CN213522512U - Third-order HDI high density lamination circuit board - Google Patents

Abstract

The utility model discloses a third-order HDI high density lamination circuit board, including roof, shock attenuation board, bottom plate, fin, the top equidistance fixed mounting of bottom plate has five group's springs, the top fixed mounting of spring has the shock attenuation board, the top both sides fixed mounting of shock attenuation board has the mount pad, the top fixed mounting of mount pad has the spout, the inboard movable mounting of spout has the current conducting plate, the bottom welding of roof has the circuit board, the fin is installed through the bolt in the top of roof. The utility model discloses an install the spout at the top of shock attenuation board, the installation of circuit board of can being convenient for, the spout can be fixed spacingly to the both sides of circuit board, and simple to operate is high-efficient, can not cause wearing and tearing and damage to the important part of circuit board, not only can guarantee the normal use of circuit board, still does benefit to the later stage and maintains the repair to equipment, has reduced the work load of operation maintenance.

Description

Third-order HDI high density lamination circuit board

Technical Field

The utility model relates to a high density lamination circuit board technical field specifically is a third-order HDI high density lamination circuit board.

Background

Along with the progress of science and technology, the application of electronic equipment is more and more extensive, and the circuit board has irreplaceable status as the main body frame of electronic equipment internal component, and traditional circuit board is bulky, and the integration level is low, has not only occupied the inside valuable space of electronic equipment, and the function of realization is still less, and is not perfect enough, but along with the development of science and technology, the circuit board has been dwindled gradually, and the pluralism has not only made huge contribution for the volume reduction of electronic equipment, has also given more functions for electronic equipment, in order to make the circuit board can be more stable when using high-efficiently, we propose a three-order HDI high density build-up circuit board.

The existing circuit board has the following defects:

1. the existing circuit board is usually positioned by penetrating bolts through the circuit board, so that the circuit board is irreversibly abraded and possibly cracked because the strength is not well controlled;

2. when the existing circuit board is vibrated, the printed circuit on the surface of the circuit board and the electronic element are vibrated, and the vibration can cause the installation and connection of the electronic element to be loosened, so that the performance and the use of equipment are influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a third-order HDI high density lamination circuit board to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a three-order HDI high-density laminated circuit board comprises a top plate, a damping plate, a bottom plate and a heat sink, the bottom of the bottom plate is fixedly provided with a rubber pad, the top of the bottom plate is fixedly provided with five groups of springs at equal intervals, the top of the spring is fixedly provided with a damping plate, the bottom of the damping plate is equidistantly welded with a limiting sleeve, the limiting sleeve is clamped and connected with the top of the spring, mounting seats are fixedly arranged on two sides of the top of the damping plate, the top of the mounting seat is fixedly provided with a chute, the inner side of the chute is movably provided with a conductive plate, the two sides in the conductive plate are fixedly provided with a thread cylinder extending out of the top, the top of the thread cylinder is provided with a top plate through a bolt, the heat dissipation structure is characterized in that a circuit board is welded at the bottom of the top plate, a heat dissipation fin is installed at the top of the top plate through a bolt, and heat conduction columns extending to the interior of the circuit board are installed on two sides of the bottom of the heat dissipation fin.

Preferably, mounting holes are formed in two sides of the interior of the circuit board, and a waterproof layer is fixedly mounted on the outer side of the circuit board.

Preferably, the inside of spout is equipped with the screw thread, and the internally mounted of spout has spacing bolt.

Preferably, the two sides of the inside of the bottom plate are provided with positioning bolts through thread structures, and the outer sides of the positioning bolts are sleeved with gaskets.

Preferably, the two sides of the current-conducting plate are fixedly provided with clamping blocks, and the clamping blocks are clamped and connected with the sliding grooves.

Preferably, the top of fin equidistance welding has the copper pipe, and the bottom fixed mounting of copper pipe has fixed cover.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses an install the spout at the top of shock attenuation board, the installation of circuit board of can being convenient for, the spout can be fixed spacingly to the both sides of circuit board, and simple to operate is high-efficient, can not cause wearing and tearing and damage to the important part of circuit board, not only can guarantee the normal use of circuit board, still does benefit to the later stage and maintains the repair to equipment, has reduced the work load of operation maintenance.

2. The utility model discloses an install the spring at the top of bottom plate, utilize the spring to carry out elastic connection with shock attenuation board and bottom plate, and then when the bottom plate received vibrations, the spring utilized the elasticity of self to offset and cushion the vibrations that come to the bottom plate transmission, reduced the vibrations dynamics that the bottom plate transmitted to the circuit board, can effectually prevent that the circuit board from rocking and leading to unable normal use because of receiving the vibration.

Drawings

Fig. 1 is a schematic front internal structure diagram of the present invention;

FIG. 2 is a schematic view of the front external structure of the present invention;

FIG. 3 is a schematic side view of the external structure of the present invention;

fig. 4 is a schematic view of the top view of the external structure of the present invention.

In the figure: 1. a top plate; 101. a circuit board; 102. mounting holes; 103. a waterproof layer; 2. a damper plate; 201. a mounting seat; 202. a chute; 203. a limiting sleeve; 3. a base plate; 301. a rubber pad; 302. a spring; 303. positioning the bolt; 4. a conductive plate; 401. a threaded barrel; 402. a clamping block; 5. a heat sink; 501. a heat-conducting column; 502. copper tubing.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-4, the present invention provides an embodiment: a three-order HDI high-density laminated circuit board comprises a top plate 1, a damping plate 2, a bottom plate 3 and a radiating fin 5, wherein a rubber pad 301 is fixedly installed at the bottom of the bottom plate 3, the bottom plate 3 can provide an installation position for installing a circuit board 101, the rubber pad 301 can provide certain cushioning capacity for the bottom plate 3 and reduce the pressure on the bottom when the bottom plate 3 is installed, five groups of springs 302 are fixedly installed at the top of the bottom plate 3 at equal intervals, the springs 302 can utilize the elasticity of the springs to buffer and damp the vibration transmitted by the bottom plate 3, the damping plate 2 is fixedly installed at the top of the springs 302, the damping plate 2 can provide an installation position for a sliding chute 202, limiting sleeves 203 are welded at the bottom of the damping plate 2 at equal intervals, the limiting sleeves 203 are connected with the top of the springs 302 in a clamping manner, the limiting sleeves 203 can provide limiting for the top of the springs 302, the stability of the springs 302 is ensured, and installing seats, the mounting seat 201 can provide a mounting position for the sliding groove 202, the sliding groove 202 is fixedly mounted at the top of the mounting seat 201, the sliding groove 202 can be connected with a clamping block 402 in a clamping manner so as to fixedly mount the conductive plate 4, the conductive plate 4 is movably mounted at the inner side of the sliding groove 202 and can provide a mounting position for the top plate 1 and is connected with the circuit board 101 so as to enable the circuit board 101 to be communicated with an external circuit, the threaded cylinders 401 extending out of the top are fixedly mounted at two inner sides of the conductive plate 4, the threaded cylinders 401 can be connected with bolts through threaded structures so as to fixedly mount the top plate 1, the top plate 1 is mounted at the top of the threaded cylinders 401 through bolts, the top plate 1 can provide a mounting position for the circuit board 101, the circuit board 101 is welded at the bottom of the top plate 1, the circuit board 101 can be connected, the top of roof 1 is passed through the bolt and is installed fin 5, and fin 5 can provide the position of installation for copper pipe 502 and heat dissipation post, and then provides the heat dissipation for circuit board 101, and the bottom both sides of fin 5 are installed and are extended to the inside heat conduction post 501 of circuit board 101, and heat conduction post 501 can be connected the contact with circuit board 101, and then distributes away to copper pipe 502 with the heat conduction of circuit board 101 inside to reach the purpose to circuit board 101 cooling.

Further, the inside both sides of circuit board 101 are equipped with mounting hole 102, and mounting hole 102 can be convenient for the wire to pass, and then carries out fixed connection to circuit board 101, and the outside fixed mounting of circuit board 101 has waterproof layer 103, and waterproof layer 103 adopts the nanometer material coating, can increase the hydrophobicity on circuit board 101 surface effectively, prevents that circuit board 101 surface from adhering to steam and making circuit board 101 corrode.

Further, the inside of spout 202 is equipped with the screw thread, and the internally mounted of spout 202 has spacing bolt, can make spacing bolt and spout 202 be connected fixedly through the screw thread, and then carries out spacing fixedly to one side of current-conducting plate 4.

Further, positioning bolt 303 is installed through helicitic texture in the inside both sides of bottom plate 3, and positioning bolt 303's outside cover has the gasket, and positioning bolt 303 can run through bottom plate 3, makes bottom plate 3 install, and the gasket can reduce positioning bolt 303 to the pressure at bottom plate 3 top, prevents that positioning bolt 303 from causing the damage to bottom plate 3.

Further, the two sides of the conductive plate 4 are fixedly mounted with the fixture blocks 402, and the fixture blocks 402 are connected with the sliding grooves 202 in a clamping manner, so that the conductive plate 4 can be slidably clamped inside the sliding grooves 202 by the fixture blocks 402, and the conductive plate 4 can move inside the sliding grooves 202.

Further, the top equidistance welding of fin 5 has copper pipe 502, and copper pipe 502 can increase heat radiating area, promotes the radiating effect to in cooling down circuit board 101, and the bottom fixed mounting of copper pipe 502 has fixed cover, and fixed cover can be installed fixedly to copper pipe 502, has guaranteed the stability of copper pipe 502 installation.

The working principle is as follows: pass bottom plate 3 through positioning bolt 303, with bottom plate 3 fixed back, slide the inside of going into spout 202 with the fixture block 402 of current conducting plate 4 both sides card, make current conducting plate 4 drive roof 1 and circuit board 101 slidable mounting in spout 202, when circuit board 101 moves, the heat that circuit board 101 sent conducts to fin 5 through heat conduction post 501, the heat on fin 5 conducts to giving off naturally in the copper pipe 502 again, and then make circuit board 101 cool down, prevent that circuit board 101 high temperature from causing equipment to shut down, when bottom plate 3 receives vibrations, spring 302 can cushion the shock attenuation to vibrations, and then reduce the vibrations that circuit board 101 received, prevent that the inside electrical components of circuit board 101 from receiving the normal use that damages the influence equipment, the stability of equipment when moving has been guaranteed.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (6)

1. The utility model provides a third-order HDI high density lamination circuit board, includes roof (1), damper plate (2), bottom plate (3), fin (5), its characterized in that: the bottom fixed mounting of bottom plate (3) has rubber pad (301), the top equidistance fixed mounting of bottom plate (3) has five group spring (302), the top fixed mounting of spring (302) has shock attenuation board (2), the bottom equidistance welding of shock attenuation board (2) has stop collar (203), and stop collar (203) and the top block of spring (302) are connected, the top both sides fixed mounting of shock attenuation board (2) has mount pad (201), the top fixed mounting of mount pad (201) has spout (202), the inboard movable mounting of spout (202) has current conducting plate (4), the inside both sides fixed mounting of current conducting plate (4) has a screw thread section of thick bamboo (401) that extend the top, roof (1) is installed through the bolt in the top of screw thread section of thick bamboo (401), the bottom welding of roof (1) has circuit board (101), the top of roof (1) is installed fin (5) through the bolt, heat conduction post (501) that extend to circuit board (101) inside are installed to the bottom both sides of fin (5).

2. The three-order HDI high-density build-up circuit board of claim 1, characterized in that: mounting holes (102) are formed in two sides of the interior of the circuit board (101), and a waterproof layer (103) is fixedly mounted on the outer side of the circuit board (101).

3. The three-order HDI high-density build-up circuit board of claim 1, characterized in that: the inside of spout (202) is equipped with the screw thread, and the internally mounted of spout (202) has spacing bolt.

4. The three-order HDI high-density build-up circuit board of claim 1, characterized in that: positioning bolts (303) are installed on two sides of the inner portion of the bottom plate (3) through thread structures, and gaskets are sleeved on the outer sides of the positioning bolts (303).

5. The three-order HDI high-density build-up circuit board of claim 1, characterized in that: clamping blocks (402) are fixedly mounted on two sides of the conductive plate (4), and the clamping blocks (402) are connected with the sliding grooves (202) in a clamping mode.

6. The three-order HDI high-density build-up circuit board of claim 1, characterized in that: copper pipes (502) are welded on the top of the radiating fin (5) at equal intervals, and fixed sleeves are fixedly mounted at the bottoms of the copper pipes (502).

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