CN213617668U

CN213617668U - Scribing machine for semiconductor clamp

Info

Publication number: CN213617668U
Application number: CN202022239285.8U
Authority: CN
Inventors: 姚胜军; 卞可鹏; 刘正
Original assignee: Wuxi Haifa Industrial Measurement And Control Equipment Co ltd
Current assignee: Wuxi Haifa Industrial Measurement And Control Equipment Co ltd
Priority date: 2020-10-10
Filing date: 2020-10-10
Publication date: 2021-07-06
Anticipated expiration: 2030-10-10

Abstract

The utility model discloses a wafer scriber for semiconductor anchor clamps, which comprises a body, the top fixedly connected with fixed plate of body. The utility model discloses a set up first connecting plate, the second connecting plate, the fixed block, the through-hole, perforate, the connecting hole, remove the hole, accomodate groove and positioner's cooperation is used, the limiting plate removes and contacts the back with the semiconductor board, the stripper plate moves down the extrusion spring and drives the connecting rod removal, the connecting rod moves down to drive the locating plate and moves down to pass the connecting hole and remove the hole and remove to the circular recess in, then the rotation push rod drives the locating plate at the circular recess internal rotation, spacing to the semiconductor board position has been accomplished, solved current scribing machine for semiconductor anchor clamps and did not carry out the spacing device in position to its semiconductor when using, in case the user takes place the skew when putting, will lead to the problem that the skew takes place for the semiconductor scribing position, this scribing machine for semiconductor anchor clamps, possess convenient spacing.

Description

Scribing machine for semiconductor clamp

Technical Field

The utility model belongs to the technical field of the semiconductor scribing, especially, relate to a scribing machine for semiconductor anchor clamps.

Background

The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and has application in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, and for example, a diode is a device made of the semiconductor.

The process of separating each chip with independent electrical performance is called dicing, and the problems of the prior art are that: the existing dicing saw for the semiconductor clamp is not provided with a device for limiting the position of a semiconductor when in use, and once a user deflects when putting, the semiconductor dicing position can be deflected, so that the dicing saw is inconvenient to use by the user.

SUMMERY OF THE UTILITY MODEL

The problem to prior art exists, the utility model provides a wafer scriber for semiconductor anchor clamps possesses convenient spacing advantage, has solved current wafer scriber for semiconductor anchor clamps and has not carried out the spacing device in position to its semiconductor when using, in case the user takes place the skew when putting, will lead to the problem that the skew takes place for the semiconductor scribing position.

The utility model discloses a realize like this, a dicing saw for semiconductor anchor clamps, which comprises a body, the top fixedly connected with fixed plate of body, the first connecting plate of rear side fixedly connected with at fixed plate top, the left side fixedly connected with second connecting plate at fixed plate top, the top fixedly connected with fixed block of first connecting plate and second connecting plate, the through-hole has been seted up to the bottom of fixed block, the perforation has been seted up at the top of fixed block, the connecting hole has all been seted up to the bottom of first connecting plate and second connecting plate, the fixed plate is close to one side of connecting hole and has been seted up the removal hole, the groove of accomodating has been seted up to the fenestrate bottom, the inner chamber swing joint who accomodates the groove has positioner, fenestrate inner chamber swing joint has.

As the utility model discloses it is preferred, positioner includes the stripper plate, the bottom fixedly connected with connecting rod of stripper plate, the surface cover of connecting rod is equipped with the spring, one side and stripper plate fixed connection that the push rod is close to the stripper plate.

As the utility model discloses it is preferred, the outside fixedly connected with slip ring of stripper plate, accomodate one side that the groove is close to the slip ring and seted up the sliding tray that uses with the slip ring cooperation, the slip ring is close to one side of sliding tray inner wall and the inner wall contact of sliding tray.

As the utility model discloses it is preferred, the top swing joint of fixed plate has the limiting plate, first connecting plate and second connecting plate are close to one side of limiting plate and offer the spacing hole that uses with the limiting plate cooperation, the limiting plate is close to one side of spacing downthehole wall and the inner wall contact in spacing hole, the limiting plate is close to one side of connecting hole and has seted up the removal hole.

As the utility model discloses it is preferred, through-hole and fixedly connected with locating plate are passed to the bottom of connecting rod, the circular recess that uses with the locating plate cooperation is seted up to the bottom in removal hole, the inner chamber that connecting hole and removal hole and extended to the circular recess is passed to the bottom of locating plate.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a set up first connecting plate, the second connecting plate, the fixed block, the through-hole, perforate, the connecting hole, remove the hole, accomodate groove and positioner's cooperation is used, the limiting plate removes and contacts the back with the semiconductor board, the stripper plate moves down the extrusion spring and drives the connecting rod removal, the connecting rod moves down to drive the locating plate and moves down to pass the connecting hole and remove the hole and remove to the circular recess in, then the rotation push rod drives the locating plate at the circular recess internal rotation, spacing to the semiconductor board position has been accomplished, solved current scribing machine for semiconductor anchor clamps and did not carry out the spacing device in position to its semiconductor when using, in case the user takes place the skew when putting, will lead to the problem that the skew takes place for the semiconductor scribing position, this scribing machine for semiconductor anchor clamps, possess convenient spacing.

2. The utility model discloses a set up positioner, spacing back in limiting plate position has accomplished the spacing to the locating plate position through the spring to the pressure of stripper plate, has played the effect that the locating plate can not break away from the circular recess.

3. The utility model discloses a set up slip ring and sliding tray, the stripper plate has the drive slip ring to remove in the sliding tray, has reduced the stripper plate and has accomodate the frictional force between the groove, has played the stripper plate and can not take place the dead effect of card in accomodating the inslot.

4. The utility model discloses a set up limiting plate and spacing hole, the semiconductor is placed behind the fixed plate top, removes at spacing downthehole through removing the limiting plate, has accomplished spacing to the semiconductor position, has played the effect that the semiconductor can not take place to remove when the semiconductor scribing of body.

5. The utility model discloses a set up locating plate and circular recess, stripper plate extrusion connecting rod drives the locating plate and removes to the circular recess in, then rotatory locating plate, has accomplished the fixed to the limiting plate position, has played the limiting plate can not take place the effect of removal after spacing to the semiconductor.

Drawings

Fig. 1 is a schematic structural diagram provided in an embodiment of the present invention;

fig. 2 is a schematic perspective view of a fixing plate according to an embodiment of the present invention;

fig. 3 is a schematic perspective view of a positioning plate according to an embodiment of the present invention;

fig. 4 is a partial front sectional view provided by an embodiment of the present invention.

In the figure: 1. a body; 2. a fixing plate; 3. a first connecting plate; 4. a second connecting plate; 5. a fixed block; 6. a through hole; 7. perforating; 8. connecting holes; 9. moving the hole; 10. a receiving groove; 11. a positioning device; 12. a push rod; 1101. a pressing plate; 1102. a connecting rod; 1103. a spring; 13. a slip ring; 14. a sliding groove; 15. a limiting plate; 16. a limiting hole; 17. positioning a plate; 18. a circular groove.

Detailed Description

In order to further understand the contents, features and effects of the present invention, the following embodiments are illustrated and described in detail with reference to the accompanying drawings.

The structure of the present invention will be described in detail with reference to the accompanying drawings.

As shown in fig. 1 to 4, the embodiment of the utility model provides a pair of wafer scriber for semiconductor anchor clamps, which comprises a body 1, top fixedly connected with fixed plate 2 of body 1, the first connecting plate 3 of rear side fixedly connected with at 2 tops of fixed plate, the left side fixedly connected with second connecting plate 4 at 2 tops of fixed plate, the top fixedly connected with fixed block 5 of first connecting plate 3 and second connecting plate 4, through-hole 6 has been seted up to the bottom of fixed block 5, perforation 7 has been seted up at the top of fixed block 5, connecting hole 8 has all been seted up to the bottom of first connecting plate 3 and second connecting plate 4, removal hole 9 has been seted up to one side that fixed plate 2 is close to connecting hole 8, it accomodates groove 10 to have been seted up to perforation 7's bottom, the inner chamber swing joint who accomodates groove 10 has positioner 11, the.

Referring to fig. 4, the positioning device 11 includes a pressing plate 1101, a connecting rod 1102 is fixedly connected to the bottom of the pressing plate 1101, a spring 1103 is sleeved on the surface of the connecting rod 1102, and a side of the push rod 12 close to the pressing plate 1101 is fixedly connected to the pressing plate 1101.

Adopt above-mentioned scheme: by arranging the positioning device 11, after the position of the limiting plate 15 is limited, the position of the positioning plate 17 is limited by the pressure of the spring 1103 on the extrusion plate 1101, so that the positioning plate 17 cannot be separated from the circular groove 18.

Referring to fig. 4, a sliding ring 13 is fixedly connected to an outer side of the pressing plate 1101, a sliding groove 14 matched with the sliding ring 13 is formed in one side of the accommodating groove 10 close to the sliding ring 13, and one side of the sliding ring 13 close to an inner wall of the sliding groove 14 contacts with the inner wall of the sliding groove 14.

Adopt above-mentioned scheme: through setting up slip ring 13 and sliding tray 14, the stripper plate 1101 has the slip ring 13 of drive and moves in sliding tray 14, has reduced the frictional force between stripper plate 1101 and the groove 10 of accomodating, has played stripper plate 1101 and can not take place the dead effect of card in accomodating the groove 10.

Referring to fig. 2, a limiting plate 15 is movably connected to the top of the fixing plate 2, a limiting hole 16 used in cooperation with the limiting plate 15 is formed in one side, close to the limiting plate 15, of the first connecting plate 3 and the second connecting plate 4, one side, close to the inner wall of the limiting hole 16, of the limiting plate 15 is in contact with the inner wall of the limiting hole 16, and a moving hole 9 is formed in one side, close to the connecting hole 8, of the limiting plate 15.

Adopt above-mentioned scheme: through setting up limiting plate 15 and spacing hole 16, the semiconductor is placed behind fixed plate 2 tops, removes in spacing hole 16 through removing limiting plate 15, has accomplished spacing to the semiconductor position, has played body 1 and can not take place the effect that removes when the semiconductor scribing semiconductor.

Referring to fig. 4, the bottom of the connecting rod 1102 passes through the through hole 6 and is fixedly connected with a positioning plate 17, the bottom of the moving hole 9 is opened with a circular groove 18 used in cooperation with the positioning plate 17, and the bottom of the positioning plate 17 passes through the connecting hole 8 and the moving hole 9 and extends to the inner cavity of the circular groove 18.

Adopt above-mentioned scheme: through setting up locating plate 17 and circular recess 18, stripper plate 1101 extrusion connecting rod 1102 drives locating plate 17 and moves to circular recess 18 in, then rotatory locating plate 17, has accomplished the fixed to limiting plate 15 position, has played limiting plate 15 can not take place the effect that removes after spacing to the semiconductor.

The utility model discloses a theory of operation:

when the semiconductor board limiting device is used, a semiconductor board is placed at the top of the fixing plate 2, the limiting plate 15 is pushed to be driven at the top of the fixing plate 2, the limiting plate 15 moves to be in contact with the semiconductor board, the moving hole 9 is aligned with the connecting hole 8, the lower push rod 12 drives the extrusion plate 1101 to move downwards in the containing groove 10, the extrusion plate 1101 moves downwards to extrude the spring 1103 and drive the connecting rod 1102 to move, the connecting rod 1102 moves downwards to drive the positioning plate 17 to move downwards to penetrate through the connecting hole 8 and the moving hole 9 to move into the circular groove 18, then the push rod 12 is rotated to drive the positioning plate 17 to rotate in the circular groove 18.

In summary, the following steps: the dicing saw for the semiconductor clamp is characterized in that a first connecting plate 3, a second connecting plate 4, a fixing block 5, a through hole 6, a through hole 7, a connecting hole 8, a moving hole 9, a containing groove 10 and a positioning device 11 are arranged in a matched mode, after a limiting plate 15 moves to be in contact with a semiconductor plate, a pressing plate 1101 moves downwards to press a spring 1103 and drive a connecting rod 1102 to move, the connecting rod 1102 moves downwards to drive a positioning plate 17 to move downwards to penetrate through the connecting hole 8 and the moving hole 9 to move into a circular groove 18, then a push rod 12 is rotated to drive the positioning plate 17 to rotate in the circular groove 18, the position of the semiconductor plate is limited, the problem that the position of a semiconductor of an existing dicing saw for the semiconductor clamp is not limited when the existing dicing saw for the semiconductor clamp is used is solved, once a user deviates when the dicing saw for the semiconductor clamp is placed, the semiconductor, is worthy of popularization.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A dicing saw for a semiconductor jig, comprising a body (1), characterized in that: the top of the body (1) is fixedly connected with a fixed plate (2), the rear side of the top of the fixed plate (2) is fixedly connected with a first connecting plate (3), the left side of the top of the fixed plate (2) is fixedly connected with a second connecting plate (4), the tops of the first connecting plate (3) and the second connecting plate (4) are fixedly connected with a fixed block (5), the bottom of the fixed block (5) is provided with a through hole (6), the top of the fixed block (5) is provided with a through hole (7), the bottoms of the first connecting plate (3) and the second connecting plate (4) are both provided with connecting holes (8), one side of the fixed plate (2) close to the connecting hole (8) is provided with a moving hole (9), the bottom of perforation (7) has been seted up and has been accomodate groove (10), the inner chamber swing joint of accomodating groove (10) has positioner (11), the inner chamber swing joint of perforation (7) has push rod (12).

2. The dicing saw for semiconductor jigs according to claim 1, wherein: the positioning device (11) comprises an extrusion plate (1101), a connecting rod (1102) is fixedly connected to the bottom of the extrusion plate (1101), a spring (1103) is sleeved on the surface of the connecting rod (1102), and one side, close to the extrusion plate (1101), of the push rod (12) is fixedly connected with the extrusion plate (1101).

3. The dicing saw for semiconductor jigs according to claim 2, wherein: the outer side of the extrusion plate (1101) is fixedly connected with a sliding ring (13), one side, close to the sliding ring (13), of the accommodating groove (10) is provided with a sliding groove (14) matched with the sliding ring (13) for use, and one side, close to the inner wall of the sliding groove (14), of the sliding ring (13) is in contact with the inner wall of the sliding groove (14).

4. The dicing saw for semiconductor jigs according to claim 1, wherein: the top swing joint of fixed plate (2) has limiting plate (15), first connecting plate (3) and second connecting plate (4) are close to one side of limiting plate (15) and offer spacing hole (16) with limiting plate (15) cooperation use, limiting plate (15) are close to one side of spacing hole (16) inner wall and the inner wall contact of spacing hole (16), moving hole (9) have been seted up to one side that limiting plate (15) are close to connecting hole (8).

5. The dicing saw for semiconductor jigs according to claim 2, wherein: the bottom of connecting rod (1102) passes through-hole (6) and fixedly connected with locating plate (17), circular recess (18) that use with locating plate (17) cooperation are seted up to the bottom of removal hole (9), connecting hole (8) and removal hole (9) are passed and are extended to the inner chamber of circular recess (18) to the bottom of locating plate (17).