CN213522776U

CN213522776U - Multilayer semiconductor printed integrated circuit board

Info

Publication number: CN213522776U
Application number: CN202022368364.9U
Authority: CN
Inventors: 尹苏敏; 叶陆圣; 游清远
Original assignee: Shengweice Electronics Jiangsu Co ltd
Current assignee: Shengweice Electronics Jiangsu Co ltd
Priority date: 2020-10-22
Filing date: 2020-10-22
Publication date: 2021-06-22
Anticipated expiration: 2030-10-22

Abstract

The utility model discloses a multilayer semiconductor printed integrated circuit board, which comprises a base, wherein a containing box is fixedly arranged at the top of the base, a mounting box is fixedly arranged inside the containing box, one end of the mounting box penetrates through the side wall of the containing box and extends to the outside of the containing box, two clamping blocks are symmetrically distributed, a sliding block is movably connected inside the mounting box, a push rod is fixedly connected at the right side of the sliding block, the spring pushes the sliding block to slide inside the mounting box through the stretching force by pulling off a positioning pin, so that the push plate is controlled to be pushed by the push rod, the semiconductor circuit board is pushed to be used from the inside of the containing box, when the use is not needed, the semiconductor circuit board is pushed, so that the push rod and the sliding block are pushed to move leftwards, the spring is extruded, the first limiting hole and the second limiting hole correspond, the positioning pin, the semiconductor circuit board is placed in the storage box for storage and protection.

Description

Multilayer semiconductor printed integrated circuit board

Technical Field

The utility model belongs to the technical field of circuit board equipment, concretely relates to multilayer semiconductor printed integrated circuit board.

Background

The integrated circuit board is made up by using semiconductor production process, on a small single crystal silicon chip several transistors, resistors and capacitors are made, and according to the multilayer wiring or tunnel wiring method the components are combined into a complete electronic circuit.

At present, the conventional semiconductor circuit board is generally outside for a long time, is inconvenient to store, cannot well store and protect the semiconductor circuit board, and is easy to damage the semiconductor circuit board, so that a multilayer semiconductor printed integrated circuit board is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a multilayer semiconductor printed integrated circuit board to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a multilayer semiconductor printed integrated circuit board, includes the base, base top fixed mounting has the containing box, the inside fixed mounting of containing box has the install bin, install bin one end runs through the containing box lateral wall and extends to the outside fixedly connected with fixture block of containing box, and the fixture block symmetric distribution is provided with two, the inside swing joint of install bin has the slider, slider right side fixedly connected with push rod, push rod one end runs through install bin lateral wall fixedly connected with push pedal, push pedal one side fixedly connected with mounting panel, mounting panel one side is provided with the aluminium lamination, and the aluminium lamination is provided with two, two be provided with a plurality of semiconductor circuit boards between the aluminium lamination, slider left side fixedly connected with gag lever post, gag lever post one end runs through the install bin lateral wall and extends.

Preferably, the base is provided with a plurality of first limiting holes, the limiting rod is provided with a second limiting hole, and the first limiting hole and the second limiting hole are internally provided with positioning pins.

Preferably, the side wall of the clamping block is rotatably connected with a roller.

Preferably, one side of the containing box is provided with a through hole.

Preferably, the side wall of the mounting plate is provided with a clamping groove.

Preferably, springs are arranged on two sides of the limiting rod, and two ends of each spring are fixedly connected with the left side wall of the installation box and the right side wall of the sliding block respectively.

Preferably, the through hole is formed in the right side wall of the installation box, and the length of the sliding block is larger than the aperture of the through hole.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) this multilayer semiconductor printed integrated circuit board, when semiconductor circuit board uses, through pulling out the locating pin, the spring passes through the telescopic power and promotes the slider and slide in the install bin inside, thereby control push rod promotes the push pedal, and then realize pushing out the use with semiconductor circuit board from the containing box is inside, when need not use, promote semiconductor circuit board, thereby promote push rod and slider and remove left, the extrusion spring, make the spacing hole of first spacing hole and second correspond, the locating pin is inserted again, carry out spacing fixed to the gag lever post, place semiconductor circuit board into the containing box inside and accomodate the protection.

(2) This multilayer semiconductor printed circuit board through the gyro wheel on fixture block and the fixture block, is convenient for inject the removal orbit of gag lever post, takes place the position deviation when avoiding the spacing piece to remove, causes first spacing hole and the spacing hole of second not to correspond, influences its spacingly, through set up the draw-in groove on the mounting panel, is convenient for install semiconductor circuit board on the mounting panel.

Drawings

Fig. 1 is a schematic view of a three-dimensional structure of a semiconductor circuit board according to the present invention;

fig. 2 is a main sectional view of the present invention;

fig. 3 is a cross-sectional top view of the present invention;

fig. 4 is an enlarged view of a structure in fig. 3 according to the present invention.

In the figure: 1. a base; 2. a storage box; 3. installing a box; 4. a clamping block; 5. a slider; 6. a push rod; 7. pushing the plate; 8. mounting a plate; 9. an aluminum layer; 10. a semiconductor circuit board; 11. a limiting rod; 12. a spring; 13. a first limit hole; 14. a second limiting hole; 15. positioning pins; 16. and a roller.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a multilayer semiconductor printed circuit board, which comprises a base 1, a storage box 2 fixedly mounted on the top of the base 1, a mounting box 3 fixedly mounted inside the storage box 2, a clamping block 4 fixedly connected to one end of the mounting box 3 extending through the sidewall of the storage box 2 to the outside of the storage box 2, two clamping blocks 4 are symmetrically distributed, a sliding block 5 is movably connected in the installation box 3, a push rod 6 is fixedly connected on the right side of the sliding block 5, one end of the push rod 6 penetrates through the side wall of the installation box 3 and is fixedly connected with a push plate 7, one side of the push plate 7 is fixedly connected with an installation plate 8, one side of the installation plate 8 is provided with an aluminum layer 9, and aluminium lamination 9 is provided with two, is provided with a plurality of semiconductor circuit board 10 between two aluminium laminations 9, and slider 5 left side fixedly connected with

gag lever post

11, 11 one end of gag lever post run through the 3 lateral walls of installing bin and extend to the outside.

In this embodiment, preferably, the base 1 is provided with a plurality of first limiting holes 13, the limiting rod 11 is provided with a second limiting hole 14, and the first limiting holes 13 and the second limiting holes 14 are internally provided with positioning pins 15, so that the limiting rod 11 is fixed and limited by matching the first limiting holes 13, the second limiting holes 14 and the positioning pins 15, and when the limiting rod 11 is prevented from sliding, the semiconductor circuit board 10 is pushed out of the storage box 2 by the elastic force of the spring 12.

In this embodiment, preferably, the side wall of the clamping block 4 is rotatably connected with the roller 16, and by arranging the roller 16, the friction force between the clamping block 4 and the limiting rod 11 is reduced, so that the limiting rod 11 can slide between the clamping blocks 4 conveniently.

In this embodiment, it is preferable that a through hole is formed in one side of the storage box 2, and the semiconductor circuit board 10 is conveniently stored in the storage box 2 for storage and protection by the through hole.

In this embodiment, preferably, the side wall of the mounting plate 8 is provided with a clamping groove, so that the semiconductor circuit board 10 can be conveniently mounted and dismounted on the mounting plate 8.

In this embodiment, preferably, springs 12 are disposed on two sides of the limiting rod 11, two ends of each of the two springs 12 are respectively fixedly connected to the left side wall of the mounting box 3 and the right side wall of the slider 5, and by disposing the springs 12, when the positioning pin 15 is pulled out, the springs 12 can push out the semiconductor circuit board 10 for use through the stretching force.

In this embodiment, preferably, the through hole has been seted up to install bin 3 right side wall, and the length of slider 5 is greater than the through hole aperture, avoids slider 5 length to be less than the through hole aperture, and slider 5 follows the inside roll-off of install bin 3.

The utility model discloses a theory of operation and use flow: when the device is used, a worker pulls the positioning pin 15 down, the spring 12 pushes the sliding block 5 to slide in the installation box 3 through the telescopic force, so that the push rod 6 is controlled to push the push plate 7, the semiconductor circuit board 10 is pushed out of the containing box 2 for use, when the device is not needed to be used, the worker pushes the semiconductor circuit board 10, so that the push rod 6 and the sliding block 5 are pushed to move leftwards, the spring 12 is extruded, the first limiting hole 13 and the second limiting hole 14 correspond to each other, the positioning pin 15 is inserted to limit and fix the limiting rod 11, the semiconductor circuit board 10 is placed in the containing box 2 for containing and protecting, the moving track of the limiting rod 11 is conveniently limited through the clamping block 4 and the roller 16 on the clamping block 4, the situation that the position of the limiting block deviates when the limiting block moves to cause the first limiting hole 13 and the second limiting hole 14 not to correspond to influence the limiting position is avoided, and the limiting is realized by arranging, the semiconductor circuit board 10 is convenient for workers to install and remove the semiconductor circuit board 10 on and from the mounting plate 8, and the semiconductor circuit board 10 is convenient to protect from being damaged by arranging the aluminum layers 9 on the top and the bottom of the semiconductor circuit board 10.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A multilayer semiconductor printed integrated circuit board comprising a base (1), characterized in that: the storage box (2) is fixedly mounted at the top of the base (1), the mounting box (3) is fixedly mounted inside the storage box (2), one end of the mounting box (3) penetrates through the side wall of the storage box (2) and extends to the outside of the storage box (2) to be fixedly connected with two clamping blocks (4), the two clamping blocks (4) are symmetrically distributed, the inside of the mounting box (3) is movably connected with a sliding block (5), the right side of the sliding block (5) is fixedly connected with a push rod (6), one end of the push rod (6) penetrates through the side wall of the mounting box (3) to be fixedly connected with a push plate (7), one side of the push plate (7) is fixedly connected with a mounting plate (8), one side of the mounting plate (8) is provided with an aluminum layer (9), the two aluminum layers (9) are provided with two, a plurality of semiconductor circuit boards (10) are, one end of the limiting rod (11) penetrates through the side wall of the installation box (3) and extends to the outside.

2. A multilayer semiconductor printed integrated circuit board according to claim 1, wherein: a plurality of first limiting holes (13) are formed in the base (1), a second limiting hole (14) is formed in the limiting rod (11), and positioning pins (15) are arranged in the first limiting holes (13) and the second limiting holes (14).

3. A multilayer semiconductor printed integrated circuit board according to claim 1, wherein: the side wall of the clamping block is rotatably connected with a roller (16).

4. A multilayer semiconductor printed integrated circuit board according to claim 1, wherein: one side of the containing box (2) is provided with a through opening.

5. A multilayer semiconductor printed integrated circuit board according to claim 1, wherein: the side wall of the mounting plate (8) is provided with a clamping groove.

6. A multilayer semiconductor printed integrated circuit board according to claim 1, wherein: and springs (12) are arranged on two sides of the limiting rod (11), and two ends of each spring (12) are fixedly connected with the left side wall of the installation box (3) and the right side wall of the sliding block (5) respectively.

7. A multilayer semiconductor printed integrated circuit board according to claim 1, wherein: the right side wall of the installation box (3) is provided with a through hole, and the length of the sliding block (5) is larger than the aperture of the through hole.