CN213693794U - Display screen assembly and mobile terminal - Google Patents

Display screen assembly and mobile terminal Download PDF

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Publication number
CN213693794U
CN213693794U CN202023087129.0U CN202023087129U CN213693794U CN 213693794 U CN213693794 U CN 213693794U CN 202023087129 U CN202023087129 U CN 202023087129U CN 213693794 U CN213693794 U CN 213693794U
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panel
display
chip
film
display screen
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CN202023087129.0U
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Chinese (zh)
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张彦超
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Abstract

The utility model discloses a display screen subassembly and mobile terminal, the display screen subassembly includes display panel, the panel protective layer, circuit board and electronic component, display panel is OLED display panel, display surface and non-display surface back to the back of the body have mutually, the panel protective layer sets up in display panel's non-display surface, one side that deviates from non-display surface of panel protective layer is equipped with keeps away the dead slot, the circuit board sets up in one side that deviates from non-display surface of panel protective layer, electronic component sets up the one side towards the panel protective layer at the circuit board, electronic component part at least is arranged in keeping away the dead slot. Therefore, the space of the existing panel protective layer of the display screen assembly can be utilized for arranging the electronic element, so that the electronic element is arranged on one side of the shell facing the mobile terminal in the related art, the space occupation of the shell of the mobile terminal can be reduced, and the whole light and thin design of the display screen assembly and even the mobile terminal is facilitated.

Description

Display screen assembly and mobile terminal
Technical Field
The utility model relates to a show technical field, especially relate to a display screen subassembly and mobile terminal.
Background
Peripheral circuits around an OLED (organic light-Emitting Diode) display driving IC (Integrated Circuit Chip) of a mobile terminal (such as a mobile phone or a tablet computer) need to be built through a Circuit board, electronic elements on the Circuit board are mostly arranged on one side of the Circuit board facing a housing of the mobile terminal, and thus, a slot needs to be arranged on the housing to avoid the electronic elements, which not only causes the electronic elements to occupy the whole space of the mobile terminal, but also easily affects the layout of functional devices on the housing because the housing needs to be slotted.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model discloses display screen subassembly and mobile terminal can reduce to occupy mobile terminal's complete machine space, reduces the influence to the overall arrangement of the function device on the casing simultaneously.
In order to achieve the above object, in a first aspect, an embodiment of the present invention discloses a display screen assembly, which includes
The display panel is an OLED display panel and is provided with a display surface and a non-display surface which are opposite;
the panel protective layer is arranged on the non-display surface of the display panel, and a clearance groove is formed in one side of the panel protective layer, which is far away from the non-display surface;
the circuit board is arranged on one side of the panel protection layer, which is far away from the non-display surface; and
the electronic element is arranged on one side, facing the panel protection layer, of the circuit board, and at least part of the electronic element is located in the clearance groove.
In a second aspect, the embodiment of the utility model provides a still disclose a display screen subassembly, the display screen subassembly includes:
the display panel is an OLED display panel and is provided with a display surface and a non-display surface which are opposite;
the panel protective layer is arranged on the non-display surface of the display panel, and a clearance groove is formed in one side of the panel protective layer, which is far away from the non-display surface;
the circuit board is arranged on one side of the panel protection layer, which is far away from the non-display surface;
the chip on film is at least partially arranged on one side of the panel protective layer, which is deviated from the non-display surface, and the chip on film is electrically connected with the circuit board; and
the IC chip is arranged on one side, facing the panel protective layer, of the chip on film, and at least part of the IC chip is located in the clearance groove.
In a third aspect, the embodiment of the present invention further discloses a mobile terminal, where the mobile terminal includes a housing and a display screen assembly as described in the first aspect or the second aspect, the housing is formed with an open-ended accommodation space, and the display screen assembly is accommodated in the accommodation space and covers the opening of the housing.
Compared with the prior art, the beneficial effects of the utility model reside in that:
the embodiment of the utility model discloses in display screen subassembly and mobile terminal, set up on the panel protective layer and keep away the dead slot, when setting up electronic component on the circuit board, can set up electronic component towards the panel protective layer, and at least part is arranged in should keeping away the dead slot, and thus, can utilize the space of the existing panel protective layer of display screen subassembly, set up one side at the casing towards mobile terminal with electronic component in the substitution correlation technique, thereby reducible space to mobile terminal's casing occupies, thereby make display screen subassembly overall structure compacter, it is more frivolous. In addition, by adopting the design of the application, the shell of the mobile terminal is not required to be grooved to avoid the electronic element, so that the structure of the shell is not required to be adjusted, and the influence on the layout of the functional devices on the shell is favorably reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of a related art in which electronic components are disposed on a side of a circuit board facing a housing of a mobile terminal;
FIG. 2 is a schematic view of a first structure of a display screen assembly according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of an electronic component disposed on a circuit board according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of a second configuration of a display screen assembly according to an embodiment of the present disclosure;
FIG. 5 is a schematic diagram of a third structure of a display screen assembly according to an embodiment of the present disclosure;
FIG. 6 is a schematic diagram of a fourth configuration of a display screen assembly according to an embodiment of the present disclosure;
FIG. 7 is a schematic diagram of a fifth configuration of a display screen assembly according to an embodiment of the present disclosure;
fig. 8 is a schematic structural diagram of a mobile terminal disclosed in an embodiment of the present application;
fig. 9 is another schematic structural diagram of a mobile terminal disclosed in the embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the present invention, the terms "upper", "lower", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the invention and its embodiments, and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in the present invention can be understood by those of ordinary skill in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Furthermore, the terms "first," "second," and the like are used primarily to distinguish one device, element, or component from another (the specific type and configuration of the device may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.
The inventor has found through research that, in the related art, for a mobile terminal, for example, a mobile phone, as shown in fig. 1, peripheral circuits of a driver IC of an OLED display screen 1 are all required to be built through a circuit board 2, and electronic components 2a such as capacitors and resistors on the circuit board 2 are welded on one side of the circuit board 2 facing a mobile phone shell 3, in this way, because the electronic components 2a protrude outwards relative to the circuit board 2, therefore, a slot 3a corresponding to the electronic components 2a on the mobile phone shell 3 is often required to avoid a space, which not only affects the layout of functional devices of the mobile phone shell 3, but also affects the overall thickness of the mobile phone, and thus, the light and thin design cannot be realized. Moreover, when the mobile phone housing 3 is a metal housing, in order to prevent the electronic component 2a from contacting with the mobile phone housing and causing a short circuit, an insulating sticker 2b, such as a PET (polyethylene terephthalate) sticker, needs to be added on the side of the electronic component 2a facing the mobile phone housing 3, so as to further increase the thickness of the mobile phone in the area corresponding to the electronic component 2 a.
Further, because electronic component 2a sets up towards cell-phone casing 3, when cell-phone casing 3's water-proof effects is unsatisfactory, probably lead to outside steam to get into the condition that influences electronic component 2a in cell-phone casing 3, in order to promote electronic component 2 a's waterproof performance, adopt among the correlation technique encapsulating 4's mode to live electronic component 2a parcel in order to block steam erosion, further increase mobile terminal's material and assembly cost.
In order to improve the above-mentioned problem that occupies the inner space of cell-phone casing and lead to the whole thickness increase of cell-phone and increase mobile terminal's material and assembly cost, first aspect, this application embodiment discloses a display screen subassembly. Referring to fig. 2 and 3, the display screen assembly 10 includes a display panel 11, a panel protective layer 12, a circuit board 13, and an electronic component 14. The display panel 11 has a display surface 111 and a non-display surface 112 opposite to each other, and the panel protection layer 12 is disposed on the non-display surface 112 of the display panel 11. The circuit board 13 is disposed on a side of the panel protection layer 12 facing away from the non-display surface 112 of the display panel 11, and the electronic component 14 is disposed on a side of the circuit board 13 facing the panel protection layer 12.
It is understood that the circuit board 13 may be a flexible circuit board or a flexible and hard circuit board, and of course, the circuit board 13 may also be a pure hard board. In consideration of the fact that the flexible circuit board 13 is thinner and can be bent and deformed, the flexible circuit board 13 can increase the occupied space of the mobile terminal housing, in other words, the flexible circuit board 13 can make the overall thickness of the display screen assembly 10 thinner and thinner.
It is understood that the display panel 11 can be an OLED display panel, when the display screen assembly 10 is applied to a mobile terminal, the non-display surface 112 of the display panel 11 can be a surface facing the inside of the housing of the mobile terminal, and the display surface 111 of the display panel 11 is a surface facing away from the non-display surface 112.
Compared with the related art, in the display screen assembly 10 disclosed in the embodiment of the present application, the space of the panel protection layer 12 of the display screen assembly 10 is utilized, and then the electronic component 14 is disposed on the side of the circuit board 13 facing the panel protection layer 12, so that the occupation of the electronic component 14 on the internal space of the housing of the mobile terminal can be reduced, which is beneficial to the overall light and thin design of the display screen assembly 10. In addition, the electronic element 14 is arranged on the side of the circuit board 13 facing the panel protection layer 12, instead of a way of slotting on the housing of the mobile terminal to avoid the electronic element 14, so that the structure of the housing of the mobile terminal does not need to be adjusted, and the influence on the layout of the functional devices on the housing is favorably reduced.
In some embodiments, the panel protection layer 12 may be a protective auxiliary material layer of the display panel 11 to protect the display panel 11, and the panel auxiliary material layer may cover the non-display surface 112 of the display panel 11 to provide a certain supporting and buffering function for the display panel 11.
Further, in order to enable better positioning of the electronic components 14, such that the panel protection layer 12 may blank the electronic components 14, a side of the panel protection layer 12 facing away from the non-display surface 112 of the display panel 11 is provided with a blank groove 120, and the electronic components 14 may be at least partially located in the blank groove 120. In this way, the electronic component 14 can be at least partially hidden in the clearance groove 120, so that the space of the panel protection layer 12 can be utilized, and the whole structure of the display screen assembly 10 is more compact.
In some embodiments, the panel protective layer 12 may include a flexible protective layer and/or a rigid protective layer. In other words, the panel protection layer 12 may be a flexible protection layer, or the panel protection layer 12 may be a rigid protection layer, or the panel protection layer 12 may be two layers including both a flexible protection layer and a rigid protection layer. It is understood that when the panel protection layer 12 has two layers, the empty space groove 120 may be disposed on only one layer closest to the circuit board 13, for example, if the rigid protection layer is disposed on the flexible protection layer, and the flexible protection layer is disposed toward the circuit board 13, the empty space groove 120 may be disposed on the flexible protection layer. On the contrary, if the flexible protective layer is disposed on the rigid protective layer, and the rigid protective layer is disposed toward the circuit board 13, the clearance groove 120 may be disposed on the rigid protective layer. Of course, the clearance groove 120 may be provided on both the flexible protective layer and the rigid protective layer.
Further, in order to make the structure of the display screen assembly 10 more compact, the projection area of the clearance groove 120 on the circuit board 13 may be greater than or equal to the projection area of the electronic component 14 on the circuit board 13. In this way, the electronic component 14 can be mostly or completely located in the clearance groove 120, thereby making the overall structure of the display screen assembly 10 more compact.
Further, the clearance groove 120 on the panel protection layer 12 may be implemented by opening a window on the panel protection layer 12, and the clearance groove 120 may be a through groove or a blind groove, depending on the protruding height of the electronic component 14 on the circuit board 13. For example, when the protruding height of the electronic component 14 on the circuit board 13 is high, the clearance groove 120 may be a through groove, so that the clearance groove 120 can have a sufficient depth to accommodate the electronic component 14. When the protruding height of the electronic component 14 on the circuit board 13 is small, the clearance groove 120 may be a blind groove, so that the electronic component 14 can be accommodated on one hand, and the panel protection layer 12 can be ensured to have a sufficient supporting effect on the display panel 11 on the other hand.
Furthermore, it can be understood that, since the electronic component 14 is located in the empty avoiding groove 120, when the empty avoiding groove 120 is a through groove and the electronic component 14 may contact the display panel 11, since the display panel 11 is not conductive, there is no need to worry about the electronic component 14 being short-circuited by the panel, so that an insulating sticker may not be attached on the electronic component 14, and the thickness of the display screen assembly 10 in the area where the corresponding electronic component 14 is located may be reduced.
Of course, when the empty avoiding groove 120 is a blind groove, since the panel protection layer 12 itself is an insulating material, there is no need to worry about the short circuit of the electronic component 14, and the use of the insulating sticker can be eliminated.
Therefore, according to the scheme of the embodiment of the application, the electronic component 14 can be accommodated in the clearance groove 120 by the arrangement of the clearance groove 120 on the panel protection layer 12, so that the use of the insulation sticker can be omitted, the thickness of the display screen assembly 10 in the area where the corresponding electronic component 14 is located can be effectively reduced, the use of materials can be reduced, and the material cost can be saved.
In some embodiments, the clearance groove 120 may be one or more, and the electronic component 14 may also include one or more. Specifically, when there is one empty avoiding groove 120, the one or more electronic components 14 may be located in the one empty avoiding groove 120, so that only one empty avoiding groove 120 needs to be formed on the panel protection layer 12, which is convenient for processing. When the empty avoiding groove 120 is plural, the electronic component 14 may also include plural electronic components, and at this time, each electronic component 14 may be set to correspond to one empty avoiding groove 120, so that, on one hand, each electronic component 14 may be separated by each empty avoiding groove 120 to prevent two adjacent electronic components 14 from contacting and conducting electricity, and on the other hand, each empty avoiding groove 120 may be set to correspond to each electronic component 14, so that the influence of concentrated slotting on the strength of the panel protection layer 12 may be avoided, and the support strength of the panel protection layer 12 may be effectively ensured.
It will be appreciated that the above-mentioned electronic components 14 may include one or more of capacitors, resistors, inductors, diodes, or transistors.
In some embodiments, the display screen assembly 10 further includes a first adhesive layer 15, and the circuit board 13 can be adhered to a side of the panel protection layer 12 facing away from the non-display surface 112 of the display panel 11 by the first adhesive layer 15, so that the first adhesive layer 15 can surround the electronic component 14 to seal the electronic component 14. Optionally, the first adhesive layer 15 may be a back adhesive or an adhesive. In actual installation, the first adhesive layer 15 may be made of a back adhesive, in order to facilitate bonding the circuit board 13 and the panel protection layer 12, the first adhesive layer 15 may be covered on the circuit board 13, and then a groove is formed at a position of the first adhesive layer 15 corresponding to the clearance groove 120, so that the first adhesive layer 15 can avoid the electronic component 14, and finally the first adhesive layer 15 is bonded to the non-display surface 112 of the panel protection layer 12 away from the display panel 11.
In the above way, on the one hand, the first adhesive layer 15 can realize the connection between the circuit board 13 and the panel protective layer 12, and on the other hand, the first adhesive layer 15 can enclose the periphery of the electronic element 14, so that the electronic element 14 can be sealed, and thus, the situation that external water vapor enters the shell of the mobile terminal to affect the electronic element 14 can be avoided, and the waterproof performance of the electronic element 14 can be improved. In addition, with the first adhesive layer 15, there is no need to wrap an additional sealant around the electronic element 14 to achieve sealing, so that the material and assembly costs of the mobile terminal can be reduced.
Referring to fig. 4 and 5, in order to further reduce the occupation of the internal space of the housing of the mobile terminal, so that the overall structure of the display screen assembly 10 is more compact and the volume is lighter and thinner, the layout of the IC chip of the display screen assembly 10 is also adjusted to save the occupation of the IC chip on the space of the display screen assembly 10, which will be described in detail below.
As shown in fig. 4, in some embodiments, the display panel assembly 10 further includes a Chip On Flex (or) Chip On Film (COF) 16 and an IC Chip 17, the Chip On Film 16 is at least partially located On a side of the panel protection layer 12 away from the non-display surface 112 of the display panel 11, the Chip On Film 16 is electrically connected to the circuit board 13, the IC Chip 17 is disposed On a side of the Chip On Film 16 facing the panel protection layer 12, and the IC Chip 17 is at least partially located in the clearance groove 120. Specifically, the IC chip 17 may be disposed in the same clearance groove 120 as the electronic component 14, or may be disposed separately. Considering that the IC chip 17 is disposed on the chip on film 16, which is distant from the electronic component 14 disposed on the circuit board 13, if the IC chip 17 and the electronic component 14 are disposed in one empty space groove 120, the empty space groove 120 may be disposed to be large, which may result in insufficient structural strength of the panel protection layer 12. Therefore, in practical arrangement, the IC chip 17 and the electronic component 14 may be disposed in different clearance grooves 120, for example, the clearance groove 120 may include a first clearance groove 121 and a second clearance groove 122 spaced apart from the first clearance groove 121, the electronic component 14 may be at least partially disposed in the first clearance groove 121, and the IC chip 17 may be at least partially disposed in the second clearance groove 122. In this way, when the dummy groove 120 is provided in the panel protective layer 12, the first dummy groove 121 may be provided at a position corresponding to the electronic component 14, and the second dummy groove 122 may be provided at a position corresponding to the IC chip 17.
Thus, by adopting the embodiment of the present application, the electronic component 14 can be disposed on the side of the circuit board 13 facing the panel protection layer 12, and the IC chip 17 can be disposed on the side of the chip on film 16 facing the panel protection layer 12, so as to utilize the existing space of the panel protection layer 12, and thus the display screen assembly 10 is lighter and thinner as a whole, and further does not need to occupy the internal space of the housing of the mobile terminal, thereby effectively reducing the overall thickness of the mobile terminal, and making the whole mobile terminal lighter and thinner.
In addition, similarly, since the IC chip 17 is disposed on the side of the cover glass 16 facing the panel protection layer 12, when the display screen assembly 10 is applied to a mobile terminal, it is not necessary to additionally slot on the housing of the mobile terminal to avoid the IC chip 17, so that the housing structure of the mobile terminal does not need to be adjusted, thereby facilitating the layout of the functional devices on the housing of the mobile terminal.
Further, the display panel 11 may be a rigid panel or a flexible panel.
In an alternative embodiment, as shown in fig. 4, when the display panel 11 is a rigid panel, one end of the flip-chip 16 can be electrically connected to the circuit board 13, and the other end of the flip-chip 16 can extend to the display surface 111 of the display panel 11 and be connected to the display panel 11. Specifically, one end of the chip on film 16, at which the circuit is disposed, may abut against one end of the circuit board 13, at which the circuit is disposed, so as to achieve electrical connection therebetween.
In this embodiment, when the display panel 11 is a rigid panel, the display panel 11 may include a stack of LTPS (Low Temperature Poly-silicon) glass 113 and encap glass 114, wherein the encap glass 114 is disposed above the LTPS glass 113, that is, the LTPS glass 113 has the non-display surface 112, and the other end of the flip chip 16 extends onto the LTPS glass 113 and is connected to the LTPS glass 113.
As shown in fig. 5, in another alternative embodiment, when the display panel 11 is a flexible panel, since the COF has no supporting function, in order to effectively support the flexible display panel 11, the display panel assembly 10 further includes a COP (cyclic Olefin Polymer) film 18, the cover lay film 16 is located on a side of the panel protection layer 12 facing away from the non-display surface 112 of the display panel 11, one end of the cover lay film 16 is electrically connected to the circuit board 13, the other end of the cover lay film 16 is connected to the COP film 18, and one end of the COP film 18 facing away from the cover lay film 16 extends to a display surface 111 of the display panel 11 and is connected to the display panel 11. Specifically, in order to support the COP film 18, a reinforcing layer 181 is provided on the COP film 18, and the reinforcing layer 181 may be, for example, a PET layer, which enhances the strength of the COP film 18 and is also relatively thin and light. Further, in this embodiment, the flip-chip film 16 is disposed below the panel protection layer 12, and the flip-chip film 16 is used to connect the circuit board 13 and the COP film 18.
In some embodiments, the display screen assembly 10 further includes a second adhesive layer 161, and the second adhesive layer 161 may be wrapped around the connection between the flip chip 16 and the circuit board 13 to seal the connection between the flip chip 16 and the circuit board 13. It can be understood that the second adhesive layer 161 can be made of glue, so as to coat the periphery of the joint between the flip chip film 16 and the circuit board 13, thereby preventing water vapor from permeating into the joint between the flip chip film 16 and the circuit board 13, and improving the waterproof effect.
Therefore, no matter the display panel 11 is the flexible display panel 11 or the rigid display panel 11, the second clearance groove 122 may be disposed on the side of the panel protection layer 12 away from the non-display surface 112 of the display panel 11 according to the embodiment of the present application, so that the IC chip 17 may be disposed on the side of the COF toward the panel protection layer 12, the display screen assembly 10 may be more compact, and the occupation of the housing space of the mobile terminal may be reduced.
In some embodiments, the display screen assembly 10 further includes a cover plate 19, and the cover plate 19 may be disposed on the display surface 111 of the display panel 11 to protect the display panel 11. Alternatively, the cover plate 19 may be a glass cover plate 19, so as to facilitate the light of the display panel 11 to pass through, and also to effectively protect the display panel 11.
Adopt the display screen subassembly 10 of the embodiment of this application, utilize the existing panel protective layer 12's of display screen subassembly 10 setting, through set up first clearance groove 121 and second clearance groove 122 on panel protective layer 12, utilize first clearance groove 121 to be used for holding electronic component 14 on the circuit board 13, second clearance groove 122 can be used to hold the IC chip 17 of display screen subassembly 10 simultaneously, thereby can make the overall structure of display screen subassembly 10 compacter, the whole thickness of display screen subassembly 10 is less, when being favorable to display screen subassembly 10 to be applied to mobile terminal, satisfy mobile terminal's frivolous design requirement.
Referring to fig. 6 and 7, in a second aspect, the present embodiment further discloses another display panel assembly 10, where the display panel assembly 10 includes a display panel 11, a panel protection layer 12, a circuit board 13, a chip on film 16, and an IC chip 17. The display panel 11 has a display surface 111 and a non-display surface 112 opposite to each other, and the panel protection layer 12 is disposed on the non-display surface 112 of the display panel 11. The circuit board 13 is disposed on a side of the panel protection layer 12 away from the non-display surface 112, the flip-chip film 16 is at least partially disposed on a side of the panel protection layer 12 away from the non-display surface 112 of the display panel 11, and the flip-chip film 16 is electrically connected to the circuit board 13. The IC chip 17 is disposed on a side of the flip-chip film 16 facing the panel protection layer 12.
It is understood that the display panel 11 can be an OLED display panel, when the display screen assembly 10 is applied to a mobile terminal, the non-display surface 112 of the display panel 11 can be a surface facing the inside of the housing of the mobile terminal, and the display surface 111 of the display panel 11 is a surface facing away from the non-display surface 112.
Compared with the related art, in the display screen assembly 10 disclosed in the embodiment of the present application, the existing space of the panel protection layer 12 of the display screen assembly 10 is utilized, and then the IC chip 17 is disposed on the side of the chip on film 16 facing the panel protection layer 12, so that the occupation of the IC chip 17 on the internal space of the housing of the mobile terminal can be reduced, which is beneficial to the overall light and thin design of the display screen assembly 10. In addition, the IC chip 17 is disposed on the side of the circuit board 13 facing the panel protection layer 12, instead of slotting on the housing of the mobile terminal to avoid the IC chip 17, so that the structure of the housing of the mobile terminal does not need to be adjusted, which is beneficial to reducing the influence on the layout of the functional devices on the housing.
In some embodiments, the panel protection layer 12 may be a protective auxiliary material layer of the display panel 11 to protect the display panel 11, and the panel auxiliary material layer may cover the non-display surface 112 of the display panel 11 to provide a certain supporting and buffering function for the display panel 11.
Further, in order to better enable the arrangement of the IC chip 17 such that the panel protection layer 12 can blank the IC chip 17, a side of the panel protection layer 12 facing away from the non-display surface 112 of the display panel 11 is provided with a blank groove 120, and the IC chip 17 can be at least partially located in the blank groove 120. In this way, the IC chip 17 can be at least partially hidden in the clearance groove 120, so that the space of the panel protection layer 12 can be utilized, and the overall structure of the display panel assembly 10 can be more compact.
In some embodiments, the panel protective layer 12 may include a flexible protective layer and/or a rigid protective layer. In other words, the panel protection layer 12 may be a flexible protection layer, or the panel protection layer 12 may be a rigid protection layer, or the panel protection layer 12 may be two layers including both a flexible protection layer and a rigid protection layer. It is understood that when the panel protection layer 12 has two layers, the empty space groove 120 may be disposed on only one layer closest to the circuit board 13, for example, if the rigid protection layer is disposed on the flexible protection layer, and the flexible protection layer is disposed toward the circuit board 13, the empty space groove 120 may be disposed on the flexible protection layer. On the contrary, if the flexible protective layer is disposed on the rigid protective layer, and the rigid protective layer is disposed toward the circuit board 13, the clearance groove 120 may be disposed on the rigid protective layer. Of course, the clearance groove 120 may be provided on both the flexible protective layer and the rigid protective layer.
Further, the clearance groove 120 on the panel protection layer 12 can be implemented by opening a window on the panel protection layer 12, and the clearance groove 120 can be a through groove or a blind groove, depending on the protrusion height of the IC chip 17 on the chip on film 16. For example, when the protrusion height of the IC chip 17 on the chip on film 16 is high, the clearance groove 120 may be a through groove, so that the clearance groove 120 can have a sufficient depth to accommodate the IC chip 17. When the protrusion height of the IC chip 17 on the flip-chip film 16 is small, the empty-avoiding groove 120 can be a blind groove, so that the IC chip 17 can be accommodated, and the panel protection layer 12 can be ensured to have a sufficient supporting function for the display panel 11.
Further, the display panel 11 may be a rigid panel or a flexible panel.
In an alternative embodiment, as shown in fig. 6, when the display panel 11 is a rigid panel, one end of the flip-chip 16 can be electrically connected to the circuit board 13, and the other end of the flip-chip 16 can extend to the display surface 111 of the display panel 11 and be connected to the display panel 11. Specifically, one end of the chip on film 16, at which the circuit is disposed, may abut against one end of the circuit board 13, at which the circuit is disposed, so as to achieve electrical connection therebetween.
In this embodiment, when the display panel 11 is a rigid panel, the display panel 11 may include a stack of LTPS (Low Temperature Poly-silicon) glass 113 and encap glass 114, wherein the encap glass 114 is disposed above the LTPS glass 113, that is, the LTPS glass 113 has the non-display surface 112, and the other end of the flip chip 16 extends onto the LTPS glass 113 and is connected to the LTPS glass 113.
As shown in fig. 7, in another alternative embodiment, when the display panel 11 is a flexible panel, since the COF has no supporting function, in order to effectively support the flexible display panel 11, the display panel assembly 10 further includes a COP (cyclic Olefin Polymer) film 18, the cover lay film 16 is located on a side of the panel protection layer 12 facing away from the non-display surface 112 of the display panel 11, one end of the cover lay film 16 is electrically connected to the circuit board 13, the other end of the cover lay film 16 is connected to the COP film 18, and one end of the COP film 18 facing away from the cover lay film 16 extends to a display surface 111 of the display panel 11 and is connected to the display panel 11. Specifically, in order to support the COP film 18, a reinforcing layer 181 is provided on the COP film 18, and the reinforcing layer 181 may be, for example, a PET layer, which enhances the strength of the COP film 18 and is also relatively thin and light. Further, in this embodiment, the flip-chip film 16 is disposed below the panel protection layer 12, and the flip-chip film 16 is used to connect the circuit board 13 and the COP film 18.
In some embodiments, the display screen assembly 10 further includes a second adhesive layer 161, and the second adhesive layer 161 may be wrapped around the connection between the flip chip 16 and the circuit board 13 to seal the connection between the flip chip 16 and the circuit board 13. It can be understood that the second adhesive layer 161 can be made of glue, so as to coat the periphery of the joint between the flip chip film 16 and the circuit board 13, thereby preventing water vapor from permeating into the joint between the flip chip film 16 and the circuit board 13, and improving the waterproof effect.
Therefore, no matter the display panel 11 is the flexible display panel 11 or the rigid display panel 11, the clearance groove 120 may be disposed on the side of the panel protection layer 12 away from the non-display surface 112 of the display panel 11 according to the embodiment of the present application, so that the IC chip 17 may be disposed on the side of the COF facing the panel protection layer 12, the display panel assembly 10 is more compact, and the occupation of the housing space of the mobile terminal is reduced.
In some embodiments, the display screen assembly 10 further includes a cover plate 19, and the cover plate 19 may be disposed on the display surface 111 of the display panel 11 to protect the display panel 11. Alternatively, the cover plate 19 may be a glass cover plate 19, so as to facilitate the light of the display panel 11 to pass through, and also to effectively protect the display panel 11.
Further, the display panel 11 may be adhered to the cover plate 19 by the optical adhesive layer 115, so that the cover plate 19 and the display panel 11 may be more reliably connected. It is understood that the optical glue layer 115 can be an OCA glue layer.
By adopting the display screen assembly 10 of the embodiment of the application, the arrangement of the panel protective layer 12 of the display screen assembly 10 is utilized, the clearance groove 120 is arranged on the panel protective layer 12, and the clearance groove 120 is used for accommodating the IC chip 17, so that the whole structure of the display screen assembly 10 is more compact, the whole thickness of the display screen assembly 10 is smaller, and the light and thin design requirement of the mobile terminal is met when the display screen assembly 10 can be applied to the mobile terminal.
Referring to fig. 8, a third aspect of the present embodiment discloses a mobile terminal 100, where the mobile terminal 100 includes a housing 101 and the display screen assembly 10 as described in the first aspect, the housing 101 may form an accommodating space 101a with an opening, and the display screen assembly 10 may be accommodated in the accommodating space 101a and cover the opening of the housing 101.
As shown in fig. 9, it is understood that the mobile terminal 100 may also include a housing 101 and the display screen assembly 10 as described above in the second aspect. The housing 101 may form an accommodating space 101a having an opening, and the display screen assembly 10 may be accommodated in the accommodating space 101a and cover the opening of the housing 101.
It is understood that the mobile terminal 100 may include, but is not limited to, a mobile terminal 100 such as a mobile phone, a tablet computer, a smart watch, and the like. Taking a mobile phone as an example, the housing 101 may include a middle frame and a rear cover connected to the middle frame and forming an accommodating space with the middle frame. Considering that functional devices, such as a battery, a microphone, a speaker, a camera module, a fingerprint identification module, etc., need to be disposed in the middle frame, with the display screen assembly 10 of the embodiment of the present application, since the electronic component 14 and the IC chip 17 are disposed on the side of the circuit board 13 and the COF facing the panel protection layer 12, respectively, neither the electronic component 14 nor the IC chip 17 occupies the space of the middle frame, thereby facilitating the arrangement of the functional devices on the middle frame.
The display screen assembly and the mobile terminal disclosed in the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the above embodiments are only used to help understanding the display screen assembly and the mobile terminal and their core ideas of the present invention; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the specific implementation and application scope, and in summary, the content of the present specification should not be understood as the limitation of the present invention.

Claims (13)

1. A display screen assembly, the display screen assembly comprising:
the display panel is an OLED display panel and is provided with a display surface and a non-display surface which are opposite;
the panel protective layer is arranged on the non-display surface of the display panel, and a clearance groove is formed in one side of the panel protective layer, which is far away from the non-display surface;
the circuit board is arranged on one side of the panel protection layer, which is far away from the non-display surface; and
the electronic element is arranged on one side, facing the panel protection layer, of the circuit board, and at least part of the electronic element is located in the clearance groove.
2. The display screen assembly of claim 1, wherein the panel protective layer comprises a flexible protective layer and/or a rigid protective layer.
3. The display screen assembly of claim 1, wherein the clearance slot is one, the electronic components include one or more, and one or more of the electronic components are located in one of the clearance slots; alternatively, the first and second electrodes may be,
the electronic component comprises a plurality of electronic components, and each electronic component corresponds to one empty avoiding groove.
4. The display screen assembly of claim 1, further comprising a first adhesive layer, wherein the circuit board is adhered to the panel protection layer on a side thereof away from the non-display surface via the first adhesive layer, and the first adhesive layer surrounds the electronic component to seal the electronic component.
5. The display screen assembly of any one of claims 1-4, wherein the display screen assembly further comprises a flip-chip on film and an IC chip, the flip-chip on film is at least partially located on a side of the panel protection layer facing away from the non-display surface, the flip-chip on film is electrically connected to the circuit board, the IC chip is located on a side of the flip-chip on film facing the panel protection layer, and the IC chip is at least partially located in the clearance groove.
6. The display screen assembly of claim 5, wherein the clearance slots include a first clearance slot and a second clearance slot spaced apart from the first clearance slot, the electronic component being at least partially disposed in the first clearance slot, the IC chip being at least partially disposed in the second clearance slot.
7. The display screen assembly of claim 5, wherein the display panel is a rigid panel or a flexible panel;
when the display panel is a rigid panel, one end of the chip on film is electrically connected with the circuit board, and the other end of the chip on film extends to the display surface of the display panel and is connected with the display panel;
when the display panel is a flexible panel, the display screen assembly further comprises a COP film, one end of the chip on film is electrically connected with the circuit board, the other end of the chip on film is connected with the COP film, and one end of the COP film, which is deviated from the chip on film, extends to the display surface of the display panel and is connected with the display panel.
8. The display screen assembly of claim 5, further comprising a second adhesive layer, wherein the second adhesive layer is wrapped around a connection between the flip-chip on film and the circuit board to seal the connection between the flip-chip on film and the circuit board.
9. The display screen assembly of any one of claims 1-4, wherein the circuit board is a flexible circuit board or a rigid-flex circuit board.
10. The display screen assembly of any one of claims 1-4, further comprising a cover plate disposed on the display surface of the display panel.
11. A display screen assembly, the display screen assembly comprising:
the display panel is an OLED display panel and is provided with a display surface and a non-display surface which are opposite;
the panel protective layer is arranged on the non-display surface of the display panel, and a clearance groove is formed in one side of the panel protective layer, which is far away from the non-display surface;
the circuit board is arranged on one side of the panel protection layer, which is far away from the non-display surface;
the chip on film is at least partially arranged on one side of the panel protective layer, which is deviated from the non-display surface, and the chip on film is electrically connected with the circuit board; and
the IC chip is arranged on one side, facing the panel protective layer, of the chip on film, and at least part of the IC chip is located in the clearance groove.
12. The display screen assembly of claim 11, wherein the display panel is a rigid panel or a flexible panel;
when the display panel is a rigid panel, one end of the chip on film is electrically connected with the circuit board, and the other end of the chip on film extends to the display surface of the display panel and is connected with the display panel;
when the display panel is a flexible panel, the display screen assembly further comprises a COP film, one end of the chip on film is electrically connected with the circuit board, the other end of the chip on film is connected with the COP film, and one end of the COP film, which is deviated from the chip on film, extends to the display surface of the display panel and is connected with the display panel.
13. A mobile terminal, characterized in that the mobile terminal comprises a housing and a display screen assembly according to any one of claims 1 to 10 or a display screen assembly according to claim 11 or 12, the housing forms an accommodating space with an opening, and the display screen assembly is accommodated in the accommodating space and covers the opening of the housing.
CN202023087129.0U 2020-12-17 2020-12-17 Display screen assembly and mobile terminal Active CN213693794U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202023087129.0U CN213693794U (en) 2020-12-17 2020-12-17 Display screen assembly and mobile terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202023087129.0U CN213693794U (en) 2020-12-17 2020-12-17 Display screen assembly and mobile terminal

Publications (1)

Publication Number Publication Date
CN213693794U true CN213693794U (en) 2021-07-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
CN (1) CN213693794U (en)

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