm; the depth of the groove is 0.5 mm-2 mm.

4. The chassis for PCB packaging as claimed in claim 2, wherein the distance between both sidewalls of the groove is set to be equal in width or gradually narrowed from the notch of the groove to the bottom of the groove.

5. The bottom plate for a PCB package of any one of claims 1 to 4, wherein the bottom plate is rectangular, the number of the grooves is multiple, a plurality of the grooves are arranged at intervals along the width direction of the bottom plate, and each of the grooves extends along the length direction of the bottom plate.

6. The chassis for PCB packaging of claim 5, wherein a distance between any two adjacent grooves is 2mm to 6 mm.

7. The chassis for PCB package according to claim 5, wherein the number of the suction holes is plural, the plural suction holes are arranged at intervals along the width direction of the chassis, and at least one suction hole is distributed between any two adjacent grooves.

8. A chassis for a PCB package according to claim 7, wherein a suction passage is formed in the chassis, the suction passage extending in a width direction of the chassis; the plurality of air suction holes are arranged at intervals along the width direction of the bottom plate in a linear mode to form a row of air suction hole groups, and each air suction hole is communicated with the air suction channel.

9. A base plate for a PCB package according to claim 8, wherein the number of the suction hole sets is at least two rows, at least two rows of the suction hole sets are arranged at intervals along the length direction of the base plate, each row of the suction hole sets is provided with one of the suction channels; an air inlet channel is formed in the bottom plate and communicated with all the air suction channels.

10. The bottom plate for a PCB package according to any of claims 1 to 4, wherein a side of the bottom plate facing away from the groove is provided with a snap structure protruding from the bottom plate in a direction away from the groove.