CN213560631U - Follow-up device for silicon wafer cutting laser head - Google Patents
Follow-up device for silicon wafer cutting laser head Download PDFInfo
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- CN213560631U CN213560631U CN202021520994.7U CN202021520994U CN213560631U CN 213560631 U CN213560631 U CN 213560631U CN 202021520994 U CN202021520994 U CN 202021520994U CN 213560631 U CN213560631 U CN 213560631U
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- 238000005520 cutting process Methods 0.000 title claims abstract description 55
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 23
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 23
- 239000010703 silicon Substances 0.000 title claims abstract description 23
- 238000001816 cooling Methods 0.000 claims description 11
- 230000017525 heat dissipation Effects 0.000 claims description 9
- 230000007246 mechanism Effects 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 8
- 238000006073 displacement reaction Methods 0.000 claims description 6
- 125000004122 cyclic group Chemical group 0.000 claims description 5
- 238000003698 laser cutting Methods 0.000 abstract description 36
- 230000001360 synchronised effect Effects 0.000 abstract description 7
- 230000008859 change Effects 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 12
- 238000001514 detection method Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000009417 prefabrication Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
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Abstract
The utility model relates to a silicon wafer cutting servo-actuated device for laser head, including bearing the frame, three-dimensional revolving stage, the CCD camera, laser rangefinder, the cursor lamp, linear drive guide rail, annular drive guide rail, the plummer, bear tray and drive circuit, bear frame left surface and right flank and all establish a constant head tank, linear drive guide rail inlays in the lateral wall of constant head tank side, annular drive guide rail inlay in one of them constant head tank and with linear drive guide rail sliding connection, it inlays in the constant head tank of opposite side to bear the tray, the CCD camera, laser rangefinder, the cursor lamp all with bear the tray before the terminal surface be connected, drive circuit inlays in bearing the frame. On one hand, the novel laser cutting device can flexibly meet the requirements of matching assembly and operation with various laser cutting; on the other hand, in the cutting operation, the laser cutting operation is met, and meanwhile, the synchronous adjustment of the position between the laser cutting equipment and the cutting operation surface and the cutting power according to the change of the operation surface of the workpiece to be cut is effectively realized.
Description
Technical Field
The utility model relates to a silicon wafer laser cutting mechanism is exactly a follow-up device for silicon wafer cutting laser head.
Background
At present, in the processing operation of silicon wafer laser cutting and the like, although the currently used laser cutting equipment can meet the use requirement, in the cutting process, the adjusting capacity is relatively poor, only the requirement of cutting the silicon wafer along the corresponding cutting path according to a cutting program can be met, and when the defects of fluctuation or poor roughness and the like of a cutting operation surface cannot be caused according to the surface structure of the silicon wafer, the positioning clamp deviation and the like, the cutting operation interval and the laser cutting operation power between the laser cutting equipment and the silicon wafer can be flexibly adjusted, so that the cutting quality stability of the cutting operation surface is relatively poor in the current silicon wafer cutting process, and the requirement of efficient cutting operation is difficult to effectively meet.
In view of the current situation, there is an urgent need to develop an auxiliary detection device for laser cutting of silicon wafers to meet the needs of practical use.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects in the prior art, the utility model provides a servo device for a silicon wafer cutting laser head, which has simple structure, flexible and convenient use and good universality, and can flexibly meet the requirements of assembly operation matched with various laser cutting on one hand; on the other hand, in the cutting operation, the laser cutting operation is satisfied, and simultaneously, the synchronous adjustment of the position and the cutting power between the laser cutting equipment and the cutting operation surface is effectively realized according to the change of the operation surface of the workpiece to be cut, so that the overall quality and the efficiency of the laser cutting operation are effectively improved, and the surface quality of the laser cutting operation surface is improved.
In order to achieve the above purpose, the present invention is realized by the following technical solution:
a servo device for a silicon wafer cutting laser head comprises a bearing frame, a three-dimensional rotary table, a CCD camera, a laser ranging device, a cursor lamp, linear driving guide rails, at least two annular driving guide rails, bearing tables, a bearing tray and a driving circuit, wherein the bearing frame is of an I-shaped frame structure with a cross section, the left side surface and the right side surface of the bearing frame are respectively provided with a positioning groove, the axes of the positioning grooves are distributed in parallel with the axis of the bearing frame, the linear driving guide rails are respectively embedded in the side walls of the two positioning grooves and are distributed in parallel with the axes of the positioning grooves, at least two annular driving guide rails are embedded in one positioning groove and are uniformly distributed from top to bottom along the axis of the positioning groove, the annular driving guide rails are connected with the linear driving guide rails in a sliding mode through the bearing tables and are mutually and coaxially distributed, the annular driving guide rails are of a closed annular structure, and the inner, the bearing tray is embedded in the positioning groove on the other side and is coaxially distributed with the positioning groove, the side surface of the bearing tray is in sliding connection with the linear driving guide rail through the bearing table, the CCD camera, the laser ranging device and the cursor lamp are connected with the front end face of the bearing tray, the CCD camera, the laser ranging device and the cursor lamp are hinged with the front end face of the bearing tray through the three-dimensional rotary table respectively, the CCD camera, the laser ranging device and the optical axis of the cursor lamp are intersected with the axis of the annular driving guide rail and form an included angle of 10-60 degrees, and the driving circuit is embedded in the bearing frame and is electrically connected with the three-dimensional rotary table, the CCD camera, the laser ranging device, the cursor lamp, the linear driving guide rail and the annular.
Further, bear the frame in establish and bear the heat dissipation chamber of the coaxial distribution of frame, at least one cooling tube is established to heat dissipation chamber lateral wall, the cooling tube encircles heat dissipation chamber axis and is the helical structure distribution, and the cooling tube both ends all are located and bear the frame up end and establish the connector head.
Furthermore, the bottom of the positioning groove is provided with a guide sliding groove which is distributed in parallel with the axis of the positioning groove, and the guide sliding groove is vertically connected with the outer surface of the bearing table through an auxiliary positioning mechanism.
Furthermore, the auxiliary positioning mechanism comprises a pressure sensor, an elastic telescopic rod and a guide pulley, the rear end face of the elastic telescopic rod is vertically connected with the outer surface of the bearing table through the pressure sensor, the front end face of the elastic telescopic rod is connected with the guide pulley, the guide pulley is embedded in the guide chute and is in sliding connection with the guide chute, and the pressure sensor is electrically connected with the driving circuit.
Furthermore, the intersection point of the CCD camera, the laser ranging device, the optical axis of the cursor lamp and the axis of the annular driving guide rail is positioned at least 10 mm below the bearing rack.
Furthermore, at least one angle sensor is arranged on the three-dimensional rotary table, at least one displacement sensor is arranged on the bearing table, and the angle sensor and the displacement sensor are electrically connected with the driving circuit.
Furthermore, the light spot of the cursor lamp is in any one of a straight line shape and a cross shape.
Furthermore, the driving circuit is a circuit system based on any one of an industrial single chip microcomputer and a programmable controller.
The novel laser cutting device is simple in structure, flexible and convenient to use and good in universality, and on one hand, the requirements of matching assembly operation with various laser cutting can be flexibly met; on the other hand, in the cutting operation, the laser cutting operation is satisfied, and simultaneously, the synchronous adjustment of the position and the cutting power between the laser cutting equipment and the cutting operation surface is effectively realized according to the change of the operation surface of the workpiece to be cut, so that the overall quality and the efficiency of the laser cutting operation are effectively improved, and the surface quality of the laser cutting operation surface is improved.
Drawings
The present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
FIG. 1 is a schematic diagram of the novel structure;
fig. 2 is a schematic structural view of the auxiliary positioning mechanism.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
As shown in figures 1 and 2, a servo device for a silicon wafer cutting laser head comprises a bearing frame 1, a three-dimensional rotary table 2, a CCD camera 3, a laser distance measuring device 4, a cursor lamp 5, a linear driving guide rail 6, at least two annular driving guide rails 7, a bearing table 8, a bearing tray 9 and a driving circuit 10, wherein the bearing frame 1 is of an I-shaped frame structure with a cross section, the left side surface and the right side surface of the bearing frame are respectively provided with a positioning groove 11, the axes of the positioning grooves 11 are distributed in parallel with the axis of the bearing frame 1, the linear driving guide rails 6 are respectively embedded in the side walls of the two positioning grooves 11 and are distributed in parallel with the axes of the positioning grooves 11, the annular driving guide rails 7 are embedded in one positioning groove 11 and are uniformly distributed from top to bottom along the axes of the positioning grooves 11, and the annular driving guide rails 7 are connected with the linear driving guide rails 6 in a sliding, the annular driving guide rail 7 is of a closed annular structure, the inner surface of the annular driving guide rail 7 is provided with at least two bearing tables 8 which are uniformly distributed around the axis of the annular driving guide rail 7, a bearing tray 9 is embedded in a positioning groove 11 at the other side and is coaxially distributed with the positioning groove 11, the side surface of the bearing tray 9 is in sliding connection with a linear driving guide rail 6 of the bearing tables 8, a CCD camera 3, a laser ranging device 4 and a cursor lamp 5 are all connected with the front end surface of the bearing tray 9, the CCD camera 3, the laser ranging device 4 and the cursor lamp 5 are respectively hinged with the front end surface of the bearing tray 9 through a three-dimensional turntable 2, the optical axes of the CCD camera 3, the laser ranging device 4 and the cursor lamp 5 are intersected with the axis of the annular driving guide rail 7 and form an included angle of 10-60 degrees, a driving circuit 10 is embedded in a bearing frame 1 and is respectively connected with the three-dimensional turntable 2, the CCD camera 3, the endless drive rail 7 is electrically connected.
In this embodiment, bear frame 1 in establish and bear heat dissipation chamber 12 of frame 1 coaxial distribution, at least one cooling tube 13 is established to heat dissipation chamber 12 lateral wall, cooling tube 13 encircles heat dissipation chamber 12 axis and is the helical structure distribution, and cooling tube 13 both ends all are located and bear 1 up end of frame and establish connector 14.
Meanwhile, the bottom of the positioning groove 11 is provided with a guide sliding groove 14 which is distributed in parallel with the axis of the positioning groove 11, and the guide sliding groove 14 is vertically connected with the outer surface of the bearing table 8 through an auxiliary positioning mechanism.
It is emphasized that the auxiliary positioning mechanism includes a pressure sensor 15, an elastic telescopic rod 16 and a guide pulley 17, the rear end face of the elastic telescopic rod 16 is vertically connected with the outer surface of the bearing table 8 through the pressure sensor 15, the front end face is connected with the guide pulley 17, the guide pulley 17 is embedded in the guide chute 14 and is slidably connected with the guide chute 14, and the pressure sensor 15 is electrically connected with the driving circuit 10.
Further preferably, the intersection point of the optical axes of the CCD camera 3, the laser distance measuring device 4 and the cursor lamp 5 and the axis of the annular driving guide rail 7 is located at least 10 mm below the bearing rack 1.
In this embodiment, the three-dimensional turntable 2 is provided with at least one angle sensor 18, the plummer 8 is provided with at least one displacement sensor 19, and both the angle sensor 18 and the displacement sensor 19 are electrically connected with the driving circuit 10.
Further optimally, the light spot of the cursor lamp is in any one of a straight line shape and a cross shape.
Further preferably, the driving circuit is a circuit system based on any one of an industrial single chip microcomputer and a programmable controller.
This is novel carrying on in the concrete implementation, at first according to the needs of use this neotype frame that bears, three-dimensional revolving stage, the CCD camera, laser rangefinder, the cursor lamp, the linear drive guide rail, cyclic annular drive guide rail, the plummer, bear tray and drive circuit and assemble, then this is novel after will assembling is connected through the frame that bears frame and laser cutting equipment, inlay the laser cutting head in the constant head tank that bears frame one side, and inlay in cyclic annular drive guide rail through the plummer, with cyclic annular drive guide rail coaxial distribution and sliding connection, at last with this neotype cooling tube and outside cooling system intercommunication, with drive circuit and laser cutting equipment control circuit electrical connection, can accomplish this neotype needs of assembly operation.
When carrying out the laser cutting operation, at first adjust the CCD camera, laser rangefinder, cursor lamp optical axis intersects with the laser cutting head optical axis, and the nodical for cutting on the operation face, then guide the cutting route through the facula on waiting to cut the operation face by the cursor lamp, the cutting route position operation face that is guided to the facula by laser rangefinder carries out synchronous detection with this novel interval within a definite time to carry out synchronous video monitoring by the cutting behavior of CCD camera to facula position and laser cutting operation head, can accomplish the cutting prefabrication.
Accomplish and can carry out the cutting operation after prefabrication, when the cutting operation, the cutting route that is directly guided along the facula by the laser cutting head and the cutting route of procedure setting carry out the cutting operation, cutting operation face and the range finding according to laser range finder detection simultaneously, and according to range finding operation structure, interval and cutting power between through linear drive guide rail synchro-regulated laser cutting head and the cutting operation face, thereby improve the stability of cutting operation face quality, simultaneously in the cutting operation, the drive of accessible ring drive guide rail bears the frame axis and encircles the laser cutting head axis and carry out 0-360 scope rotations, thereby reach and satisfying in the cutting operation, this is novel when not influencing the cutting operation, the synchronous realization is to the needs that the cutting operation face monitored and detected and the synchro-adjustment.
The novel laser cutting device is simple in structure, flexible and convenient to use and good in universality, and on one hand, the requirements of matching assembly operation with various laser cutting can be flexibly met; on the other hand, in the cutting operation, the laser cutting operation is satisfied, and simultaneously, the synchronous adjustment of the position and the cutting power between the laser cutting equipment and the cutting operation surface is effectively realized according to the change of the operation surface of the workpiece to be cut, so that the overall quality and the efficiency of the laser cutting operation are effectively improved, and the surface quality of the laser cutting operation surface is improved.
Those skilled in the art should understand that the present invention is not limited by the above embodiments. The foregoing embodiments and description have been made only for the purpose of illustrating the principles of the invention. The present invention can be further modified and improved without departing from the spirit and scope of the present invention. Such changes and modifications are intended to be within the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (8)
1. The utility model provides a follow-up device for silicon wafer cutting laser head which characterized in that: the follow-up device for the silicon wafer cutting laser head comprises a bearing frame, a three-dimensional rotary table, a CCD camera, a laser ranging device, a cursor lamp, linear driving guide rails, at least two annular driving guide rails, bearing tables, a bearing tray and a driving circuit, wherein the cross section of the bearing frame is of an I-shaped frame structure, the left side surface and the right side surface of the bearing frame are respectively provided with one positioning groove, the axes of the positioning grooves are distributed in parallel with the axis of the bearing frame, the linear driving guide rails are respectively embedded in the side walls of the two positioning grooves and are distributed in parallel with the axes of the positioning grooves, at least two annular driving guide rails are embedded in one positioning groove and are uniformly distributed from top to bottom along the axis of the positioning groove, each annular driving guide rail is connected with the linear driving guide rails in a sliding mode through the bearing tables and are mutually and coaxially distributed, each annular driving guide rail is of a closed annular structure, and at, bear the tray and inlay in the constant head tank of opposite side to with the coaxial distribution of constant head tank, bear the tray side surface and pass through plummer linear drive guide rail sliding connection, CCD camera, laser range finder, cursor lamp all with bear the tray preceding terminal surface and be connected, and CCD camera, laser range finder, cursor lamp are articulated through three-dimensional revolving stage and bear the tray preceding terminal surface respectively, CCD camera, laser range finder, cursor lamp optical axis intersect with cyclic annular drive guide rail axis to be 10-60 contained angles, drive circuit inlays in bearing the frame to respectively with three-dimensional revolving stage, CCD camera, laser range finder, cursor lamp, linear drive guide rail, cyclic annular drive guide rail electrical connection.
2. The follow-up device for the silicon wafer cutting laser head according to claim 1, characterized in that: bear the frame in establish and bear the heat dissipation chamber of the coaxial distribution of frame, at least one cooling tube is established to heat dissipation chamber lateral wall, the cooling tube encircles heat dissipation chamber axis and is the heliciform structure and distributes, and the cooling tube both ends all are located and bear the frame up end and establish the connector tube head.
3. The follow-up device for the silicon wafer cutting laser head according to claim 1, characterized in that: the locating groove bottom establish with locating groove axis parallel distribution's direction spout, the direction spout passes through auxiliary positioning mechanism and is connected with the plummer surface is perpendicular.
4. The follow-up device for the silicon wafer cutting laser head according to claim 3, characterized in that: the auxiliary positioning mechanism comprises a pressure sensor, an elastic telescopic rod and a guide pulley, the rear end face of the elastic telescopic rod is vertically connected with the outer surface of the bearing table through the pressure sensor, the front end face of the elastic telescopic rod is connected with the guide pulley, the guide pulley is embedded in the guide sliding groove and is in sliding connection with the guide sliding groove, and the pressure sensor is electrically connected with the driving circuit.
5. The follow-up device for the silicon wafer cutting laser head according to claim 1, characterized in that: and the intersection point of the CCD camera, the laser ranging device and the optical axis of the cursor lamp and the axis of the annular driving guide rail is positioned at least 10 mm below the bearing rack.
6. The follow-up device for the silicon wafer cutting laser head according to claim 1, characterized in that: the three-dimensional rotary table is provided with at least one angle sensor, the bearing table is provided with at least one displacement sensor, and the angle sensor and the displacement sensor are electrically connected with the driving circuit.
7. The follow-up device for the silicon wafer cutting laser head according to claim 1, characterized in that: the light spot of the cursor lamp is in any one of a straight line shape and a cross shape.
8. The follow-up device for the silicon wafer cutting laser head according to claim 1, characterized in that: the driving circuit is a circuit system based on any one of an industrial single chip microcomputer and a programmable controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021520994.7U CN213560631U (en) | 2020-07-28 | 2020-07-28 | Follow-up device for silicon wafer cutting laser head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021520994.7U CN213560631U (en) | 2020-07-28 | 2020-07-28 | Follow-up device for silicon wafer cutting laser head |
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| Publication Number | Publication Date |
|---|---|
| CN213560631U true CN213560631U (en) | 2021-06-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021520994.7U Active CN213560631U (en) | 2020-07-28 | 2020-07-28 | Follow-up device for silicon wafer cutting laser head |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200324374A1 (en) * | 2019-04-12 | 2020-10-15 | Skyworks Solutions, Inc. | Method of optimizing laser cutting of wafers for producing integrated circuit dies |
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2020
- 2020-07-28 CN CN202021520994.7U patent/CN213560631U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200324374A1 (en) * | 2019-04-12 | 2020-10-15 | Skyworks Solutions, Inc. | Method of optimizing laser cutting of wafers for producing integrated circuit dies |
| US11701739B2 (en) * | 2019-04-12 | 2023-07-18 | Skyworks Solutions, Inc. | Method of optimizing laser cutting of wafers for producing integrated circuit dies |
| US20230415269A1 (en) * | 2019-04-12 | 2023-12-28 | Skyworks Solutions, Inc. | Method of optimizing laser cutting of wafers for producing integrated circuit dies |
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Address after: 214400, 1st to 2nd floors, Building 3, Xiakewan Chuangzhi Park, No. 215 Qingtong Road, Qingyang Town, Jiangyin City, Wuxi City, Jiangsu Province Patentee after: Jiangsu General Semiconductor Co.,Ltd. Country or region after: China Address before: Room a130-10, 1st floor, building 2, entrepreneurship center, No.96 Ruida Road, Zhengzhou high tech Industrial Development Zone, Henan Province, 450000 Patentee before: Henan general intelligent equipment Co.,Ltd. Country or region before: China |