CN213601635U - Composite conductive film - Google Patents
Composite conductive film Download PDFInfo
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- CN213601635U CN213601635U CN202022217672.1U CN202022217672U CN213601635U CN 213601635 U CN213601635 U CN 213601635U CN 202022217672 U CN202022217672 U CN 202022217672U CN 213601635 U CN213601635 U CN 213601635U
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Abstract
The utility model discloses a composite conductive film, composite conductive film includes the insulating layer, sets up in the first enhancement layer and the second enhancement layer of insulating layer both sides, sets up respectively in first metal level and the second metal level of first enhancement layer and second enhancement layer one side through-hole, fill that run through the setting on insulating layer, first enhancement layer, second enhancement layer, first metal level and the second metal level in conducting material in the through-hole, gained conductive film have flexibility good, tensile strength is high, characteristics that electric conductivity is high, buckle 180 with 1cm bending radius, it can buckle and be greater than 300 times, the electric conductivity is not less than 300, the electric conductivity7×104s/m, tensile strength not less than 75 MPa.
Description
Technical Field
The application relates to the technical field of films, in particular to a composite conductive film.
Background
With the continuous development of social informatization degree and the continuous improvement of living standard of people, electronic products are increasingly and widely appeared in the life of people, and thus higher requirements on energy density, conductivity and safety of electronic devices and energy storage devices contained in the electronic devices are provided.
Currently, the mainstream solution to the above problems is to use a polymer-based conductive film to replace the conventional conductive material, which has achieved significant results. However, the composite conductive film in the prior art has the defects of poor conductivity, low tensile strength, weak adhesion of the metal layer, reduced stability of the conductive film and the like. Therefore, many improvements are still needed to obtain conductive films with high tensile strength, good conductivity, light weight and small thickness.
Based on this, we present the application.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problem, an object of the present invention is to provide a composite conductive film, which includes: the insulating layer, set up first enhancement layer and second enhancement layer in the insulating layer both sides, set up first metal layer and second metal layer in first enhancement layer and second enhancement layer one side respectively on insulating layer, first enhancement layer, second enhancement layer, first metal layer and second metal layer run through the through-hole that sets up and fill in the conducting material in the through-hole.
Further, the insulating layer is a composite film of an organic material and an inorganic material, the organic material comprises more than one of polypropylene, polyethylene terephthalate, polyimide and polystyrene, and the inorganic material comprises more than one of carbon fiber, zinc oxide, nano aluminum powder and carbon black.
Further, the enhancement layer is made of Zn, Ni and SnOr more than one metal coating film of SiC or Si3N4、Al2O3At least one kind of non-metal plating film.
Further, the metal layer comprises at least one of Ni, Ti, Cu, Cr, W, Mo, Al, Mg, K, Na, Ca, Ge, Sb and Zn.
Further, the aperture of the through holes is 1-100 μm, and the average hole density of the through holes is 1/cm2-500/cm2。
Further, the conductive material includes at least one of a metal conductive material and a carbon-based conductive material, the metal conductive material includes at least one of aluminum, copper, nickel, titanium, nickel-copper alloy and aluminum-zirconium alloy, and the carbon-based conductive material includes at least one of graphite, acetylene black, graphene and carbon nanotubes.
The preparation method of the composite conductive film comprises the following steps:
1) preparation of organic/inorganic composite film
Uniformly mixing an organic material and an inorganic material, performing extrusion casting and cold roll rolling in a hot-melt state, and performing biaxial tension to obtain an organic/inorganic composite film;
2) preparation of conductive film
S1, when the plating layer is a metal oxide: firstly, placing a winding drum plastic film on a film coating machine, sealing a vacuum chamber, vacuumizing, then heating an evaporation boat by a heating electrode to realize premelting of metal, carrying out corona treatment on the surface of the plastic film to be coated after premelting is finished, then carrying out efficient film coating on the two sides of the plastic film by vacuum evaporation in a reciprocating manner under the condition of introducing oxygen, adjusting the unwinding speed and the winding speed, and combining evaporated metal steam and oxygen to form a non-metal oxide layer, namely a bonding force enhancement layer, on the moving film;
or when the plating layer is metal: firstly, placing a winding drum plastic film on a film coating machine, sealing a vacuum chamber, vacuumizing, then heating an evaporation boat by a heating electrode to realize premelting of metal, carrying out corona treatment on the surface of the plastic film to be coated after premelting is finished, then carrying out reciprocating high-efficiency film coating on the two surfaces of the plastic film by utilizing vacuum evaporation, adjusting the unwinding speed and the winding speed, and forming a metal layer, namely an adhesion enhancement layer, on the moving film by evaporated metal steam, wherein the purity is more than or equal to 99.9%;
s2, placing the aluminum oxide-plated film obtained in the step S1 into a vacuum chamber of a double-sided reciprocating evaporation coating machine, sealing the vacuum chamber, vacuumizing, heating metal with the purity of more than or equal to 99.9% in an evaporation mode, adjusting the unwinding speed, the winding speed and the evaporation amount, continuously melting and evaporating the metal on the surface of an evaporation boat, and forming a metal-plated layer, namely a metal coating, on the surface of a moving film;
s3, finally, punching holes on the surface of the composite conductive film by high-energy laser, wherein the hole diameter is 1-50 mu m, and the hole density is 1-100 holes/cm2The holes are uniformly distributed on the surface of the whole composite conductive film, and the holes are filled with a conductive layer to be used as a conductive material.
Further, the parameter range of the evaporation process is as follows: deposition voltage range: 4-10V; deposition oxygen partial pressure range: 1000-; wire feeding amount range: 60-350 mm/min; vacuum range: 8X 10-4-5×10-2mba; the running speed of the film: 3-10 m/s.
Another object of the present invention is to provide a method for preparing the composite conductive film, comprising the following steps:
1) preparation of organic/inorganic composite film
Uniformly mixing an organic material and an inorganic material, performing extrusion casting and cold roll rolling in a hot-melt state, and performing biaxial tension to obtain an organic/inorganic composite film;
2) preparation of conductive film
S1, when the plating layer is a metal oxide: firstly, placing a winding drum plastic film on a film coating machine, sealing a vacuum chamber, vacuumizing, then heating an evaporation boat by a heating electrode to realize premelting of metal, carrying out corona treatment on the surface of the plastic film to be coated after premelting is finished, then carrying out efficient film coating on the two sides of the plastic film by vacuum evaporation in a reciprocating manner under the condition of introducing oxygen, adjusting the unwinding speed and the winding speed, and combining evaporated metal steam and oxygen to form a non-metal oxide layer, namely a bonding force enhancement layer, on the moving film;
or when the plating layer is metal: firstly, placing a winding drum plastic film on a film coating machine, sealing a vacuum chamber, vacuumizing, then heating an evaporation boat by a heating electrode to realize premelting of metal, carrying out corona treatment on the surface of the plastic film to be coated after premelting is finished, then carrying out reciprocating high-efficiency film coating on the two surfaces of the plastic film by utilizing vacuum evaporation, adjusting the unwinding speed and the winding speed, and forming a metal layer, namely an adhesion enhancement layer, on the moving film by evaporated metal steam, wherein the purity is more than or equal to 99.9%;
s2, placing the aluminum oxide-plated film obtained in the step S1 into a vacuum chamber of a double-sided reciprocating evaporation coating machine, sealing the vacuum chamber, vacuumizing, heating metal with the purity of more than or equal to 99.9% in an evaporation mode, adjusting the unwinding speed, the winding speed and the evaporation amount, continuously melting and evaporating the metal on the surface of an evaporation boat, and forming a metal-plated layer, namely a metal coating, on the surface of a moving film;
s3, finally, punching holes on the surface of the composite conductive film by high-energy laser, wherein the hole diameter is 1-50 mu m, and the hole density is 1-100 holes/cm2The holes are uniformly distributed on the surface of the whole composite conductive film, and meanwhile, the holes are filled with a conductive layer to be used as a conductive material;
further, the parameter range of the evaporation process is as follows: deposition voltage range: 4-10V; deposition oxygen partial pressure range: 1000-; wire feeding amount range: 60-350 mm/min; vacuum range: 8X 10-4-5×10-2mba; the running speed of the film: 3-10 m/s.
The utility model discloses a set up the through-hole on conductive film uniquely to unexpected discovery this conductive film's pore structure increase can make the electric conductivity of conductive film constantly improve, guarantees that the electrode positive and negative is even as an organic whole, improves the multiplying power performance of electrode, based on the utility model discloses unique system is with conductive film's aperture control for 1-50 mu m, and hole density control is 1-100/cm2It is preferable.
The utility model discloses beneficial effect for prior art is: the insulating layer is an organic/inorganic composite film, the composite material is provided with the reinforcing layer, and the through holes are filled with the conductive material, so that the insulating layer has the characteristics of good flexibility, high tensile strength and high conductivity, and the conductivity and the tensile strength of the substrate can be further improved after the substrate is plated with the ultrathin conductive metal layer and the through holes are filled with the conductive material. Meanwhile, the preparation method has the characteristics of simplicity, low cost and easiness in large-scale production. The porous structure of the conductive film can also ensure that the front and the back of the electrode are connected into a whole, and the multiplying power performance of the electrode is improved.
Based on the technical scheme of the utility model the compound pole piece that obtains is buckled 180 with 1cm bending radius, and it can buckle and be greater than 300, the conductivity is not less than 7 x 104s/m, tensile strength not less than 75 MPa.
Drawings
FIG. 1 is a schematic view of a pole piece structure of a conductive film of the present invention
1-insulating layer, 2-first reinforcing layer, 3-second reinforcing layer, 4-first metal layer, 5-second metal layer, 6-via hole
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It will be understood by those skilled in the art that the foregoing is merely a preferred embodiment of the present invention, and is not intended to limit the invention to the particular forms disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.
Example 1
A high-conductivity composite conductive film comprises an insulating layer, a first enhancement layer and a second enhancement layer which are arranged on two sides of the insulating layer, a first metal layer and a second metal layer which are respectively arranged on one side of the first enhancement layer and one side of the second enhancement layer, through holes which are arranged on the insulating layer, the first enhancement layer, the second enhancement layer, the first metal layer and the second metal layer in a penetrating mode, and conductive materials filled in the through holes, wherein the insulating layer is a polyethylene terephthalate and 25 wt% carbon fiber composite film, and the second enhancement layer is made of polyethylene terephthalate and 25 wt% carbon fiber composite filmOne enhancement layer and the second enhancement layer are Al2O3And the first metal layer and the second metal are Al metal layers.
The preparation method of the composite conductive film comprises the following steps:
1. preparation of organic/inorganic composite film
The organic/inorganic composite membrane is obtained by uniformly mixing polyethylene terephthalate and 25 wt% of carbon fiber, extruding and casting in a hot melting state, rolling by a cold roller and stretching in two directions.
2. Preparation of conductive film
S1, firstly, placing a wound roll plastic film on a film coating machine, sealing a vacuum chamber, and gradually vacuumizing until the vacuum degree reaches 8.0 multiplied by 10-4mba, then heating the evaporation boat by a heating electrode to realize the pre-melting of the aluminum wire, after the pre-melting is finished, carrying out corona treatment on the surface of the plastic film to be coated, then carrying out double-sided reciprocating high-efficiency coating on the plastic film by vacuum evaporation under the condition of introducing oxygen, wherein the purity is more than or equal to 99.9 percent, the unwinding speed and the winding speed are adjusted, and the evaporated aluminum steam and the oxygen are combined on the moving film to form an aluminum oxide coating layer, namely an adhesion enhancement layer;
s2, placing the aluminum oxide film plated obtained in the step S1 into a vacuum chamber of a double-sided reciprocating evaporation film plating machine, sealing the vacuum chamber, and vacuumizing step by step until the vacuum degree reaches 8.0 multiplied by 10-4mba, heating aluminum with the purity of more than or equal to 99.9% in an evaporation mode, adjusting the unwinding speed, the winding speed and the evaporation capacity, continuously melting and evaporating the aluminum on the surface of an evaporation boat, and forming an aluminum plating layer with the thickness of 1 mu m on the surface of a moving film, namely an aluminum metal plating layer;
s3, finally, punching holes on the surface of the composite conductive film by high-energy laser, wherein the hole diameter is 20 mu m, and the hole density is 3/cm2The holes are uniformly distributed on the surface of the whole composite conductive film, and the holes are filled with a conductive layer to be used as a conductive material.
The prepared flexible porous conductive film is bent by 180 degrees at a bending radius of 1cm, can be bent for more than 300 times, and has the conductivity of about 7.2 multiplied by 104s/m, tensile strength about 96 MPa.
Example 2
The same procedure was followed as in example 1, except that in example 1, S3 had a pore density of 5 pores/cm2。
The prepared flexible porous conductive film is bent by 180 degrees at a bending radius of 1cm, can be bent for more than 300 times, and has the conductivity of about 7.4 multiplied by 104s/m, tensile strength of about 94 MPa.
Example 3
The same procedure was followed as in example 1, except that in example 1, S3 had a pore density of 25 pores/cm2。
The prepared flexible porous conductive film is bent by 180 degrees at the bending radius of 1cm, can be bent for more than 300 times and has the conductivity of about 8.1 multiplied by 104s/m, tensile strength of about 78 MPa.
Example 4
In the same manner as in example 1, except for changing the step of vacuum deposition of aluminum layer for S2 in example 1 to 0.5 μm of copper metal by vacuum deposition.
The prepared flexible porous conductive film is bent by 180 degrees at a bending radius of 1cm, can be bent for more than 300 times, and has the conductivity of about 7 multiplied by 104s/m, tensile strength of about 94 MPa.
Example 6
The same procedure was followed as in example 1, except that in example 6, S3 had a pore size of 25 μm.
The prepared flexible porous conductive film is bent by 180 degrees at a bending radius of 1cm, can be bent for more than 300 times, and has the conductivity of about 7.4 multiplied by 104s/m, tensile strength of about 92 MPa.
Example 7
The same procedure was followed as in example 1, except that in example 6, S3 had a pore size of 50 μm.
The prepared flexible porous conductive film is bent by 180 degrees at a bending radius of 1cm, can be bent for more than 300 times, and has the conductivity of about 7.8 multiplied by 104s/m, tensile strength of about 87 MPa.
Comparative example 1
In the same manner as in example 1, except for proceeding to step S3, punching was not performed.
The prepared flexible porous conductive film is bent by 180 degrees at a bending radius of 1cm, can be bent for more than 300 times, and has the conductivity of about 6.5 multiplied by 104s/m, tensile strength of about 97 MPa.
Comparative example 2
In the same manner as in example 1, except for proceeding to step S1, the reinforcing layer was not evaporated.
The prepared flexible porous conductive film is bent by 180 degrees at a bending radius of 1cm, can be bent for more than 300 times, and has the conductivity of about 7.2 multiplied by 104s/m, tensile strength of about 68 MPa.
Claims (3)
1. A composite conductive film characterized by: the composite conductive film comprises an insulating layer, a first enhancement layer and a second enhancement layer which are arranged on two sides of the insulating layer, a first metal layer and a second metal layer which are respectively arranged on one side of the first enhancement layer and one side of the second enhancement layer, through holes which are arranged on the insulating layer, the first enhancement layer, the second enhancement layer, the first metal layer and the second metal layer in a penetrating mode and conductive materials filled in the through holes, wherein the insulating layer is a polyethylene glycol terephthalate and 25 wt% carbon fiber composite film, and the first enhancement layer and the second enhancement layer are Al2O3And the first metal layer and the second metal are Al metal layers.
2. The composite conductive film according to claim 1, wherein: the aperture of the through holes is 1-100 μm, and the average hole density of the through holes is 1/cm2-500/cm2。
3. The composite conductive film according to claim 1, wherein: the aperture of the through holes is 1-50 μm, and the average hole density of the through holes is 1-100/cm2。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022217672.1U CN213601635U (en) | 2020-09-30 | 2020-09-30 | Composite conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022217672.1U CN213601635U (en) | 2020-09-30 | 2020-09-30 | Composite conductive film |
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| Publication Number | Publication Date |
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| CN213601635U true CN213601635U (en) | 2021-07-02 |
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| CN202022217672.1U Active CN213601635U (en) | 2020-09-30 | 2020-09-30 | Composite conductive film |
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Effective date of registration: 20211008 Address after: 314406 area B, building 1, No. 6, Xinhe Road, Xieqiao Town, Haining City, Jiaxing City, Zhejiang Province Patentee after: Zhejiang rouzhen Technology Co.,Ltd. Address before: Building 2, No.6 Xinhe Road, Xieqiao Town, Haining City, Jiaxing City, Zhejiang Province (Changhai Industrial Park) Patentee before: ZHEJIANG CHANGYU NEW MATERIALS Co.,Ltd. |
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