CN213579821U

CN213579821U - Thermocouple and electronic equipment

Info

Publication number: CN213579821U
Application number: CN202022365394.4U
Authority: CN
Inventors: 袁宁; 田雨洪; 习宜平
Original assignee: Nanchang OFilm Display Technology Co Ltd
Current assignee: Nanchang OFilm Display Technology Co Ltd
Priority date: 2020-10-22
Filing date: 2020-10-22
Publication date: 2021-06-29
Anticipated expiration: 2030-10-22

Abstract

The application discloses thermocouple and electronic equipment includes: the thermocouple structure extends from a hot end to a cold end, and comprises a first thermocouple metal and a second thermocouple metal connected with the first thermocouple metal, wherein the first thermocouple metal and the second thermocouple metal respectively extend from the hot end to the cold end; the compensation structure comprises a temperature measuring assembly and a heat conducting circuit, wherein the heat conducting circuit extends along the direction from the hot end to the cold end so as to conduct the temperature of the hot end along the direction towards the cold end through a wire, and the temperature measuring assembly is connected with the end part, deviating from the hot end, of the heat conducting circuit so as to obtain the temperature of the end part, deviating from the hot end, of the heat conducting circuit. This application can indirectly acquire the temperature that the thermocouple cold junction rises through the temperature that is located the thermocouple cold junction position of acquireing the heat conduction line. And then can get rid of system error for the measurement accuracy of thermocouple is higher.

Description

Thermocouple and electronic equipment

Technical Field

The application relates to the technical field of temperature measurement, in particular to a thermocouple and electronic equipment.

Background

The thermocouple is a common temperature measuring element, and the existing thermocouples have systematic errors when measuring temperature, so that the temperature measurement precision is low.

SUMMERY OF THE UTILITY MODEL

The application provides a thermocouple and electronic equipment, can carry out more accurate temperature measurement.

According to an aspect of the present application, there is provided a thermocouple including: the thermocouple structure extends from a hot end to a cold end, and comprises a first thermocouple metal and a second thermocouple metal connected with the first thermocouple metal, wherein the first thermocouple metal and the second thermocouple metal respectively extend from the hot end to the cold end; the compensation structure comprises a temperature measuring assembly and a heat conducting circuit, wherein the heat conducting circuit extends along the direction from the hot end to the cold end so as to conduct the temperature of the hot end along the direction towards the cold end through a wire, and the temperature measuring assembly is connected with the end part, deviating from the hot end, of the heat conducting circuit so as to obtain the temperature of the end part, deviating from the hot end, of the heat conducting circuit.

In the above scheme, system errors caused by temperature transfer from the hot end to the cold end of the thermocouple during working are fully considered. Due to the fact that the heat conducting circuit is added, the heat conducting circuit transmits the temperature of the hot end position of the thermocouple to the cold end position so as to be used for simulating the temperature of the hot end of the thermocouple transmitted to the cold end, and the temperature of the cold junction of the thermocouple rising can be indirectly obtained by obtaining the temperature of the heat conducting circuit located at the cold end position of the thermocouple. After the temperature is obtained, the system error value of the thermocouple in the related technology can be obtained through simple calculation, and then the system error can be eliminated, so that the measurement precision of the thermocouple is higher.

According to an embodiment of the application, the heat conducting circuit has a first heat conducting efficiency for transferring heat from the hot end to the cold end, the galvanic structure has a second heat conducting efficiency for transferring heat from the hot end to the cold end, and the heat conducting circuit is configured such that the first heat conducting efficiency is equal to the second heat conducting efficiency.

In the above solution, the "the heat conducting circuit is configured to make the first heat conducting efficiency equal to the second heat conducting efficiency" means that, under the same time and temperature difference conditions, the heat conducted by the heat conducting circuit from the hot end to the cold end is equal to the heat conducted by the thermocouple structure from the hot end to the cold end. When the heat conduction circuit meets the conditions, the temperature transmitted to the cold end by the heat conduction circuit has reference significance, and the heat transmitted to the cold end from the hot end and the temperature change condition of the thermocouple structure can be reflected better.

According to one embodiment of the present application, the first galvanic metal, the second galvanic metal and the heat conductive circuit all extend along a straight line, and the first galvanic metal, the second galvanic metal and the heat conductive circuit are disposed in parallel and spaced apart.

In the above scheme, the first galvanic metal, the second galvanic metal and the heat conducting circuit extend linearly, so that the heat conducting performance between the heat conducting circuit and the first galvanic metal and between the heat conducting circuit and the second galvanic metal is easier to match correspondingly, the heat conducting circuit can simulate the heat conducted by the first galvanic metal and the second galvanic metal more accurately, and the measurement accuracy of the thermocouple is further improved.

According to one embodiment of the application, the first galvanic metal, the second galvanic metal and the heat conducting circuit are all the same size in a direction from the hot end to the cold end.

In the above scheme, when the lengths of the first galvanic metal and the heat conducting circuit are the same, the temperature change of the end part of the first galvanic metal, which is away from the hot end, of the heat conducting circuit is more similar, so that the heat conducting circuit can simulate the heat conducted by the first galvanic metal more accurately, and the measurement accuracy of the thermocouple is further improved.

According to one embodiment of the invention, the direction pointing from the hot end to the cold end is a first direction;

the first galvanic couple metal comprises M first metal wires extending along a first direction, the second galvanic couple metal comprises M second metal wires extending along the first direction, the M first metal wires and the M second metal wires are arranged in a staggered mode one by one, and the M first metal wires and the M second metal wires are connected end to end one by one to form a series connection passage, wherein M is a positive integer;

the heat conducting circuit comprises N third metal wires extending along the first direction, and the end parts of the N third metal wires, which are far away from the hot end, are connected with the temperature measuring assembly, wherein N is a positive integer;

each first metal wire has a cross-sectional area S in a direction perpendicular to the first direction₁The sum of the cross-sectional area of each second metal wire is S₂Each third metal line has a cross-sectional area S₃；

The first metal wire has a thermal conductivity of lambda₁The second metal wire has a thermal conductivity of λ₂The third metal wire has a thermal conductivity of λ₃Wherein λ is₁＞λ₂；

The first metal line has a dimension L along the first direction₁The second metal line has a dimension L along the first direction₂The third metal line has a dimension L along the first direction₃；

S₁、S₂、S₃、λ₁、λ₂、λ₃、L₁、L₂、L₃Satisfy the relation:

wherein A is an error range, and-0.3 is more than or equal to A and less than or equal to 0.3.

In the above scheme, no matter the value of M is 1 or an integer greater than 1, the heat conducting circuit is processed and manufactured by the above formula, so that the heat conducting circuit can simultaneously simulate the comprehensive temperature transmission process of the first galvanic couple metal and the second galvanic couple metal, and the temperature compensation result is more accurate.

According to an embodiment of the present application, M and N satisfy the following relation:

M＝N

the M first metal lines and the M second metal lines are combined to form M groups of galvanic couple groups, and one third metal line is arranged between the first metal line and the second metal line in each group of galvanic couple groups.

In the above scheme, each third metal wire is located between the first metal wires and the second metal wires which are arranged in groups, so that the environment where each third metal wire is located is more similar to the adjacent first metal wires and the adjacent second metal wires, and the temperature of the third metal wires conducted to the cold ends is more meaningful for reference.

According to an embodiment of the present application, said N is equal to 2, and said galvanic structure is disposed between two of said third metal lines.

In the above scheme, the two third metal wires are arranged around the periphery of the thermocouple structure, so that the position arrangement of the heat conducting circuit does not affect the thermocouple structure, that is, the structure of the heat conducting circuit can be redesigned on the periphery of the original thermocouple structure, and the problem of interference between the heat conducting circuit and the thermocouple structure is not considered when the width of the heat conducting circuit is increased or reduced (the width of the heat conducting circuit can be expanded towards the periphery), so that the design cost is reduced.

According to an embodiment of the application, the thermocouple further comprises:

a substrate layer comprising a first surface;

wherein, the galvanic couple structure and the heat conduction circuit are both arranged on the first surface.

In the scheme, the thermocouple structure and the heat conducting circuit are simultaneously positioned on one surface of the base material, so that the thermocouple is higher in integration level and more compact in structure.

According to one embodiment of the present application, a first galvanic metal is connected to a second galvanic metal at the hot end and forms a hot junction;

the thermocouple also comprises an insulating layer connected with the hot junction, and the insulating layer is arranged on the surface of the hot junction, which is deviated from the base material layer;

the end of the heat conducting circuit close to the hot junction is arranged on the surface of the insulating layer, which is far away from the hot junction.

In the above scheme, the end part of the heat conducting circuit, which is located at the hot end, can be flush with the hot junction position of the thermocouple structure, and the end part and the hot junction position of the heat conducting circuit can basically contact the heat source at the same position, so that the heat conducting circuit can simulate the heat conducted by the first thermocouple metal more accurately, and the measurement accuracy of the thermocouple is further improved.

the substrate layer comprises a first surface and a second surface which are oppositely arranged;

the galvanic couple structure is arranged on the first surface, and the heat conduction circuit is arranged on the second surface.

In the above scheme, when heat conduction circuit and galvanic couple structure arrange in two relative surfaces of substrate layer, heat conduction circuit can be in the direction of perpendicular to substrate layer and the position of arranging of galvanic couple structure coincide completely to can be more accurate simulate out the temperature that galvanic couple structure transmitted to the cold junction by the hot junction. Moreover, the heat conducting circuit and the thermocouple structure are distributed on different surfaces of the substrate layer, so that the heat conducting circuit and the thermocouple structure can not generate position interference at all, and meanwhile, the thermocouple structure is more compact and smaller in size.

According to one embodiment of the application, the heat conducting circuit comprises a first heat conducting wire and a second heat conducting wire, wherein the first heat conducting wire and the second heat conducting wire respectively extend from the hot end to the cold end, the first heat conducting wire and the second heat conducting wire are connected at the hot end, the first heat conducting wire is made of the same material as the first galvanic couple metal, and the second heat conducting wire is made of the same material as the second galvanic couple metal;

the orthographic projection of the first galvanic metal on the second surface is a first projection, the arrangement position of the first heat conduction line is superposed with the first projection, the orthographic projection of the second galvanic metal on the second surface is a second projection, and the arrangement position of the second heat conduction line is superposed with the second projection;

the temperature measuring assembly comprises a first temperature measuring part and a second temperature measuring part, the first temperature measuring part is connected with the end part of the first heat conducting wire, which deviates from the hot end, and the second temperature measuring part is connected with the end part of the second heat conducting wire, which deviates from the hot end.

In the above scheme, the first heat conduction line is used to simulate temperature conduction of the first galvanic metal, the second heat conduction line is used to simulate temperature conduction of the second galvanic metal, and the first heat conduction line is arranged corresponding to the position of the first galvanic metal, and the second heat conduction line is arranged corresponding to the position of the second galvanic metal. The heat conducting circuit completely simulates the structure of the galvanic couple structure, so that the heat conducting circuit can simulate the temperature transfer effect of the galvanic couple metal more accurately.

the shielding layer is arranged on the second surface;

wherein the second surface includes a first arrangement region where the thermal conductive circuit is arranged and a second arrangement region where the shielding layer is arranged.

In the above scheme, the shielding layer and the heat conduction circuit are arranged on the second surface of the base material plate at the same time, and specifically, the shielding layer and the heat conduction circuit are completely paved on the second surface of the base material plate (only a gap exists at the junction of the heat conduction circuit and the shielding layer). On one hand, the heat conducting circuit does not occupy extra space, and on the other hand, the heat conducting circuit also serves as a part of the shielding layer to play a role in shielding, thereby achieving two purposes.

According to an embodiment of the application, the temperature measurement assembly comprises a positive line, a negative line and a thermistor, the thermistor is connected with the end of the heat conducting line away from the hot end, and the positive line, the negative line and the thermistor are connected to form a series circuit.

In the above scheme, the temperature of the heat conducting line at the cold end is measured by using the principle that the thermistor generates resistance value change according to the temperature, and the structure is simple and the cost is low.

The second aspect of the present application also provides an electronic device,

the thermocouple comprises an electronic equipment body and any one of the thermocouples, wherein the thermocouples are arranged in the electronic equipment body.

In the scheme, the thermocouple in the electronic equipment has the compensation structure, so that the measurement accuracy of the thermocouple is higher.

The application provides a thermocouple, fully considered because its hot junction of thermocouple during operation is to the system error that cold junction transmission temperature brought. This application increases the heat conduction line, and the heat conduction line transmits the temperature of the hot junction position of thermocouple to the cold junction position to the hot junction that is used for simulating the thermocouple transmits the temperature to the cold junction, can indirectly acquire the temperature that the thermocouple cold junction rises through the temperature that is located thermocouple cold junction position who acquires the heat conduction line. After the temperature is obtained, the system error value of the thermocouple in the related technology can be obtained through simple calculation, and then the system error can be eliminated, so that the measurement precision of the thermocouple is higher.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a schematic structural diagram of a thermocouple provided in an embodiment of the present application;

FIG. 2 is a schematic structural diagram of a thermocouple provided in another embodiment of the present application;

FIG. 3 is a schematic structural diagram of a thermocouple provided in accordance with yet another embodiment of the present application;

FIG. 4 is a schematic diagram of a galvanic couple structure, a compensation structure, and a substrate layer combined according to an embodiment of the present disclosure;

FIG. 5 is a schematic cross-sectional view of the A-A direction of the bitmap 4;

FIG. 6 is a schematic diagram of a galvanic couple structure, a compensation structure and a substrate layer combined together according to another embodiment of the present disclosure;

FIG. 7 is a schematic cross-sectional view of the bitmap 6 in the direction B-B;

FIG. 8 is a schematic diagram of a galvanic couple structure, a compensation structure and a substrate layer combined according to another embodiment of the present disclosure;

FIG. 9 is a schematic diagram of a galvanic couple structure, a compensation structure, and a substrate layer combined in yet another embodiment of the present application;

FIG. 10 is a schematic diagram of a galvanic couple structure, a compensation structure, and a substrate layer combined according to an embodiment of the present disclosure; the compensation structure and the galvanic couple structure are distributed on different surfaces of the base material layer;

FIG. 11 is a schematic cross-sectional view taken along line C-C of FIG. 10;

FIG. 12 is a schematic diagram of a galvanic couple structure, a compensation structure, and a substrate layer combined according to an embodiment of the present disclosure; the compensation structure and the galvanic couple structure are distributed on different surfaces of the substrate layer, and the heat conduction circuit is divided into a first heat conduction line and a second heat conduction line;

FIG. 13 is a schematic cross-sectional view taken along line D-D of FIG. 10;

FIG. 14 is a schematic diagram of a galvanic couple structure, a compensation structure, a substrate layer, and a shielding layer combined in one embodiment of the present disclosure;

FIG. 15 is a schematic view in full section of a thermocouple according to an embodiment of the present application.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

The thermocouple is a commonly used temperature measuring element in a temperature measuring instrument, directly measures temperature, converts a temperature signal into a thermal electromotive force signal, and converts the thermal electromotive force signal into the temperature of a measured medium through an electric instrument (a secondary instrument). When two different conductors or semiconductors a and B form a loop, and the two ends of the loop are connected with each other, as long as the temperatures at the two junctions are different, one end is at T, called the working end or the hot end, and the other end is at T0, called the free end (also called the reference end) or the cold end, an electromotive force is generated in the loop, and the direction and magnitude of the electromotive force are related to the materials of the conductors and the temperatures of the two junctions. This phenomenon is called "thermoelectric effect", the circuit formed by the two conductors, called "thermocouple", the two conductors called "hot electrode", and the electromotive force generated, called "thermoelectric force".

In the actual operation process, the inventor finds that, when the thermocouple carries out temperature measurement, the temperature at the hot end position of the thermocouple is transmitted to the cold end position through a lead wire (namely the conductor or the semiconductors a and B) in the thermocouple, so that the temperature difference between the hot end and the cold end of the thermocouple is changed, the electromotive force generated in a thermocouple loop is further changed, and the accuracy of temperature measurement of the thermocouple is finally influenced.

In view of the above technical problems, the present inventors have initially taken various means to improve the specific structure of the thermocouple. On the one hand, the inventor considers that when the temperature change of the cold end of the thermocouple is detected, the temperature displayed after the detection of the thermocouple can be corrected according to the temperature change, so that an additional temperature sensor is adopted to directly measure the temperature of the cold end of the thermocouple in the initial stage. However, later experimental data show that, in the above solution, since the additional temperature sensor is generally a module with a current path (the additional temperature sensor is not suitable for a thermocouple structure, because the additional thermocouple still has a problem of temperature compensation), for example, the additional temperature sensor may be a circuit module with a thermistor. When the additional temperature sensor directly detects the temperature of the cold end of the thermocouple, the generated current can affect the electromotive force in the thermocouple (or when the additional temperature sensor senses, the additional temperature can be generated, the generated temperature is not high, but cannot be ignored relative to the temperature to be compensated by the thermocouple), which is equivalent to that the thermocouple generates a new system error, and the measured temperature is not ideal. On the other hand, the inventor considers that an additional temperature sensor is not suitable for being directly connected with a conductor of the thermocouple, so that the temperature sensor is arranged beside the cold end of the thermocouple to directly detect the temperature near the cold end of the thermocouple. Although this solution can correct the measured value of the thermocouple to some extent, the result is still not ideal, because the temperature beside the cold end of the thermocouple is difficult to completely reflect the temperature of the thermocouple transmitted from the hot end to the cold end through the lead wire.

Through the above thought and practice of the present inventors, as shown in fig. 1-15, the following provides a technical solution of an improved thermocouple, which overcomes the drawbacks of all the above solutions and has higher temperature detection accuracy. Specifically, the thermocouple includes a galvanic couple structure 100 and a compensation structure 200.

The electric coupling structure 100 extends from a hot end 11 position to a cold end 12, and it is noted that "hot end 11" and "cold end 12" are both terms of orientation herein, and the electric coupling structure 100 has a hot junction 130 and a cold junction 140, wherein when the electric coupling structure 100 is in operation, the hot junction 130 is at the hot end 11 position and the cold junction 140 is at the cold end 12 position. The galvanic structure 100 includes a first galvanic metal 110 and a second galvanic metal 120, and the first galvanic metal 110 and the second galvanic metal 120 are the conductor or semiconductor a and the conductor or semiconductor B in the foregoing description. The first galvanic metal 110 and the second galvanic metal 120 both extend from the hot end 11 to the cold end 12 of the galvanic structure 100, respectively, and the first galvanic metal 110 and the second galvanic metal 120 are connected at the hot end 11 and form a hot junction 130. When the temperatures of the hot end 11 and the cold end 12 of the thermocouple structure 100 are different, electromotive force is generated in a loop formed by the first thermocouple metal 110 and the second thermocouple metal 120, and the temperature of the hot end 11 of the thermocouple can be correspondingly obtained according to the magnitude of the generated electromotive force.

Compensation structure 200 includes a temperature measurement assembly 220 and a thermally conductive line 210, where thermally conductive line 210 extends in a direction from hot end 11 toward cold end 12 to transfer the temperature of hot end 11 to cold end 12 via a wire. That is, in this embodiment, a conducting wire extending from the hot end 11 of the thermocouple toward the cold end 12 is provided, and the temperature of the hot end 11 of the thermocouple is guided to the cold end 12 through the conducting wire, so as to simulate the effect of the thermocouple metal of the thermocouple structure 100 on transferring the temperature of the hot end 11. The temperature measuring assembly 220 is connected with the end of the heat conducting circuit 210 away from the hot end 11 to obtain the temperature transmitted from the hot end 11 to the cold end 12 through the heat conducting circuit 210, and the temperature increased by the thermocouple cold junction 140 can be indirectly obtained by obtaining the temperature of the heat conducting circuit 210 at the position of the thermocouple cold end 12. After the temperature is obtained, the system error value of the thermocouple in the related technology can be obtained through simple calculation, and then the system error can be eliminated, so that the measurement precision of the thermocouple is higher.

It is noted that "wire" is defined herein to mean a structure of wires capable of conducting heat. That is, the conductive wire may be a metal wire or a non-metal wire capable of conducting current, or may be another wire incapable of conducting current. For example, the material of the heat conducting circuit 210 may be common conductive metal such as copper, iron, gold, or silver, may be nonmetal having conductive property such as graphite or carbon fiber, or may be ceramic or other non-conductive material having high temperature resistance. When the operating temperature of the thermocouple is low, the heat conducting circuit 210 may be made of a non-conductive material such as plastic or silica gel. However, regardless of the material of the heat conducting line 210, in order to reflect the compensation temperature of the thermocouple (hereinafter, the temperature of the thermocouple transferred from the hot end 11 to the cold end 12 is referred to as the compensation temperature for convenience of description), parameters such as a sectional area, a density, a length, and an arrangement position of the heat conducting line 210 need to be specially designed according to the material of the heat conducting line 210, so that the heat conducting process of the heat conducting line matches the heat conducting process of the thermocouple. For example, when the thermal conductivity of the material of the thermal conductive line 210 is lower than that of the material of the thermocouple, the length of the thermal conductive line 210 may be appropriately smaller than that of the thermocouple; when the thermal conductivity of the material of the thermal conductive line 210 is higher than that of the material of the thermocouple, the length of the thermal conductive line 210 may be appropriately longer than that of the thermocouple, or the end of the thermal conductive line 210 close to the hot end 11 of the thermocouple may be appropriately distant from the hot end 11 of the thermocouple.

The first galvanic metal 110 and the second galvanic metal 120 in the thermocouple are two metals with different materials, and the difference of the thermal conductivity coefficients of the two metals is large. For convenience of description, it is defined that the thermal conductivity of the first galvanic metal 110 is higher than that of the second galvanic metal 120. Illustratively, the first galvanic metal 110 may be copper and the second galvanic metal 120 may be a copper-nickel alloy, in which case the thermal conductivity of the first galvanic metal 110 is about seventy times that of the second galvanic metal 120, so the compensation temperature of the thermocouple is mainly caused by the transfer of the first galvanic metal 110. Of course, the specific materials of the first galvanic metal 110 and the second galvanic metal 120 may be combined with each other, and are not described herein in detail.

When the thermal conductivity of the first galvanic metal 110 is higher than that of the second galvanic metal 120, the material of the thermal conductive circuit 210 may be the same as that of the first galvanic metal 110, considering that the temperature coefficients of the two galvanic metals of the thermocouple are generally different from each other, and the main error source of the thermocouple is caused by the temperature of the conductive hot end 11 of the galvanic metal with a higher temperature coefficient. The measurement accuracy of the thermocouple can be improved to a large extent by simulating the temperature transmitted by the thermocouple metal with a high temperature coefficient, and the design difficulty and the processing cost can be reduced by adopting the existing thermocouple material for the heat conducting circuit 210.

In order to enable the heat conducting circuit 210 to match the temperature conducting path of the first galvanic metal 110 so as to obtain the compensated temperature more accurately, in one embodiment, the first galvanic metal 110 and the heat conducting circuit 210 both extend along a straight line, and the first galvanic metal 110 and the heat conducting circuit 210 are disposed in parallel and spaced apart. In the above scheme, the heat conduction performance between the heat conduction circuit 210 and the first galvanic metal 110 is more easily matched, so that the heat conduction circuit 210 can simulate the heat conducted by the first galvanic metal 110 more accurately, and further the measurement accuracy of the thermocouple is improved.

Along the direction that points to cold junction 12 by hot junction 11, the size of first galvanic metal 110, second galvanic metal 120 and heat conduction circuit 210 can be the same also can be inequality, and when the size of three is the same, the temperature variation at the tip that deviates from hot junction 11 of first galvanic metal 110 and heat conduction circuit 210 is more similar for heat conduction circuit can more accurate simulation first galvanic metal 110 conducted heat, and then has promoted the measurement accuracy of thermocouple. Of course, in some scenarios, due to space limitation, the length dimensions of the heat conducting circuit 210, the first galvanic metal 110 and the second galvanic metal 120 cannot be the same, and the heat conducting effect of the heat conducting circuit 210 may be matched with the heat conducting effect of the galvanic structure 100 by changing the material, the cross-sectional area or the arrangement position of the heat conducting circuit 210.

The compensation structure 200 may be connected to the galvanic structure 100 or may not be connected at all, i.e. the compensation structure 200 and the galvanic structure 100 may be two independent units. For example, the compensation structure 200 may be a separate element disposed beside the thermocouple in the related art, the compensation structure 200 may display the compensation temperature or may transmit a signal having the compensation temperature, and an operator may analyze the measured value of the thermocouple according to the displayed compensation temperature or the transmitted signal to obtain a final accurate value. In the above-described scheme, the thermocouple in the related art is the thermocouple structure 100 in the embodiment of the present application, and the combination of the thermocouple in the related art and the compensation structure 200 is referred to as the thermocouple in the embodiment of the present application.

In order to make the thermocouple structure 100 more compact, the thermocouple structure 100 and the compensation structure 200 may be connected to each other. According to an embodiment of the present application, the thermocouple may further include a substrate layer 300. The base material layer 300 includes a first surface 310, and the galvanic structure 100 and the heat conductive path 210 are disposed on the first surface 310. That is, the heat conducting lines 210 of the thermocouple structure 100 and the compensation structure 200 are connected by the substrate layer 300, which is suitable for a small thermocouple, and for a large thermocouple, the thermocouple structure 100 and the compensation structure 200 may be connected by other connecting brackets, which are not described herein.

When the thermal conductive circuit 210 is disposed on the first surface 310, the temperature measurement component 220 of the compensation structure 200 may be disposed on the first surface 310, or may be disposed outside the first surface 310. When the temperature measurement assembly 220 is disposed outside the first surface 310, the end of the heat conductive path 210 facing away from the hot end 11 of the thermocouple protrudes out of the substrate layer 300 to be connected to the temperature measurement assembly 220.

When the heat conductive circuit 210 and the electric coupling structure 100 are both located on the same surface of the substrate layer 300, in order to avoid the position interference between the heat conductive circuit 210 and the electric coupling structure 100, the end of the heat conductive circuit 210 located at the hot end 11 of the electric coupling structure 100 cannot be aligned with the hot junction 130 of the electric coupling structure 100 (i.e., the intersection point between the first electric coupling metal 110 and the second electric coupling metal 120 and the portion for receiving a heat source), and thus the initial temperatures received by the hot junction 130 of the electric coupling structure 100 and the heat conductive circuit 210 from the heat source position have a small difference. In view of this drawback, in an embodiment of the present application, the thermocouple further includes an insulating layer 400 connected to the hot junction 130, the insulating layer 400 is disposed on a surface of the hot junction 130 facing away from the substrate layer 300, and an end of the thermal conductive line 210 close to the hot junction 130 is disposed on a surface of the insulating layer 400 facing away from the hot junction 130. In other words, the end of the heat conductive line 210 near the thermocouple hot end 11 is stacked on the hot junction 130 of the thermocouple structure 100, and is isolated from the hot junction by the insulating layer 400. In the above solution, the end of the heat conducting circuit 210 located at the hot end 11 may be flush with the position of the hot junction 130 of the electric couple structure 100, and both can contact the heat source at substantially the same position, so the initial temperature received by the hot junction 130 of the electric couple structure 100 and the heat conducting circuit 210 from the heat source position is substantially the same, and finally the measurement accuracy of the thermocouple can be improved.

Specifically, the area covered by the insulating layer 400 on the surface of the galvanic couple structure 100 facing away from the substrate layer 300 and the covered position depend on the orientation and specific size of the heat conducting circuit 210. The specific function of the insulating layer 400 is to prevent the heat conductive line 210 from being connected to the thermocouple structure 100, and therefore the insulating layer 400 may have an effect of isolating the heat conductive line 210 from the thermocouple structure 100.

In one embodiment, when the material of the thermally conductive trace 210 is non-conductive (e.g., the material of the thermally conductive trace 210 is ceramic), the thermocouple may also have no insulating layer 400, and the thermally conductive trace 210 is in direct contact with the hot junction 130 of the thermocouple structure 100. Of course, in such an embodiment, the length, thermal conductivity, and cross-sectional area of the thermal conductive line 210 need to be specifically designed to match the thermal conduction process of the galvanic structure 100.

When the heat conducting structure 130 and the thermocouples are uniformly distributed on the first surface 310 of the substrate layer 300, the relative positions of the heat conducting structure and the thermocouples can be determined according to specific design requirements, and only the heat conducting processes of the heat conducting structure and the thermocouples need not to affect each other. Specifically, according to an embodiment of the present application, the first galvanic metal 110 includes M first metal lines 111 arranged in parallel at intervals (of course, each first metal line 111 may also be arranged in non-parallel, but for illustration, a specific example in which the first metal lines 111 are arranged in parallel is taken here), and the second galvanic metal 120 includes M second metal lines 121 arranged in parallel at intervals. Each first metal line 111 and each second metal line 121 extend along a direction (i.e., the first direction X in fig. 3) pointing from the hot end 11 to the cold end 12 of the galvanic couple structure 100, and the M first metal lines 111 and the M second metal lines 121 are sequentially arranged in a staggered manner one by one, and the M first metal lines 111 and the M second metal lines 121 are connected end to form a series path, where M is a positive integer, and M may be 1, 2, or 3 … …, for example. Referring to fig. 2, a schematic diagram of a galvanic couple structure 100 when M is 1; referring to fig. 3, a schematic diagram of the galvanic couple structure 100 when M is 4 is shown. The heat conducting circuit 210 includes N third metal wires, each of the N third metal wires extends in a direction from the hot end 11 to the cold end 12, and ends of the N third metal wires facing away from the hot end 11 are connected to the temperature measuring assembly 220, where N is a positive integer, and N may be 1, 2, or 3 … …, for example. Referring to fig. 2, a schematic diagram of a galvanic couple structure 100 when N is 1; referring to fig. 3, a schematic diagram of the galvanic couple structure 100 when N is 4.

The number of the first metal lines 111 and the number of the second metal lines 121 may not be directly related to the number of the third metal lines, that is, the value of M and the value of N may not be directly related. For convenience of arrangement, in an embodiment of the present application, M and N satisfy the following relation:

M＝N

the M first metal lines 111 and the M second metal lines 121 are combined to form M galvanic couples, and a third metal line is disposed between the first metal line 111 and the second metal line 121 in each galvanic couple. Referring to fig. 3, where M is 4, and one third metal wire is disposed between the first metal wire 111 and the second metal wire 121 in each group of galvanic couples, so that there are four third metal wires, and ends of the four third metal wires facing away from the hot end 11 are connected together. In the above solution, each third metal line is located in an environment more similar to the adjacent first metal line 111 and second metal line 121, so that the temperature of the third metal line conducted to the cold end 12 is more meaningful.

As shown in fig. 9, in order to add the heat conducting circuit 210 to the existing galvanic couple structure 100, in an embodiment of the present application, N may be equal to 2, and the galvanic couple structure 100 is disposed between two third metal wires. That is to say, the heat conducting circuit 210 is disposed at the peripheral position of the thermocouple structure 100, such a structural design can enable the thermocouple in the embodiment of the present application to be formed by directly adding the heat conducting circuit 210 at the periphery on the basis of the original thermocouple (i.e., the thermocouple structure 100 in the present application), the addition of the heat conducting circuit 210 does not affect the layout of the original thermocouple structure 100, the original processing equipment can still be used, the processing process of the thermocouple structure 100 is basically unchanged compared with the previous processing process, and the processing cost is reduced.

In the foregoing embodiment, the galvanic structure 100 and the heat conductive path 210 are disposed on the same surface of the substrate layer 300, so that the galvanic structure 100 and the heat conductive path 210 can be processed in the same process, and the processing efficiency is higher. However, in order to make the thermocouple structure 100 more compact, the heat conducting wire 210 and the thermocouple structure 100 may be disposed on different surfaces of the substrate layer 300. That is, in one embodiment of the present application, the thermocouple includes a substrate layer 300, and the substrate layer 300 includes a first surface 310 and a second surface 320 which are oppositely disposed. The galvanic couple structure 100 is disposed on the first surface 310, and the heat conducting circuit 210 is disposed on the second surface 320. In the above scheme, the heat conducting circuit 210 and the thermocouple structure 100 do not generate position interference at all, and the thermocouple has a more compact structure and a smaller volume.

When the heat conductive line 210 is disposed on the second surface 320, the disposition position of the heat conductive line 210 may be more flexible than when the heat conductive line 210 is disposed on the first surface 310. The arrangement position of the heat conductive circuit 210 on the second surface 320 in the present embodiment may correspond to the arrangement position of the heat conductive circuit 210 on the first surface 310 in the foregoing embodiments, that is, the heat conductive circuit 210 in the present embodiment may be arranged at the orthographic projection position of the heat conductive circuit 210 on the second surface 320 in the foregoing embodiments. Of course, the heat conducting circuit 210 may also be arranged at the orthographic projection position of the galvanic structure 100 on the second surface 320. When the thermal conductive circuit 210 is disposed at the orthographic projection position of the electric couple structure 100 on the second surface 320, the end of the thermal conductive circuit 210 close to the hot junction 130 of the electric couple structure 100 can be at the same position of the heat source as the hot junction 130 of the electric couple structure 100 at the same time, so that the thermal conductive circuit 210 can more accurately simulate the heat conduction process of the electric couple structure 100.

When the heat conductive circuit 210 is disposed on the second surface 320, the heat conductive circuit 210 may include a first heat conductive wire 212 and a second heat conductive wire 213, the first heat conductive wire 212 and the second heat conductive wire 213 extend from the hot end 11 to the cold end 12, respectively, and the first heat conductive wire 212 and the second heat conductive wire 213 are connected at the hot end 11. The material of the first thermal conductive line 212 is the same as that of the first galvanic metal 110, and the material of the second thermal conductive line 213 is the same as that of the second galvanic metal 120. The orthographic projection of the first galvanic metal 110 on the second surface 320 is a first projection, the arrangement position of the first heat conduction line 212 coincides with the first projection, the orthographic projection of the second galvanic metal 120 on the second surface 320 is a second projection, and the arrangement position of the second heat conduction line 213 coincides with the second projection. It can also be understood that the heat conducting circuit 210 is a mirror image structure of the galvanic couple structure 100 on the second surface 320, and both have the same material and size, but the galvanic couple structure 100 is used for temperature measurement and the heat conducting circuit 210 is used for temperature compensation. When the heat conductive path 210 is arranged as the above-described structure, the heat conduction process of the heat conductive path 210 is substantially identical to that of the thermocouple structure 100, so that the temperature measurement accuracy of the thermocouple is higher.

When the heat conducting circuit 210 is a mirror image structure of the thermocouple structure 100 on the second surface 320, the temperature measuring assembly 220 may also include a first temperature measuring portion and a second temperature measuring portion, and both the first temperature measuring portion and the second temperature measuring portion may be used for temperature measurement. The first temperature measuring part is connected with the end part of the first heat conducting wire 212, which is far away from the hot end 11, so as to measure the temperature of the end part of the first heat conducting wire 212, which is far away from the hot end 11; the second temperature measuring portion is connected to the end of the second heat conducting wire 213 away from the hot end 11 to measure the temperature of the end of the second heat conducting portion away from the hot end 11. In the above scheme, the temperature of the first heat-conducting wire 212 and the temperature of the second heat-conducting wire 213 away from the hot end 11 are measured at the same time, so that the compensation temperature of the thermocouple structure 100 can be better reflected, and the measurement accuracy of the thermocouple is improved.

In the related art thermocouple, the second surface 320 is provided with a shielding layer 500, and the shielding layer 500 is used to shield electromagnetic interference. However, when the heat conducting path 210 is disposed on the second surface 320, the heat conducting path 210 occupies a part of the position of the shielding layer 500, and therefore, when the thermocouple of the embodiment of the present invention also includes the shielding layer 500, in one embodiment, a part of the shielding layer 500 may be disposed on a surface of the heat conducting path 210 facing away from the base material layer 300 (i.e., a part of the shielding layer 500 is disposed to be stacked on the heat conducting path 210), and another part may be disposed on a position of the second surface 320 where the heat conducting path 210 is not disposed. In another embodiment, in order to reduce the thickness of the thermocouple, the shielding layer 500 may be disposed only on a portion of the second surface 320 where the heat conducting circuit 210 is not disposed, that is, the second surface 320 includes a first arrangement region 321 and a second arrangement region 322, the heat conducting circuit 210 is arranged in the first arrangement region 321, and the shielding layer 500 is arranged in the second arrangement region 322. In the above solution, the shielding layer 500 and the thermal conductive circuit 210 are disposed on the second surface 320 of the substrate board at the same time, specifically, the shielding layer 500 and the thermal conductive circuit 210 substantially completely cover the second surface 320 of the substrate board (only a gap exists at a boundary between the thermal conductive circuit 210 and the shielding layer 500). On the one hand, the heat conducting circuit 210 does not occupy extra space, and the thickness of the thermocouple is reduced. On the other hand, when the heat conducting circuit 210 is made of metal, the heat conducting circuit 210 also serves as a part of the shielding layer 500, thereby playing a role of shielding.

Specifically, regardless of whether the heat conductive line 210 is disposed on the first surface 310 or the second surface 320, the thermocouple may further have two protective layers 600, and the two protective layers 600 have both insulating and protective functions. One of the protection layers 600 is attached to one side of the first surface 310 of the substrate layer 300, and the galvanic couple structure 100 is located between the substrate layer 300 and the protection layer 600. The other protection layer 600 is attached to one side of the second surface 320 of the substrate layer 300, and the shielding layer 500 is located between the substrate layer 300 and the protection layer 600.

The temperature measuring assembly 220 may have any conventional component capable of measuring temperature, and specifically, in one embodiment, the temperature measuring assembly 220 may include a positive electrode line, a negative electrode line, and a thermistor 221, the thermistor 221 is connected to an end of the heat conducting line 210 away from the hot end 11, and the positive electrode line, the negative electrode line, and the thermistor 221 are connected to form a series circuit. When the temperature of the thermistor 221 changes, the current of the positive electrode line and the negative electrode line changes, and the temperature value of the thermistor 221 can be analyzed according to the change of the current, so as to reflect the temperature value of the end of the heat conducting line 210 away from the hot end 11 of the galvanic couple structure 100.

In some embodiments, the material and length of the heat conducting circuit 210 are the same as those of the first galvanic metal 110 for the sake of saving the processing cost or the design cost. However, the foregoing solution is not universal, and the heat conducting circuit 210 theoretically cannot completely simulate the temperature transfer effect of the galvanic couple structure 100, and still has a certain error in theory. In order to further improve the measurement accuracy of the thermocouple, a more precise solution is provided in the following embodiments.

Specific parameters of the first galvanic metal 110, the second galvanic metal 120, and the heat conductive circuit 210 are defined below.

The first galvanic metal 110 includes M first metal lines 111 extending along the first direction X, the second galvanic metal 120 includes M second metal lines 121 extending along the first direction X, the M first metal lines 111 and the M second metal lines 121 are arranged in a staggered manner one by one, and the M first metal lines 111 and the M second metal lines 121 are connected end to form a series path, where M is a positive integer, and for example, M may be 1, 2, or 3 … …. Referring to fig. 2, a schematic diagram of a galvanic couple structure 100 when M is 1; referring to fig. 3, a schematic diagram of the galvanic couple structure 100 when M is 4 is shown. The heat conducting circuit 210 includes N third metal wires extending along the first direction X, and ends of the N third metal wires facing away from the hot end 11 are all connected to the temperature measuring assembly 220, where N is a positive integer, and N may be 1, 2, or 3 … …, for example. Referring to fig. 2, a schematic diagram of a galvanic couple structure 100 when N is 1; referring to fig. 3, a schematic diagram of the galvanic couple structure 100 when N is 4.

The cross-sectional area of each first metal line 111 along a direction perpendicular to the first direction X is S₁The sum of the cross-sectional area of each second metal line 121 is S₂Each third metal line has a cross-sectional area S₃. It should be noted that the dimensions of the first galvanic metal 110, the second galvanic metal 120, and the heat conductive path 210 may be the same or different, that is, the thicknesses of the first galvanic metal 110, the second galvanic metal 120, and the heat conductive path 210 may be the same or different, along the direction perpendicular to the substrate layer 300. The number of the first metal lines 111 in the first galvanic metal 110 may be one or more, and the number of the second metal lines 121 in the second galvanic metal 120 is the same as the number of the first metal lines 111 in the first galvanic metal 110. The number of the third metal lines in the heat conductive line 210There may be one or more, and the number of the third metal lines and the number of the first metal lines 111 may or may not be related.

The first metal line 111 has a thermal conductivity of λ₁The second metal line 121 has a thermal conductivity of λ₂The third metal wire has a thermal conductivity of λ₃Wherein λ is₁＞λ₂. It should be noted that, when the number of the first metal lines 111 and the second metal lines 121 is one (that is, when the electric couple structure 100 has only one hot junction 130 and one cold junction 140), the hot junction 130 and the cold junction 140 of the electric couple structure 100 are substantially distributed at two ends of the second metal lines 121, and at this time, an error occurring in the electric couple structure 100 is generated only by the heat conduction of the second metal lines 121 and is unrelated to the first metal lines 111, so that it is only necessary to match the temperature conduction processes of the heat conduction lines 210 and the second metal lines 121. When the number of the first metal wire 111 and the second metal wire 121 is greater than 1 (that is, when the number of the hot junction 130 and the cold junction 140 of the electric couple structure 100 is multiple), the conduction of the first metal wire 111 and the second metal wire 121 to the temperature has an influence on the measurement result of the electric couple structure 100, for example, when the number of the first metal wire 111 and the second metal wire 121 is two, one first metal wire 111 and two second metal wires 121 transmit the temperature of the hot junction 11 to influence the measurement result of the electric couple, and since the thermal conductivity of the first metal wire 111 is generally much greater than that of the second metal wire 121, the first metal wire 111 has a greater influence on the measurement accuracy of the electric couple structure 100.

The dimension of the first metal line 111 along the first direction X is L₁The dimension of the second metal line 121 along the first direction X is L₂The third metal line has a dimension L along the first direction X₃。

S₁、S₂、S₃、λ₁、λ₂、λ₃、L₁、L₂、L₃M, N satisfies the relationship:

wherein A is an error range and-0.3. ltoreq. A. ltoreq.0.3, for example, the value of A may be-0.3, -0.1, 0, 0.1, 0.3 or the like.

When S is₁、S₂、S₃、λ₁、λ₂、λ₃、L₁、L₂、L₃M, N satisfy the above relations, the thermal conductivity of the thermal conductive path 210 is precisely limited to a proper range, so that the thermal conductivity of the thermal conductive path 210 can match the superposition effect of the first galvanic metal 110 and the second galvanic metal 120. And the matching process does not limit the material and size of the thermal conductive traces 210.

Theoretically, any wire having a heat conductive function can be used as the heat conductive circuit 210 according to the above formula. For example, when the thermal conductivity of the thermal conductive path 210 is low, it is sufficient to increase the cross-sectional area or decrease the length thereof; when the heat conductive lines 210 cannot be arranged too long due to space limitation, a material having a low heat conductivity may be selected to process the heat conductive lines 210 or reduce the cross-sectional area of the heat conductive lines 210.

Of course, in order to reduce the design cost and the processing cost, the material of the heat conducting circuit 210 may be directly selected from the material of the first galvanic metal 110 or the material of the second galvanic metal 120. For example, when the first galvanic metal 110 is made of copper and the second galvanic metal 120 is made of copper and nickel, the heat conducting circuit 210 may be made of copper or copper and nickel. In particular, theoretically, the heat conducting circuit 210 may be made of various materials, that is, one section of the heat conducting circuit 210 is made of one material, and the other section of the heat conducting circuit 210 is made of another material. For example, the heat conducting circuit 210 may have one section of copper and another section of copper-nickel. When the heat conducting circuit 210 has a plurality of third metal lines, the material of each third metal line may be the same, or the material of at least two third metal lines may be different. Meanwhile, the same third metal line may be made of one or more materials, for example, one section of the same third metal line may be copper, and the other section may be copper nickel.

The following is a specific derivation of the foregoing formula:

according to the law of thermal conduction:

is the energy transferred, λ is the thermal conductivity, S is the heat transfer area, dt is the temperature difference across, dx is the coordinate on the thermal conduction surface, i.e., L.

The amount of heat transferred from the hot junction 130 to the cold junction 140 through the first galvanic metal 110 in the thermocouple is:

the amount of heat transferred from the hot junction 130 to the cold junction 140 by the second galvanic metal 120 in the thermocouple is:

the temperature difference dt between the cold junction 130 is made equal to the temperature difference dt at both ends of the heat conducting line, and the heat transferred through the heat conducting line is:

namely, it is

The method is simplified and can be obtained:

adding the error range A to obtain:

it should be noted that the heat conducting circuit 210 designed according to the above formula may be disposed in a thermocouple having the substrate layer 300, or may be disposed in a thermocouple without the substrate layer 300, and when there is the substrate layer 300, the heat conducting circuit 210 may be disposed on the same surface as the thermocouple structure 100, or may be disposed on a different surface. The specific arrangement position of the heat conducting circuit 210 depends on the actual requirement.

The second aspect of the present application also provides an electronic apparatus including an electronic apparatus body and the thermocouple of any one of the above, wherein the thermocouple is provided in the electronic apparatus body.

The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it is to be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and specific meanings of the above terms may be understood by those skilled in the art according to specific situations.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A thermocouple, comprising:

the thermocouple structure extends from a hot end to a cold end, and comprises a first thermocouple metal and a second thermocouple metal connected with the first thermocouple metal, wherein the first thermocouple metal and the second thermocouple metal respectively extend from the hot end to the cold end;

the compensation structure comprises a temperature measuring assembly and a heat conducting circuit, wherein the heat conducting circuit extends along the direction from the hot end to the cold end so as to conduct the temperature of the hot end along the direction towards the cold end through a wire, and the temperature measuring assembly is connected with the end part, deviating from the hot end, of the heat conducting circuit so as to obtain the temperature of the end part, deviating from the hot end, of the heat conducting circuit.

2. A thermocouple as in claim 1,

the heat conducting circuit has a first heat conducting efficiency for transferring heat from the hot end to the cold end, the galvanic structure has a second heat conducting efficiency for transferring heat from the hot end to the cold end, and the heat conducting circuit is configured such that the first heat conducting efficiency is equal to the second heat conducting efficiency.

3. A thermocouple as in claim 1,

the first galvanic metal, the second galvanic metal and the heat conducting circuit all extend along a straight line, and the first galvanic metal, the second galvanic metal and the heat conducting circuit are arranged in parallel at intervals.

4. A thermocouple as in claim 3,

the sizes of the first galvanic metal, the second galvanic metal and the heat conducting circuit are the same along the direction from the hot end to the cold end.

5. A thermocouple as in claim 1,

the direction from the hot end to the cold end is a first direction;

the first galvanic couple metal comprises M first metal wires extending along the first direction, the second galvanic couple metal comprises M second metal wires extending along the first direction, the M first metal wires and the M second metal wires are arranged in a staggered mode at intervals one by one, the M first metal wires and the M second metal wires are correspondingly connected end to form a series circuit, and M is a positive integer;

the heat conducting circuit comprises N third metal wires extending along the first direction, and the end parts of the N third metal wires departing from the hot end are connected with the temperature measuring assembly, wherein N is a positive integer;

each of the first metal lines has a cross-sectional area S in a direction perpendicular to the first direction₁The sum of the cross-sectional area of each second metal wire is S₂Each of the third metal lines has a cross-sectional area S₃；

The first metal wire has a thermal conductivity of λ₁The second metal wire has a thermal conductivity of λ₂The third metal wire has a thermal conductivity of λ₃Wherein λ is₁＞λ₂；

The first metal line has a dimension L along the first direction₁The dimension of the second metal line along the first direction is L₂The dimension of the third metal line along the first direction is L₃；

Said S₁The S₂The S₃Said λ₁Said λ₂Said λ₃The said L₁The said L₂The said L₃Satisfy the relation:

wherein A is an error range, and is more than or equal to-0.3 and less than or equal to 0.3.

6. A thermocouple as in claim 5,

the M and the N satisfy the relation:

M＝N

7. A thermocouple as in claim 5,

and N is equal to 2, and the galvanic couple structure is arranged between the two third metal wires.

8. The thermocouple of claim 1, further comprising:

a substrate layer comprising a first surface;

9. A thermocouple as in claim 8,

the first galvanic metal and the second galvanic metal are connected at the hot end and form a hot junction;

the thermocouple also comprises an insulating layer connected with the hot junction, and the insulating layer is arranged on the surface of the hot junction, which is far away from the base material layer;

10. The thermocouple of claim 1, further comprising:

the galvanic couple structure is arranged on the first surface, and the heat conducting circuit is arranged on the second surface.

11. A thermocouple as in claim 10,

the heat conduction circuit comprises a first heat conduction line and a second heat conduction line, the first heat conduction line and the second heat conduction line respectively extend from the hot end to the cold end, the first heat conduction line and the second heat conduction line are connected at the hot end, the first heat conduction line is made of the same material as the first galvanic couple metal, and the second heat conduction line is made of the same material as the second galvanic couple metal;

the orthographic projection of the first galvanic metal on the second surface is a first projection, the arrangement position of the first heat conduction line is coincided with the first projection, the orthographic projection of the second galvanic metal on the second surface is a second projection, and the arrangement position of the second heat conduction line is coincided with the second projection;

12. The thermocouple of claim 10, further comprising:

the shielding layer is arranged on the second surface;

13. A thermocouple as in claim 1,

the temperature measuring assembly comprises a positive electrode circuit, a negative electrode circuit and a thermistor, the thermistor is connected with the end part, deviating from the hot end, of the heat conducting circuit, and the positive electrode circuit, the negative electrode circuit and the thermistor are connected to form a series circuit.

14. An electronic device, characterized in that,

comprising an electronic device body and a thermocouple according to any of claims 1-13, said thermocouple being arranged within said electronic device body.