CN213583783U

CN213583783U - Photoelectric integrated LED lamp bead packaging structure

Info

Publication number: CN213583783U
Application number: CN202022040376.9U
Authority: CN
Inventors: 李国琪
Original assignee: Shenzhen Fangjing Technology Co ltd
Current assignee: Shenzhen Fangjing Technology Co ltd
Priority date: 2020-09-17
Filing date: 2020-09-17
Publication date: 2021-06-29
Anticipated expiration: 2030-09-17

Abstract

The utility model discloses a photoelectric integrated LED lamp bead packaging structure, which comprises a substrate, wherein a first surface of the substrate and a second surface opposite to the first surface are both provided with a conductive layer, and the conductive layer on the first surface is electrically connected with the conductive layer on the second surface; the conducting layer on the first surface is electrically connected with an electrode of a control chip; the conducting layer on the second surface is electrically connected with an LED light-emitting chip; the two insulation covers are respectively covered on the first surface and the second surface, a metal layer is fixed on the outer side surface of the insulation cover covered on the first surface, and the metal layer is electrically connected with the conducting layer on the first surface. The utility model discloses encapsulate control chip and luminescence chip respectively, utilize a plurality of conducting material to connect the two electricity, compact structure is small, and is with low costs.

Description

Photoelectric integrated LED lamp bead packaging structure

Technical Field

The utility model relates to a LED lamp pearl encapsulation specifically is a photoelectric integration LED lamp pearl packaging structure.

Background

The LED lamp bead packaging is the packaging of a light-emitting chip and a control chip, in the packaging method used at present, the LED lamp bead in the prior art is only packaged with the light-emitting chip, the packaging is not provided with an integrated control chip, the packaged lamp bead and the control chip are assembled in an application circuit only in the using process of the lamp bead, and the LED lamp bead is controlled through an external control chip. The scheme of the external control chip has large volume, loose structure, long assembly process and high cost.

SUMMERY OF THE UTILITY MODEL

For solving the defect of above-mentioned prior art, the utility model provides a photoelectric integration LED lamp pearl packaging structure, the utility model discloses encapsulate control chip and luminescence chip respectively, utilize a plurality of conducting material to connect the two electricity, compact structure, it is small, with low costs.

In order to achieve the technical purpose, the utility model adopts the following technical scheme: photoelectric integrated LED lamp bead packaging structure, include

The conductive layer on the first surface is electrically connected with the conductive layer on the second surface;

the conducting layer on the first surface is electrically connected with an electrode of a control chip; the conducting layer on the second surface is electrically connected with an LED light-emitting chip;

the two insulation covers are respectively covered on the first surface and the second surface, a metal layer is fixed on the outer side surface of the insulation cover covered on the first surface, and the metal layer is electrically connected with the conducting layer on the first surface.

Furthermore, a lower conductive layer is fixed to each of two ends of the first surface, and an upper conductive layer is fixed to each of two ends of the second surface.

Further, the cross-sectional length of the upper conductive layer is greater than the cross-sectional length of the lower conductive layer.

Furthermore, first through holes are respectively formed in the two ends of the substrate along the thickness direction of the substrate, first connecting columns are arranged in the first through holes, and the lower conducting layer and the upper conducting layer at the same end are electrically connected through the first connecting columns.

Furthermore, first conducting strips are fixed on the two lower conducting layers, and the electrodes of the control chip are fixed on the two first conducting strips.

Furthermore, a first insulating cover is fixed on the first surface, the first insulating cover covers the control chip, second through holes are formed in two ends of the first insulating cover, a second connecting column is arranged in each second through hole, and the second connecting column enables the metal layer at the same end to be electrically connected with the lower conducting layer.

Furthermore, second conducting strips are fixed on the two upper conducting layers, and the LED light-emitting chips are fixed on the two second conducting strips.

Furthermore, a second insulating cover is fixed on the second surface and covers the LED light-emitting chip.

A photoelectric integrated LED lamp bead packaging method further comprises the following steps,

providing a substrate;

manufacturing conducting layers on the front side and the back side of the substrate respectively, and filling conducting substances into the conducting layers on the front side and the back side to connect the conducting layers, wherein the first through hole is formed in the substrate;

fixedly connecting electrodes of a control chip on the back conductive layer of the substrate through a conductive material;

wrapping the back surface of the substrate by using an insulating substance, and arranging a metal layer on the insulating substance, wherein holes are punched in the insulating substance and a conductive material is filled in the holes to lead out the electrodes of the control chip to the metal layer;

fixedly connecting an LED light-emitting chip on the front conductive layer of the substrate through a conductive bonding material;

and the front surface of the substrate is wrapped by an insulating substance.

To sum up, the utility model discloses following technological effect has been gained:

1. the utility model is provided with the first connecting post made of conductive material on the base plate, and electrically connects the two conductive layers on the front and back sides, and the first connecting post is arranged in the base plate, thus occupying no extra space and having smaller submission;

2. the utility model fixes the electrode of the control chip on the lower conductive layer through the conductive material, electrically connects the LED light-emitting chip through the lower conductive layer, the first connecting column and the upper conductive layer, and pulls the electrode of the control chip to the outside of the whole packaging structure through the transition of the lower conductive layer, so that the whole electric connection is firm and the stability is strong;

3. the utility model discloses fix the insulating boot on the reverse side of base plate, wear to establish the second spliced pole on the insulating boot, the second spliced pole is worn to establish inside the insulating boot, saves volume, can utilize the second spliced pole to draw the electrode of control chip outside the insulating boot simultaneously, is connected with the fixed electricity of metal level, realizes the external connection of control chip;

4. the control chip and the light-emitting chip are packaged together to form an integral structure, so that the LED lamp is more convenient to install and use, smaller in integral volume, compact in structure, short in assembly process and low in cost.

Drawings

Fig. 1 is a schematic cross-sectional view of a package structure provided in an embodiment of the present invention;

FIG. 2 is a front perspective view of the package;

fig. 3 is a schematic diagram of the packaging step.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment without inventive contribution as required after reading the present specification, but all of them are protected by patent laws within the scope of the claims of the present invention.

Example (b):

as shown in figure 1, a photoelectric integrated LED lamp bead packaging structure comprises

The circuit board comprises a substrate 1, wherein a first surface and a second surface opposite to the first surface of the substrate 1 are respectively provided with a conductive layer; specifically, two ends of the first surface are respectively fixed with a lower conductive layer 3, and two ends of the second surface are respectively fixed with an upper conductive layer 2, wherein in this embodiment, the sectional length of the upper conductive layer 2 is greater than the sectional length of the lower conductive layer 3, that is, the distance between the two lower conductive layers 3 is greater, which is convenient for fixing the electrode of the control chip 4, and the distance between the two upper conductive layers 2 is smaller, which is convenient for fixing the LED light emitting chip 11.

Still further, the conductive layer on the first side is electrically connected with the conductive layer on the second side. Namely, the two ends of the substrate 1 are respectively provided with a first through hole along the thickness direction thereof, a first connecting column 8 is arranged in the first through hole, the first connecting column 8 is a conductive substance, the first connecting column 8 electrically connects the lower conductive layer 3 and the upper conductive layer 2 at the same end, and the control chip 4 and the LED light-emitting chip 11 are electrically connected.

The conductive layer on the first surface is electrically connected with the electrode 5 of the control chip 4; specifically, the control chip 4 is an electrical parameter control chip, the two lower conductive layers 3 are both fixed with first conductive sheets 6, and the electrodes 5 of the control chip 4 are fixed on the two first conductive sheets 6, so that the control chip 4 is electrically connected with the LED light-emitting chip 11 through the first conductive sheets 6, the lower conductive layers 3 and the first connecting column 8.

The conducting layer on the second surface is electrically connected with the LED light-emitting chip 11; specifically, the two upper conductive layers 2 are fixed with second conductive sheets 12, and the LED light emitting chips 11 are fixed on the two second conductive sheets 12 and electrically connected to the control chip 4 through the second conductive sheets 12, the upper conductive layers 2 and the first connecting posts 8.

And the two insulating covers are respectively covered on the first surface and the second surface, a metal layer 10 is fixed on the outer side surface of the insulating cover covered on the first surface, and the metal layer 10 is electrically connected with the conducting layer on the first surface.

Specifically, be fixed with first insulating boot 7 on the first face, first insulating boot 7 covers control chip 4 and establishes, and the second through-hole has all been seted up at the both ends of first insulating boot 7, is equipped with second spliced pole 9 in the second through-hole, and second spliced pole 9 is conducting material, and second spliced pole 9 is connected the metal level 10 with one end with conducting layer 3 electricity down to draw the electrode of control chip 4 to the insulating boot outside. And a second insulating cover 13 is fixed on the second surface, the LED light-emitting chip 11 is covered by the second insulating cover 13, and the second insulating cover 13 is made of a light-transmitting insulating material.

In another embodiment, a method for packaging a photoelectric integrated LED lamp bead is provided, as shown in fig. 2, IC die bonding → plastic package leveling → grinding laser drilling → filling laser hole → bottom pad front RGB die bonding → silica gel film pressing.

Specifically, as shown in fig. 3, the method includes the steps of,

(1) providing a substrate 1, wherein the substrate 1 is an insulating material, as shown in (1) of fig. 3;

(2) respectively manufacturing conductive layers on the front side and the back side of the substrate 1, and filling the conductive layers on the front side and the back side with a conductive substance through a first through hole for connection, wherein the first through hole is formed in the substrate 1; specifically, the front surface corresponds to the second surface, the back surface corresponds to the first surface, and the first through hole is filled with a conductive material so as to electrically connect the upper conductive layer 2 and the lower conductive layer 3, as shown in (2) in fig. 3;

(3) fixedly connecting electrodes of a control chip on a back conductive layer of the substrate 1 through a conductive material; specifically, the electrode 5 of the control chip 4 is fixed on the first conductive sheet 6, and the first conductive sheet 6 is fixed on the lower conductive layer 3, as shown in (3) in fig. 3;

(4) wrapping the back surface of the substrate 1 with an insulating material; and a metal layer is arranged on the insulating substance, wherein the insulating substance is perforated and filled with a conductive material to lead out the electrodes of the control chip to the metal layer, as shown in (4), (5) and (6) of FIG. 3;

(5) fixedly connecting an LED light-emitting chip on the front conductive layer of the substrate 1 through a conductive adhesive material, as shown in (7) in FIG. 3;

(6) the front surface of the substrate 1 is covered with an insulating material, as shown in (8) of fig. 3.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and all the modifications and equivalents of the technical spirit of the present invention to any simple modifications of the above embodiments are within the scope of the technical solution of the present invention.

Claims

1. The utility model provides a photoelectric integration LED lamp pearl packaging structure which characterized in that: comprises that

The circuit board comprises a substrate (1), wherein a first surface and a second surface opposite to the first surface of the substrate (1) are respectively provided with a conductive layer, and the conductive layer on the first surface is electrically connected with the conductive layer on the second surface;

the conducting layer on the first surface is electrically connected with an electrode (5) of a control chip (4); the conducting layer on the second surface is electrically connected with an LED light-emitting chip (11);

the two insulation covers are respectively covered on the first face and the second face, a metal layer (10) is fixed on the outer side face of the insulation cover covered on the first face, and the metal layer (10) is electrically connected with the conducting layer on the first face.

2. The optoelectronic integrated LED lamp bead packaging structure of claim 1, wherein: and two lower conductive layers (3) are respectively fixed at two ends of the first surface, and an upper conductive layer (2) is respectively fixed at two ends of the second surface.

3. The photoelectric integrated LED lamp bead packaging structure of claim 2, wherein: the cross-sectional length of the upper conductive layer (2) is greater than that of the lower conductive layer (3).

4. The optoelectronic integration LED lamp bead packaging structure of claim 3, characterized in that: first through holes are respectively formed in the two ends of the substrate (1) along the thickness direction of the substrate, first connecting columns (8) are arranged in the first through holes, and the first connecting columns (8) are used for electrically connecting the lower conducting layer (3) and the upper conducting layer (2) at the same end.

5. The optoelectronic integration LED lamp bead packaging structure of claim 4, characterized in that: first conducting strips (6) are fixed on the two lower conducting layers (3), and the electrodes (5) of the control chip (4) are fixed on the two first conducting strips (6).

6. The photoelectric integrated LED lamp bead packaging structure of claim 5, wherein: be fixed with first insulating boot (7) on the first face, first insulating boot (7) will control chip (4) cover is established, the second through-hole has all been seted up at the both ends of first insulating boot (7), be equipped with second spliced pole (9) in the second through-hole, second spliced pole (9) will be with one end metal level (10) with conducting layer (3) electricity is connected down.

7. The optoelectronic integration LED lamp bead packaging structure of claim 4, characterized in that: second conducting strips (12) are fixed on the two upper conducting layers (2), and the LED light-emitting chips (11) are fixed on the two second conducting strips (12).

8. The optoelectronic integrated LED lamp bead packaging structure of claim 7, wherein: and a second insulating cover (13) is fixed on the second surface, and the LED light-emitting chip (11) is covered by the second insulating cover (13).