CN213620948U - Storage device for wafer processing - Google Patents
Storage device for wafer processing Download PDFInfo
- Publication number
- CN213620948U CN213620948U CN202022295255.9U CN202022295255U CN213620948U CN 213620948 U CN213620948 U CN 213620948U CN 202022295255 U CN202022295255 U CN 202022295255U CN 213620948 U CN213620948 U CN 213620948U
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- fixedly connected
- box body
- wafer
- connecting plate
- loop bar
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- 235000012431 wafers Nutrition 0.000 abstract description 66
- 238000000034 method Methods 0.000 abstract description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
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Abstract
The utility model belongs to the technical field of the wafer processing technique and specifically relates to a storage device is used in wafer processing, comprises a box bod, box body upper end one side fixedly connected with upper cover, fixedly connected with fastening device between upper cover and the box body, box body upper end opposite side articulates there is the side cap, one side fixedly connected with sleeve pipe of side cap is kept away from to the box body inside wall, sleeve pipe one end is provided with the loop bar, and the one end of loop bar is inserted and is established among the sleeve pipe, the other end of loop bar extends to the sheathed tube outside and fixedly connected with push mechanism, the outside cover of loop bar is equipped with first spring, and the one end fixed connection of first spring is on the sleeve pipe, the other end fixed connection of first spring is on push mechanism, a plurality of wafer bodies have been placed to the inside of box body, and a plurality. The storage device for wafer processing can conveniently store, place and take out wafers, and is simple to operate and convenient to use.
Description
Technical Field
The utility model relates to a wafer processing technology field especially relates to a storage device is used in wafer processing.
Background
The wafer is made by purifying, melting and distilling silicon dioxide to prepare silicon crystal rods, and then taking the silicon crystal rods to grind, polish and slice the silicon crystal rods to form a wafer master slice in a wafer factory; since circular wafers are not directional and not suitable for electronic transmission, the wafers must be cut to have an edge as a triangle-like "bottom", so that the wafers do not grow like a home DVD is a standard circle, but are cut to have an edge as a "bottom" circle.
In the production and processing process of the wafers, the storage device of the wafers is required to be used, most of the existing storage devices are composed of a simple placing box, and therefore the existing storage device is simple in structure and single in function, can only play a role of simply storing the wafers, is not convenient to store and take out, is poor in stability of storage of a plurality of wafers, and is easy to damage the wafers.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the problem that the storage device is not only inconvenient to store and take out and the storage stability of a plurality of wafers is poor, which is easy to cause the damage of the wafers and provides a wafer processing storage device.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the storage device for processing the wafer comprises a box body, wherein one side of the upper end of the box body is fixedly connected with an upper cover, a fastening mechanism is fixedly connected between the upper cover and the box body, the other side of the upper end of the box body is hinged with a side cover, one end of the side cover is contacted with the opposite end of the upper cover, one side of the inner side wall of the box body, which is far away from the side cover, is fixedly connected with a sleeve, one end of the sleeve is provided with a loop bar, one end of the loop bar is inserted in the sleeve, the other end of the loop bar extends to the outer side of the sleeve and is fixedly connected with a pushing mechanism, the outer side of the loop bar is sleeved with a first spring, one end of the first spring is fixedly connected to the sleeve, the other end of the first spring is fixedly connected to the pushing mechanism, a plurality of wafer bodies, and the wafer bodies are positioned on one side of the pushing mechanism.
Preferably, fastening device includes first connecting plate and second connecting plate, first connecting plate fixed connection be in the top position of box body one side, second connecting plate fixed connection be in the bottom position of upper cover one side, first connecting plate upper surface is fixedly connected with a plurality of threaded rod uniformly, and a plurality of the threaded rod is equallyd divide and is do not run through the second connecting plate passes through nut fixed connection.
Preferably, push mechanism includes the connecting plate, connecting plate fixed connection be in the one end of loop bar, connecting plate one side is a plurality of second springs of evenly fixedly connected with, and is a plurality of the one end fixedly connected with push pedal of second spring.
Preferably, a buffer layer is bonded to one side of the push plate, and the buffer layer is a rubber pad.
Preferably, the upper end of the side cover is fixedly connected with a projection.
The utility model provides a storage device is used in processing of wafer, beneficial effect lies in: according to the storage device for processing the wafer, through the arrangement of the sleeve, the loop bar, the first spring and the pushing mechanism, firstly, the upper cover is detached, then the wafer bodies can be placed into the box body, the wafer bodies are placed on one side of the pushing mechanism, and under the action of the sleeve, the loop bar, the first spring and the pushing mechanism, the wafer bodies can be stably clamped in the box body under the elastic acting force generated by the sleeve, the loop bar, the first spring and the pushing mechanism; secondly, when the wafer body needs to be taken out, after the side cover is pulled open, part of the wafer body can be exposed, a worker can take out the wafer bodies in corresponding quantity according to the requirement, after part of the wafer body is taken out, under the elastic acting force generated by the sleeve, the loop bar and the first spring, the pushing mechanism can extrude and push the rest wafer body forwards again and enable the wafer body to be stably clamped in the box body, and when the wafer body needs to be taken out next time, part of the wafer body can be directly located below the side cover. Therefore, through the design, the storage process and the taking-out process of the wafer bodies can be greatly facilitated, a plurality of wafer bodies can be stably stored in the box body, and a worker can repeatedly use and take out the wafer bodies, so that great convenience can be brought to the work of the worker.
Drawings
Fig. 1 is a schematic structural diagram of a storage device for wafer processing according to the present invention.
Fig. 2 is a sectional view of the internal structure of fig. 1.
Fig. 3 is a top view of a wafer processing storage device according to the present invention.
Fig. 4 is an enlarged schematic view of the structure of the portion a in fig. 2.
In the figure: the wafer packaging box comprises a box body 1, an upper cover 2, a fastening mechanism 3, a first connecting plate 31, a second connecting plate 32, a threaded rod 33, a side cover 4, a protrusion 5, a sleeve 6, a loop bar 7, a first spring 8, a pushing mechanism 9, a connecting plate 91, a second spring 92, a push plate 93, a buffer layer 94 and a wafer body 10.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Example 1
Referring to fig. 1-4, a storage device for wafer processing comprises a box body 1, wherein an upper cover 2 is fixedly connected to one side of the upper end of the box body 1, a fastening mechanism 3 is fixedly connected between the upper cover 2 and the box body 1, the upper cover 2 and the box body 1 are fixedly connected together through the fastening mechanism 3, and the upper cover 2 is detachable.
The opposite side of the upper end of the box body 1 is hinged with a side cover 4, one end of the side cover 4 is in contact with the opposite end of the upper cover 2, the upper end of the side cover 4 is fixedly connected with a protrusion 5, the protrusion 5 is used for conveniently poking the side cover 4, and after the side cover 4 is poked, a worker can conveniently take out the wafer from the box body 1.
One side fixedly connected with sleeve 6 that the side cap 4 was kept away from to box body 1 inside wall, sleeve 6 one end is provided with loop bar 7, and the one end of loop bar 7 is inserted and is established among sleeve 6, the other end of loop bar 7 extends to the outside of sleeve 6 and fixedly connected with push mechanism 9, the outside cover of loop bar 7 is equipped with first spring 8, and the one end fixed connection of first spring 8 is on sleeve 6, the other end fixed connection of first spring 8 is on push mechanism 9, a plurality of wafer bodies 10 have been placed to the inside of box body 1, and a plurality of wafer bodies 10 are located one side of push mechanism 9, through sleeve 6, loop bar 7, first spring 8 and push mechanism 9's setting, at first, upper cover 2 is dismantled, then can put into box body 1 with a plurality of wafer bodies 10, and make a plurality of wafer bodies 10 place in one side of push mechanism 9, at sleeve 6, Under the action of the loop bar 7, the first spring 8 and the pushing mechanism 9, under the elastic acting force generated by the loop bar, a plurality of wafer bodies 10 can be stably clamped in the box body 1; secondly, when the wafer body 10 needs to be taken out, after the side cover 4 is pulled away, part of the wafer body 10 is exposed, a worker can take out a corresponding number of wafer bodies 10 as required, after part of the wafer body 10 is taken out, under the elastic acting force generated by the sleeve 6, the loop bar 7 and the first spring 8, the pushing mechanism 9 can extrude and push the rest of the wafer body 10 forwards again and stably clamp the wafer body in the box body 1, and when the wafer body 10 needs to be taken out next time, part of the wafer body 10 is still directly positioned below the side cover 4. Therefore, through the design, the storage process and the taking-out process of the wafer bodies 10 can be greatly facilitated, a plurality of wafer bodies 10 can be stably stored in the box body 1, and a worker can repeatedly use and take out the wafer bodies, so that great convenience is brought to the work of the worker.
Example 2
Referring to fig. 1-3, as another preferred embodiment of the present invention, the difference from embodiment 1 lies in that the fastening mechanism 3 includes a first connecting plate 31 and a second connecting plate 32, the first connecting plate 31 is fixedly connected at the top position of one side of the box body 1, the second connecting plate 32 is fixedly connected at the bottom position of one side of the upper cover 2, a plurality of threaded rods 33 are uniformly and fixedly connected to the upper surface of the first connecting plate 31, and the plurality of threaded rods 33 equally divide and respectively run through the second connecting plate 32 and pass through the nut fixed connection, through the first connecting plate 31, the second connecting plate 32 and the setting of the plurality of threaded rods 33, thereby the disassembling and assembling process of the upper cover 2 can be greatly facilitated, and then the placing process and the storing process of the plurality of wafer bodies 10 can be facilitated.
Example 3
Referring to fig. 2 and 4, as another preferred embodiment of the present invention, the difference from embodiment 1 lies in that, the pushing mechanism 9 includes a connecting plate 91, the connecting plate 91 is fixedly connected to one end of the loop bar 7, a plurality of second springs 92 are uniformly fixedly connected to one side of the connecting plate 91, one end fixedly connected to the push plate 93 of the second springs 92, one side of the push plate 93 is bonded with a buffer layer 94, and the buffer layer 94 is a rubber pad, through the connecting plate 91, the second springs 92, the push plate 93 and the buffer layer 94, thereby being capable of having a certain buffering capacity, playing a role in buffering and protecting the wafer body 10, and effectively avoiding the damage to the wafer body 10 due to the excessive squeezing force.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (5)
1. A storage device for wafer processing comprises a box body (1) and is characterized in that an upper cover (2) is fixedly connected to one side of the upper end of the box body (1), a fastening mechanism (3) is fixedly connected between the upper cover (2) and the box body (1), a side cover (4) is hinged to the other side of the upper end of the box body (1), one end of the side cover (4) is in contact with the opposite end of the upper cover (2), a sleeve (6) is fixedly connected to one side, far away from the side cover (4), of the inner side wall of the box body (1), a loop bar (7) is arranged at one end of the sleeve (6), one end of the loop bar (7) is inserted into the sleeve (6), the other end of the loop bar (7) extends to the outer side of the sleeve (6) and is fixedly connected with a pushing mechanism (9), a first spring (8) is sleeved on the outer side of the loop bar (7, and one end of the first spring (8) is fixedly connected to the sleeve (6), the other end of the first spring (8) is fixedly connected to the pushing mechanism (9), a plurality of wafer bodies (10) are placed in the box body (1), and the wafer bodies (10) are located on one side of the pushing mechanism (9).
2. A storage device for wafer processing as claimed in claim 1, wherein the fastening mechanism (3) comprises a first connecting plate (31) and a second connecting plate (32), the first connecting plate (31) is fixedly connected to a top position of one side of the box body (1), the second connecting plate (32) is fixedly connected to a bottom position of one side of the upper cover (2), a plurality of threaded rods (33) are uniformly and fixedly connected to an upper surface of the first connecting plate (31), and the plurality of threaded rods (33) respectively penetrate through the second connecting plate (32) and are fixedly connected through nuts.
3. The wafer processing storage device as set forth in claim 1, wherein the pushing mechanism (9) comprises a connecting plate (91), the connecting plate (91) is fixedly connected to one end of the loop bar (7), a plurality of second springs (92) are uniformly and fixedly connected to one side of the connecting plate (91), and a pushing plate (93) is fixedly connected to one end of the second springs (92).
4. A wafer processing storage device as claimed in claim 3, wherein a buffer layer (94) is bonded to one side of the push plate (93), and the buffer layer (94) is a rubber pad.
5. A storage device for wafer processing as claimed in claim 1, wherein a projection (5) is fixedly connected to the upper end of the side cover (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022295255.9U CN213620948U (en) | 2020-10-15 | 2020-10-15 | Storage device for wafer processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022295255.9U CN213620948U (en) | 2020-10-15 | 2020-10-15 | Storage device for wafer processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213620948U true CN213620948U (en) | 2021-07-06 |
Family
ID=76660693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022295255.9U Active CN213620948U (en) | 2020-10-15 | 2020-10-15 | Storage device for wafer processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213620948U (en) |
-
2020
- 2020-10-15 CN CN202022295255.9U patent/CN213620948U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 215000 rooms 106 and 109, 1st floor, block B, building 3, No. 99, Suhong West Road, Suzhou Industrial Park, Suzhou area, China (Jiangsu) pilot Free Trade Zone, Suzhou, Jiangsu Patentee after: Baikejing semiconductor technology (Suzhou) Co.,Ltd. Address before: 215000 Suzhou Industrial Park, Jiangsu Province Patentee before: Suzhou baikejing Electronic Technology Co.,Ltd. |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A storage device for wafer processing Effective date of registration: 20230510 Granted publication date: 20210706 Pledgee: Jiangsu Jiangyin Rural Commercial Bank Co.,Ltd. Suzhou Branch Pledgor: Baikejing semiconductor technology (Suzhou) Co.,Ltd. Registration number: Y2023980040169 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20210706 Pledgee: Jiangsu Jiangyin Rural Commercial Bank Co.,Ltd. Suzhou Branch Pledgor: Baikejing semiconductor technology (Suzhou) Co.,Ltd. Registration number: Y2023980040169 |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240914 Address after: Room 1039, 10th Floor, Maker Center, Gaoyou High tech Zone, Yangzhou City, Jiangsu Province 225000 Patentee after: Yangzhou Niefeng Electronic Materials Co.,Ltd. Country or region after: China Address before: 215000 rooms 106 and 109, 1st floor, block B, building 3, No. 99, Suhong West Road, Suzhou Industrial Park, Suzhou area, China (Jiangsu) pilot Free Trade Zone, Suzhou, Jiangsu Patentee before: Baikejing semiconductor technology (Suzhou) Co.,Ltd. Country or region before: China |