CN213635909U - Wafer baking device - Google Patents

Abstract

The utility model discloses a wafer baking device, it includes the casing and sets up sealing mechanism, heater and ejection mechanism in the casing, the utility model discloses a set up the elevating guide at the casing surface, ejection mechanism and sealing mechanism all with this elevating guide sliding connection, thereby can cooperate the heater of steady state through the elevating movement of ejection mechanism to realize ejecting wafer or thimble return, cooperate the heater of steady state through the elevating movement of sealing mechanism to seal or remove sealedly to the heater, overcome the harmful effects that the heating plate goes up and down and bring in the prior art, improved the steadiness that the wafer was placed, the security is good, be convenient for subsequent get and put the process go on; meanwhile, the direct connection of the lifting mechanism with the heating plate is avoided, the requirements on the heat resistance, safety and the like of the lifting device are reduced, and the selectivity of the lifting device is widened.

Description

Wafer baking device

Technical Field

The utility model relates to the field of semiconductor technology, in particular to wafer baking equipment.

Background

Integrated circuit wafer production is a series of production processes in which semiconductor devices are fabricated on and within the surface of a wafer, in which multiple stages require heat treatment of the wafer.

The wafer baking apparatus generally includes a heating plate for heating the wafer loaded on the upper surface thereof, a sealing mechanism is generally disposed above the heating plate for sealing and connecting the upper surface of the heater to prevent heat loss, and an ejection mechanism is generally disposed below the heating plate for ejecting the wafer after the wafer is baked. However, most of the existing wafer baking devices are hermetically connected with a sealing mechanism by adopting a heating plate lifting mode, or the heating plate is lowered to enable a thimble to jack up a wafer, the wafer is arranged on the upper surface of the heating plate, in the process of lifting the heating plate, the heating plate is easy to fluctuate to cause the wafer to slide or slide, the wafer is not safe enough and is not beneficial to the subsequent taking and placing processes, in addition, the temperature of the heating plate during working is high, and the requirements for the lifting device (such as heat resistance, safety and the like) are more and higher.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a wafer baking equipment.

The utility model aims to solve the problems that in the process of lifting the heating plate in the prior art, the heating plate is easy to fluctuate to cause the wafer to slide or slide, is not safe enough and is not beneficial to the development of the subsequent taking and placing processes; in addition, the heating plate has high temperature during operation, and the requirement on a lifting device (such as heat resistance, safety and the like) is more and higher.

For realizing the purpose of the utility model, the utility model adopts the technical proposal that:

a wafer baking apparatus, comprising:

the wafer loading device comprises a shell, a wafer loading device and a wafer unloading device, wherein the shell is provided with an inner cavity, the inner cavity is provided with at least one opening, the opening is used for the wafer to enter and exit, and the surface of the shell is provided with a lifting guide rail;

the heater is arranged in the inner cavity and used for bearing and heating the wafer;

the ejection mechanism is connected with the lifting guide rail in a sliding manner so as to be capable of lifting along the lifting guide rail, and is provided with an ejector pin, and the ejector pin is arranged in the heater in a penetrating manner so as to be capable of partially extending out of the heater along with the lifting movement; and

and the sealing mechanism is arranged above the heater and is in sliding connection with the lifting guide rail so as to be capable of lifting along the lifting guide rail to seal or unseal the heater.

Optionally, the device further comprises a first driving mechanism and a second driving mechanism, wherein the first driving mechanism is connected with the ejection mechanism to drive the ejection mechanism to perform lifting movement, and the second driving mechanism is connected with the sealing mechanism to drive the sealing mechanism to perform lifting movement.

Optionally, one side of the casing is provided with a lifting support frame, the lifting guide rails are arranged on two opposite side walls of the lifting support frame, the lifting support frame is provided with a cavity, and the first driving mechanism and the second driving mechanism are arranged in the cavity.

Optionally, the heater includes heating disc subassembly and is used for fixing the fixed baseplate of heating disc subassembly, heating disc subassembly contains the metal disc and connects the ceramic dish of heating source, the lower surface of metal disc with the upper surface of ceramic dish is connected, the below of ceramic dish is equipped with heat insulating part, fixed baseplate has the confession the holding chamber of heating disc subassembly holding.

Optionally, the heat insulation piece is bonded to the lower surface of the ceramic disc, and the heat insulation piece is tinfoil paper.

Optionally, the fixed base includes a fixed ring and a fixed disk, two ends of the fixed ring are open, and one of the open ends of the fixed ring is connected with the fixed disk to form the accommodating cavity.

Optionally, a positioning plate is further arranged below the fixed plate, and an ejector pin positioning hole is formed in the positioning plate.

Optionally, the heater further comprises a number of temperature testing elements for testing the temperature of the heating disc assembly, the temperature testing elements being located inside or outside the heating disc assembly.

Optionally, the fixing base further includes a plurality of fixing brackets, the fixing brackets are connected to the bottom of the fixing plate, the fixing brackets extend to the outer side of the fixing plate to form a support arm, and the support arm is fixedly connected to the housing.

Optionally, the housing is further provided with a first position sensor and a second position sensor, the first position sensor is used for sensing the position of the ejection mechanism so as to enable the ejection mechanism to reach a preset ejection position, and the second position sensor is used for sensing the position of the sealing mechanism so as to enable the sealing mechanism to reach a preset sealing position.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model provides a wafer baking device is through setting up the elevating guide on the casing surface, ejection mechanism and sealing mechanism all with this elevating guide sliding connection to can cooperate the heater of stablizing through the elevating movement of ejection mechanism to realize ejecting wafer or thimble return, cooperate the heater of stablizing through the elevating movement of sealing mechanism to seal or remove sealed to the heater, overcome the harmful effects that the lifting of heating plate brought among the prior art, improved the steadiness that the wafer was placed, the security is good, be convenient for subsequent get and put the process go on; meanwhile, the direct connection of the lifting mechanism with the heating plate is avoided, the requirements on the heat resistance, safety and the like of the lifting device are lowered, and the selectivity of the lifting device is widened;

2. the utility model provides a wafer baking device still has the first actuating mechanism that is used for driving ejection mechanism to go up and down, and is used for driving the second actuating mechanism that the sealing mechanism goes up and down, and one side of casing has the lift support frame, and the riser guide sets up on the lift support frame, and first actuating mechanism and second actuating mechanism holding are in the support frame to whole wafer baking device compact structure, retrench, regular, and the aesthetic measure is good, is convenient for a plurality of wafer baking devices to make up the connection each other, is convenient for improve the production efficiency of wafer;

3. in the wafer baking device provided by the utility model, the heater comprises a heating disc component and a fixed base used for fixing the heating disc component, the fixed base is provided with a holding cavity for holding the heating disc component, and the whole device is beautiful and tidy; the heating disc assembly comprises a metal disc and a ceramic disc connected with a heating source, the lower surface of the metal disc is connected with the upper surface of the ceramic disc, the heating source enables the ceramic disc to generate heat, the ceramic disc transfers heat to the metal disc, and a wafer borne on the metal disc is further heated; the heat insulation piece is arranged below the ceramic disc, so that heat can be effectively insulated and prevented from being transferred to the direction far away from the wafer, the overall heat utilization rate of the heater is improved, the temperature of the wafer is constant in the heating process, and the production efficiency of the wafer is improved;

4. the utility model provides a wafer baking equipment still is equipped with first position sensor and second position sensor, first position sensor is used for the response ejection mechanism's position is in order to make it reach predetermined ejecting position, the second position sensor is used for the response sealing mechanism's position is in order to make it reach predetermined sealing position to effective restriction is carried out ejection mechanism and sealing mechanism's elevating movement stroke, has improved accurate nature and energy utilization.

Drawings

FIG. 1: a schematic perspective view of the wafer baking apparatus of embodiment 1;

FIG. 2: a schematic perspective view of the wafer baking apparatus of embodiment 1 in another direction;

FIG. 3: an exploded view of the wafer baking apparatus of example 1;

FIG. 4: a schematic perspective view of the housing of example 1;

FIG. 5: a schematic perspective view of the housing of embodiment 1 in another direction;

FIG. 6: a schematic perspective view of the heater of example 1;

FIG. 7: a schematic perspective view of the heater of example 1 when inverted;

FIG. 8: the explosion diagram of the heater of example 1;

FIG. 9: a schematic perspective view of the ejection mechanism of embodiment 1;

FIG. 10: a schematic perspective view of the sealing mechanism of example 1;

FIG. 11: a schematic perspective view of the first drive mechanism of embodiment 1;

FIG. 12: a schematic perspective view of the second drive mechanism of embodiment 1;

FIG. 13: the wafer baking apparatus of embodiment 1 is schematically illustrated in an initial state;

FIG. 14: a schematic view of the wafer baking apparatus of example 1 in a closed state;

FIG. 15: the wafer baking apparatus of embodiment 1 is schematically illustrated in the ejection state.

In the figure:

1. the lifting device comprises a shell, 11, an inner cavity, 111, an opening, 1111, a lower window edge, 12, a side plate, 121, a lifting support frame, 1211, a lifting guide rail, 1212, a cavity, 13, a top plate, 14, a first lifting hole, 15 and a second lifting hole;

2. the heater comprises a heater 21, a heating disc assembly 211, a metal disc 212, a ceramic disc 22, a fixed base 221, an accommodating cavity 222, a fixed ring 223, a fixed disc 2231, an accommodating space 224, a positioning disc 2241, a thimble positioning hole 225, a fixed support 2251, a support arm 23, a heat insulation piece 24, an electric heating head 25 and a temperature testing element;

3. the ejection mechanism 31, the first chute 32, the thimble 321, the ejection section 322 and the connecting section;

4. a sealing mechanism 41, a second chute 42 and a sealing cover;

5. a first driving mechanism for driving the first motor to rotate,

6. a second drive mechanism.

Detailed Description

In the prior art, in the process of lifting the heating plate, the heating plate is easy to fluctuate to cause wafer sliding or slipping, is not safe enough and is not beneficial to the development of subsequent picking and placing procedures; in addition, the heating plate has high temperature during operation, and the requirement on a lifting device (such as heat resistance, safety and the like) is more and higher. Therefore, the present invention provides a new solution, and for better clarity, the present invention will be described in detail with reference to the accompanying drawings and embodiments.

Example 1

Referring to fig. 1-3, the present invention provides a wafer baking apparatus, which includes a housing 1, a heater 2, an ejection mechanism 3 and a sealing mechanism 4. Wherein, the housing 1 has an inner cavity 11, the inner cavity 11 has at least one opening 111, the opening 111 is used for the entry and exit of the wafer, the surface of the housing 1 has a lifting guide 1211; the heater 2 is arranged in the inner cavity 11 and used for bearing and heating the wafer; an ejection mechanism 3 slidably connected to the elevating guide 1211 to be capable of performing an elevating movement along the elevating guide 1211, wherein the ejection mechanism 3 has a thimble 32, the thimble 32 is inserted into the heater 2, and the thimble 32 is capable of partially extending out of the heater 2 along with the elevating movement of the elevating movement; the sealing mechanism 4 is provided above the heater 2, and slidably connected to the elevating guide 1211 to be movable up and down along the elevating guide 1211, thereby sealing or unsealing the heater 2.

The utility model discloses can also include first actuating mechanism 5 and second actuating mechanism 6, first actuating mechanism 5 is connected ejection mechanism 3 and is carried out elevating movement with drive ejection mechanism 3, and second actuating mechanism 6 is connected sealing mechanism 4 and is carried out elevating movement with drive sealing mechanism 4.

The housing 1 is hollow to form an inner cavity 11, and as shown in fig. 3-5, a lifting support frame 121 is further connected to a partial area of the side plate 12 on one side of the housing 1, and the partial area may be a middle part. Referring to fig. 5, the lifting support frame 121 has two opposite side walls and a top wall connected to tops of the two side walls, the lifting rail 1211 is vertically disposed on the two side walls, a cavity 1212 is formed between the two side walls and the top wall, and the first driving mechanism 5 and the second driving mechanism 6 are accommodated in the cavity 1212. Therefore, the whole wafer baking device is compact, simple and regular in structure and good in attractiveness, a plurality of wafer baking devices are convenient to combine and connect with one another, and the production efficiency of wafers is convenient to improve; the first drive mechanism 5 and the second drive mechanism 6 may be adjacently arranged to further improve the compactness and regularity of the device.

Referring to fig. 3, the sealing mechanism 4 is positioned above the heater 2 in the inner cavity 11, a top plate 13 of the shell is arranged above the sealing mechanism 4, and the top plate 13 is detachably connected with the side plate 12, so that the assembly, disassembly and maintenance of the sealing mechanism are facilitated. In this embodiment, the opening 111 for wafer access is formed in the side wall of the housing opposite to the side plate 12, and may be in a window shape, and the lower window edge 1111 may be flush with the upper surface of the heater 2 or slightly higher than the upper surface of the heater 2, so that the side wall of the housing below the lower window edge may block heat of the heater, thereby improving safety and preventing the heat from affecting yield of the wafer pick-and-place process (for example, the temperature of a robot for picking and placing the wafer from being adversely affected). In other embodiments, the opening 111 may be plural, and may be disposed at different positions of the housing (for example, on the side wall in other directions)

Referring to fig. 6-8, the heater 2 of the present invention includes a heater tray assembly 21, a fixing base 22 and a heat insulation member 23, wherein the fixing base 22 has a receiving cavity 221 for receiving the heater tray assembly 21. The heater tray assembly 21 includes a metal tray 211 and a ceramic tray 212, and as shown in fig. 6 and 8, the metal tray 211 is disposed above the ceramic tray 212, and has an upper surface for carrying a wafer and a lower surface connected to the upper surface of the ceramic tray 212, for example, by screwing or bonding. The heat insulation piece 23 is arranged below the ceramic disc 212, so that heat energy is effectively insulated and prevented from being transferred to the direction far away from the wafer, the overall heat utilization rate of the heater 2 is improved, the temperature of the wafer is constant in the heating process, and the production efficiency of the wafer is improved.

The ceramic plate 212 is connected to a heating source (e.g., an electric heating head 24 connected to a power source, see fig. 6-8), the heating source heats the ceramic plate 212, the ceramic plate 212 transfers heat to the metal plate 211, and the wafer supported on the metal plate 211 is heated, the ceramic plate 212 heats and transfers heat quickly, the metal plate 211 conducts heat quickly and effectively, and the metal plate 211 is added on the ceramic plate 212, and the combination of the two makes the wafer heated more uniformly.

As shown in fig. 8, the metal disk 211 and the ceramic disk 212 may have a disk shape, and the heat insulator 23 may have a disk shape or a circular film shape, so that a disk-like structure that fits a wafer can be more favorably realized. The metal discs 211, the ceramic discs 212 and the thermal insulation 23 have the same radius, so that the combination of the metal discs, the ceramic discs and the thermal insulation 23 makes the structure more regular. The thickness distribution of the three can be as follows: the thickness of the metal disc 211 is larger than that of the ceramic disc 212, the thickness of the ceramic disc 212 is larger than that of the heat insulation piece 23, the thickness of the metal disc 211 is large, the uniformity of heating of the wafer can be further improved, the thickness of the heat insulation piece is small, the heat insulation piece can be effectively prevented from occupying more space, materials are saved, and the prior art is easily and directly improved. The metal plate 211 can be an aluminum plate, the heat conductivity of aluminum is 237W/mK, the heat conduction effect is good, and compared with other precious metals such as copper, the aluminum is moderate in price. Further, the aluminum plate can be a solid aluminum block structure or an aluminum structure body with a vacuum layer inside, so that the uniformity of heat transfer can be further improved. The ceramic disc 212 may be a conventional structure with heating wires disposed therein, or may be other structures with uniformly distributed heating elements (e.g., mica heating plates) disposed therein to further reduce the problem of uneven heating caused by the heating wires.

The thermal insulation 23 may be a disc or circular film of thermal insulation material. For example, a foil of 0.4mm to 1mm (e.g., 0.4mm, 0.6mm, 0.7mm, or 0.8mm) in thickness, which is of a moderate thickness to meet thermal insulation requirements and to have little impact on the footprint of the heater plate assembly 21. In this embodiment, the tinfoil paper may be adhered to the lower surface of the ceramic plate 212 by an adhesive, or a commercially available tinfoil sticker may be directly used. In other embodiments, the tinfoil may also be adhered to the bottom of the receiving cavity 221, which is near or in contact with the lower surface of the ceramic disk 212.

Referring to fig. 6-8, the fixing base 22 includes a fixing ring 222 and a fixing plate 223, the fixing ring 222 is open at two ends (as shown in fig. 8), and one of the open ends (as shown in fig. 8 as a lower open end) is connected to the fixing plate 223 to form a receiving cavity 221. In this embodiment, the fixing plate 223 is recessed inwards to form an accommodating space 2231, and the accommodating space 2231 is lengthened by the fixing ring 222, so as to form the accommodating cavity 221. Preferably, the height or thickness of the fixing plate 223 may be equal to that of the fixing ring 222, so that the overall structure of the heater 2 may be more symmetrical, neat and beautiful.

As shown in fig. 6-8, a positioning plate 224 may be further connected below the fixed plate 223, the positioning plate 224 has a pin positioning hole 2241, the pin positioning hole 2241 may be a column (as shown in fig. 8), and holes (not shown) for the pin positioning hole 2241 to pass through are formed in the fixed plate 223, the heat insulating member 23, the metal plate 211 and the ceramic plate 212. The positioning plate 224 is connected to an ejector mechanism 3, and the ejector mechanism 3 has an ejector pin 32, and the ejector pin 32 is extended and retracted in an ejector pin positioning hole 2241 to eject the wafer or release the ejected wafer.

The fixed base 22 may also include a number of fixed brackets 225. Referring to fig. 6 to 8, one end of the fixing bracket 225 is attached (e.g., screwed) to a periphery of the bottom of the fixing disk 223, and the outside of the fixing disk at the other end is extended to form a bracket arm 2251, and the bracket arm 2251 is used to fix the heater 2 to the case 1. In this embodiment, the number of the fixing brackets 225 is 2, which are symmetrically disposed at both sides of the fixing plate 223. In other embodiments, the number of the fixing brackets 225 may be set as required, as long as a stable fixing effect can be achieved, for example, 3, 4, 5, etc.

The heater 2 may also contain a number of temperature testing elements 25 for testing the temperature of the heater tray assembly 21, the temperature testing elements 25 may be located inside or outside the heater tray assembly 21. As shown in fig. 7 and 8, in the present embodiment, the temperature testing element 25 is a temperature sensor, which is disposed inside the heater tray assembly 21, and the number of the temperature testing elements is 1, and is used for sensing the temperature of the ceramic tray 212, so that the real-time monitoring of the temperature of the ceramic tray 212 can be realized, and the temperature control accuracy of the heater 2 is improved. In other embodiments, there may be a plurality of temperature testing elements 25, a plurality of ceramic discs 212 may be tested simultaneously, or a plurality of ceramic discs 212, metal discs 211, fixing discs 223, etc. may be tested separately.

Referring to fig. 9, the ejection mechanism 3 includes a bottom plate connected to the first driving mechanism 5, and the bottom plate has two sides extending upward to form first sliding grooves 31, and the first sliding grooves 31 are designed to fit the lifting rail 1211, so that the ejection mechanism 3 can move up and down along the lifting rail 1211. The thimble 32 is disposed on the bottom plate, the thimble 32 includes an ejection section 321 and a connection section 322 connected to each other, one end of the connection section 322 is connected to the bottom plate, and the other end is connected to the ejection section 321. The end of the ejection section 321 away from the connecting section 322 is used for ejecting the wafer. In this embodiment, the ejecting section 321 and the connecting section 322 are both cylindrical, the diameter of the connecting section 322 is larger than that of the ejecting section 321, and the diameter of the ejecting section 321 is matched with the size of the thimble positioning hole 2241, so that the ejecting section 321 can extend out of the surface of the heater 2 along with the rising of the ejecting mechanism to eject the wafer. The number of the thimble 32 can be set according to the requirement, for example, 1, 2, 3, 4, etc., in this embodiment, the number of the thimble 32 is 3 (see fig. 9), and the three are arranged into a stable triangular shape, so that the wafer is kept stable when being ejected, and the wafer slippage phenomenon is avoided. Correspondingly, in this embodiment, there are 3 thimble positioning holes 2241.

Referring to fig. 10, the sealing mechanism 4 has a body connected to the second driving mechanism 6, and the inner sides of the two side walls of the body are provided with second sliding grooves 41, and the second sliding grooves 41 are designed to match with the lifting rail 1211, so that the sealing mechanism 4 can perform lifting movement along the lifting rail 1211. The body below is connected with sealed cowling 42, and sealed cowling 42 cooperates the disk body structural design of heater 2, and it can seal, cover the upper surface that closes heater 2 for be in sealed heat retaining state when wafer heating/toasting, the effect of heating or toasting is better.

As shown in fig. 2 and fig. 3, a first lifting hole 14 is formed on the side plate 12 of the housing 1 near the lifting rail 1211, a second lifting hole 15 is formed on the side wall of the lifting support frame 121 near the lifting rail 1211, the first lifting hole 14 is located at the lower portion of the housing 1, and the second lifting hole 15 is located at the upper portion of the housing, that is, the position where the second lifting hole 15 is located is higher than the first lifting hole 14. The space of casing 1 and lift support frame 121 has so fully been utilized, and design one on top of the other, and ingenious regular, the practicality is good. The part of the sealing mechanism 4 body connected with the two second sliding chutes 41 (namely, one side edge of the body) is penetrated in the two second lifting holes 15, and the part of the bottom plate of the ejection mechanism 3 connected with the two first sliding chutes 31 is penetrated in the two first lifting holes 14. The lengths of the first elevation hole 14 and the second elevation hole 5 in the elevation direction (the direction parallel to the elevation guide 1211) may be further set in accordance with the elevation movement strokes of the ejector mechanism 3 and the sealing mechanism 4, respectively, so that the ejector mechanism 3 and the sealing mechanism 4 can only be elevated within a set range, thereby preventing the waste of the source power. In this embodiment, the first driving mechanism 5 and the second driving mechanism 5 may be air cylinders (as shown in fig. 11 and 12), and the first driving mechanism 5 and the second driving mechanism 6 may be disposed adjacent to each other such that the first driving mechanism 5 is located inside the second driving mechanism 6, and correspondingly, the first lifting hole 14 is also located inside the second lifting hole 15.

The housing 1 may further be provided with a first position sensor for sensing the position of the ejector mechanism 3 to a predetermined ejection position (i.e., the ejection section 321 of the ejector pin 32 is fully extended out of the heater 2), and a second position sensor for sensing the position of the sealing mechanism 4 to a predetermined sealing position (i.e., the sealing cover 42 just seals the heater 2). Therefore, the lifting movement strokes of the ejection mechanism 3 and the sealing mechanism 4 are effectively limited, and the accuracy and the energy utilization rate are improved. The first position sensor and the second position sensor may be both disposed inside the sidewall of the lifting support frame 121, or may be disposed inside the first lifting hole 14 and the second lifting hole 15, respectively. The first and second position sensors may be infrared sensors.

Referring to fig. 13-15, the utility model can be used as follows:

firstly, the wafer baking device provided by the utility model is in an initial state, the sealing mechanism 4 is positioned above the heater 2 in the initial state, a certain distance exists between the sealing cover 42 and the upper surface of the heater 2, the thimble 32 of the ejection mechanism 3 does not extend out of the heater 2, and the first driving mechanism 5 and the second driving mechanism 6 are not in a starting state;

then, the wafer is transferred to the upper surface of the heater 2 by a transfer mechanism (e.g. a robot), at this time, the second driving mechanism 6 starts to work, the sealing mechanism 4 is driven to descend along the elevating guide 1211, the sealing cover 42 is sealed and covers the heater 2, the wafer is heated and baked in the sealed and heat-preserving environment,

finally, after the wafer is heated and baked, the second driving mechanism 6 drives the sealing mechanism 4 to ascend along the elevating guide 1211 to return to the initial state, the first driving mechanism 5 drives the ejection mechanism 3 to ascend along the elevating guide 1211 until the ejection section 321 of the thimble 32 extends out of the heater 2, the ejection mechanism ejects the wafer, the wafer is taken away by the transfer mechanism (such as a robot), and the first driving mechanism 5 drives the ejection mechanism 3 to descend along the elevating guide 1211 to return to the initial state to prepare for the next round of work.

The above embodiments are only used for explaining the technical solution of the present invention and not for limiting the same, and although the above embodiments are specific to the present invention, it should be understood by those skilled in the art that the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the present invention, which should be covered by the claims of the present invention.

Claims (10)

1. A wafer baking device is characterized in that: the method comprises the following steps:

the wafer loading device comprises a shell, a wafer loading device and a wafer unloading device, wherein the shell is provided with an inner cavity, the inner cavity is provided with at least one opening, the opening is used for the wafer to enter and exit, and the surface of the shell is provided with a lifting guide rail;

the heater is arranged in the inner cavity and used for bearing and heating the wafer;

the ejection mechanism is connected with the lifting guide rail in a sliding manner so as to be capable of lifting along the lifting guide rail, and is provided with an ejector pin, and the ejector pin is arranged in the heater in a penetrating manner so as to be capable of partially extending out of the heater along with the lifting movement; and

and the sealing mechanism is arranged above the heater and is in sliding connection with the lifting guide rail so as to be capable of lifting along the lifting guide rail to seal or unseal the heater.

2. The wafer baking apparatus of claim 1, wherein: the device comprises a sealing mechanism and is characterized by further comprising a first driving mechanism and a second driving mechanism, wherein the first driving mechanism is connected with the ejection mechanism to drive the ejection mechanism to perform lifting motion, and the second driving mechanism is connected with the sealing mechanism to drive the sealing mechanism to perform lifting motion.

3. The wafer baking apparatus of claim 2, wherein: one side of the shell is provided with a lifting support frame, the lifting guide rails are arranged on two opposite side walls of the lifting support frame, the lifting support frame is provided with a cavity, and the first driving mechanism and the second driving mechanism are arranged in the cavity.

4. The wafer baking apparatus of claim 1, wherein: the heater includes the heating plate subassembly and is used for fixing the fixed baseplate of heating plate subassembly, the heating plate subassembly contains the metal disc and connects the ceramic dish of heating source, the lower surface of metal disc with the upper surface of ceramic dish is connected, the below of ceramic dish is equipped with heat insulating part, fixed baseplate has the confession the holding chamber of heating plate subassembly holding.

5. The wafer baking apparatus of claim 4, wherein: the heat insulation piece is bonded with the lower surface of the ceramic disc, and the heat insulation piece is tin foil paper.

6. The wafer baking apparatus of claim 4, wherein: the fixed base comprises a fixed ring and a fixed disc, two ends of the fixed ring are open, and one of the open ends of the fixed ring is connected with the fixed disc to form the accommodating cavity.

7. The wafer baking apparatus of claim 6, wherein: and a positioning disc is further arranged below the fixed disc, and a thimble positioning hole is formed in the positioning disc.

8. The wafer baking apparatus of claim 6, wherein: the heater also includes a plurality of temperature test elements for testing the temperature of the heating disc assembly, the temperature test elements being located inside or outside the heating disc assembly.

9. The wafer baking apparatus of claim 6, wherein: the fixed base further comprises a plurality of fixed supports, the fixed supports are connected to the bottom of the fixed disc, the fixed supports extend to the outer side of the fixed disc to form a support arm, and the support arm is fixedly connected with the shell.

10. The wafer baking apparatus of claim 1, wherein: the shell is further provided with a first position sensor and a second position sensor, the first position sensor is used for sensing the position of the ejection mechanism to enable the ejection mechanism to reach a preset ejection position, and the second position sensor is used for sensing the position of the sealing mechanism to enable the sealing mechanism to reach a preset sealing position.

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