CN213533429U

CN213533429U - Diode die for semiconductor device

Info

Publication number: CN213533429U
Application number: CN202022287406.6U
Authority: CN
Inventors: 不公告发明人
Original assignee: Core Semiconductor Technology Shenzhen Co ltd
Current assignee: Shenzhen shituoda Technology Co.,Ltd.
Priority date: 2020-10-15
Filing date: 2020-10-15
Publication date: 2021-06-25
Anticipated expiration: 2030-10-15

Abstract

The utility model discloses a diode mould for semiconductor device, which comprises a lower mould and an upper mould, wherein the upper wall of the lower mould is provided with a lower groove, the upper wall of the lower mould is fixedly connected with a guide pillar, the inner cavity of the lower mould is rotationally connected with a trimming mechanism and an unloading mechanism, the lower wall of the upper mould is provided with an upper groove, the upper wall of the upper mould is fixedly connected with a connecting block, the connecting block is fixedly connected with an external press machine, the inner cavity of the upper mould is fixedly connected with a pouring mechanism, the lower wall of the upper mould is provided with a guide hole, the inner cavity of the lower mould of the device is provided with a trimming mechanism and an unloading mechanism, after the forming is finished, a central column can be driven by a small motor to rotate, the side wall of the central column is provided with a blade, in the rotating process, the inner wall of a diode tube shell is trimmed, compared, the central column is erected through the piece unloading mechanism, and the taking is convenient.

Description

Diode die for semiconductor device

Technical Field

The utility model relates to a diode mould technical field specifically is a diode mould for semiconductor device.

Background

The mould is used in the industrial production to get the various moulds and tools of the required products by the methods of injection moulding, blow moulding, extrusion, die casting or forging forming, smelting, stamping, etc., in short, the mould is the tool used for making the formed article, the tool is composed of various parts, different moulds are composed of different parts, it mainly realizes the processing of the article appearance through the change of the physical state of the formed material, the diode mould is the diode tube shell forming mould, the diode tube shell is mostly made of plastic material and needs to be poured and formed, but the inner surface of the diode tube shell formed by the existing diode mould is not smooth and has burrs, and the burrs need to be trimmed when the tube core is inserted at the later stage.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a diode mould for semiconductor device to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the diode die for the semiconductor device comprises a lower die and an upper die, wherein a lower groove is formed in the upper wall of the lower die, a guide pillar is fixedly connected to the upper wall of the lower die, an inner cavity of the lower die is rotatably connected with a trimming mechanism and a piece unloading mechanism, an upper groove is formed in the lower wall of the upper die, a connecting block is fixedly connected to the upper wall of the upper die, the connecting block is fixedly connected with an external press machine, a pouring mechanism is fixedly connected to the inner cavity of the upper die, and a guide hole is formed in the lower wall of the upper die.

Preferably, the trimming mechanism comprises a small motor, a rotating shaft, a sleeve, a central column and a blade, the rotating shaft is fixedly connected to the upper wall of the lower die, the sleeve is fixedly connected to the side wall of the rotating shaft, the small motor is fixedly connected to the inner cavity of the sleeve, the central column is fixedly connected to the output end of the small motor, the blade is fixedly connected to the side wall of the central column, and the small motor is electrically connected with an external power supply.

Preferably, unload a mechanism and include connecting rod, handle and axle sleeve, the lateral wall fixedly connected with axle sleeve of bed die, the inside wall of axle sleeve rotates and is connected with the connecting rod, the lateral wall fixed connection of the lateral wall that the one end of connecting rod runs through the bed die and pivot, the other end fixedly connected with handle of connecting rod.

Preferably, the pouring mechanism comprises a pouring opening and a flow channel, the pouring opening is formed in the upper wall of the upper die, the flow channel is formed in the inner cavity of the upper die, and the pouring opening, the flow channel and the inner cavity of the upper groove are communicated with each other.

Preferably, the side wall of the lower die is fixedly connected with a fan gun rack.

Compared with the prior art, the beneficial effects of the utility model are that: the device is characterized in that an inner cavity of a lower die of the device is provided with a trimming mechanism and an unloading mechanism, after the forming is finished, the central column can be driven to rotate by a small motor, the side wall of the central column is provided with a blade, the inner wall of a diode tube shell is trimmed in the rotating process, the consumed time is short compared with manual trimming, the trimming is more finished, after the trimming is finished, a connecting rod is rotated by a handle, the connecting rod drives a rotating shaft to enable the central column to stand up with a sleeve, and the diode tube shell is sleeved on the outer wall of the central column, so that the diode tube shell is convenient to.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a top view of the lower mold of the present invention.

In the figure: the device comprises a lower die 1, an upper die 2, a lower groove 3, a guide post 4, a trimming mechanism 5, a small motor 51, a rotating shaft 52, a sleeve 53, a central post 54, a blade 55, a part unloading mechanism 6, a connecting rod 61, a handle 62, a shaft sleeve 63, an upper groove 7, a connecting block 8, a pouring mechanism 9, a pouring opening 91, a flow channel 92, a gun frame 10 and a guide hole 11.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, the present invention provides a technical solution: a diode mould for a semiconductor device comprises a lower mould 1 and an upper mould 2, wherein the upper wall of the lower mould 1 is provided with a lower groove 3, the upper wall of the lower mould 1 is fixedly connected with a guide post 4, the inner cavity of the lower mould 1 is rotatably connected with a trimming mechanism 5 and a part unloading mechanism 6, the lower wall of the upper mould 2 is provided with an upper groove 7, the upper wall of the upper mould 2 is fixedly connected with a connecting block 8, the connecting block 8 is fixedly connected with an external press, the inner cavity of the upper mould 2 is fixedly connected with a pouring mechanism 9, the lower wall of the upper mould 2 is provided with a guide hole 11, the upper mould 2 and the lower mould 1 are in positioning connection and matching through the guide post 4 and the guide hole 11, when the lower wall of the upper mould 2 is superposed with the upper wall of the lower mould 1, the upper groove 7 and the lower groove 3 form a cavity, a solution is poured into the cavity through the pouring mechanism 9 for forming, compared with manual trimming, the time consumption is short, the trimming is more finished, and the unloading mechanism 6 enables the unloading to be more convenient and faster.

Specifically, the trimming mechanism 5 comprises a small motor 51, a rotating shaft 52, a sleeve 53, a central column 54 and a blade 55, the rotating shaft 52 is fixedly connected to the upper wall of the lower die 1, the sleeve 53 is fixedly connected to the side wall of the rotating shaft 52, the small motor 51 is fixedly connected to the inner cavity of the sleeve 53, the central column 54 is fixedly connected to the output end of the small motor 51, the blade 55 is fixedly connected to the side wall of the central column 54, the small motor 51 is electrically connected with an external power supply, after the diode tube shell is formed, burrs are generated on the inner wall of the tube shell more or less, at the moment, the small motor 51 is electrified to drive the central column 54 to rotate, so that the blade 55 on the side wall of the central column 54 trims the inner wall of the tube shell.

Specifically, unload a mechanism 6 and include connecting rod 61, handle 62 and axle sleeve 63, the lateral wall fixedly connected with axle sleeve 63 of bed die 1, the inside wall of axle sleeve 63 rotates and is connected with connecting rod 61, the lateral wall of the lateral wall that the one end of connecting rod 61 runs through bed die 1 and the lateral wall fixed connection of pivot 52, the other end fixedly connected with handle 62 of connecting rod 61, through rotating handle 62, drive connecting rod 61 and pivot 52, sleeve 53 stands under the effect of pivot 52, it is more convenient to make it get a piece.

Particularly, the pouring mechanism 9 comprises a pouring opening 91 and a flow channel 92, the pouring opening 91 is formed in the upper wall of the upper die 2, the flow channel 92 is formed in the inner cavity of the upper die 2, the pouring opening 91, the flow channel 92 and the inner cavity of the upper groove 7 are communicated with each other, and the pouring opening 91 is conical, so that the pouring of the solution is more convenient.

Specifically, a blower gun holder 10 is fixedly connected to the side wall of the lower mold 1, and the blower gun holder 10 is used for fixing an external blower gun, so that the blower gun can be taken out to clean the cavity after each molding is finished, and preparation is made for the next molding.

The working principle is as follows: go up mould 2 and bed die 1 and carry out the location connection cooperation through guide pillar 4 and guide hole 11, transport two moulds to the press board on, go up module 2 through connecting block 8 and press machine horn fixed connection, it waters solution to form in the die cavity with lower recess 3 through pouring mouth 91 upper groove 7, when its solution cooling fixed shaping, small-size motor 51 circular telegram, center post 54 is rotatory, make the blade 55 of center post 54 lateral wall carry out the deburring to the tube shell inner wall, make its tube shell inner wall more smooth, can not produce the separation when convenient later stage inserts the tube core, after the edging, go up mould 2 and rise through the press, through turning handle 62, drive connecting rod 61 and pivot 52, sleeve 53 stands under the effect of pivot 52, make it more convenient to get it, later use the air gun to clean the die cavity, prepare next shaping.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A diode mould for semiconductor device, includes bed die (1) and mould (2), its characterized in that: the upper wall of lower mould (1) has been seted up lower groove (3), the upper wall fixedly connected with guide pillar (4) of lower mould (1), the inner chamber of lower mould (1) rotates and is connected with deburring mechanism (5) and unloads a mechanism (6), upper groove (7) have been seted up to the lower wall of last mould (2), the upper wall fixedly connected with connecting block (8) of going up mould (2), connecting block (8) and external press fixed connection, the inner chamber fixedly connected with of going up mould (2) pours mechanism (9), guide hole (11) have been seted up to the lower wall of going up mould (2).

2. The diode die for a semiconductor device according to claim 1, wherein: trimming mechanism (5) includes small-size motor (51), pivot (52), sleeve (53), center post (54) and blade (55), the upper wall fixedly connected with pivot (52) of bed die (1), the lateral wall fixedly connected with sleeve (53) of pivot (52), the inner chamber fixedly connected with small-size motor (51) of sleeve (53), the output fixedly connected with center post (54) of small-size motor (51), the lateral wall fixedly connected with blade (55) of center post (54), small-size motor (51) are connected with external power source electricity.

3. The diode die for a semiconductor device according to claim 1, wherein: unload a mechanism (6) and include connecting rod (61), handle (62) and axle sleeve (63), the lateral wall fixedly connected with axle sleeve (63) of bed die (1), the inside wall of axle sleeve (63) rotates and is connected with connecting rod (61), the lateral wall fixed connection of the lateral wall that the one end of connecting rod (61) runs through bed die (1) and pivot (52), the other end fixedly connected with handle (62) of connecting rod (61).

4. The diode die for a semiconductor device according to claim 1, wherein: the pouring mechanism (9) comprises a pouring opening (91) and a flow channel (92), the pouring opening (91) is formed in the upper wall of the upper die (2), the flow channel (92) is formed in the inner cavity of the upper die (2), and the pouring opening (91), the flow channel (92) and the inner cavity of the upper groove (7) are communicated with each other.

5. The diode die for a semiconductor device according to claim 1, wherein: the side wall of the lower die (1) is fixedly connected with a wind gun rack (10).