CN216414759U - Intelligent electronic semiconductor device for high power consumption - Google Patents
Intelligent electronic semiconductor device for high power consumption Download PDFInfo
- Publication number
- CN216414759U CN216414759U CN202122321070.5U CN202122321070U CN216414759U CN 216414759 U CN216414759 U CN 216414759U CN 202122321070 U CN202122321070 U CN 202122321070U CN 216414759 U CN216414759 U CN 216414759U
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- CN
- China
- Prior art keywords
- mounting box
- universal ball
- power consumption
- semiconductor refrigeration
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 58
- 238000005057 refrigeration Methods 0.000 claims abstract description 27
- 239000002184 metal Substances 0.000 claims description 13
- 238000000605 extraction Methods 0.000 claims description 8
- 238000001816 cooling Methods 0.000 abstract description 9
- 230000000149 penetrating effect Effects 0.000 abstract description 2
- 230000033228 biological regulation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 206010010904 Convulsion Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000036461 convulsion Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an intelligent electronic high-power semiconductor device, which comprises a mounting box, semiconductor refrigeration sheets, an L-shaped clamping plate, a guide rod, a tension spring and a universal ball, wherein the semiconductor refrigeration sheets are embedded and installed on one side of the mounting box, the periphery of each semiconductor refrigeration sheet is fixedly installed and connected with the mounting box through a bolt, a heat exchange groove corresponding to a heat conducting end of each semiconductor refrigeration sheet is arranged on one side of the mounting box in a penetrating mode, a suction fan is embedded and installed on the other side of the mounting box, an air inlet end of the suction fan is located in the heat exchange groove, and the L-shaped clamping plate is oppositely arranged on one side of the top and one side of the bottom of the mounting box. The semiconductor device for the whole intelligent electronic high power consumption is stable and efficient in use, can help personnel to carry out rapid cooling treatment on intelligent electronic equipment in high power consumption operation, can carry out multi-angle supporting and adjusting on the electronic equipment, enables the personnel to be separated from both hands, is more convenient to use the electronic equipment, and has higher practicability.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to an intelligent electronic high-power semiconductor device.
Background
With the development of technology, semiconductors have a crucial operation in various industries, and semiconductor cooling plates are also used in various electronic devices due to their small size and stable cooling characteristics, so as to maintain the stability of the electronic devices.
The conventional semiconductor refrigerating sheet is generally used in large and precise electronic equipment, is not well applicable when facing electronic equipment such as a smart phone, a smart tablet or a PSP which is newly developed at present, and when the electronic equipment such as the smart phone, the smart tablet or the PSP is subjected to large-scale application operation, the electronic equipment generates large heat, so that the working stability of the electronic equipment is greatly influenced, and a good heat-dissipation and efficient semiconductor device is lacked. Therefore, a semiconductor device for intelligent electronic high power consumption is proposed.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a semiconductor device for high power consumption of intelligent electronic devices, which can effectively solve the problems of the related art.
In order to achieve the purpose, the utility model adopts the technical scheme that:
the utility model provides an intelligence electron semiconductor device for high-power consumption, includes mounting box, semiconductor refrigeration piece and L type splint, still includes guide bar, tension spring and universal ball, mounting box one side inlays to establish and installs the semiconductor refrigeration piece, the semiconductor refrigeration piece periphery is connected through bolt and mounting box fixed mounting, one side runs through in the mounting box and sets up the heat transfer groove that corresponds with semiconductor refrigeration piece heat conduction end, the mounting box opposite side inlays to establish and installs the extraction fan, the air inlet end of extraction fan is located the heat transfer inslot, mounting box top and bottom one side are equipped with L type splint in opposite directions.
Furthermore, the back of the L-shaped clamping plate is provided with a guide rod through a bolt, the top and the bottom of each of the two ends of the mounting box are respectively provided with a rod hole corresponding to the guide rod, the end part of the guide rod is respectively inserted into and connected with the rod hole at the corresponding position, the guide rod is sleeved with a tension spring, and the two ends of the tension spring are respectively connected with the guide rod and the mounting box in a welded manner.
Further, the mounting box opposite side just is located and installs first universal ball cover through the bolt between the extraction fan, the mounting box bottom is equipped with the clip, the universal ball cover of second is installed through the bolt in the top of clip, be equipped with metal forming hose between mounting box and the clip, universal ball is installed through the bolt respectively at metal forming hose both ends, metal forming hose both ends are connected through universal ball and first universal ball cover and the universal ball cover joint of second respectively.
Furthermore, the top of one side of the mounting box is provided with a storage battery through a bolt, and the output end of the storage battery is electrically connected with the input end of the exhaust fan and the input end of the semiconductor refrigeration piece through a conducting wire.
Compared with the prior art, the utility model has the following beneficial effects:
1. when the device is used, a person places the back of the intelligent electronic equipment with high power consumption and needing cooling on one side of the semiconductor refrigerating sheet, clamps the side edges of the top and the bottom of the electronic equipment through the L-shaped clamping plates at the top and the bottom of the mounting box, and utilizes the pull back of the tension spring to enable the L-shaped clamping plates to clamp and connect the electronic equipment and the mounting box so as to enable the electronic equipment to be attached and connected with the semiconductor refrigerating sheet on the mounting box, the refrigeration end of the semiconductor refrigeration piece is enabled to realize cooling treatment on the electronic equipment.
2. The heat release end through the semiconductor refrigeration piece is in the inside heat exchange groove to release heat and handle, after the exhaust fan carries out convulsions operation to the heat exchange inslot, make outside air discharge outside by the exhaust fan through the heat exchange groove fast, make the inside quick circulation of air of heat exchange groove, make the heat release end of semiconductor refrigeration piece realize quick heat transfer and handle, it is better to electronic equipment's cooling effect to help the semiconductor refrigeration piece, make the electronic equipment of high-power consumption in service safety and stability more in use.
3. Through the buckling deformation of metal forming hose, adjust the use angle of mounting box, through universal ball with correspond first universal ball cover and the connection of the universal ball cover of second, the realization is further rotated the regulation to the use angle of clip and mounting box, make personnel can break away from both hands, use electronic equipment, the convenience of greatly increased use, whole intelligent electron semiconductor device for the high-power consumption uses stably high-efficient, can help personnel to carry out rapid cooling to the intelligent electronic equipment in the high-power consumption operation and handle, and can carry out the multi-angle to electronic equipment and support the regulation, make personnel can break away from both hands, more convenient use electronic equipment, higher practicality has.
Drawings
Fig. 1 is a schematic diagram of an overall structure of an intelligent electronic high-power semiconductor device according to the present invention.
Fig. 2 is a schematic diagram of a back structure of a mounting box of an intelligent electronic high-power semiconductor device according to the present invention.
Fig. 3 is an enlarged schematic view of the semiconductor device for high power consumption of an intelligent electronic device according to the present invention shown in fig. 1A.
In the figure: 1. mounting a box; 2. a semiconductor refrigeration sheet; 3. an exhaust fan; 4. a heat exchange tank; 5. an L-shaped splint; 6. a rod hole; 7. a guide bar; 8. a tension spring; 9. a clip; 11. a first universal ball sleeve; 12. a second universal ball sleeve; 13. a metal sizing hose; 14. a universal ball; 15. and (4) a storage battery.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.
As shown in fig. 1-3, an intelligent electronic semiconductor device for high power consumption comprises a mounting box 1, a semiconductor refrigeration piece 2 and an L-shaped clamping plate 5, and further comprises a guide rod 7, a tension spring 8 and a universal ball 14, wherein the semiconductor refrigeration piece 2 is installed on one side of the mounting box 1 in an embedded manner, the periphery of the semiconductor refrigeration piece 2 is fixedly installed and connected with the mounting box 1 through a bolt, a heat exchange groove 4 corresponding to the heat conducting end of the semiconductor refrigeration piece 2 is formed in the mounting box 1 in a penetrating manner, a fan 3 is installed on the other side of the mounting box 1 in an embedded manner, the air inlet end of the fan 3 is located in the heat exchange groove 4, and the L-shaped clamping plate 5 is oppositely arranged on one side of the top and the bottom of the mounting box 1.
The back of each L-shaped clamping plate 5 is provided with a guide rod 7 through a bolt, the top and the bottom of each of two ends of each mounting box 1 are respectively provided with a rod hole 6 corresponding to each guide rod 7, the end part of each guide rod 7 is respectively inserted and connected with the corresponding rod hole 6, each guide rod 7 is sleeved with a tension spring 8, and two ends of each tension spring 8 are respectively welded and connected with each guide rod 7 and each mounting box 1; the personnel realize the guiding treatment to the drawing direction of the L-shaped splint 5 through the guide rod 7.
The fan fixing structure comprises a mounting box 1, an extraction fan 3, a first universal ball sleeve 11, a clamp 9, a second universal ball sleeve 12, a metal shaping hose 13, universal balls 14 and universal balls 14, wherein the first universal ball sleeve 11 is mounted on the other side of the mounting box 1 and located between the extraction fan 3 through bolts; the universal ball 14 is connected with the corresponding first universal ball sleeve 11 and the second universal ball sleeve 12, so that the use angle of the clamp 9 and the mounting box 1 can be further rotationally adjusted.
The top of one side of the mounting box 1 is provided with a storage battery 15 through a bolt, and the output end of the storage battery 15 is electrically connected with the suction fan 3 and the input end of the semiconductor refrigeration piece 2 through a lead; the working power supply is provided for the exhaust fan 3 and the semiconductor refrigerating sheet 2 by the personnel through the storage battery 15.
It should be noted that, the utility model is an intelligent electronic high-power consumption semiconductor device, when working, a person clamps the electronic equipment required to be cooled due to high power consumption through a clamping assembly composed of an L-shaped clamping plate 5, a guide rod 7 and a tension spring 8, the electronic equipment is cooled through an assembly composed of a semiconductor refrigeration sheet 2 and a suction fan 3, the whole semiconductor device is supported through an assembly composed of a clamp 9, a metal shaping hose 13, a universal ball 14, a first universal ball sleeve 11 and a second universal ball sleeve 12, when in use, the person places the back of the intelligent electronic equipment required to be cooled due to high power consumption at one side of the semiconductor refrigeration sheet 2, clamps the top and bottom sides of the electronic equipment through the L-shaped clamping plates 5 at the top and bottom of the mounting box 1, and utilizes the tension spring 8 to pull back, the L-shaped clamp plate 5 is used for clamping and connecting the electronic equipment and the mounting box 1, the electronic equipment is attached and connected with the semiconductor refrigerating sheet 2 on the mounting box 1, the refrigerating end of the semiconductor refrigerating sheet 2 is used for cooling the electronic equipment, the heat releasing end of the semiconductor refrigerating sheet 2 is used for heat releasing treatment in the heat exchange groove 4, the exhaust fan 3 is used for exhausting air in the heat exchange groove 4, external air is quickly exhausted from the exhaust fan 3 through the heat exchange groove 4, air in the heat exchange groove 4 is quickly circulated, the heat releasing end of the semiconductor refrigerating sheet 2 is used for quickly heat exchanging treatment, the cooling effect of the semiconductor refrigerating sheet 2 on the electronic equipment is better, the electronic equipment with high power consumption in work is safer and more stable in use, and when in use, a person can clamp and support the mounting box 1 by using the clamp 9 and the metal shaping hose 13, during the support, the personnel press from both sides clip 9 and locate on the support body or the table that need support, utilize universal ball 14 and first universal ball cover 11 and the connection of second universal ball cover 12 of metal forming hose 13, make clip 9 support mounting box 1, the buckling deformation of personnel's accessible metal forming hose 13, adjust the use angle of mounting box 1, through universal ball 14 and the connection that corresponds first universal ball cover 11 and second universal ball cover 12, the realization is advanced further rotation regulation to the use angle of clip 9 and mounting box 1, make personnel can break away from both hands, use electronic equipment, greatly increased convenience of use.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (4)
1. The utility model provides an intelligence electron semiconductor device for high-power consumption, includes mounting box (1), semiconductor refrigeration piece (2) and L type splint (5), its characterized in that still includes guide bar (7), tension spring (8) and universal ball (14), mounting box (1) one side is inlayed and is established and install semiconductor refrigeration piece (2), semiconductor refrigeration piece (2) periphery is connected with mounting box (1) fixed mounting through the bolt, one side runs through in mounting box (1) and sets up heat transfer groove (4) that lead the hot junction and correspond with semiconductor refrigeration piece (2), mounting box (1) opposite side is inlayed and is established and install extraction fan (3), the air inlet end of extraction fan (3) is located heat transfer groove (4), mounting box (1) top and bottom one side are equipped with L type splint (5) in opposite directions.
2. An intelligent electronic high power consumption semiconductor device, according to claim 1, wherein: l type splint (5) back all installs guide bar (7) through the bolt, pole hole (6) that correspond with guide bar (7) are seted up respectively to the top and the bottom at mounting box (1) both ends, guide bar (7) tip is inserted respectively with pole hole (6) that correspond the position and is established the connection, the cover is equipped with tension spring (8) on guide bar (7), tension spring (8) both ends respectively with guide bar (7) and mounting box (1) welded connection.
3. An intelligent electronic high power consumption semiconductor device, according to claim 1, wherein: install first universal ball cover (11) through the bolt between mounting box (1) opposite side and being located extraction fan (3), mounting box (1) bottom is equipped with clip (9), the universal ball cover of second (12) is installed through the bolt in the top of clip (9), be equipped with metal design hose (13) between mounting box (1) and clip (9), universal ball (14) are installed through the bolt respectively at metal design hose (13) both ends, metal design hose (13) both ends are connected through universal ball (14) and first universal ball cover (11) and the universal ball cover of second (12) joint respectively.
4. An intelligent electronic high power consumption semiconductor device, according to claim 1, wherein: the top of one side of the mounting box (1) is provided with a storage battery (15) through a bolt, and the output end of the storage battery (15) is electrically connected with the input ends of the exhaust fan (3) and the semiconductor refrigeration piece (2) through a wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122321070.5U CN216414759U (en) | 2021-09-24 | 2021-09-24 | Intelligent electronic semiconductor device for high power consumption |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122321070.5U CN216414759U (en) | 2021-09-24 | 2021-09-24 | Intelligent electronic semiconductor device for high power consumption |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216414759U true CN216414759U (en) | 2022-04-29 |
Family
ID=81294561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122321070.5U Expired - Fee Related CN216414759U (en) | 2021-09-24 | 2021-09-24 | Intelligent electronic semiconductor device for high power consumption |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216414759U (en) |
-
2021
- 2021-09-24 CN CN202122321070.5U patent/CN216414759U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221111 Address after: Floor 1, No. 99 Shunhe Street, Huayang Street, Tianfu New District, Chengdu, Sichuan 610000 Patentee after: Chengdu Xingchen Xinhai Enterprise Management Partnership (L.P.) Address before: 610000 No. 16, floor 4, unit 3, building 35, No. 96, xiangheli, Chenghua District, Chengdu, Sichuan Patentee before: Wang Xihong |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220429 |