CN213638040U

CN213638040U - Modular reinforced switch of CPEX bus

Info

Publication number: CN213638040U
Application number: CN202021646159.8U
Authority: CN
Inventors: 罗军
Original assignee: Hunan Junan Xinda Technology Co ltd
Current assignee: Hunan Junan Xinda Technology Co ltd
Priority date: 2020-08-10
Filing date: 2020-08-10
Publication date: 2021-07-06
Anticipated expiration: 2030-08-10

Abstract

The utility model provides a reinforced (rfd) switch of CPEX bus modularization. The switch with the modularized and reinforced CPEX bus comprises a switch case, an interface arranged on the side surface of the case, and a board card arranged in the case and connected with the interface, wherein one or more groups of heat pipe radiating modules are arranged in the case; the heat pipe radiating module comprises a radiating shell, a fan, a fin group, a heat pipe and a soaking plate, wherein the radiating shell covers the inner wall of the case, a radiating cavity is formed between the radiating shell and the soaking plate, one surface of the soaking plate penetrates through the radiating shell and is attached to the board card, the other surface of the soaking plate is attached to one end of the heat pipe, the other end of the heat pipe is attached to the fin group, and the fin group is arranged at an air outlet of the fan; and the chassis is provided with a ventilation opening which is suitable for the air inlet and outlet of the fan at the heat dissipation cavity. The utility model provides a consolidated switch of CPEX bus modularization has solved the technical problem that prior art's switch is not suitable for adverse circumstances such as smoke and dust, humidity.

Description

Modular reinforced switch of CPEX bus

Technical Field

The utility model relates to a switch field, concretely relates to reinforced (rfd) switch of CPEX bus modularization.

Background

A switch means a "switch", which is a network device used for forwarding of electrical (optical) signals. It may provide an exclusive electrical signal path for any two network nodes accessing the switch. The most common switch is an ethernet switch. Most of the switches on the market at present are designed to be applied in indoor common environments and are not suitable for severe environments such as humidity, vibration and the like. Many reinforced design schemes have been proposed to solve the problem, but most solutions are mainly directed to vibration resistance and stability, and the reinforcement of dust-proof and moisture-proof aspects of the switch is limited.

SUMMERY OF THE UTILITY MODEL

For the technical problem who solves prior art's switch and not adapt to adverse circumstances such as smoke and dust, humidity, the utility model provides a can solve above-mentioned problem and accord with the reinforced (rfd) switch of CPEX bus modularization of CPEX standard.

A CPEX bus modularized reinforced switch comprises a switch case, an interface arranged on the side surface of the case, and a board card arranged in the case and connected with the interface, wherein one or more groups of heat pipe radiating modules are arranged in the case; the heat pipe radiating module comprises a radiating shell, a fan, a fin group, a heat pipe and a soaking plate, wherein the radiating shell covers the inner wall of the case, a radiating cavity is formed between the radiating shell and the soaking plate, one surface of the soaking plate penetrates through the radiating shell and is attached to the board card, the other surface of the soaking plate is attached to one end of the heat pipe, the other end of the heat pipe is attached to the fin group, and the fin group is arranged at an air outlet of the fan; and the chassis is provided with a ventilation opening which is suitable for the air inlet and outlet of the fan at the heat dissipation cavity.

The utility model provides a reinforced (rfd) switch of CPEX bus modularization in a preferred embodiment, the integrated circuit board includes exchange part, monitor part, serial ports debugging part, port configuration part, memory part, power part, and exchange chip, monitor chip, serial ports debugging chip, port configuration chip, memory chip, the power chip that corresponds respectively.

The utility model provides a CPEX bus modularization reinforced (rfd) switch's a preferred embodiment, including two sets of heat pipe heat dissipation module, every group heat pipe heat dissipation module includes threely the soaking board, one-to-one with exchange chip the control chip the serial ports debugging chip the port configuration chip the memory chip power chip butt, every group is three the soaking board is through three the heat pipe is connected to same the fin.

In a preferred embodiment of the modular reinforced CPEX bus switch provided by the present invention, the enclosure is an aluminum enclosure; one side of the vapor chamber is attached to the board card, the other side of the vapor chamber is attached to the heat pipe, and the other side of the heat pipe is attached to the inner wall of the case.

In a preferred embodiment of the modular reinforced CPEX bus switch provided by the present invention, the fan is a centrifugal fan, and the air inlet and outlet directions thereof are perpendicular to each other; the heat dissipation shell is arranged on the inner wall of one side wall of the case, the edge of the heat dissipation shell is connected with the inner wall of the other side wall adjacent to the heat dissipation shell, a heat dissipation cavity is formed among the heat dissipation shell, the heat dissipation shell and the heat dissipation shell, and the air inlet and outlet vents are respectively arranged on the two adjacent side walls of the case at the position of the heat dissipation cavity.

In a preferred embodiment of the modular reinforced switch of the CPEX bus provided by the present invention, the case is recessed to form the heat dissipation chamber, and the heat dissipation shell covers the heat dissipation chamber and is parallel to the outer wall surface of the side wall where the heat dissipation chamber is located; the heat dissipation shell is provided with a ventilation opening adapted to the air inlet and outlet of the fan, or the heat dissipation cavity and the side wall adjacent to the side wall where the heat dissipation cavity is located are respectively provided with a ventilation opening adapted to the air inlet and outlet of the fan.

Compared with the prior art, the utility model provides a reinforced (rfd) switch of CPEX bus modularization has not only consolidated to anti vibration, stability, still dustproof, dampproofing has also consolidated for the normal operating that the switch can all be stable under various adverse circumstances.

The exchanger reinforced by the CPEX bus in a modularized mode is provided with the totally-enclosed heat pipe radiating module, only the radiating part is communicated with the outside, and the board card is in a completely-enclosed state, so that the influence of factors such as external dust, moisture and the like on internal electronic devices is avoided. And each chip is all through the soaking plate, the heat pipe with the inner wall butt of quick-witted case, even meet strong impact, vibrations also can not loosen, collide with, can keep stable normal operating.

Drawings

FIG. 1 is a schematic structural diagram of a modular enhanced switch for the CPEX bus;

fig. 2 is a schematic structural diagram of fig. 1 with the heat pipe heat dissipation module removed.

Fig. 3 is a schematic structural diagram of a heat pipe heat dissipation module.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Example 1:

please refer to fig. 1-3, which are schematic structural diagrams of the switch 1 modularized and reinforced by the CPEX bus according to the present invention, respectively, in order to show the internal structure, the structure of the board 13 partially covered is removed; the schematic structural diagram after the heat pipe heat dissipation module 14 is removed; the structural diagram of the heat pipe heat dissipation module 14 is shown. The switch 1 for modularized reinforcement of the CPEX bus comprises a case, an interface, a board card 13 and a heat pipe heat dissipation module 14. The case is a conventional hexagonal aluminum case, the board card 13 is arranged in the case, and an interface connected with the board card 13 is arranged on one side wall of the case. Since the external structure is not much related to the content of the present disclosure, the chassis and the interface are omitted in the drawings and are not depicted.

The board card 13 includes a switching portion 31, a monitoring portion 32, a serial port debugging portion 33, a port configuration portion 34, a memory portion 35, and a power supply portion 36. The structure and the connection relation of the method are basically consistent with the scheme recorded in CN201921129097.0, and the specific contents are as follows:

the switching part 31 mainly comprises a core switching chip 311, a photoelectric conversion interface 312 and an optical module 313. The photoelectric conversion interface 312 is electrically connected to the core switch chip 311 and the optical module 313, respectively, and the switch portion 31 supports a two-layer switch function. The core switch chip 311 is disposed at the front end of the switch, the core switch chip 311 is a switch chip of a boston company, model number BCM53415, and is configured as a 16-channel SerDes interface conforming to SFI specification, and the 16-channel signals conforming to SFI specification are sent to the photoelectric conversion interface 312. The photoelectric conversion interface 312 adopts a double-layer optical module interface with the model number of B869S8-0030-Y001, is connected with 16 SFP + optical modules, supports 16 paths of ten-gigabit data networks for exchange, and supports the stacking function of the exchange board card, so that a plurality of board cards can be stacked for use to meet application places with more exchange port requirements.

The monitoring part 32 is mainly implemented by a PCA9548PW chip, and is electrically connected to the photoelectric conversion interface 312 and the core switch chip 311, and communicates with the photoelectric conversion interface 312 and the core switch chip 311 through I2C signals, and transmits information such as voltage, current, temperature, and receiving/transmitting power of a port to the core switch chip 311, thereby implementing monitoring of the port.

The serial port debugging part 33 comprises a MAX3232EUE level conversion chip which is electrically connected with the core exchange chip 311 and converts UART signals provided by the core exchange chip 311 into RS232 signals for debugging.

The port configuration part 34 comprises a PHY chip BCM54616, which is electrically connected with the core switch chip 311 and is connected with the backplane through a connector 341, the core switch chip provides 1 path of signals which conform to GMII specification, the signals are converted into 10/100/1000Base-T signals through the BCM54616 and are sent to the backplane by the connector 341, and the configuration of 16 ten-million network ports is realized through a PC.

The memory part 35 adopts two 16-bit DDR3 chips MT41J128M16HA-15E to realize a memory space of 512 MB.

The power supply section 36 includes a piece of LTC3728EG and a piece of LTM4644EY _ PBF, and supplies an external input +12V/DC to +5V, +3.3V, +2.5V, +1.8V, +1.2V grid voltage to the chips such as BCM53415, BCM54616, and PCA9548 PW.

The heat pipe heat dissipation module 14 includes a heat dissipation case 41, a fan 42, a fin group 43, a heat pipe 44, and a vapor chamber 45. The heat dissipation case 41 is fixed to an inner wall of the chassis, and an edge of the heat dissipation case is connected to another adjacent inner wall, so that a completely closed heat dissipation chamber is formed therebetween. A heat equalizing plate 45 with a size suitable for the chip is respectively arranged at positions of BCM53415, PCA9548PW, MAX3232EUE, BCM54616, the internal memory part 35 and the power supply part 36 in an abutting mode, the heat equalizing plate 45 is fixed on the heat dissipation shell 41, one surface of the heat equalizing plate is in abutting mode with the chip, and the other surface of the heat equalizing plate penetrates through the heat dissipation shell 41 to reach the heat dissipation chamber and is connected with a heat pipe 44. And a glue layer is arranged in a gap between the soaking plate 45 and the heat dissipation shell 41 to keep sealing.

The other surface of the heat pipe 44 abuts against the inner wall of the housing, and the chip and the housing are sequentially abutted. The other end of the heat pipe 44 extends to vertically abut against the fin group 43. The fin group 43 is arranged at the air outlet of the fan 41, and the air outlet direction is the same as the fin gap direction.

The heat pipes 44 are arranged in the manner shown in the figure, and the heat pipes 44 connected to every three soaking plates 45 are collected into one group of fin groups 43, which correspond to one fan 41 respectively. The two fans 11 are both arranged at the positions close to the corners of the heat dissipation chamber, and here, centrifugal fans are adopted, and the air inlet direction of the centrifugal fans is perpendicular to the air outlet direction, so that ventilation openings are respectively arranged at the positions where the fans 41 are arranged and on the adjacent two side walls of the box body along the air inlet direction and the air outlet direction.

Example 2:

please refer to fig. 3, which is a schematic structural diagram of the heat pipe radiating module 14 in the switch 1 with the CPEX bus modularized reinforcement provided by the present invention.

The heat pipe heat dissipation module 14 includes a heat dissipation case, a fan 42, a fin group 43, a heat pipe 44, and a vapor chamber 45. The difference from example 1 is that: the outer wall of the case 11 is concave, and the opening of the concave area is covered with the heat dissipation shell 41 which is flush with the outer wall of the case 11, so that the concave area forms a completely closed heat dissipation chamber. Therefore, in embodiment 1, the heat dissipation casing is located under the components such as the fan 42 and the heat pipe 44, and in this embodiment, the case 11 is located. The other structures were the same as those in example 1.

The above only is the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes made by the present specification can be changed, or directly or indirectly applied to other related technical fields, and all the same principles are included in the protection scope of the present invention.

Claims

1. The utility model provides a reinforced (rfd) switch of CPEX bus modularization, includes the switch machine case, locates the interface of machine case side is located in the machine case and with interface connection's integrated circuit board, its characterized in that: one or more groups of heat pipe radiating modules are arranged in the case; the heat pipe radiating module comprises a radiating shell, a fan, a fin group, a heat pipe and a soaking plate, wherein the radiating shell covers the inner wall of the case, a radiating cavity is formed between the radiating shell and the soaking plate, one surface of the soaking plate penetrates through the radiating shell and is attached to the board card, the other surface of the soaking plate is attached to one end of the heat pipe, the other end of the heat pipe is attached to the fin group, and the fin group is arranged at an air outlet of the fan; and the chassis is provided with a ventilation opening which is suitable for the air inlet and outlet of the fan at the heat dissipation cavity.

2. A CPEX bus modular hardened switch as claimed in claim 1, characterized in that: the board card comprises an exchange part, a monitoring part, a serial port debugging part, a port configuration part, a memory part, a power supply part, and an exchange chip, a monitoring chip, a serial port debugging chip, a port configuration chip, a memory chip and a power supply chip which are respectively corresponding to the exchange part, the monitoring part, the serial port debugging part, the port configuration part, the memory chip and the power supply part.

3. A CPEX bus modular hardened switch according to claim 2, characterized in that: the heat pipe heat dissipation module comprises three vapor chambers, one-to-one correspondence with the exchange chip, the monitoring chip, the serial port debugging chip, the port configuration chip, the memory chip and the power chip are abutted, and each vapor chamber is three, and the heat pipes are connected to the same fins.

4. A CPEX bus modular hardened switch according to any one of claims 1 to 3, characterized in that: the case is an aluminum case; one side of the vapor chamber is attached to the board card, the other side of the vapor chamber is attached to the heat pipe, and the other side of the heat pipe is attached to the inner wall of the case.

5. A CPEX bus modular hardened switch according to any one of claims 1 to 3, characterized in that: the fan is a centrifugal fan, and the air inlet and outlet directions of the fan are vertical; the heat dissipation shell is arranged on the inner wall of one side wall of the case, the edge of the heat dissipation shell is connected with the inner wall of the other side wall adjacent to the heat dissipation shell, a heat dissipation cavity is formed among the heat dissipation shell, the heat dissipation shell and the heat dissipation shell, and the air inlet and outlet vents are respectively arranged on the two adjacent side walls of the case at the position of the heat dissipation cavity.

6. A CPEX bus-modular hardened switch according to claim 5, wherein: the chassis is internally concave to form the heat dissipation chamber, and the heat dissipation shell covers the heat dissipation chamber and is parallel to the outer wall surface of the side wall where the heat dissipation chamber is located; the heat dissipation shell is provided with a ventilation opening adapted to the air inlet and outlet of the fan, or the heat dissipation cavity and the side wall adjacent to the side wall where the heat dissipation cavity is located are respectively provided with a ventilation opening adapted to the air inlet and outlet of the fan.