CN213692089U

CN213692089U - Novel packaging structure of diode

Info

Publication number: CN213692089U
Application number: CN202023249187.9U
Authority: CN
Inventors: 邱海波
Original assignee: Yike United Shenzhen Ic Co ltd
Current assignee: Yike United Shenzhen Ic Co ltd
Priority date: 2020-12-29
Filing date: 2020-12-29
Publication date: 2021-07-13
Anticipated expiration: 2030-12-29

Abstract

The utility model provides a novel packaging structure of a diode, which belongs to the technical field of diode packaging, and comprises a bottom plate, wherein the top part of the bottom plate is fixedly connected with a support column, a reflecting cup and a shell from inside to outside in sequence, the top end of the support column is fixedly connected with a support plate, the bottom part of the support plate is fixedly connected with a radiating fin, the top part of the support plate is fixedly connected with a clamping plate, the novel packaging structure of the diode is provided with the radiating fin, the support column and the support column, the heat generated by a chip is transmitted to the radiating fin through the support plate and the support column, and finally the heat is transmitted to the outside, thereby avoiding the damage caused by the internal overheating of the diode, and the clamping seat and the clamping plate can respectively fix the chip, an anode pin and a cathode pin to prevent the chip, the, the light reflecting cup and the lens can be used for converging light to prevent the light from diverging.

Description

Novel packaging structure of diode

Technical Field

The utility model belongs to the technical field of the diode encapsulation, concretely relates to novel packaging structure of diode.

Background

In recent years, as the light emitting efficiency of the light emitting diode is continuously improved, the light emitting diode is widely used in many lighting applications, such as a scanner light source requiring high-speed response, a backlight source of a liquid crystal display or a front light source of an automobile, a traffic signal lamp, and a general lighting device.

The diode structure among the prior art is comparatively simple, and positive negative pole pin and chip position take place to remove easily during the encapsulation, and the unable discharge of heat that produces of chip self in the use leads to the fact the damage to the diode easily, shortens life.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a novel packaging structure of diode, positive negative pole pin and chip position take place easily to remove when aiming at solving among the prior art encapsulation, and the unable discharge of heat that chip self produced in the use, cause the damage to the diode easily, shorten life's problem.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a novel packaging structure of diode, comprises a base plate, fixedly connected with support column, anti-light cup and shell in proper order from inside to outside at the top of bottom plate, the top fixedly connected with backup pad of support column, the bottom fixedly connected with fin of backup pad, the top fixedly connected with cardboard of backup pad, the inside swing joint of cardboard has the chip, the anodal gold thread of left side fixedly connected with at chip top, the anodal pin of one end fixedly connected with of anodal gold thread, the right side fixedly connected with negative pole gold thread at chip top, the one end fixedly connected with negative pole pin of negative pole gold thread, the inside of shell is provided with the encapsulated layer, the top fixedly connected with lens of shell.

In order to make this novel packaging structure of diode reach the effect of being convenient for distinguish anodal pin and negative pole pin, conduct the utility model relates to an it is preferred, one side fixedly connected with lug that the bottom plate bottom is close to anodal pin.

In order to make this novel packaging structure of diode reach the effect of fixed anodal pin and negative pole pin, conduct the utility model relates to an it is preferred, the equal fixedly connected with cassette in the outside of anodal pin and negative pole pin.

In order to make this novel packaging structure of diode reach the radiating effect of being convenient for, as the utility model relates to an it is preferred, the quantity of fin is four, four the fin is arranged with linear array.

In order to make this novel packaging structure of diode reach the effect of fixed chip, conduct the utility model relates to an it is preferred, the quantity of cardboard is four, four the cardboard is arranged with rectangular array.

In order to make this novel packaging structure of diode reach the effect of reinforcing diode light transmissivity and receiving and dispatching signal ability, as the utility model relates to an it is preferred, the encapsulated layer is made by the epoxy material.

Compared with the prior art, the beneficial effects of the utility model are that:

1. this novel packaging structure of diode, through the setting of fin, support column and support column, the heat that chip self produced transmits the fin for via backup pad and support column, finally transmits the heat to the external world through the fin, avoids the inside overheat of diode to cause the harm.

2. This novel packaging structure of diode, through the setting of lens, anti-light cup, cassette and cardboard can fix a position chip and anodal pin, negative pole pin respectively and fix a position, prevent that chip, anodal pin and negative pole pin position from taking place the skew, and anti-light cup and convex surface form's lens can be to the light polymerization, prevent that light from dispersing.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic view of an axial measurement structure of the present invention;

fig. 2 is a schematic front view of the cross-sectional structure of the present invention;

fig. 3 is a schematic top view of the cross-sectional structure of the present invention;

fig. 4 is an enlarged schematic view of a portion a in fig. 2 according to the present invention.

In the figure: 1. a base plate; 2. a housing; 3. a bump; 4. a positive electrode pin; 5. a negative electrode pin; 6. a heat sink; 7. a lens; 8. a light reflecting cup; 9. a packaging layer; 10. a card holder; 11. a support plate; 12. a support pillar; 13. a negative gold wire; 14. clamping a plate; 15. a chip; 16. and (3) positive gold wire.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Examples

Referring to fig. 1-4, the present invention provides the following technical solutions: the utility model provides a novel packaging structure of diode, comprising a base plate 1, bottom plate 1's top is from interior fixedly connected with support column 12 to outer in proper order, anti-light cup 8 and shell 2, support column 12's top fixedly connected with backup pad 11, backup pad 11's bottom fixedly connected with fin 6, backup pad 11's top fixedly connected with cardboard 14, cardboard 14's inside swing joint has chip 15, the anodal gold thread 16 of the left side fixedly connected with at chip 15 top, the anodal pin 4 of the one end fixedly connected with of anodal gold thread 16, the right side fixedly connected with negative pole gold thread 13 at chip 15 top, the one end fixedly connected with negative pole pin 5 of negative pole gold thread 13, the inside of shell 2 is provided with packaging layer 9, the top fixedly connected with lens 7 of shell 2.

The utility model discloses an in the embodiment, through fin 6, the setting of backup pad 11 and support column 12, the heat that chip 15 self produced is transmitted for fin 6 through backup pad 11 and support column 12, finally transmit the heat to the external world through fin 6, avoid the inside overheated harm that causes of diode, through lens 7, anti-light cup 8, the setting of cassette 10 and cardboard 14, cassette 10 and cardboard 14 can be respectively to chip 15 and anodal pin 4, negative pole pin 5 fixes a position fixedly, prevent chip 15, anodal pin 4 and negative pole pin 5 offset take place, anti-light cup 8 and convex surface's lens 7 can be polymerized to the light, prevent that light from dispersing.

Specifically, a bump 3 is fixedly connected to one side of the bottom plate 1, which is close to the positive pin 4.

In this embodiment: the effect of facilitating the discrimination of the positive electrode pin 4 and the negative electrode pin 5 is achieved by providing the projection 3.

Specifically, the outer sides of the positive electrode pin 4 and the negative electrode pin 5 are both fixedly connected with the clamping seats 10.

In this embodiment: the clamping seat 10 is arranged to fix the positive electrode pin 4 and the negative electrode pin 5.

Specifically, the number of the heat radiating fins 6 is four, and the four heat radiating fins 6 are arranged in a linear array.

In this embodiment: the effect of facilitating heat dissipation is achieved by arranging the four heat dissipation fins 6.

Specifically, the number of the cards 14 is four, and the four cards 14 are arranged in a rectangular array.

In this embodiment: the effect of securing the chip 15 is achieved by providing four card plates 14.

Specifically, the encapsulating layer 9 is made of an epoxy resin material.

In this embodiment: the effect of reinforcing diode light transmissivity and receiving and dispatching signal ability is reached through the encapsulation layer 9 that sets up the epoxy material.

The electrical components presented in the document are all electrically connected with an external master controller and 220V mains, and the master controller can be a conventional known device controlled by a computer or the like.

The utility model discloses a theory of operation and use flow: when the novel diode packaging structure is used, an operator places the anode pin 4 and the cathode pin 5 into the clamping seat 10 and places the chip 15 into the clamping plate 14, the clamping seat 10 and the clamping plate 14 can respectively position and fix the chip 15, the anode pin 4 and the cathode pin 5 to prevent the chip 15, positive pole pin 4 and the skew takes place for negative pole pin 5 position, reflection of light cup 8 and convex surface form lens 7 can be to the light polymerization, prevent that the light from dispersing the heat that chip 15 self produced and transmitting for fin 6 through backup pad 11 and support column 12, finally transmit the heat to the external world through fin 6, avoid the inside overheat of diode to cause the harm, lug 3 can be convenient for the operator to distinguish positive pole pin 4 and negative pole pin 5, lens 7, reflection of light cup 8 and epoxy's encapsulated layer 9 can strengthen the light transmissivity and the signal transceiver ability of diode.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A novel diode packaging structure comprises a bottom plate (1), and is characterized in that: the top of the bottom plate (1) is fixedly connected with a supporting column (12), a reflecting cup (8) and a shell (2) from inside to outside in sequence, the top end of the supporting column (12) is fixedly connected with a supporting plate (11), the bottom of the supporting plate (11) is fixedly connected with a radiating fin (6), the top of the supporting plate (11) is fixedly connected with a clamping plate (14), the inside of the clamping plate (14) is movably connected with a chip (15), the left side of the top of the chip (15) is fixedly connected with an anode gold wire (16), one end of the positive gold wire (16) is fixedly connected with a positive pin (4), the right side of the top of the chip (15) is fixedly connected with a negative gold thread (13), one end of the negative gold thread (13) is fixedly connected with a negative pin (5), the LED lamp is characterized in that an encapsulation layer (9) is arranged inside the shell (2), and a lens (7) is fixedly connected to the top of the shell (2).

2. The novel diode packaging structure of claim 1, wherein: and a convex block (3) is fixedly connected to one side of the bottom plate (1) close to the positive pin (4).

3. The novel diode packaging structure of claim 1, wherein: and clamping seats (10) are fixedly connected to the outer sides of the positive electrode pin (4) and the negative electrode pin (5).

4. The novel diode packaging structure of claim 1, wherein: the number of the radiating fins (6) is four, and the four radiating fins (6) are arranged in a linear array.

5. The novel diode packaging structure of claim 1, wherein: the number of the clamping plates (14) is four, and the four clamping plates (14) are arranged in a rectangular array.

6. The novel diode packaging structure of claim 1, wherein: the packaging layer (9) is made of epoxy resin material.