CN213593532U - Glue feeding mechanism of flip-chip die - Google Patents
Glue feeding mechanism of flip-chip die Download PDFInfo
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- CN213593532U CN213593532U CN202022490965.7U CN202022490965U CN213593532U CN 213593532 U CN213593532 U CN 213593532U CN 202022490965 U CN202022490965 U CN 202022490965U CN 213593532 U CN213593532 U CN 213593532U
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Abstract
The utility model relates to an injection mold technical field specifically discloses flip-chip mould advance gluey mechanism, including front mould benevolence and back mould, be equipped with runner plate mold insert on the back mould, be equipped with into the mouth of gluing on the runner plate mold insert, the one side of advancing the mouth of gluing is equipped with rather than the gluey runner of advancing of intercommunication, is equipped with thin mouth of a river runner in front mould benevolence and the back mould, the one end and the mouth of advancing the mouth of a river runner intercommunication, the opposite side of thin mouth of a river runner is equipped with thin mouth of a river and glues the mouth, and the lower extreme of front mould benevolence is equipped with the position of moulding plastics that is used for placing the product, and thin mouth of. The utility model discloses simple structure, convenient to use advance jiao kou department and be a whole, when guaranteeing the shaping, advance the temperature of jiao kou department unanimously, prevent appearance problems such as arch or sunken, advance gluey through adopting thin water gap, injection pressure when effectively reducing the product shaping avoids the product simultaneously because of advancing gluey production runner vestige.
Description
Technical Field
The utility model relates to an injection mold technical field, concretely relates to flip-chip mould advance gluey mechanism.
Background
With the development of the mobile phone industry, mobile phone products become thinner and thinner, and the requirement of part of thin-wall products is difficult to meet by the common mold structure nowadays. For thin-walled products, such as mobile phone battery covers, in order to avoid influencing the appearance of the products, the glue inlet of the mold with a common structure is composed of a plurality of parts, temperature differences exist among the parts, the thermoplastic material is sensitive to the temperature, and when the products are molded, the appearance problems such as bulges or depressions are caused by overlarge temperature differences.
Disclosure of Invention
To the defect of above-mentioned prior art, the utility model provides a flip-chip mould advance gluey mechanism, simple structure, convenient to use advance jiao kou and be a whole, when guaranteeing the shaping, advance the temperature unanimity of jiao kou department, prevent appearance problems such as arch or sunken, advance gluey through adopting thin water gap, injection pressure when effectively reducing the product shaping avoids the product simultaneously because of advancing gluey production runner vestige.
In order to achieve the above object, the utility model adopts the following technical scheme:
flip-chip mould advance gluey mechanism, including front mould benevolence and back mould, be equipped with runner plate mold insert on the back mould, be equipped with into jiao kou on the runner plate mold insert, the one side of advancing jiao kou is equipped with rather than the entering gluey runner of intercommunication, be equipped with thin mouth of a river runner in front mould benevolence and the back mould, the one end and the entering jiao kou intercommunication of thin mouth of a river runner, the opposite side of thin mouth of a river runner is equipped with thin mouth of a river and glues mouthful, the lower extreme of front mould benevolence is equipped with the position of moulding plastics that is used for placing the product, thin mouth of a river glues the.
In the above description, it is preferable that the rear mold is provided with a mounting groove for mounting the runner plate insert, and the runner plate insert is detachably mounted to the rear mold by a screw.
The utility model discloses produced beneficial effect is: the rear die is provided with a runner plate insert which is provided with a glue inlet, one side of the glue inlet is provided with a glue inlet runner communicated with the glue inlet, and the glue inlet is an integral body, so that the temperature at the glue inlet is ensured to be consistent during molding, and appearance problems such as protrusion or depression are prevented; one end of the thin water gap flow channel is communicated with the glue inlet, the other side of the thin water gap flow channel is provided with the thin water gap glue inlet, and the thin water gap glue inlet is adopted, so that the injection molding pressure during product molding can be effectively reduced, and the phenomenon that one side of a product is subjected to pouring gate marks due to glue inlet is avoided.
Drawings
FIG. 1: is a schematic cross-sectional structure diagram of an embodiment of the present invention;
the attached drawings indicate the following: 10-front mold core, 20-rear mold, 21-runner plate insert, 22-glue inlet, 23-glue inlet runner, 24-fine water gap runner, 25-fine water gap glue inlet and 30-product.
Detailed Description
To more clearly illustrate the structural features and technical means of the present invention and the specific objects and functions achieved thereby, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments:
in this embodiment: as shown in fig. 1, the glue feeding mechanism of the flip-chip mold comprises a front mold core 10 and a rear mold 20, a runner plate insert 21 is arranged on the rear mold 20, a mounting groove for mounting the runner plate insert 21 is formed in the rear mold 20, the runner plate insert 21 is detachably mounted on the rear mold 20 through screws, a glue feeding port 22 is formed in the runner plate insert 21, a glue feeding runner 23 communicated with the glue feeding port 22 is formed in one side of the glue feeding port 22, a water gap runner 24 is formed in the front mold core 10 and the rear mold 20, one end of the water gap runner 24 is communicated with the glue feeding port 22, a water gap glue port 25 is formed in the other side of the water gap runner 24, an injection molding position for placing a product 30 is formed in the lower end of the front mold core 10, and the water gap glue port 25 penetrates through the lower surface of the front mold core 10 and.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, so any modifications, equivalent replacements, improvements, etc. made to the above embodiments by the technology of the present invention are all within the scope of the technical solution of the present invention.
Claims (2)
1. Flip-chip mould advance gluey mechanism, including front mould benevolence and back mould, its characterized in that: the back mould is equipped with runner plate mold insert, is equipped with into jiao kou on the runner plate mold insert, advances one side of jiao kou to be equipped with rather than the gluey runner of advancing that communicates, is equipped with thin mouth of a river runner in front mould benevolence and the back mould, and the one end of thin mouth of a river runner communicates with advancing jiao kou, and the opposite side of thin mouth of a river runner is equipped with thin mouth of a river and glues the mouth, and the lower extreme of front mould benevolence is equipped with the position of moulding plastics that is used for placing the product, and thin mouth of a river glues the lower surface.
2. The glue feeding mechanism of the flip-chip mold according to claim 1, characterized in that: the back mould is provided with a mounting groove for mounting the runner plate insert, and the runner plate insert is detachably mounted on the back mould through screws.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022490965.7U CN213593532U (en) | 2020-11-02 | 2020-11-02 | Glue feeding mechanism of flip-chip die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022490965.7U CN213593532U (en) | 2020-11-02 | 2020-11-02 | Glue feeding mechanism of flip-chip die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213593532U true CN213593532U (en) | 2021-07-02 |
Family
ID=76594619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022490965.7U Active CN213593532U (en) | 2020-11-02 | 2020-11-02 | Glue feeding mechanism of flip-chip die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213593532U (en) |
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2020
- 2020-11-02 CN CN202022490965.7U patent/CN213593532U/en active Active
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