CN213634324U - High heat dissipation plasma host structure - Google Patents
High heat dissipation plasma host structure Download PDFInfo
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- CN213634324U CN213634324U CN202022864446.2U CN202022864446U CN213634324U CN 213634324 U CN213634324 U CN 213634324U CN 202022864446 U CN202022864446 U CN 202022864446U CN 213634324 U CN213634324 U CN 213634324U
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Abstract
The utility model discloses a high heat dissipation plasma host computer structure, including roof and bottom plate, the both sides that the roof is relative are equipped with the curb plate, the heat dissipation seam has been seted up to the curb plate lateral wall, the terminal surface is equipped with front bezel and back plate around the bottom plate is relative, the roof, two blocks of curb plates, the bottom plate, front bezel and back plate constitute a cavity, the bottom plate internal surface is equipped with the mainboard, be equipped with a plurality of high-power components and parts on the mainboard, the mainboard holding is inside the cavity, the front bezel inlays and is equipped with air inlet fan, the back plate inlays and is equipped with air outlet fan, the inside centrifugal fan that still is equipped with of cavity, centrifugal fan is fixed in on the mainboard, centrifugal fan. The utility model provides a high heat dissipation plasma host computer structure constitutes main wind channel structure through arranging in preceding, the air inlet fan and the air-out fan after in respectively, recycles centrifugal fan and shifts the heat that the mainboard produced to the air outlet fast, combines the supplementary heat dissipation of heat dissipation seam at last, can derive the heat of cavity inside fast.
Description
Technical Field
The utility model relates to a quick-witted case technical field especially relates to a high heat dissipation plasma host computer structure.
Background
In the prior art, the heat dissipation of the high-power case mostly adopts the way that an independent radiator or a heat dissipation fan is arranged on a related power device in a circuit board of a power supply, and meanwhile, a plurality of ventilation openings are arranged on the case of the power supply to form an air duct for heat dissipation. Because the heat production quantity of the high-power components in unit time is relatively large, the heat can not be quickly discharged by utilizing the heat dissipation structure, the internal temperature can be gradually increased along with the prolonging of the operation time of the high-power components, and the long-time high-temperature environment can influence the operation state of the high-power components.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high heat dissipation plasma host computer structure can be fast derive the heat of quick-witted incasement portion, ensures the normal operating condition of high-power components and parts.
The utility model discloses a technical scheme that high heat dissipation plasma host computer structure adopted is:
the utility model provides a high heat dissipation plasma host computer structure, includes roof and bottom plate, the relative both sides of roof are equipped with the curb plate, the heat dissipation seam has been seted up to the curb plate lateral wall, the relative front and back terminal surface of bottom plate is equipped with front bezel and back plate, roof, two curb plates, bottom plate, front bezel and back plate constitute a cavity, the bottom plate internal surface is equipped with the mainboard, be equipped with a plurality of high-power components and parts on the mainboard, the mainboard holding is inside the cavity, the front bezel inlays and is equipped with air inlet fan, the back plate inlays and is equipped with air outlet fan, the inside centrifugal fan that still is equipped with of cavity, centrifugal fan is fixed in on the mainboard, centrifugal fan's air intake is close to high-power components and parts.
Preferably, the air inlet fan is arranged on one side of the front plate, the air outlet fan is arranged on one side of the rear plate, and the air inlet fan and the air outlet fan are arranged on the diagonal line of the cavity.
Preferably, a radiator is arranged between the high-power component and the centrifugal fan, a heat conducting plate is arranged at one end of the radiator, and the heat conducting plate is attached to the high-power component.
Preferably, the outer surface of the bottom plate is provided with raised grains.
Preferably, the top plate and the side plate are integrally formed, and the bottom plate and the front plate are integrally formed.
As the preferred scheme, the front bezel outer wall and the back plate outer wall all are equipped with prevents that the hand touches the screen panel, two prevent that the hand touches the screen panel and cover respectively and locate on air inlet fan and the air-out fan.
The utility model discloses a high heat dissipation plasma host computer structure's beneficial effect is: the relative both sides of roof are equipped with the curb plate, and the heat dissipation seam has been seted up to the curb plate lateral wall, and the relative front and back terminal surface of bottom plate is equipped with front bezel and back plate. The top plate, the two side plates, the bottom plate, the front plate and the rear plate form a cavity, the inner surface of the bottom plate is provided with a main plate, the main plate is provided with a plurality of high-power components, and the main plate is accommodated in the cavity. The front plate is embedded with an air inlet fan, the rear plate is embedded with an air outlet fan, the cavity is internally provided with a centrifugal fan, the centrifugal fan is fixed on the main board, an air inlet of the centrifugal fan is close to the high-power component, and an air outlet of the centrifugal fan is aligned with the air outlet fan. The air inlet fan and the air outlet fan which are respectively arranged on the front plate and the rear plate form a main air channel structure, heat generated by the high-power components is quickly transferred to the air outlet by the aid of the centrifugal fan, and finally the heat inside the cavity can be quickly led out by the aid of auxiliary heat dissipation of the heat dissipation seams, so that the normal operation state of the high-power components is ensured.
Drawings
Fig. 1 is a schematic structural diagram of a high heat dissipation plasma host structure of the present invention;
fig. 2 is a side view of the heat sink of the high heat dissipation plasma main body structure of the present invention;
fig. 3 is a schematic structural diagram of a high heat dissipation plasma host structure bottom plate of the present invention.
Detailed Description
The invention will be further elucidated and described with reference to the following embodiments and drawings in which:
referring to fig. 1-3, a high thermal dissipation plasma mainframe structure includes a top plate 10 and a bottom plate 30.
The opposite two sides of the top plate 10 are provided with side plates 20, the side walls of the side plates 20 are provided with heat dissipation seams 21, and the opposite front and back end surfaces of the bottom plate 30 are provided with a front plate 40 and a back plate 50. The top plate 10, the two side plates 20, the bottom plate 30, the front plate 40 and the rear plate 50 form a cavity, a main plate 60 is arranged on the inner surface of the bottom plate 30, a plurality of high-power components 61 are arranged on the main plate 60, and the main plate 60 is accommodated in the cavity. The front plate 40 is embedded with an air inlet fan 41, the rear plate 50 is embedded with an air outlet fan 42, the cavity is also internally provided with a centrifugal fan 71, the centrifugal fan 71 is fixed on the main board 60, an air inlet of the centrifugal fan 71 is close to the high-power component 61, and an air outlet of the centrifugal fan 71 is aligned with the air outlet fan 42.
The air inlet fan 41 and the air outlet fan 42 which are respectively arranged on the front plate 40 and the rear plate 50 form a main air duct structure, heat generated by the high-power component 61 is quickly transferred to the air outlet by the centrifugal fan 71, and finally, the heat inside the cavity can be quickly led out by combining with auxiliary heat dissipation of the heat dissipation seam 21, so that the normal operation state of the high-power component 61 is ensured.
Preferably, the air inlet fan 41 is disposed at one side of the front plate 40, the air outlet fan 42 is disposed at one side of the rear plate 50, and the air inlet fan 41 and the air outlet fan 42 are disposed on the diagonal line of the cavity. It is ensured that the heat generated by each outlet of the main board 60 can be carried away by the airflow flowing in the air duct.
Preferably, a heat sink 72 is disposed between the high power component 61 and the centrifugal fan 71, a heat conducting plate 721 is disposed at one end of the heat sink 72, and the heat conducting plate 721 is attached to the high power component 61. The heat conducting plate 721 sucks out heat and transfers the heat to the radiator 72, the radiator 72 in the embodiment is a radial structure, and the outer ring can increase the contact area with air and improve the heat dissipation rate; the heat that is difficult to dissipate in the middle is absorbed by the centrifugal fan 71 that enters the air laterally, and the heat gathered in the middle of the radiator 72 is quickly led out through the air outlet of the directional air outlet fan 42, so that the overall heat dissipation efficiency is further improved.
Because the general mainboard 60 is between or indirectly contact with bottom plate 30, consequently this embodiment is equipped with raised grain 31 at bottom plate 30 surface to increase the area of contact of bottom plate 30 and air, promote the radiating efficiency.
The top plate 10 and the side plates 20 are integrally formed, and the bottom plate 30 and the front plate 40 are integrally formed, so that the rigidity is ensured, and heat on a certain plate can be quickly dispersed to surrounding plate bodies for heat dissipation.
The outer wall of the front plate 40 and the outer wall of the rear plate 50 are both provided with a hand touch prevention mesh enclosure 80, and the two hand touch prevention mesh enclosures 80 are respectively covered on the air inlet fan 41 and the air outlet fan 42. The fan rotating at high speed is prevented from accidentally injuring users.
The utility model provides a high heat dissipation plasma host computer structure, the both sides that the roof is relative are equipped with the curb plate, and the heat dissipation seam has been seted up to the curb plate lateral wall, and the terminal surface is equipped with front bezel and back plate around the bottom plate is relative. The top plate, the two side plates, the bottom plate, the front plate and the rear plate form a cavity, the inner surface of the bottom plate is provided with a main plate, the main plate is provided with a plurality of high-power components, and the main plate is accommodated in the cavity. The front plate is embedded with an air inlet fan, the rear plate is embedded with an air outlet fan, the cavity is internally provided with a centrifugal fan, the centrifugal fan is fixed on the main board, an air inlet of the centrifugal fan is close to the high-power component, and an air outlet of the centrifugal fan is aligned with the air outlet fan. The air inlet fan and the air outlet fan which are respectively arranged on the front plate and the rear plate form a main air channel structure, heat generated by the high-power components is quickly transferred to the air outlet by the aid of the centrifugal fan, and finally the heat inside the cavity can be quickly led out by the aid of auxiliary heat dissipation of the heat dissipation seams, so that the normal operation state of the high-power components is ensured.
It should be finally noted that the above embodiments are only intended to illustrate the technical solutions of the present invention, and not to limit the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.
Claims (6)
1. The high-heat-dissipation plasma host structure is characterized in that an air inlet fan is embedded in the front plate, an air outlet fan is embedded in the rear plate, a centrifugal fan is further arranged in the cavity, the centrifugal fan is fixed on the main plate, an air inlet of the centrifugal fan is close to the high-power components, and an air outlet of the centrifugal fan is aligned to the air outlet fan.
2. The plasma mainframe structure of claim 1, wherein the air inlet fan is disposed at one side of the front plate, the air outlet fan is disposed at one side of the rear plate, and the air inlet fan and the air outlet fan are disposed on a diagonal line of the chamber.
3. The high heat dissipation plasma host structure of claim 1, wherein a heat sink is disposed between the high power device and the centrifugal fan, and a heat conducting plate is disposed at one end of the heat sink and attached to the high power device.
4. The structure of claim 1, wherein the outer surface of the bottom plate is provided with raised grains.
5. The structure of claim 1, wherein the top plate and the side plate are integrally formed, and the bottom plate and the front plate are integrally formed.
6. The structure of any one of claims 1-5, wherein said front and rear walls are provided with anti-hand-touch screens, and said anti-hand-touch screens are respectively covered on said air inlet fan and said air outlet fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022864446.2U CN213634324U (en) | 2020-12-03 | 2020-12-03 | High heat dissipation plasma host structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022864446.2U CN213634324U (en) | 2020-12-03 | 2020-12-03 | High heat dissipation plasma host structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213634324U true CN213634324U (en) | 2021-07-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022864446.2U Active CN213634324U (en) | 2020-12-03 | 2020-12-03 | High heat dissipation plasma host structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213634324U (en) |
-
2020
- 2020-12-03 CN CN202022864446.2U patent/CN213634324U/en active Active
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