CN213582069U - Computer motherboard hardware heat dissipation processing apparatus - Google Patents
Computer motherboard hardware heat dissipation processing apparatus Download PDFInfo
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- CN213582069U CN213582069U CN202023173927.5U CN202023173927U CN213582069U CN 213582069 U CN213582069 U CN 213582069U CN 202023173927 U CN202023173927 U CN 202023173927U CN 213582069 U CN213582069 U CN 213582069U
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- heat dissipation
- fixedly connected
- plate
- mounting hole
- protection box
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Abstract
The utility model discloses a computer motherboard hardware heat dissipation processing apparatus. The technical key points are as follows: including the guard box, the lateral wall fixedly connected with mounting panel of guard box perpendicular ground one side, the heat dissipation frame that can dismantle the vertical direction of being connected with in the guard box, the mainboard hardware main part of the vertical direction of heat dissipation frame fixedly connected with, the guard box is kept away from mounting panel one side and has been seted up first mounting hole, the axis perpendicular to mainboard hardware main part direction of installation of first mounting hole, fixedly connected with heat dissipation mechanism in the first mounting hole, the guard box inside wall is close to the mechanism of cooling of the vertical direction of mounting panel one side fixedly connected with, guard box inside wall fixedly connected with temperature sensor and controller, temperature sensor is connected with the controller electricity, the controller is connected with heat dissipation mechanism and the equal electricity of cooling. The utility model has the advantages that: overall structure can carry out the hierarchical heat dissipation according to particular case, strengthens heat abstractor's practicality.
Description
Technical Field
The utility model relates to a heat abstractor technical field specifically is a computer motherboard hardware heat dissipation processing apparatus.
Background
At present, a computer is an electronic computing machine for high-speed computing, can perform numerical computation and logic computation, and also has a memory function, and is a modern intelligent electronic device capable of automatically and high-speed processing mass data according to program operation. Computers have had an extremely important impact on human productivity and social activities and have been rapidly developed with great vitality. A computer motherboard is one of the most basic and important components of a computer, and main circuit systems constituting the computer are mounted on the motherboard. In order to avoid damage of computer motherboard hardware due to over-high temperature, the computer motherboard hardware needs to be subjected to heat dissipation treatment, so that heat generated by the computer motherboard hardware is quickly dissipated into the air, and the heat dissipation effect of the conventional heat dissipation device still needs to be improved.
The above prior art solution has the following drawbacks: the existing computer mainboard hardware heat dissipation processing device mostly adopts a single fan for heat dissipation, and cannot perform graded heat dissipation according to the heat dissipation condition of the computer mainboard.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model aims to provide a computer motherboard hardware heat dissipation processing apparatus, its advantage that has: the temperature sensor can monitor the temperature in the protection box in real time, and when the temperature is not high, the signal is transmitted to the controller. The controller can send an instruction to enable the heat dissipation mechanism to start the first-stage heat dissipation, and the heat dissipation mechanism can blow air, so that the air flowing speed around the main board hardware main body is increased, and the heat dissipation purpose is achieved; when the temperature sensor detects that the temperature is high, the controller controls the heat dissipation mechanism to start the second-stage heat dissipation, the heat dissipation mechanism can timely extract hot air dissipated by the main board hardware main body, meanwhile, the controller can control the cooling mechanism to start to emit cold air, and the purpose of powerful heat dissipation is achieved by matching with the heat dissipation mechanism in the second-stage heat dissipation; overall structure can carry out the hierarchical heat dissipation according to particular case, strengthens heat abstractor's practicality.
The above object of the present invention can be achieved by the following technical solutions:
the utility model provides a computer motherboard hardware heat dissipation processing apparatus, includes the guard box, the lateral wall fixedly connected with mounting panel of guard box perpendicular ground one side, the heat dissipation frame that is connected with vertical direction can be dismantled in the guard box, the mainboard hardware main part of the vertical direction of heat dissipation frame fixedly connected with, the guard box is kept away from first mounting hole has been seted up to mounting panel one side, the axis perpendicular to mainboard hardware main part installation direction of first mounting hole, fixedly connected with heat dissipation mechanism in the first mounting hole, the guard box inside wall is close to the cooling mechanism of the vertical direction of mounting panel one side fixedly connected with, guard box inside wall fixedly connected with temperature sensor and controller, temperature sensor with the controller electricity is connected, the controller with heat dissipation mechanism with the equal electricity of cooling mechanism is connected.
Through adopting above-mentioned technical scheme, the temperature sensor that sets up can real-time supervision guard box in the temperature, when the temperature is not high, gives the controller with signal transmission. The controller can send an instruction to enable the heat dissipation mechanism to start the first-stage heat dissipation, and the heat dissipation mechanism can blow air, so that the air flowing speed around the main board hardware main body is increased, and the heat dissipation purpose is achieved; when the temperature sensor detects that the temperature is high, the controller controls the heat dissipation mechanism to start the second-stage heat dissipation, the heat dissipation mechanism can timely extract hot air dissipated by the main board hardware main body, meanwhile, the controller can control the cooling mechanism to start to emit cold air, and the purpose of powerful heat dissipation is achieved by matching with the heat dissipation mechanism in the second-stage heat dissipation; overall structure can carry out the hierarchical heat dissipation according to particular case, strengthens heat abstractor's practicality.
The present invention may be further configured in a preferred embodiment as: the heat dissipation mechanism comprises a supporting plate, the supporting plate is arranged along the vertical direction, the supporting plate is connected with the protection box through a first mounting hole in a fixed mode, a connecting shaft penetrates through the supporting plate and is connected with the supporting plate in a rotating mode, the connecting shaft is close to a motor output end fixedly connected with one side of the mounting plate, a fixing plate fixedly connected with the motor shell is arranged on the outer side of the motor shell, the fixing plate is parallel to the supporting plate, the fixing plate is arranged through the first mounting hole in the protection box in a fixed mode, and the connecting shaft is kept away from a mounting plate end.
By adopting the technical scheme, the arranged heat dissipation mechanism can start the first-stage heat dissipation when the heat dissipation capacity of the main board hardware main body is not large, the motor rotates forwards, the blades rotate to form a blower to blow air in, the air flow around the main board hardware main body is accelerated, and the heat dissipation purpose is achieved; when mainboard hardware main part heat dissipation capacity is great, the motor reversal, the blade rotates, forms the air exhauster, in time takes out the hot-air that mainboard hardware main part gived off, and the lower air range of formation temperature around the cooperation cooling mechanism makes mainboard hardware main part reaches powerful radiating purpose.
The present invention may be further configured in a preferred embodiment as: the side wall of the protection box is fixedly connected with a mesh cover, and the mesh cover is arranged in the first mounting hole.
Through adopting above-mentioned technical scheme, the screen panel that sets up can play the guard action to heat dissipation mechanism, has reduced the entering volume of dust, also avoids heat dissipation mechanism working process in the blade injury past personnel simultaneously.
The present invention may be further configured in a preferred embodiment as: the cooling mechanism comprises an air cooler, an air cooler outer shell is fixedly connected to the inner side wall of the protection box, an air guide pipe is fixedly connected to the output end of the air cooler, an air guide pipe fixedly connected to an air homogenizing plate is arranged along the vertical direction, and the air homogenizing plate is fixedly connected to the inner side wall of the protection box.
Through adopting above-mentioned technical scheme, the cooling mechanism that sets up can start when the second grade heat dissipation, sends cold air through the air-cooler, carries cold air on the even gas board through the air duct, and even gas board can be with the even discharge of cold air, has avoided because the heat dissipation is inhomogeneous for the condition that the computer life shortens takes place, and the cold air of setting can fully contact with mainboard hardware main part, reaches the radiating purpose of forced cooling.
The present invention may be further configured in a preferred embodiment as: the utility model discloses a ventilation device, including guard box, ventilation frame, baffle, transmission shaft, cylinder, transmission shaft, ventilation frame, second mounting hole has been seted up in addition on the lateral wall of guard box, the guard box passes through second mounting hole fixedly connected with ventilation mechanism, ventilation mechanism is including ventilation frame, a pair of side of ventilation frame all articulates along vertical direction has a plurality of connecting pieces, and is a plurality of the equal fixedly connected with baffle of connecting piece one end, the connecting piece is kept away from baffle one end articulates there is the transmission shaft, axial fixedly connected with cylinder is followed to the transmission shaft, the cylinder is kept away from.
By adopting the technical scheme, the arranged air cylinder can drive the transmission shaft to move through expansion and contraction when heat dissipation is needed, so that the partition plate is driven to be opened, the contact area of the main hardware body of the mainboard and air is increased, and the heat dissipation effect is enhanced; also can be when mainboard hardware main part is out of work for the baffle covers the second mounting hole completely, prevents that debris such as dust from getting into the guard box inside.
The present invention may be further configured in a preferred embodiment as: the heat dissipation frame comprises a connecting plate, a plurality of ventilation holes are formed in the connecting plate, and the arrangement direction of the ventilation holes is the same as the arrangement direction of the first mounting holes.
Through adopting above-mentioned technical scheme, the ventilation hole that sets up can be conveniently when second level heat dissipation cooling mechanism starts, and the radiating effect is strengthened in the smooth passing through of cold air.
To sum up, the utility model discloses a following at least one useful technological effect:
1. the temperature in the protection box can be monitored in real time through the arranged temperature sensor, and when the temperature is not high, the signal is transmitted to the controller. The controller can send an instruction to enable the heat dissipation mechanism to start the first-stage heat dissipation, and the heat dissipation mechanism can blow air, so that the air flowing speed around the main board hardware main body is increased, and the heat dissipation purpose is achieved; when the temperature sensor detects that the temperature is high, the controller controls the heat dissipation mechanism to start the second-stage heat dissipation, the heat dissipation mechanism can timely extract hot air dissipated by the main board hardware main body, meanwhile, the controller can control the cooling mechanism to start to emit cold air, and the purpose of powerful heat dissipation is achieved by matching with the heat dissipation mechanism in the second-stage heat dissipation; overall structure can carry out the hierarchical heat dissipation according to particular case, strengthens heat abstractor's practicality.
2. The first-stage heat dissipation can be started when the heat dissipation capacity of the main board hardware main body is not large through the arranged heat dissipation mechanism, the motor rotates forwards, the blades rotate to form a blower to blow air, the air flow around the main board hardware main body is accelerated, and the heat dissipation purpose is achieved; when mainboard hardware main part heat dissipation capacity is great, the motor reversal, the blade rotates, forms the air exhauster, in time takes out the hot-air that mainboard hardware main part gived off, and the lower air range of formation temperature around the cooperation cooling mechanism makes mainboard hardware main part reaches powerful radiating purpose.
3. Can start when the second level dispels the heat through the cooling mechanism that sets up, send cold air through the air-cooler, carry even gas board with cold air through the air duct on, even gas board can be with the even discharge of cold air, has avoided because the heat dissipation is inhomogeneous for the condition that computer life shortens takes place, and the cold air of setting can fully contact with mainboard hardware main part, reaches the radiating purpose of forced cooling.
Drawings
FIG. 1 is an overall structure of the present invention;
FIG. 2 is a first perspective structural view of the vent mechanism;
FIG. 3 is a cross-sectional view taken at A-A in FIG. 1;
fig. 4 is a second perspective view structural view of the ventilation mechanism.
Reference numerals: 1. a protection box; 2. mounting a plate; 3. a heat dissipation frame; 31. a connecting plate; 32. a vent hole; 4. a main board hardware body; 5. a first mounting hole; 6. a heat dissipation mechanism; 61. a support plate; 62. a connecting shaft; 63. a motor; 64. a fixing plate; 65. a blade; 7. a cooling mechanism; 71. an air cooler; 72. an air duct; 73. a gas homogenizing plate; 8. a temperature sensor; 9. a controller; 10. a mesh enclosure; 11. a second mounting hole; 12. a ventilation mechanism; 121. a ventilation frame; 122. a connecting member; 123. a partition plate; 124. a drive shaft; 125. and a cylinder.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in FIG. 1 and FIG. 3, the heat dissipation device for computer motherboard hardware disclosed by the present invention comprises a protection box 1, wherein the protection box 1 is fixedly connected with a mounting plate 2 perpendicular to the outer side wall of one side of the ground surface, the fixing connection mode is through bolt connection, and is convenient for disassembly and maintenance, a heat dissipation frame 3 in the vertical direction is detachably connected in the protection box 1, the heat dissipation frame 3 is matched with a motherboard hardware main body 4 to meet the ventilation requirement, the heat dissipation frame 3 is fixedly connected with a motherboard hardware main body 4 in the vertical direction, a first mounting hole 5 is formed on the side of the protection box 1 away from the mounting plate 2, the axis of the first mounting hole 5 is perpendicular to the mounting direction of the motherboard hardware main body 4, a heat dissipation mechanism 6 is fixedly connected in the first mounting hole 5, the heat dissipation mechanism 6 can realize two working modes of blowing and exhausting, the fixing connection mode, the maintenance can conveniently be dismantled, 1 inside wall of guard box is close to cooling mechanism 7 of 2 one side fixedly connected with vertical directions of mounting panel, 1 inside wall fixedly connected with temperature sensor 8 of guard box and controller 9, controller 9 can control cooling mechanism 7 and carry out hierarchical control to heat dissipation mechanism 6 according to the temperature of 8 transmissions of temperature sensor, temperature sensor 8 is connected with controller 9 electricity, controller 9 is connected with heat dissipation mechanism 6 and the equal electricity of cooling mechanism 7.
As shown in fig. 1, the heat dissipation mechanism 6 includes a supporting plate 61, the supporting plate 61 is arranged along the vertical direction, the supporting plate 61 is fixedly connected to the protection box 1 through a first mounting hole 5, the supporting plate 61 is connected with a connecting shaft 62 in a penetrating manner and in a rotating manner, the connecting shaft 62 is close to the output end of a motor 63 fixedly connected to one side of the mounting plate 2, the motor 63 can rotate forward and backward, corresponding rotation can be performed according to different working modes, a fixing plate 64 is fixedly connected to the outer shell of the motor 63, the fixing plate 64 does not affect normal air flow, the fixing plate 64 is arranged in parallel to the supporting plate 61, the fixing plate 64 is fixedly connected to the protection box 1 through the first mounting hole 5, a pot cover of the mounting plate 2 is far away from the connecting shaft 62, and a blade 65 is.
As shown in fig. 1, cooling mechanism 7 includes air-cooler 71, air-cooler 71 satisfy the cooling needs can, air-cooler 71 shell body fixed connection is in guard box 1 inside wall, air-cooler 71 output end fixed connection has air duct 72, air duct 72 fixedly connected with even gas plate 73, even gas plate 73 can be with the even sending of cold air that air-cooler 71 blew out for cold air is even in mainboard hardware main part 4 contact, even gas plate 73 is vertical to be set up, even gas plate 73 fixed connection is in guard box 1 inside wall.
As shown in fig. 2, second mounting hole 11 has additionally been seted up on the lateral wall of guard box 1, guard box 1 passes through 11 fixedly connected with ventilation mechanism 12 of second mounting hole, as shown in fig. 4, ventilation mechanism 12 is including ventilation frame 121, a pair of side of ventilation frame 121 all articulates along vertical direction has a plurality of connecting pieces 122, the specific quantity of connecting piece 122 does not have the requirement, with baffle 123 phase-match can, the equal fixedly connected with baffle 123 of a plurality of connecting pieces 122 one end, baffle 123 can cover second mounting hole 11 completely when satisfying the tiling, connecting piece 122 keeps away from that baffle 123 one end articulates has transmission shaft 124, transmission shaft 124 is along axial fixedly connected with cylinder 125, transmission shaft 124 and ventilation frame 121 fixed connection are kept away from to cylinder 125.
The implementation principle of the embodiment is as follows: the temperature sensor 8 is arranged to monitor the temperature in the protection box 1 in real time and transmit a signal to the controller 9 when the temperature is not high. The controller 9 will send out an instruction to enable the heat dissipation mechanism 6 to start the first-stage heat dissipation, and the heat dissipation mechanism 6 will blow air, so as to accelerate the air flow speed around the main board hardware body 4 and achieve the purpose of heat dissipation; when the temperature sensor 8 detects that the temperature is high, the controller 9 controls the heat dissipation mechanism 6 to start the second-stage heat dissipation, the heat dissipation mechanism 6 can timely extract hot air dissipated by the main board hardware body 4, meanwhile, the controller 9 controls the cooling mechanism 7 to start to emit cold air, and the purpose of powerful heat dissipation is achieved by matching with the heat dissipation mechanism 6 in the second-stage heat dissipation; overall structure can carry out the hierarchical heat dissipation according to particular case, strengthens heat abstractor's practicality.
The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.
Claims (6)
1. A computer mainboard hardware heat dissipation processing device comprises a protection box (1), wherein the outer side wall of the protection box (1) perpendicular to one side of the ground is fixedly connected with a mounting plate (2), and the computer mainboard hardware heat dissipation processing device is characterized in that a heat dissipation frame (3) in the vertical direction is detachably connected in the protection box (1), a mainboard hardware main body (4) in the vertical direction is fixedly connected to one side of the heat dissipation frame (3), a first mounting hole (5) is formed in one side of the protection box (1) far away from the mounting plate (2), the axis of the first mounting hole (5) is perpendicular to the mounting direction of the mainboard hardware main body (4), a heat dissipation mechanism (6) is fixedly connected in the first mounting hole (5), the inner side wall of the protection box (1) is close to a cooling mechanism (7) in the vertical direction fixedly connected to one side of the mounting plate (2), a temperature sensor (8) and a controller (9) are fixedly connected, the temperature sensor (8) is electrically connected with the controller (9), and the controller (9) is electrically connected with the heat dissipation mechanism (6) and the cooling mechanism (7).
2. The heat dissipation processing device for computer motherboard hardware as recited in claim 1, the heat dissipation mechanism (6) comprises a support plate (61), the support plate (61) is arranged along the vertical direction, the supporting plate (61) is fixedly connected to the protective box (1) through the first mounting hole (5), a connecting shaft (62) is penetratingly and rotatably connected to the supporting plate (61), one side of the connecting shaft (62) close to the mounting plate (2) is fixedly connected with an output end of a motor (63), a fixing plate (64) is fixedly connected with the outer shell of the motor (63), the fixing plate (64) is arranged in parallel with the supporting plate (61), the fixing plate (64) is fixedly connected to the protection box (1) through the first mounting hole (5), the connecting shaft (62) is far away from one end of the mounting plate (2) and is sleeved with and fixedly connected with blades (65).
3. The heat dissipation device for hardware on a computer motherboard according to claim 2, wherein a mesh enclosure (10) is fixedly connected to a sidewall of the protection box (1), and the mesh enclosure (10) is covered on the first mounting hole (5).
4. The computer motherboard hardware heat dissipation processing apparatus according to claim 1, wherein the cooling mechanism (7) comprises an air cooler (71), an outer shell of the air cooler (71) is fixedly connected to the inner side wall of the protection box (1), an output end of the air cooler (71) is fixedly connected with an air duct (72), the air duct (72) is fixedly connected with an air distribution plate (73), the air distribution plate (73) is vertically arranged, and the air distribution plate (73) is fixedly connected to the inner side wall of the protection box (1).
5. The computer motherboard hardware heat dissipation processing apparatus as claimed in claim 1, wherein a second mounting hole (11) is additionally formed in a side wall of the protection box (1), the protection box (1) is fixedly connected with a ventilation mechanism (12) through the second mounting hole (11), the ventilation mechanism (12) comprises a ventilation frame (121), a pair of side surfaces of the ventilation frame (121) are hinged to a plurality of connecting pieces (122) along a vertical direction, one ends of the connecting pieces (122) are fixedly connected to a partition plate (123), one end of the connecting piece (122) away from the partition plate (123) is hinged to a transmission shaft (124), the transmission shaft (124) is fixedly connected to an air cylinder (125) along an axial direction, and the air cylinder (125) is away from the transmission shaft (124) and fixedly connected to the ventilation frame (121).
6. The heat dissipation processing device for computer motherboard hardware as recited in claim 1, wherein the heat dissipation frame (3) comprises a connecting plate (31), the connecting plate (31) is provided with a plurality of ventilation holes (32), and the opening direction of the plurality of ventilation holes (32) is the same as the opening direction of the first mounting hole (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023173927.5U CN213582069U (en) | 2020-12-25 | 2020-12-25 | Computer motherboard hardware heat dissipation processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023173927.5U CN213582069U (en) | 2020-12-25 | 2020-12-25 | Computer motherboard hardware heat dissipation processing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213582069U true CN213582069U (en) | 2021-06-29 |
Family
ID=76549966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023173927.5U Expired - Fee Related CN213582069U (en) | 2020-12-25 | 2020-12-25 | Computer motherboard hardware heat dissipation processing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213582069U (en) |
-
2020
- 2020-12-25 CN CN202023173927.5U patent/CN213582069U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210629 Termination date: 20211225 |
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| CF01 | Termination of patent right due to non-payment of annual fee |