CN213648310U

CN213648310U - Cooling forming die for producing IC packaging tube

Info

Publication number: CN213648310U
Application number: CN202022234814.5U
Authority: CN
Inventors: 刘德强
Original assignee: Shenzhen Shengyuan Semiconductors Co ltd
Current assignee: Shenzhen Shengyuan Semiconductors Co ltd
Priority date: 2020-10-09
Filing date: 2020-10-09
Publication date: 2021-07-09
Anticipated expiration: 2030-10-09

Abstract

The application relates to a cooling forming die for producing IC packing tube, it includes interconnect's cope match-plate pattern and lower bolster, one side of lower bolster orientation cope match-plate pattern is provided with the shaping recess with plastic packing tube looks adaptation, the tank bottom of shaping recess is provided with the shaping bead along the orientation of seting up of shaping recess, the cope match-plate pattern forms the shaping passageway that supplies the plastic packing tube to pass through with the cooperation of shaping recess, be equipped with a plurality of groups negative pressure recess on the inner wall of shaping passageway. This application has the recess cell wall that makes the plastic packing tube and the junction of plastic packing tube bottom surface and forms the effect at right angle.

Description

Cooling forming die for producing IC packaging tube

Technical Field

The application relates to the field of packaging tube production, in particular to a cooling forming die for producing an IC packaging tube.

Background

At present, plastic packaging tubes are commonly used for storing power semiconductor devices (commonly known as "chips" or "ICs"). The chip is a rectangular plate-shaped object with a foolproof opening on the side surface, and the plastic packaging tube is a hollow tube with a groove on the bottom surface, and the groove is sunken towards the inside of the plastic packaging tube and is formed along the length direction of the plastic packaging tube. When the chip packaging tube is used, the fool-proof openings on the chips correspond to the grooves of the plastic packaging tube and then sequentially slide into the plastic packaging tube, so that the chips can be arranged and stored piece by piece, and the chips can be orderly taken out when being used later.

In the related art, there are two methods for producing plastic parts, one is a mold processing method for producing irregular-shaped plastic parts, which joins two parts of the plastic part by separately molding and then heating, but this method has a slow production speed, complicated process and a low yield; one is an extrusion process for producing regularly shaped plastic parts by extruding the shape of the product through an extruder and drawing, during which the outer wall of the product is cooled and set. If the plastic packing tube is produced by adopting an extrusion molding production method in order to improve the production speed, when the groove on the bottom surface of the plastic packing tube is molded by using a mold, the protrusion on the mold can be propped against the upper bottom surface of the plastic packing tube, and the connection part of the groove wall of the groove and the bottom surface of the plastic packing tube can be bent due to the lack of support inside the plastic packing tube, so that a right angle cannot be formed.

SUMMERY OF THE UTILITY MODEL

In order to enable the connecting part of the groove wall of the plastic packing tube and the bottom surface of the plastic packing tube to form a right angle, the application provides a cooling forming die for producing an IC packing tube.

The application provides a cooling forming die for producing IC packing tube adopts following technical scheme:

the utility model provides a cooling forming die for producing IC packing tube, includes interconnect's cope match-plate pattern and lower bolster, one side of lower bolster orientation cope match-plate pattern is provided with the shaping recess with plastic packing tube looks adaptation, the tank bottom of shaping recess is provided with the shaping bead along the orientation of seting up of shaping recess, the cope match-plate pattern forms the shaping passageway that supplies the plastic packing tube to pass through with the cooperation of shaping recess, be equipped with a plurality of groups negative pressure recess on the inner wall of shaping passageway.

Through adopting above-mentioned technical scheme, the circular plastic packing tube that extrudes from the extruder will be moulded for square plastic packing tube behind the shaping passageway between cope match-plate pattern and the lower bolster, and this plastic packing tube's bottom will have the recess with shaping bead looks adaptation. In use, the plastic packing tube passes through the forming channel and cooperates with the forming channel to form the cooling flow channel. The mold is placed in cooling water, the cooling water enters a cooling flow channel, water and air in the cooling flow channel are sucked by the negative pressure groove in the inner wall of the forming channel, so that the cooling water and the air in the cooling flow channel flow at high speed, the plastic packaging tube is cooled rapidly, and the surface of the plastic packaging tube is hardened. Because the inside of the plastic packaging tube is communicated with the atmosphere, the internal air pressure is close to the atmospheric pressure and is greater than the pressure in the cooling flow channel, the pressure difference enables the tube wall of the plastic packaging tube to be attached to the inner wall of the forming channel, and the connecting part of the groove wall of the groove and the bottom surface of the plastic packaging tube forms a right angle. In addition, the upper die plate and the lower die plate are matched with each other, and compared with an integrated die, the maintenance is more convenient.

Preferably, the upper template and the lower template respectively comprise an outer side part, a middle layer splint and an inner side part which are sequentially connected, the inner side part of the upper template and the inner side part of the lower template are oppositely arranged and bolted, and one side of the outer side part facing the middle layer splint is provided with a cooling clamp groove for flowing of condensed water.

Through adopting above-mentioned technical scheme, because the inside part laminating is in the plastic packing tube, the temperature is higher, and for the plastic packing tube of rapid hardening, the cooling of outside part presss from both sides the groove and carries out quick cooling to the inside part.

Preferably, the negative pressure groove is arranged on the inner side portion, the inner side portion is respectively provided with a row of negative pressure through holes at two ends of the negative pressure groove, the negative pressure through holes are respectively communicated with the negative pressure groove, two negative pressure flow passages are arranged between the inner side portion and the middle layer splint and are respectively communicated with the row of negative pressure through holes, and two sides of the inner side portion are respectively provided with an exhaust tube communicated with the negative pressure flow passages.

Through adopting above-mentioned technical scheme, the exhaust tube extracts air and cooling water in the negative pressure runner to make negative pressure through-hole and negative pressure recess form the negative pressure.

Preferably, the inner side part is provided with a heat dissipation flow channel between the negative pressure flow channels, and the inner side part is provided with a water inlet pipe and a water outlet pipe which are communicated with two ends of the heat dissipation flow channel.

By adopting the technical scheme, the condensed water flows through the heat dissipation flow channel so as to absorb the heat transferred to the inner side part by the plastic packing tube.

Preferably, the distance between each group of negative pressure grooves is gradually increased in the direction away from the inlet of the forming channel, and the number of the negative pressure grooves in each group of negative pressure grooves is gradually reduced in the direction away from the inlet of the forming channel.

Through adopting above-mentioned technical scheme, because at the entry end department of mould, the temperature of plastic packing tube is higher, and the hardness is lower, and the shape is just become, needs great negative pressure to adsorb the plastic packing tube on the inner wall of shaping passageway to accomplish better setting. Meanwhile, the negative pressure at the position is higher, so that cooling water flow is favorably sucked, and the cooling effect is improved.

Preferably, the cooling clamp groove is U-shaped, and a water inlet and a water outlet which are communicated with two ends of the cooling clamp groove are formed in the outer side part.

Through adopting above-mentioned technical scheme, cooling clamp groove is the U-shaped, compares in the runner of orthoscopic, and the flow distance of its inside cooling water is longer, and the area of contact with middle level splint is bigger, and cooling efficiency is higher.

Preferably, rubber layers are respectively arranged on two sides of the middle layer clamping plate, and the outer side part and the inner side plate are connected with the middle layer clamping plate through the rubber layers.

By adopting the technical scheme, when the upper template and the lower template are bolted on the middle layer clamping plate, the sealing effect is generated by abutting the rubber layers respectively, so that air leakage or water leakage of the negative pressure flow channel is avoided.

Drawings

FIG. 1 is a schematic overall view of a cooling and forming die for producing IC packaging tubes in an embodiment of the present application;

fig. 2 is an exploded view of a cooling molding die for producing an IC packaging tube in the embodiment of the present application.

Description of reference numerals:

1. mounting a template; 2. a lower template; 3. forming a groove; 4. forming ribs; 5. forming a channel; 61. an outer side portion; 62. a middle layer splint; 63. an inner side portion; 64. a negative pressure groove; 65. a negative pressure through hole; 66. a negative pressure flow passage; 67. a heat dissipation flow channel; 68. cooling the clamping groove; 69. a rubber layer.

Detailed Description

The present application is described in further detail below with reference to fig. 1 and 2.

The embodiment of the application discloses a cooling forming die for producing an IC packing tube. Referring to fig. 1, the mold comprises an upper mold plate 1 and a lower mold plate 2 which are connected with each other, and the upper mold plate 1 and the lower mold plate 2 are both square-shaped as a whole. One side of the lower template 2 facing the upper template 1 is provided with a forming groove 3 matched with the plastic packing tube, the bottom of the forming groove 3 is provided with a forming convex edge 4 along the opening direction of the forming groove 3, the upper template 1 is matched with the forming groove 3 to form a forming channel 5, and correspondingly, the cross section shape of the forming channel 5 is matched with the designed cross section shape of the plastic packing tube.

Referring to fig. 1 and 2, each of the upper and

lower mold plates

1 and 2 includes an outer side portion 61, a middle layer-sandwiched plate 62, and an inner side portion 63 connected in sequence, and the outer side portion 61, the middle layer-sandwiched plate 62, and the inner side portion 63 form a sandwich structure. Wherein, the inner side part 63 of the upper template 1 and the inner side part 63 of the lower template 2 are oppositely arranged and bolted, thereby realizing the fixation. When maintenance or replacement is needed, the connection can be released only by detaching the bolt, which is very convenient.

The side of the inner part 63 facing away from the outer part 61 is provided with a plurality of groups of negative pressure grooves 64, each group of negative pressure grooves 64 comprises a plurality of equally spaced and parallel negative pressure grooves 64, and the negative pressure grooves 64 are arranged along the length direction of the forming channel 5. The respective sets of negative pressure grooves 64 are gradually increased in pitch in a direction away from the inlet of the shaping passage 5, and the number of negative pressure grooves 64 in the respective sets of negative pressure grooves 64 is gradually decreased in a direction away from the inlet of the shaping passage 5. In addition, the inner side portion 63 is provided with a row of negative pressure through holes 65 at both ends of the negative pressure groove 64, and the two rows of negative pressure through holes 65 are arranged in parallel. Two ends of each negative pressure groove 64 are respectively communicated with the negative pressure through holes 65, and the negative pressure through holes 65 at the two ends are respectively affiliated to two different rows of negative pressure through holes 65. Because the inlet end of the die is higher in temperature and lower in hardness, the plastic packaging tube is initially deformed in shape, and the plastic packaging tube is adsorbed on the inner wall of the forming channel 5 by using higher negative pressure, so that better shaping is completed. Meanwhile, the negative pressure at the position is higher, so that cooling water flow is favorably sucked, and the cooling effect is improved.

Two negative pressure flow passages 66 which are parallel to each other and a heat dissipation flow passage 67 which is positioned between the two negative pressure flow passages 66 are arranged between the inner side part 63 and the middle layer clamping plate 62, the two negative pressure flow passages 66 are respectively communicated with a row of negative pressure through holes 65, two sides of the inner side part 63 are respectively provided with an air exhaust pipe, and two ends of the air exhaust pipe are respectively communicated with the negative pressure flow passages 66 and the air exhaust pump. The suction pipe sucks air and cooling water in the negative pressure flow passage 66, so that negative pressure is formed in the negative pressure through hole 65 and the negative pressure groove 64. The inner side 63 is provided with a water inlet pipe and a water outlet pipe which are communicated with two ends of the heat dissipation flow passage 67, and the condensed water flows through the heat dissipation flow passage 67 to absorb the heat transferred to the inner side 63 by the plastic packing tube.

The middle layer clamp plate 62 is a steel plate, two sides of the middle layer clamp plate are respectively provided with a rubber layer 69, and when the upper template 1 and the lower template 2 are bolted on the middle layer clamp plate 62, the middle layer clamp plate and the lower template are respectively abutted against the rubber layers 69 to generate a sealing effect, so that air leakage or water leakage of the negative pressure flow passage 66 is avoided.

The outer side portion 61 and the middle layer clamp plate 62 are matched to form a cooling clamp groove 68, the cooling clamp groove 68 can be in a linear shape, an S-shape or other shapes, in this embodiment, the cooling clamp groove 68 is in a U-shape, and the outer side portion 61 is provided with a water inlet and a water outlet which are communicated with two ends of the cooling clamp groove 68. In use, cooling water is passed from the water inlet into the cooling jacket groove 68, and the cooling water absorbs heat from the middle layer of plywood 62.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. The utility model provides a cooling forming die for producing IC packing tube, its characterized in that, cope match-plate pattern (1) and lower bolster (2) including interconnect, one side of lower bolster (2) orientation cope match-plate pattern (1) is provided with forming groove (3) with plastic packing tube looks adaptation, the tank bottom of forming groove (3) is provided with shaping bead (4) along the orientation of seting up of forming groove (3), cope match-plate pattern (1) and forming groove (3) cooperation form supply plastic packing tube through shaping passageway (5), be equipped with a plurality of groups negative pressure recess (64) on the inner wall of shaping passageway (5).

2. The cooling and forming die for producing the IC packaging tube as claimed in claim 1, wherein the upper die plate (1) and the lower die plate (2) each comprise an outer side portion (61), a middle layer clamping plate (62) and an inner side portion (63) which are connected in sequence, the inner side portion (63) of the upper die plate (1) and the inner side portion (63) of the lower die plate (2) are oppositely arranged and bolted, and a cooling clamp groove (68) for flowing of condensed water is formed in one side of the outer side portion (61) facing the middle layer clamping plate (62).

3. The cooling and forming die for producing the IC packaging tube as claimed in claim 2, wherein the negative pressure groove (64) is provided on an inner side portion (63), the inner side portion (63) is provided with a row of negative pressure through holes (65) at both ends of the negative pressure groove (64), the negative pressure through holes (65) are respectively communicated with the negative pressure groove (64), two negative pressure flow passages (66) are provided between the inner side portion (63) and the middle layer splint (62), the two negative pressure flow passages (66) are respectively communicated with the row of negative pressure through holes (65), and both sides of the inner side portion (63) are respectively provided with the suction pipes communicated with the negative pressure flow passages (66).

4. The cooling-molding die for producing IC packaging tubes as set forth in claim 3, wherein the inner side portion (63) is provided with heat dissipation flow passages (67) between the negative pressure flow passages (66), and the inner side portion (63) is provided with water inlet and outlet pipes communicating with both ends of the heat dissipation flow passages (67).

5. The cooling molding die for producing IC packaging tubes as set forth in claim 1, wherein the negative pressure grooves (64) of each group are gradually spaced apart in a direction away from the inlet of the molding passage (5), and the number of negative pressure grooves (64) of each group of negative pressure grooves (64) is gradually decreased in a direction away from the inlet of the molding passage (5).

6. The cooling molding die for producing IC packaging tubes as set forth in claim 2, wherein the cooling jacket groove (68) is U-shaped, and the outer side portion (61) is provided with a water inlet and a water outlet communicating with both ends of the cooling jacket groove (68).

7. The cooling-molding die for producing an IC packaging tube as set forth in claim 2, wherein the middle layer sandwich plate (62) is provided with a rubber layer (69) on both sides thereof, and the outer side portion (61) and the inner side portion (63) are connected to the middle layer sandwich plate (62) through the rubber layer (69).