CN213602874U - 5G high-frequency board with good radiating effect - Google Patents
5G high-frequency board with good radiating effect Download PDFInfo
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- CN213602874U CN213602874U CN202022153384.4U CN202022153384U CN213602874U CN 213602874 U CN213602874 U CN 213602874U CN 202022153384 U CN202022153384 U CN 202022153384U CN 213602874 U CN213602874 U CN 213602874U
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Abstract
The utility model discloses a 5G high-frequency plate with good heat dissipation effect, which comprises a device box and a high-frequency plate body; the first connecting groove is formed in the bottom of the device box; the heat conducting plate is fixedly connected to the inside of the first connecting groove, and the top of the heat conducting plate extends to the inside of the device box; the supporting pads are fixedly connected to the bottom of the inner surface of the device box and are positioned on the left side and the right side of the heat conducting plate; connecting block, connecting block fixed connection in the left and right sides of high frequency board body, the utility model relates to a high frequency board technical field. This 5G high frequency board with good radiating effect sets up the heat-conducting plate through the bottom at the high frequency board body, also sets up the fan at the top of device case, thereby both combined action reduce device incasement portion temperature, avoid the high frequency board body to be in high temperature environment always, cause the harm to the high frequency board body.
Description
Technical Field
The utility model relates to a high frequency board technical field specifically is a 5G high frequency board with good radiating effect.
Background
The high frequency board is a special circuit board with high electromagnetic frequency, and generally, the high frequency can be defined as a frequency above 1 GHz. The requirements on various physical properties, precision and technical parameters are very high, and the method is commonly used in the fields of automobile anti-collision systems, satellite systems, radio systems and the like.
The high frequency board is usually suppressed with FR4 glass fiber board, and it is the suppression of whole piece of epoxy glass cloth, the whole board is more even in the aspect of the colour, it is bright-colored, density is bigger than the low frequency board, general high frequency board all is used in the frequency and is the circuit more than 1G, and 5G high frequency board is at the in-process that uses, the inside heat that produces of device and self can produce more heat, the heat is difficult to scatter and disappear in the device is inside, 5G high frequency board uses in high temperature environment, cause the damage of 5G high frequency board easily.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art, the utility model provides a 5G high frequency board with good radiating effect has solved 5G high frequency board and has been in high temperature environment, the problem of easy damage.
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: A5G high-frequency board with good heat dissipation effect comprises: a device case and a high-frequency board body;
the first connecting groove is formed in the bottom of the device box;
the heat conducting plate is fixedly connected to the inside of the first connecting groove, and the top of the heat conducting plate extends to the inside of the device box;
the supporting pads are fixedly connected to the bottom of the inner surface of the device box and are positioned on the left side and the right side of the heat conducting plate;
the connecting blocks are fixedly connected to the left side and the right side of the high-frequency plate body and are positioned at the top of the supporting pad;
a fan fixedly attached to a top portion of an inner surface of the device case;
the fixed plate is fixedly connected to the top of the inner surface of the device box and is positioned on the left side and the right side of the fan;
the circular tube is fixedly connected to one side of the fixing plate and is positioned at the bottom of the fan.
Furthermore, the top of the connecting block is provided with a clamping groove.
The heat-conducting plate is arranged at the bottom of the high-frequency plate body, the fan is also arranged at the top of the device box, the fan radiates the top of the high-frequency plate body, the heat-conducting plate can transmit heat generated by other devices inside the device box and the high-frequency plate, the temperature inside the device box is reduced, the high-frequency plate body is prevented from being always in a high-temperature environment, the use of the high-frequency plate body is influenced, meanwhile, certain damage is caused to the high-frequency plate body, meanwhile, air blown out by the fan is in contact with the high-frequency plate body after being cooled by water in the clip pipe, and the heat radiation effect of the high-frequency plate.
Further, the equal fixedly connected with fixed subassembly in the left and right sides of device incasement surface, fixed subassembly is including a template and a connecting rod, the bottom of a template with the bottom fixed connection of device incasement surface, the second spread groove has been seted up to the centre at a template top of book, the left and right sides of second spread groove internal surface all communicates there is the third spread groove.
Further, the connecting rod is located the top of the template of rolling over, the bottom of connecting rod passes through the second spread groove and extends to the bottom of the template of rolling over, the bottom of connecting rod rotates and is connected with the connecting plate, the centre fixedly connected with spring of connecting plate bottom, the bottom of spring with the bottom fixed connection of device incasement surface.
Further, the surface of connecting rod just is located the top fixedly connected with kelly of connecting plate, the first fixture block of one end fixedly connected with of kelly bottom, the bottom of first fixture block extends to the inside of draw-in groove.
Furthermore, the left side and the right side of the surface of the connecting rod are fixedly connected with second clamping blocks at the tops of the clamping rods.
Through setting up fixed subassembly in the device incasement portion, block in the draw-in groove through first fixture block to carry on spacingly to the high frequency board body, guarantee the stability of high frequency board body in the device case, also make things convenient for the staff to install the high frequency board body simultaneously, avoid when installing the high frequency board body, the bolt causes the damage to the high frequency board body, influences the use of high frequency board body.
Furthermore, one end of the return pipe is fixedly connected with a connecting pipe, and one end of the connecting pipe penetrates through the fixing plate and extends to the other side of the fixing plate.
The connecting pipe is bent upwards, so that water or condensate is conveniently injected into the pipe, and the condensing effect of the pipe on gas is ensured.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) this 5G high frequency board with good radiating effect, bottom through at the high frequency board body sets up the heat-conducting plate, top at the device case also sets up the fan, the fan dispels the heat to the top of high frequency board body, and the heat-conducting plate can go out the heat transfer that other equipment of device incasement portion and high frequency board produced, thereby reduce the inside temperature of device case, avoid the high frequency board body to be in high temperature environment always, influence its use, also cause certain harm to the high frequency board body simultaneously, the wind that the fan blew off again with the high frequency board body contact after the cooling of returning shape pipe normal water simultaneously, the radiating effect to the high frequency board body is better.
(2) This 5G high frequency board with good radiating effect through set up fixed subassembly in the device incasement portion, through first fixture block card in the draw-in groove to carry on spacingly to the high frequency board body, guarantee the stability of high frequency board body in the device case, also make things convenient for the staff to install the high frequency board body simultaneously, avoid when installing the high frequency board body, the bolt causes the damage to the high frequency board body, influences the use of high frequency board body.
Drawings
FIG. 1 is a schematic view of the internal structure of the present invention;
FIG. 2 is a top view of the external structure of the hairpin tube of the present invention;
fig. 3 is a schematic view of the internal structure of the fixing assembly of the present invention;
fig. 4 is a schematic view of the external structure of the present invention.
In the figure: 1-device box, 2-high frequency plate body, 3-first connecting groove, 4-heat conducting plate, 5-supporting pad, 6-connecting block, 7-fan, 8-fixing plate, 9-returning pipe, 10-fixing component, 101-bending plate, 102-connecting rod, 103-second connecting groove, 104-third connecting groove, 105-spring, 106-clamping rod, 107-first clamping block, 108-second clamping block, 109-connecting plate, 11-connecting pipe and 12-clamping groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: A5G high-frequency board with good heat dissipation effect comprises: a device case 1 and a high-frequency board body 2;
the first connecting groove 3 is formed in the bottom of the device box 1, and the first connecting groove 3 is formed in the bottom of the device box 1;
the heat conducting plate 4 is fixedly connected inside the first connecting groove 3, and the top of the heat conducting plate 4 extends to the inside of the device box 1;
the supporting pad 5 is fixedly connected to the bottom of the inner surface of the device box 1, and the supporting pad 5 is positioned on the left side and the right side of the heat conducting plate 4;
the connecting blocks 6 are fixedly connected to the left side and the right side of the high-frequency plate body 2, and the connecting blocks 6 are positioned at the tops of the supporting pads 5;
a fan 7, wherein the fan 7 is fixedly connected to the top of the inner surface of the device box 1;
the fixing plate 8 is fixedly connected to the top of the inner surface of the device box 1, and the fixing plates 8 are positioned at the left side and the right side of the fan 7;
and the loop pipe 9, the loop pipe 9 is fixedly connected to one side of the fixed plate 8, and the loop pipe 9 is positioned at the bottom of the fan 7.
The device case 1 is a case body for mounting the high-frequency plate body 2, the first connecting groove 3 is a groove matched with the size of the heat conducting plate 4, the heat conducting plate 4 is fixed in the first connecting groove 3 through bolts, the heat conducting plate 4 is a graphite heat conducting plate, and has the advantages of high heat dissipation efficiency, small occupied space, light weight, uniform heat conduction along two directions, elimination of a 'hot spot' area and the like, the supporting pad 5 is welded at the bottom of the inner surface of the device case 1, the supporting pad 5 is strip-shaped and is respectively positioned in the device case 1 at the left side and the right side of the first connecting groove 3, the connecting blocks 6 are welded at the left side and the right side of the high-frequency plate body 2, the fan 7 is fixed at the top of the device case 1 and is positioned right above the high-frequency plate body 2, the fan 7 is connected with an external power supply through a power cord, the number of the fixing plates 8 is 2, the two, the return pipe 9 is fixed with the fixing plate 8 through a clamping piece.
The top of the connecting block 6 is provided with a clamping groove 12.
The clamping groove 12 is a groove matched with the first clamping block 107 in size, and is clamped in the clamping groove 12 through the first clamping block 107, so that the high-frequency board body 2 is fixed, and the stability of the high-frequency board body 2 is guaranteed.
The equal fixedly connected with fixed subassembly 10 in the left and right sides of device case 1 internal surface, fixed subassembly 10 is including folding board 101 and connecting rod 102, the bottom of folding board 101 with the bottom fixed connection of device case 1 internal surface, second connecting groove 103 has been seted up to the centre at folding board 101 top, the left and right sides of second connecting groove 103 internal surface all communicates with third connecting groove 104.
The number of the fixed components 10 is 2, the bottom end of the folded plate 101 is welded with the bottom of the inner surface of the device case 1, the second connecting groove 103 is a groove matched with the size of the connecting rod 102, the connecting rod 102 slides inside the second connecting groove 103, the number of the third connecting grooves 104 is 2, and the two third connecting grooves 104 are grooves matched with the size of the second clamping block 108.
The connecting rod 102 is located at the top of the folding plate 101, the bottom end of the connecting rod 102 passes through the second connecting groove 103 and extends to the bottom of the folding plate 101, the bottom end of the connecting rod 102 is rotatably connected with a connecting plate 109, a spring 105 is fixedly connected to the middle of the bottom of the connecting plate 109, and the bottom end of the spring 105 is fixedly connected with the bottom of the inner surface of the device box 1.
The connecting plate 109 is rotatably connected to the bottom end of the connecting rod 102 through a bearing, the spring 105 is a tension spring having good elasticity, and the bottom end of the spring 105 is fixed to a catch at the bottom of the inner surface of the apparatus case 1.
A clamping rod 106 is fixedly connected to the surface of the connecting rod 102 and located at the top of the connecting plate 109, a first clamping block 107 is fixedly connected to one end of the bottom of the clamping rod 106, and the bottom end of the first clamping block 107 extends into the clamping groove 12.
The second latch 108 is fixedly connected to the left and right sides of the surface of the connecting rod 102 and located on the top of the latch rod 106.
The clamping rod 106 rotates on the surface of the connecting rod 102 through a bearing, the first clamping block 107 is welded at the bottom end of the clamping rod 106, and the second clamping block 108 is welded on the surface of the connecting rod 102.
One end of the loop pipe 9 is fixedly connected with a connecting pipe 11, and one end of the connecting pipe 11 penetrates through the fixing plate 8 and extends to the other side of the fixing plate 8.
The connecting pipe 11 is welded with one end of the clip pipe 9, the connecting pipe 11 is a folding pipe, so that water can be conveniently injected into the clip pipe 9, and meanwhile, one end of the connecting pipe 11 is provided with a rubber plug to avoid water leakage.
During operation, the staff firstly pulls the connecting rod 102, pull the spring 105 upwards through the connecting rod 102, thereby make the second fixture block 108 rise to the outside of the folded plate 101 through the third connecting groove 104, then rotate the connecting rod 102, make the second fixture block 108 rotate to the position that is not aligned with the third connecting groove 104 from the position that is aligned with the third connecting groove 104, the clamping rod 106 has also carried out the rotation of direction along with the connecting rod 102 simultaneously, loosen the connecting rod 102 in hand afterwards, the joint of the second fixture block 108 is on the second connecting groove 103, the alignment carries out the position restriction.
After the fixing components 10 on the two sides are adjusted, a worker can place the high-frequency board body 2 on the two supporting pads 5 to enable the high-frequency board body 2 to be located right above the heat conducting plate 4, then the worker pulls the connecting rod 102 again and rotates the connecting rod 102 in the reverse direction, then the first clamping block 107 is rotated to be located above the clamping groove 12, meanwhile, the second clamping block 108 is also moved to be aligned with the third connecting groove 104, then the connecting rod 102 in the hand can be loosened, the spring 105 which is always in a stretching state needs to recover deformation, so that the connecting rod 102 is pulled downwards, the first clamping block 107 is clamped in the clamping groove 12 and is clamped in the clamping groove 12 through the first clamping block 107, the high-frequency board body 2 is limited, the stability of the high-frequency board body 2 in the device box 1 is ensured, meanwhile, the worker can conveniently install the high-frequency board body 2, and when the high-frequency board body 2 is installed, the bolt damages the high-frequency plate body 2 and influences the use of the high-frequency plate body 2.
In the process of using at high frequency plate body 2, heat that heat-conducting plate 4 produced the heat that high frequency plate body 2 produced and the inside other devices of device case 1 produced is derived, dispels the heat to device case 1 inside and high frequency plate body 2, avoids high frequency plate body 2 to be in high temperature environment always, influences its use, also causes certain harm to high frequency plate body 2 simultaneously.
Simultaneously fan 7 is also working, blows wind downwards, wind contacts with the top of high frequency board body 2 after the cooling of returning venturi tube 9 normal water to dispel the heat to high frequency board body 2, guarantee high frequency board body 2 normal work, use after a period, when the staff overhauls the equipment in the device case 1, can open the rubber buffer inside connecting pipe 11, then pour into water or condensate into returning venturi tube 9, guarantee the cooling effect to the wind that fan 7 blew off.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A5G high-frequency board with good heat dissipation effect, characterized by comprising: a device case and a high-frequency board body;
the first connecting groove is formed in the bottom of the device box;
the heat conducting plate is fixedly connected to the inside of the first connecting groove, and the top of the heat conducting plate extends to the inside of the device box;
the supporting pads are fixedly connected to the bottom of the inner surface of the device box and are positioned on the left side and the right side of the heat conducting plate;
the connecting blocks are fixedly connected to the left side and the right side of the high-frequency plate body and are positioned at the top of the supporting pad;
a fan fixedly attached to a top portion of an inner surface of the device case;
the fixed plate is fixedly connected to the top of the inner surface of the device box and is positioned on the left side and the right side of the fan;
the circular tube is fixedly connected to one side of the fixing plate and is positioned at the bottom of the fan.
2. The 5G high-frequency board with good heat dissipation effect of claim 1, wherein: the top of the connecting block is provided with a clamping groove.
3. The 5G high-frequency board with good heat dissipation effect of claim 1, wherein: the equal fixedly connected with fixed subassembly in the left and right sides of device incasement surface, fixed subassembly is including roll over template and connecting rod, roll over the bottom of template with the bottom fixed connection of device incasement surface, the second spread groove has been seted up to the centre at roll over template top, the left and right sides of second spread groove internal surface all communicates there is the third spread groove.
4. A 5G high-frequency board with good heat dissipation effect according to claim 3, wherein: the connecting rod is located the top of the template of rolling over, the bottom of connecting rod is passed through the second spread groove just extends to the bottom of the template of rolling over, the bottom of connecting rod is rotated and is connected with the connecting plate, the middle fixedly connected with spring of connecting plate bottom, the bottom of spring with the bottom fixed connection of device incasement surface.
5. The 5G high-frequency board with good heat dissipation effect of claim 4, wherein: the surface of connecting rod just is located the top fixedly connected with kelly of connecting plate, the first fixture block of one end fixedly connected with of kelly bottom, the bottom of first fixture block extends to the inside of draw-in groove.
6. The 5G high-frequency board with good heat dissipation effect of claim 5, wherein: the left side and the right side of the surface of the connecting rod are located on the top of the clamping rod, and a second clamping block is fixedly connected to the top of the clamping rod.
7. The 5G high-frequency board with good heat dissipation effect of claim 1, wherein: one end of the return pipe is fixedly connected with a connecting pipe, and one end of the connecting pipe penetrates through the fixing plate and extends to the other side of the fixing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022153384.4U CN213602874U (en) | 2020-09-27 | 2020-09-27 | 5G high-frequency board with good radiating effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022153384.4U CN213602874U (en) | 2020-09-27 | 2020-09-27 | 5G high-frequency board with good radiating effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213602874U true CN213602874U (en) | 2021-07-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022153384.4U Active CN213602874U (en) | 2020-09-27 | 2020-09-27 | 5G high-frequency board with good radiating effect |
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| Country | Link |
|---|---|
| CN (1) | CN213602874U (en) |
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2020
- 2020-09-27 CN CN202022153384.4U patent/CN213602874U/en active Active
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