CN108389953B - LED light-emitting device and manufacturing method thereof - Google Patents

LED light-emitting device and manufacturing method thereof Download PDF

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Publication number
CN108389953B
CN108389953B CN201810180177.2A CN201810180177A CN108389953B CN 108389953 B CN108389953 B CN 108389953B CN 201810180177 A CN201810180177 A CN 201810180177A CN 108389953 B CN108389953 B CN 108389953B
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grooves
electrode
transparent substrate
led chips
fluorescent colloid
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CN108389953A (en
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董秀玲
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Shenzhen jinxinsheng Technology Co., Ltd.
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Shenzhen Jinxinsheng Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Abstract

The invention provides an LED light-emitting device and a manufacturing method thereof, wherein a plurality of vertically distributed LED chips are used for emitting light in all angles (360-degree light emission), and compared with the traditional planar arrangement of the LED chips, the LED light-emitting device is more compact, saves space and can achieve better packaging effect; the fluorescent resin containing the laser activated metal complex is used for activation wiring, so that the flexibility and the variability are realized, and the requirement of routing is avoided; the multilayer fluorescent colloid realizes wider color gamut and can realize the effect of light mixing at all angles.

Description

LED light-emitting device and manufacturing method thereof
Technical Field
The invention relates to the field of LED packaging, in particular to an LED light-emitting device and a manufacturing method thereof.
Background
The conventional LED is mostly packaged in a COB form, the surface of a chip of the LED is parallel to the surface of a substrate, full-angle light emitting is not easy to realize, and the packaged plane has a large size, so that the packaging colloid is not beneficial to saving.
Disclosure of Invention
In order to solve the above problems, the present invention provides a method for manufacturing an LED light emitting device, including the steps of:
(1) providing a first transparent substrate, wherein a first transparent conducting layer and a plurality of first grooves which are uniformly distributed are arranged on the upper surface of the first transparent substrate;
(2) providing a plurality of flaky LED chips, wherein each LED chip comprises an electrode surface with a first electrode and a second electrode and a light-emitting surface opposite to the electrode surface, inserting one ends of the plurality of LED chips into the plurality of first grooves respectively, enabling the plurality of LED chips to be just vertically clamped into the plurality of first grooves due to the fact that the thickness of the plurality of LED chips is the same as the width of the plurality of first grooves, exposing one part of the first electrode out of the plurality of first grooves, and electrically connecting the first electrode with the first transparent conductive layer through a plurality of first welding balls;
(3) providing a second transparent substrate which has the same structure as the first transparent substrate, wherein a second transparent conducting layer and a plurality of second grooves which are uniformly distributed are arranged on the lower surface of the second transparent substrate;
(4) inserting the other ends of the plurality of LED chips into the plurality of second grooves respectively, wherein the thickness of the plurality of LED chips is the same as the width of the plurality of second grooves, so that the plurality of LED chips are just vertically clamped into the plurality of second grooves, a part of the second electrode is exposed out of the plurality of second grooves, and the second electrode and the second transparent conductive layer are electrically connected by a plurality of second welding balls;
(5) welding a first leading-out terminal and a second leading-out terminal at the tail end of the first transparent conductive layer and the tail end of the second transparent conductive layer;
(6) and filling a fluorescent colloid between the first transparent substrate and the second transparent substrate, curing, and sealing by using a plastic package colloid to expose only a part of the first leading-out terminal and the second leading-out terminal.
According to an embodiment of the present invention, the specific method for filling the fluorescent colloid in the step (6) includes: first fluorescent colloid is arranged on the first transparent substrate and solidified, then second fluorescent colloid is arranged between the first fluorescent colloid and the second transparent substrate and solidified, and the emission wavelengths of the first fluorescent colloid and the second fluorescent colloid are different.
According to an embodiment of the present invention, the specific method for filling the fluorescent colloid in the step (6) includes: and filling a third fluorescent colloid and a fourth fluorescent colloid with different emission wavelengths on the electrode surface and the light-emitting surface of the same LED chip.
The invention also provides another manufacturing method of the LED light-emitting device, which comprises the following steps:
(1) providing a first transparent substrate, wherein a first transparent conducting layer and a plurality of first grooves which are uniformly distributed are arranged on the upper surface of the first transparent substrate;
(2) providing a plurality of flaky LED chips, wherein each LED chip comprises an electrode surface with a first electrode and a second electrode and a light-emitting surface opposite to the electrode surface, inserting one ends of the plurality of LED chips into the plurality of first grooves respectively, enabling the plurality of LED chips to be just vertically clamped into the plurality of first grooves due to the fact that the thicknesses of the plurality of LED chips are the same as the widths of the plurality of first grooves, exposing one part of the first electrode out of the plurality of first grooves, electrically connecting the first electrode with the first transparent conductive layer through a plurality of first welding balls, and welding a first leading-out terminal at the tail end of the first transparent conductive layer;
(3) arranging a fluorescent colloid containing a laser activated metal complex on the first transparent substrate and among the plurality of LED chips, wherein a part of the second electrode is exposed on the upper surface of the fluorescent colloid;
(4) activating the upper surface of the fluorescent colloid by using a laser beam to form a metal activation layer, wherein the metal activation layer is embedded in the fluorescent colloid;
(5) electrically connecting the second electrode and the metal activation layer by a plurality of second solder balls, and welding the second electrode and the metal activation layer to the tail end of the metal activation layer by a second leading-out terminal;
(6) covering the fluorescent colloid, the second welding balls and the second leading-out terminals with a transparent adhesive material to form a transparent adhesive layer, wherein the upper surface of the transparent adhesive layer is lower than the end faces of the other ends of the LED chips;
(7) providing a second transparent substrate, wherein a plurality of second grooves which are uniformly distributed are arranged on the lower surface of the second transparent substrate;
(8) inserting the other ends of the LED chips into the second grooves respectively, wherein the thicknesses of the LED chips are the same as the widths of the second grooves, so that the LED chips are vertically clamped into the second grooves, and the second transparent substrate is tightly bonded with the transparent bonding layer;
(9) and sealing by using a plastic package colloid and exposing only one part of the first leading-out terminal and the second leading-out terminal.
The invention also provides an LED light-emitting device manufactured according to the method, which is characterized in that: the LED light emitting device includes:
the transparent substrate comprises a first transparent substrate and a second transparent substrate, wherein a first transparent conducting layer and a plurality of first grooves which are uniformly distributed are arranged on the upper surface of the first transparent substrate; a second transparent conducting layer and a plurality of second grooves which are uniformly distributed are arranged on the lower surface of the second transparent substrate;
a plurality of chip-shaped LED chips each including an electrode surface having a first electrode and a second electrode and a light emitting surface opposed to the electrode surface, one ends of the LED chips are respectively inserted into the first grooves, the other ends of the LED chips are respectively inserted into the second grooves, the thickness of the plurality of LED chips is the same as the width of the plurality of first grooves and the plurality of second grooves, so that the plurality of LED chips are just vertically clamped into the plurality of first grooves and the plurality of second grooves, and the plurality of first recesses expose a portion of the first electrode, the plurality of second recesses expose a portion of the second electrode, a plurality of first welding balls are used for electrically connecting the first electrode and the first transparent conducting layer, and a plurality of second welding balls are used for electrically connecting the second electrode and the second transparent conducting layer;
the first leading-out terminal and the second leading-out terminal are respectively welded at the tail end of the first transparent conductive layer and the tail end of the second transparent conductive layer;
the fluorescent colloid is filled between the first transparent substrate and the second transparent substrate;
and the plastic package colloid seals the first transparent substrate, the second transparent substrate and the fluorescent colloid and only exposes one part of the first leading-out terminal and the second leading-out terminal.
According to an embodiment of the present invention, the fluorescent colloid includes a first fluorescent colloid on the first transparent substrate and a second fluorescent colloid between the first fluorescent colloid and the second transparent substrate, and the emission wavelengths of the first fluorescent colloid and the second fluorescent colloid are different.
According to the embodiment of the invention, the electrode surface and the luminous surface of the same LED chip are filled with the third fluorescent colloid and the fourth fluorescent colloid which have different emission wavelengths.
The present invention also provides another LED light-emitting device manufactured according to the above method, characterized in that: the LED light emitting device includes:
the transparent conductive substrate comprises a first transparent substrate and a second transparent substrate, wherein a first transparent conductive layer and a plurality of uniformly distributed first grooves are arranged on the upper surface of the first transparent substrate, and a plurality of uniformly distributed second grooves are arranged on the lower surface of the second transparent substrate;
the LED chip comprises a plurality of flaky LED chips, wherein each LED chip comprises an electrode surface with a first electrode and a second electrode and a light-emitting surface opposite to the electrode surface, one ends of the LED chips are respectively inserted into the first grooves, the other ends of the LED chips are respectively inserted into the second grooves, the thicknesses of the LED chips are the same as the widths of the first grooves and the second grooves, so that the LED chips are just vertically clamped into the first grooves and the second grooves, the first grooves expose a part of the first electrode, and a plurality of first welding balls are used for electrically connecting the first electrode with the first transparent conducting layer;
the fluorescent colloid containing the laser activated metal complex is arranged on the first transparent substrate and among the plurality of LED chips, and part of the second electrode is exposed on the upper surface of the fluorescent colloid;
a metal activation layer formed by activating an upper surface of the fluorescent colloid with a laser beam, the metal activation layer being embedded in the fluorescent colloid; electrically connecting the second electrode and the metal activation layer with a plurality of second solder balls
The first leading-out terminal is welded at the tail end of the first transparent conducting layer, and the second leading-out terminal is welded at the tail end of the metal activation layer;
and the plastic package colloid seals the first transparent substrate, the second transparent substrate and the fluorescent colloid and only exposes one part of the first leading-out terminal and the second leading-out terminal.
The invention has the following advantages:
(1) the LED packaging structure utilizes the vertically distributed LED chips to carry out full-angle light emission (360-degree light emission), is more compact and saves space compared with the traditional planar LED chips, and can also achieve better packaging effect;
(2) the fluorescent resin containing the laser activated metal complex is used for activation wiring, so that the flexibility and the variability are realized, and the requirement of routing is avoided;
(3) the multilayer fluorescent colloid realizes wider color gamut and can realize the effect of light mixing at all angles.
Drawings
Fig. 1 is a schematic view of an LED light emitting device and a method of manufacturing the same of a first embodiment;
fig. 2 is a schematic view of an LED light emitting device of a second embodiment;
fig. 3 is a schematic view of an LED light-emitting device of a third embodiment;
fig. 4 is a schematic view of an LED light emitting device and a method of manufacturing the same of a fourth embodiment.
Detailed Description
First embodiment
Referring to fig. 1a to 1e, the method for manufacturing the LED light emitting device of the first embodiment includes the steps of:
(1) providing a first transparent substrate 1, wherein a first transparent conducting layer 2 and a plurality of first grooves 3 which are uniformly distributed are arranged on the upper surface of the first transparent substrate 1;
(2) providing a plurality of sheet-shaped LED chips 4, wherein each LED chip 4 comprises an electrode surface with a first electrode 5 and a second electrode 6 and a light-emitting surface opposite to the electrode surface, inserting one end of each LED chip 4 into each first groove 3, enabling the plurality of LED chips 4 to be vertically clamped into the plurality of first grooves 3 due to the fact that the thickness of each LED chip 4 is the same as the width of each first groove 3, exposing one part of each first electrode 5 from the plurality of first grooves 3, and electrically connecting the first electrodes 5 with the first transparent conductive layers 2 through a plurality of first solder balls 7;
(3) providing a second transparent substrate 8 which has the same structure as the first transparent substrate 1, wherein a second transparent conductive layer 9 and a plurality of second grooves 10 which are uniformly distributed are arranged on the lower surface of the second transparent substrate 8;
(4) inserting the other ends of the LED chips 4 into the second grooves 10, respectively, wherein the thickness of the LED chips 7 is the same as the width of the second grooves 10, so that the LED chips 4 are just vertically clamped into the second grooves 10, and the second grooves 10 expose a part of the second electrode 6, and electrically connecting the second electrode 6 and the second transparent conductive layer 9 by using second solder balls 11;
(5) welding a first leading terminal 12 and a second leading terminal 13 at the end of the first transparent conductive layer 2 and the end of the second transparent conductive layer 9;
(6) and filling a fluorescent colloid 14 between the first transparent substrate 1 and the second transparent substrate 8, curing, and sealing by using a plastic molding colloid 15 to expose only a part of the first lead-out terminal 12 and the second lead-out terminal 13.
The invention also provides an LED light-emitting device manufactured according to the method, which is characterized in that: the LED light emitting device includes:
the transparent substrate comprises a first transparent substrate and a second transparent substrate, wherein a first transparent conducting layer and a plurality of first grooves which are uniformly distributed are arranged on the upper surface of the first transparent substrate; a second transparent conducting layer and a plurality of second grooves which are uniformly distributed are arranged on the lower surface of the second transparent substrate;
a plurality of chip-shaped LED chips each including an electrode surface having a first electrode and a second electrode and a light emitting surface opposed to the electrode surface, one ends of the LED chips are respectively inserted into the first grooves, the other ends of the LED chips are respectively inserted into the second grooves, the thickness of the plurality of LED chips is the same as the width of the plurality of first grooves and the plurality of second grooves, so that the plurality of LED chips are just vertically clamped into the plurality of first grooves and the plurality of second grooves, and the plurality of first recesses expose a portion of the first electrode, the plurality of second recesses expose a portion of the second electrode, a plurality of first welding balls are used for electrically connecting the first electrode and the first transparent conducting layer, and a plurality of second welding balls are used for electrically connecting the second electrode and the second transparent conducting layer;
the first leading-out terminal and the second leading-out terminal are respectively welded at the tail end of the first transparent conductive layer and the tail end of the second transparent conductive layer;
the fluorescent colloid is filled between the first transparent substrate and the second transparent substrate;
and the plastic package colloid seals the first transparent substrate, the second transparent substrate and the fluorescent colloid and only exposes one part of the first leading-out terminal and the second leading-out terminal.
Second embodiment
Referring to fig. 2, the forming step is substantially similar to the first embodiment except that the specific method of filling the fluorescent gel in step (6) includes: first fluorescent colloid 19 is firstly arranged on the first transparent substrate 1 and is solidified, then second fluorescent colloid 20 is arranged between the first fluorescent colloid 19 and the second transparent substrate 8 and is solidified, and the emission wavelengths of the first fluorescent colloid 19 and the second fluorescent colloid 20 are different.
And the LED luminescent device manufactured according to the method, wherein the fluorescent colloid comprises a first fluorescent colloid on the first transparent substrate and a second fluorescent colloid between the first fluorescent colloid and the second transparent substrate, and the emission wavelengths of the first fluorescent colloid and the second fluorescent colloid are different.
Third embodiment
Referring to fig. 3, the forming steps are substantially similar to the first embodiment, and the specific method of filling the fluorescent colloid in the step (6) includes: and filling a third fluorescent colloid and a fourth fluorescent colloid with different emission wavelengths on the electrode surface and the light-emitting surface of the same LED chip.
And according to the LED light-emitting device manufactured by the method, the electrode surface and the light-emitting surface of the same LED chip are filled with a third fluorescent colloid and a fourth fluorescent colloid which have different emission wavelengths.
Fourth embodiment
Referring to fig. 4a-4g, the present invention also provides another method for manufacturing an LED light emitting device, which includes the steps of:
(1) providing a first transparent substrate 1, wherein a first transparent conducting layer 2 and a plurality of first grooves 3 which are uniformly distributed are arranged on the upper surface of the first transparent substrate 1;
(2) providing a plurality of sheet-shaped LED chips 4, each LED chip 4 including an electrode surface having a first electrode 5 and a second electrode 6 and a light emitting surface opposite to the electrode surface, inserting one end of each LED chip 4 into each of the first grooves 3, wherein the thickness of each LED chip 4 is the same as the width of each first groove 3, so that the LED chips 4 are just vertically clamped into the first grooves 3, the first grooves 3 expose a part of the first electrodes 5, and the first electrodes 5 and the first transparent conductive layers 2 are electrically connected by a plurality of first solder balls 7 and are welded to the ends of the first transparent conductive layers 2 by first lead-out terminals 12;
(3) a fluorescent colloid 12 containing a laser-activated metal complex is disposed on the first transparent substrate 1 and between the plurality of LED chips 4, and a part of the second electrode 6 is exposed on an upper surface of the fluorescent colloid 12;
(4) activating the upper surface of the fluorescent colloid 12 by using a laser beam 16 to form a metal activation layer 17, wherein the metal activation layer 17 is embedded in the fluorescent colloid 12;
(5) electrically connecting the second electrode 6 and the metal activation layer 17 by a plurality of second solder balls 11, and soldering the second electrode and the metal activation layer 17 to the end by a second lead-out terminal 13;
(6) forming a transparent adhesive layer 18 by covering the fluorescent colloid 12, the second solder balls 11, and the second lead terminals 13 with a transparent adhesive material 18, wherein the upper surface of the transparent adhesive layer 18 is lower than the end surface of the other end of the plurality of LED chips 4;
(7) providing a second transparent substrate 8, wherein a plurality of second grooves 10 which are uniformly distributed are arranged on the lower surface of the second transparent substrate 8;
(8) inserting the other ends of the plurality of LED chips 4 into the plurality of second grooves 10, respectively, wherein the thickness of the plurality of LED chips 4 is the same as the width of the plurality of second grooves 10, so that the plurality of LED chips 4 are just vertically clamped into the plurality of second grooves 10, and the second transparent substrate 8 is tightly bonded to the transparent adhesive layer 18;
(9) the sealing is performed by the plastic molding compound 15, and only a part of the first lead terminal 12 and the second lead terminal 13 is exposed.
The present invention also provides another LED light-emitting device manufactured according to the above method, characterized in that: the LED light emitting device includes:
the transparent conductive substrate comprises a first transparent substrate and a second transparent substrate, wherein a first transparent conductive layer and a plurality of uniformly distributed first grooves are arranged on the upper surface of the first transparent substrate, and a plurality of uniformly distributed second grooves are arranged on the lower surface of the second transparent substrate;
the LED chip comprises a plurality of flaky LED chips, wherein each LED chip comprises an electrode surface with a first electrode and a second electrode and a light-emitting surface opposite to the electrode surface, one ends of the LED chips are respectively inserted into the first grooves, the other ends of the LED chips are respectively inserted into the second grooves, the thicknesses of the LED chips are the same as the widths of the first grooves and the second grooves, so that the LED chips are just vertically clamped into the first grooves and the second grooves, the first grooves expose a part of the first electrode, and a plurality of first welding balls are used for electrically connecting the first electrode with the first transparent conducting layer;
the fluorescent colloid containing the laser activated metal complex is arranged on the first transparent substrate and among the plurality of LED chips, and part of the second electrode is exposed on the upper surface of the fluorescent colloid;
a metal activation layer formed by activating an upper surface of the fluorescent colloid with a laser beam, the metal activation layer being embedded in the fluorescent colloid; electrically connecting the second electrode and the metal activation layer with a plurality of second solder balls
The first leading-out terminal is welded at the tail end of the first transparent conducting layer, and the second leading-out terminal is welded at the tail end of the metal activation layer;
and the plastic package colloid seals the first transparent substrate, the second transparent substrate and the fluorescent colloid and only exposes one part of the first leading-out terminal and the second leading-out terminal.
Finally, it should be noted that: it should be understood that the above examples are only for clearly illustrating the present invention and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of the invention may be made without departing from the scope of the invention.

Claims (8)

1. A method of manufacturing an LED light emitting device, comprising the steps of:
(1) providing a first transparent substrate, wherein a first transparent conducting layer and a plurality of first grooves which are uniformly distributed are arranged on the upper surface of the first transparent substrate;
(2) providing a plurality of flaky LED chips, wherein each LED chip comprises an electrode surface with a first electrode and a second electrode and a light-emitting surface opposite to the electrode surface, inserting one ends of the plurality of LED chips into the plurality of first grooves respectively, enabling the plurality of LED chips to be just vertically clamped into the plurality of first grooves due to the fact that the thickness of the plurality of LED chips is the same as the width of the plurality of first grooves, exposing one part of the first electrode out of the plurality of first grooves, and electrically connecting the first electrode with the first transparent conductive layer through a plurality of first welding balls;
(3) providing a second transparent substrate which has the same structure as the first transparent substrate, wherein a second transparent conducting layer and a plurality of second grooves which are uniformly distributed are arranged on the lower surface of the second transparent substrate;
(4) inserting the other ends of the plurality of LED chips into the plurality of second grooves respectively, wherein the thickness of the plurality of LED chips is the same as the width of the plurality of second grooves, so that the plurality of LED chips are just vertically clamped into the plurality of second grooves, a part of the second electrode is exposed out of the plurality of second grooves, and the second electrode and the second transparent conductive layer are electrically connected by a plurality of second welding balls;
(5) welding a first leading-out terminal and a second leading-out terminal at the tail end of the first transparent conductive layer and the tail end of the second transparent conductive layer;
(6) and filling a fluorescent colloid between the first transparent substrate and the second transparent substrate, curing, and sealing by using a plastic package colloid to expose only a part of the first leading-out terminal and the second leading-out terminal.
2. The method of manufacturing an LED light emitting device according to claim 1, wherein: the specific method for filling the fluorescent colloid in the step (6) comprises the following steps: first fluorescent colloid is arranged on the first transparent substrate and is solidified, then second fluorescent colloid is arranged between the first fluorescent colloid and the second transparent substrate and is solidified, and the emission wavelengths of the first fluorescent colloid and the second fluorescent colloid are different.
3. The method of manufacturing an LED light emitting device according to claim 1, wherein: the specific method for filling the fluorescent colloid in the step (6) comprises the following steps: and filling a third fluorescent colloid and a fourth fluorescent colloid with different emission wavelengths on the electrode surface and the light-emitting surface of the same LED chip.
4. An LED light emitting device fabricated according to the method of claim 1, wherein: the LED light emitting device includes:
the transparent substrate comprises a first transparent substrate and a second transparent substrate, wherein a first transparent conducting layer and a plurality of first grooves which are uniformly distributed are arranged on the upper surface of the first transparent substrate; a second transparent conducting layer and a plurality of second grooves which are uniformly distributed are arranged on the lower surface of the second transparent substrate;
a plurality of chip-shaped LED chips each including an electrode surface having a first electrode and a second electrode and a light emitting surface opposed to the electrode surface, one ends of the LED chips are respectively inserted into the first grooves, the other ends of the LED chips are respectively inserted into the second grooves, the thickness of the plurality of LED chips is the same as the width of the plurality of first grooves and the plurality of second grooves, so that the plurality of LED chips are just vertically clamped into the plurality of first grooves and the plurality of second grooves, and the plurality of first recesses expose a portion of the first electrode, the plurality of second recesses expose a portion of the second electrode, a plurality of first welding balls are used for electrically connecting the first electrode and the first transparent conducting layer, and a plurality of second welding balls are used for electrically connecting the second electrode and the second transparent conducting layer;
the first leading-out terminal and the second leading-out terminal are respectively welded at the tail end of the first transparent conductive layer and the tail end of the second transparent conductive layer;
the fluorescent colloid is filled between the first transparent substrate and the second transparent substrate;
and the plastic package colloid seals the first transparent substrate, the second transparent substrate and the fluorescent colloid and only exposes one part of the first leading-out terminal and the second leading-out terminal.
5. The LED light emitting device of claim 4, wherein: the fluorescent colloid comprises a first fluorescent colloid on the first transparent substrate and a second fluorescent colloid between the first fluorescent colloid and the second transparent substrate, and the emission wavelengths of the first fluorescent colloid and the second fluorescent colloid are different.
6. The LED light emitting device of claim 4, wherein: and filling a third fluorescent colloid and a fourth fluorescent colloid with different emission wavelengths on the electrode surface and the light-emitting surface of the same LED chip.
7. A method of manufacturing an LED light emitting device, comprising the steps of:
(1) providing a first transparent substrate, wherein a first transparent conducting layer and a plurality of first grooves which are uniformly distributed are arranged on the upper surface of the first transparent substrate;
(2) providing a plurality of flaky LED chips, wherein each LED chip comprises an electrode surface with a first electrode and a second electrode and a light-emitting surface opposite to the electrode surface, inserting one ends of the plurality of LED chips into the plurality of first grooves respectively, enabling the plurality of LED chips to be just vertically clamped into the plurality of first grooves due to the fact that the thicknesses of the plurality of LED chips are the same as the widths of the plurality of first grooves, exposing one part of the first electrode out of the plurality of first grooves, electrically connecting the first electrode with the first transparent conductive layer through a plurality of first welding balls, and welding a first leading-out terminal at the tail end of the first transparent conductive layer;
(3) arranging a fluorescent colloid containing a laser activated metal complex on the first transparent substrate and among the plurality of LED chips, wherein a part of the second electrode is exposed on the upper surface of the fluorescent colloid;
(4) activating the upper surface of the fluorescent colloid by using a laser beam to form a metal activation layer, wherein the metal activation layer is embedded in the fluorescent colloid;
(5) electrically connecting the second electrode and the metal activation layer by a plurality of second solder balls, and welding the second electrode and the metal activation layer to the tail end of the metal activation layer by a second leading-out terminal;
(6) covering the fluorescent colloid, the second welding balls and the second leading-out terminals with a transparent adhesive material to form a transparent adhesive layer, wherein the upper surface of the transparent adhesive layer is lower than the end faces of the other ends of the LED chips;
(7) providing a second transparent substrate, wherein a plurality of second grooves which are uniformly distributed are arranged on the lower surface of the second transparent substrate;
(8) inserting the other ends of the LED chips into the second grooves respectively, wherein the thicknesses of the LED chips are the same as the widths of the second grooves, so that the LED chips are vertically clamped into the second grooves, and the second transparent substrate is tightly bonded with the transparent bonding layer;
(9) and sealing by using a plastic package colloid and exposing only one part of the first leading-out terminal and the second leading-out terminal.
8. An LED light emitting device fabricated according to the method of claim 7, wherein: the LED light emitting device includes:
the transparent conductive substrate comprises a first transparent substrate and a second transparent substrate, wherein a first transparent conductive layer and a plurality of uniformly distributed first grooves are arranged on the upper surface of the first transparent substrate, and a plurality of uniformly distributed second grooves are arranged on the lower surface of the second transparent substrate;
the LED chip comprises a plurality of flaky LED chips, wherein each LED chip comprises an electrode surface with a first electrode and a second electrode and a light-emitting surface opposite to the electrode surface, one ends of the LED chips are respectively inserted into the first grooves, the other ends of the LED chips are respectively inserted into the second grooves, the thicknesses of the LED chips are the same as the widths of the first grooves and the second grooves, so that the LED chips are just vertically clamped into the first grooves and the second grooves, the first grooves expose a part of the first electrode, and a plurality of first welding balls are used for electrically connecting the first electrode with the first transparent conducting layer;
the fluorescent colloid containing the laser activated metal complex is arranged on the first transparent substrate and among the plurality of LED chips, and part of the second electrode is exposed on the upper surface of the fluorescent colloid;
a metal activation layer formed by activating an upper surface of the fluorescent colloid with a laser beam, the metal activation layer being embedded in the fluorescent colloid; electrically connecting the second electrode with a first leading-out terminal and a second leading-out terminal of the metal activation layer by using a plurality of second welding balls, wherein the first leading-out terminal is welded at the tail end of the first transparent conducting layer, and the second leading-out terminal is welded at the tail end of the metal activation layer;
and the plastic package colloid seals the first transparent substrate, the second transparent substrate and the fluorescent colloid and only exposes one part of the first leading-out terminal and the second leading-out terminal.
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