CN213692000U - Heat dissipation type diode - Google Patents

Abstract

The utility model discloses a heat dissipation formula diode, the on-line screen storage device comprises a base, and the last fixed surface of base has control chip, the last fixed surface of base has the safety cover that is used for protecting control chip, control chip's circumference fixed surface has the heat conduction silicone grease layer, and is fixed with a plurality of heat pipe between heat conduction silicone grease layer and the safety cover, the louvre has been seted up on the surface of safety cover, control chip's bottom is fixed with two conductive seats. The utility model discloses an above-mentioned isotructure's cooperation, it improves heat conduction efficiency to have realized the heat pipe, the surface that is transmitted the safety cover that the heat that makes control chip during operation produce can be timely, thereby accelerated the radiating efficiency to control chip, can also play the absorbing effect of buffering to the diode simultaneously, make the diode can adapt to different abominable operational environment, avoided when the diode uses in the strong environment of vibrations, lead to pin contact failure because of vibrations, and influence the normal use of diode.

Description

Heat dissipation type diode

Technical Field

The utility model relates to a diode technical field specifically is a heat dissipation formula diode.

Background

Diodes, electronic components, a device with two electrodes, allow current to flow only in a single direction, and many applications use the rectifying function. And the varactor is used as an electronically tunable capacitor. The current directivity that most diodes have is commonly referred to as the "rectifying" function. The most common function of a diode is to allow current to pass in a single direction (referred to as forward biasing) and to block current in the reverse direction (referred to as reverse biasing).

Because the existing diode has a simple structure and a poor heat dissipation effect, and is not provided with a damping component, when the diode works in an environment with strong vibration, the pin is easy to be in poor contact due to the vibration, so that the normal use of the diode is influenced, and the diode needs to be used.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat dissipation formula diode, it improves heat conduction efficiency to possess the heat pipe, the surface that is transmitted the safety cover that the heat that makes control chip during operation produce can be timely, thereby the radiating efficiency to control chip has been accelerated, can also play the absorbing effect of buffering to the diode simultaneously, make the diode can adapt to different abominable operational environment, when having avoided when the diode uses in the strong environment of vibrations, lead to pin contact failure because of vibrations, and influence the normal use of diode, the problem of proposing among the above-mentioned background art has been solved.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a heat dissipation formula diode, includes the base, and the last fixed surface of base has control chip, the last fixed surface of base has the safety cover that is used for protecting control chip, control chip's circumference fixed surface has heat conduction silicone grease layer, and is fixed with a plurality of heat pipe between heat conduction silicone grease layer and the safety cover, the louvre has been seted up on the surface of safety cover, control chip's bottom is fixed with two electrically conductive seats, and electrically conductive seat's bottom has the pin through damper assembly electric connection.

Preferably, a dust screen for preventing external dust from entering the protective cover through the heat dissipation holes is arranged in the heat dissipation holes.

Preferably, a heat dissipation fin for increasing a contact area of the protective cover with air is fixed to a surface of the protective cover.

Preferably, the inner wall of the heat pipe is provided with a super-hydrophilic capillary wick.

Preferably, the damping component comprises a conductive cylinder fixed on the conductive seat, and an elastic component used for buffering and damping the pins is arranged in the conductive cylinder.

Preferably, the elastic component comprises a spring fixed on the inner wall of the conductive cylinder, a conductive block is fixed at the bottom end of the spring, and the conductive block is fixedly connected with the top end of the pin.

Compared with the prior art, the beneficial effects of the utility model are as follows:

one, the utility model discloses a set up heat conduction silicone grease layer, heat pipe, louvre and radiating fin for when the control chip surface produces and gathers a large amount of heats, the heat can be through on heat conduction silicone grease layer transmits the heat pipe, can know by the characteristic of heat pipe self, the heat pipe has improved heat conduction efficiency, the surface by the transmission safety cover that makes the heat that the control chip during operation produced can be timely, thereby accelerated the dissipation of control chip surface heat, improved radiating efficiency.

Two, the utility model discloses a set up conductive seat, electrically conductive section of thick bamboo, spring and conducting block for in the diode is in vibrations comparatively strong environment, the shaking force that the diode received can be stored for the elasticity of spring, make the pin firmly stably peg graft on corresponding worker, thereby make the diode can adapt to different abominable operational environment, avoided when the diode uses in the strong environment of vibrations, lead to pin contact failure because of vibrations, and influence the normal use of diode, the stability of diode work has been improved.

Drawings

Fig. 1 is a front view of the present invention;

fig. 2 is a front cross-sectional view of the present invention;

fig. 3 is an enlarged view of the structure of the present invention at a.

In the figure: 1. a base; 2. a control chip; 3. a protective cover; 4. a thermally conductive silicone layer; 5. a heat pipe; 6. heat dissipation holes; 7. a conductive seat; 8. a pin; 9. a dust screen; 10. a heat dissipating fin; 11. a conductive barrel; 12. a spring; 13. and a conductive block.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 3, the present invention provides a technical solution: the utility model provides a heat dissipation formula diode, includes base 1, and the upper surface of base 1 is fixed with control chip 2, and the upper surface of base 1 is fixed with and is used for carrying out the safety cover 3 that protects control chip 2.

Further, the surface of the protection cover 3 is fixed with the heat radiating fins 10 for increasing the contact area between the protection cover 3 and air, and the heat radiating fins 10 increase contact neps of the residual outside air of the protection cover 3, so that the heat dissipation of the surface of the protection cover 3 is accelerated.

The circumferential surface of the control chip 2 is fixed with a heat-conducting silicone grease layer 4, and a plurality of heat pipes 5 are fixed between the heat-conducting silicone grease layer 4 and the protective cover 3.

Further, the inner wall of the heat pipe 5 is provided with the super-hydrophilic capillary wick, the super-hydrophilic capillary wick in the heat pipe 5 can be prepared by adding a pore-forming agent, after the super-hydrophilic treatment is performed on the capillary wick, a layer of rough nano skin and nano grass can be formed on the surface of the capillary wick, and the existence of the nano skin and the nano grass can not only greatly improve the liquid absorption capacity of the capillary wick, but also increase the phase-change heat exchange area, thereby greatly improving the thermal performance of the heat pipe 5 (the preparation of the super-hydrophilic capillary wick belongs to the prior art, and a person skilled in the art can know by looking up related data, so that the description is omitted).

The surface of the protective cover 3 is provided with heat dissipation holes 6.

Further, be equipped with in the louvre 6 and be used for preventing that external dust from entering into the dust screen 9 in the safety cover 3 through louvre 6, dust screen 9 prevents effectively that external dust from entering into safety cover 3, when control chip 2 surface produces and gathers a large amount of heats, the heat can be passed through heat conduction silicone grease layer 4 and transmitted to heat pipe 5 on, known by the characteristics of heat pipe 5 self, the one end that heat pipe 5 is close to control chip 2 is the evaporating end, the other end is the condensing end, when heat pipe one end is heated, the liquid in the capillary vaporizes rapidly, vapour flows to the other end under the power of thermal diffusion, and release the heat at the cold junction condensation, liquid flows back to the evaporating end along porous material by the capillary action again, so the circulation is more than, steam thermal diffusion stops when heat pipe both ends temperature equals this moment. The circulation is performed rapidly, heat can be conducted continuously, so that the heat conduction efficiency is improved, heat generated by the control chip 2 during working can be timely transmitted to the surface of the protective cover 3, the heat transmitted by the heat pipe 5 can be dissipated under the action of the radiating fins 10 and the radiating holes 6, the dissipation of the heat on the surface of the control chip 2 is accelerated, and the heat dissipation efficiency is improved.

The bottom of control chip 2 is fixed with two conductive seat 7, and the bottom of conductive seat 7 has pin 8 through damper assembly electric connection.

Further, damper is including fixing the conductive tube 11 on conductive seat 7, be equipped with in the conductive tube 11 and be used for buffering absorbing elastic component to pin 8, and be in vibrations in the comparatively strong environment, the shaking force that the diode received can be converted into the elasticity of spring 12 and store, make pin 8 firmly stably peg graft on corresponding work ware, thereby make the diode can adapt to different abominable operational environment, when having avoided when the diode uses in the strong environment of vibrations, lead to pin 8 contact failure because of vibrations, and influence the normal use of diode, the stability of diode work has been improved.

Further, elastic component is including fixing spring 12 on electrically conductive section of thick bamboo 11 inner wall, and the bottom mounting of spring 12 has conducting block 13, and conducting block 13 and pin 8's top fixed connection, and through the setting of electrically conductive seat 7, electrically conductive section of thick bamboo 11 and conducting block 13 for when spring 12 played the absorbing effect of buffering to the diode, can not influence control chip 2 and pin 8's electric connection.

The working principle is as follows: when the heat dissipation diode is used, when a large amount of heat is generated and accumulated on the surface of the control chip 2, the heat can be transferred to the heat pipe 5 through the heat conduction silicone layer 4, the characteristics of the heat pipe 5 are known, namely, one end of the heat pipe 5, which is close to the control chip 2, is an evaporation end, the other end of the heat pipe is a condensation end, when one end of the heat pipe is heated, liquid in a capillary tube is rapidly vaporized, vapor flows to the other end under the power of heat diffusion, the vapor is condensed at the cold end to release heat, and the liquid flows back to the evaporation end along the porous material under the capillary action, so that the circulation is not stopped until the temperatures of the two ends of the heat pipe are equal. The circulation is performed rapidly, heat can be conducted continuously, so that the heat conduction efficiency is improved, heat generated by the control chip 2 during working can be timely transmitted to the surface of the protective cover 3, and the heat transmitted by the heat pipe 5 can be dissipated under the action of the radiating fins 10 and the radiating holes 6, so that the dissipation of the heat on the surface of the control chip 2 is accelerated, and the heat dissipation efficiency is improved; when the diode is in an environment with stronger vibration, the vibration force applied to the diode can be converted into the elastic force of the spring 12 to be stored, so that the pin 8 can be firmly and stably inserted into the corresponding working device, the diode can adapt to different severe working environments, the problem that the pin 8 is in poor contact due to vibration when the diode is used in the environment with stronger vibration, the normal use of the diode is influenced, and the working stability of the diode is improved.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a heat dissipation formula diode, includes base (1), and the upper surface of base (1) is fixed with control chip (2), the upper surface of base (1) is fixed with and is used for carrying out safety cover (3) protected control chip (2), its characterized in that: the circumference fixed surface of control chip (2) has heat conduction silicone grease layer (4), and is fixed with a plurality of heat pipe (5) between heat conduction silicone grease layer (4) and safety cover (3), louvre (6) have been seted up on the surface of safety cover (3), the bottom of control chip (2) is fixed with two electrically conductive seats (7), and the bottom of electrically conductive seat (7) has pin (8) through damper assembly electric connection.

2. The thermal diode of claim 1, wherein: and a dustproof net (9) for preventing external dust from entering the protective cover (3) through the heat dissipation holes (6) is arranged in the heat dissipation holes (6).

3. The thermal diode of claim 1, wherein: and heat radiating fins (10) for increasing the contact area between the protective cover (3) and air are fixed on the surface of the protective cover (3).

4. The thermal diode of claim 1, wherein: and the inner wall of the heat pipe (5) is provided with a super-hydrophilic capillary core.

5. The thermal diode of claim 1, wherein: the shock absorption assembly comprises a conductive cylinder (11) fixed on the conductive seat (7), and an elastic assembly used for buffering and absorbing the pins (8) is arranged in the conductive cylinder (11).

6. The thermal diode of claim 5, wherein: the elastic component comprises a spring (12) fixed on the inner wall of the conductive cylinder (11), a conductive block (13) is fixed at the bottom end of the spring (12), and the conductive block (13) is fixedly connected with the top end of the pin (8).

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