CN213520390U - Signal module differential pair arrangement structure of high-speed I/O connector - Google Patents
Signal module differential pair arrangement structure of high-speed I/O connector Download PDFInfo
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- CN213520390U CN213520390U CN202022696684.7U CN202022696684U CN213520390U CN 213520390 U CN213520390 U CN 213520390U CN 202022696684 U CN202022696684 U CN 202022696684U CN 213520390 U CN213520390 U CN 213520390U
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Abstract
The utility model relates to a signal module difference pair arrangement structure of high-speed IO connector, its characterized in that: the signal molding differential pair at least comprises a fixed end at one side and a contact end at one side; the fixed end is connected with the contact end through an arc-shaped section; in the monolithic structure of the signal terminal, adjacent differential pairs in the same plane are in a truss structure formed by arcs; an air groove is arranged in the middle of the adjacent differential pairs in the plane, and the air groove is arranged between the signal terminals in an arc shape along the extending direction of the arc-shaped connecting section in the single signal terminal; the molded insulator is provided with a signal molded differential pair, and the fixed end of the signal molded differential pair is connected with the contact end through an arc-shaped section; meanwhile, the air grooves on the molded insulator are also distributed in an arc shape, so that on one hand, materials are saved, the influence of crosstalk is improved, high-frequency transmission signals can be realized, and the loss is reduced.
Description
Technical Field
The utility model relates to a signal module difference technical field especially relates to a signal module difference of high-speed IO connector is to arrangement structure.
Background
The current high-speed I/O connector is mainly used for transmitting high-speed and high-quality signals and mainly comprises a shell and a signal module, wherein the signal module comprises an insulator and a differential pair fixed on the insulator; the general insulator structure is provided with a plurality of intermittent air grooves, but the differential pairs are generally distributed on the inner sides of the air grooves, the structure for connecting the contact terminal and the grounding terminal on the differential pairs generally adopts a right-angle triangular connecting structure, the structure of the air grooves on the insulator also adopts a plurality of independent right-angle line structures, the length of the connecting structure is increased due to the structure, the arrangement is inconvenient, the loss is increased, and the crosstalk influence is large.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide a signal module difference of high-speed IO connector is to arrangement structure, can solve the difference of general high-speed IO connector signal module and to the structure, the loss is high, the big problem of crosstalk influence.
In order to solve the technical problem, the utility model adopts the technical scheme that: a signal modular differential pair arrangement for a high speed I/O connector includes a signal molded differential pair and a ground terminal; the signal molding differential pair and the grounding terminal are formed in an overlapped mode; the innovation points are as follows:
the signal molded differential pair comprises a signal terminal and a molded insulator, wherein the signal terminal is provided with two pieces which are stacked through the molded insulator, and the signal terminal is arranged in the molded insulator; the signal terminals are stacked with a grounding terminal by adopting two pieces to form a signal molding differential pair, and the two pieces of signal terminals are arranged adjacently;
the signal molding differential pair at least comprises a fixed end at one side and a contact end at one side; the fixed end is connected with the contact end through an arc-shaped section;
in the monolithic structure of the signal terminal, adjacent differential pairs in the same plane are in a truss structure formed by arcs; an air groove is arranged in the middle of the adjacent differential pairs in the plane, and the air groove is arranged between the signal terminals in an arc shape along the extending direction of the arc-shaped connecting section in the signal terminal of the single chip.
Furthermore, positioning columns and positioning holes for the adjacent molded insulators to be in layered stacking positioning fit are arranged on the two side surfaces of the molded insulators.
Furthermore, the air groove extends from the fixing end to the contact end, and is gradually separated into a plurality of air groove units in point-break connection by one air groove unit.
The utility model has the advantages that:
1) in the utility model, the fixed end and the contact end of the signal molding differential pair are connected through the arc-shaped section by arranging the signal molding differential pair on the molding insulator; meanwhile, the air grooves on the molded insulator are also distributed in an arc shape, so that on one hand, materials are saved, the influence of crosstalk is improved, high-frequency transmission signals can be realized, and the loss is reduced.
2) The utility model discloses well air groove structure that lies in on the monolithic signal terminal adopts the continuous arc structure of discontinuous, and the air groove extends from monolithic signal terminal from fixed end to contact jaw direction, separates into the influence that this kind of cloth of air groove unit of a plurality of dot-break connections can effectively improve and crosstalk gradually by an air groove unit.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Fig. 1 is a schematic diagram of the signal module differential pair arrangement structure of the high-speed I/O connector of the present invention.
Fig. 2 is a signal terminal single-chip structure diagram of a signal module differential pair arrangement mechanism of the high-speed I/O connector according to the present invention.
Fig. 3 is an internal diagram of the signal terminal of the signal module differential pair arrangement structure of the high-speed I/O connector of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
A signal module differential pair arrangement of a high-speed I/O connector as shown in fig. 1 to 3 includes a signal molded differential pair 1 and a ground terminal; the signal molded differential pair 1 is stacked with a ground terminal.
The signal molded differential pair 1 comprises a signal terminal 11 and a molded insulator 12, wherein the signal terminal 1 is provided with two pieces which are stacked through the molded insulator, and the signal terminal 11 is arranged in the molded insulator; the signal terminals 11 are stacked with a ground terminal using two pieces to form the signal molded differential pair 1, and the two pieces of signal terminals are disposed adjacently.
The signal molded differential pair 1 has at least one side fixed end 13 and one side contact end 14; the fixed end 13 is connected to the contact end 14 via an arc-shaped section 15.
In the monolithic structure of the signal terminal 11, adjacent differential pairs in the same plane are in a truss structure formed by arcs; air grooves 16 are provided in the middle of adjacent differential pairs in the plane, and the air grooves 16 are provided between the signal terminals 11 in an arc shape along the extending direction of the arc-shaped connecting sections 15 in the signal terminals 11 of one piece.
The molded insulator 12 is provided on both side surfaces thereof with positioning posts and positioning holes for the adjacent molded insulators 12 to be positioned in a layered stack.
The air slot 16 extends from the fixed end to the contact end, and is gradually separated into a plurality of air slot units in point-break connection by one air slot unit.
The utility model discloses a theory of operation is: by molding the differential pair on the molded insulator by the signal, connecting the contact end and the fixed end of the molded differential pair on the molded insulator by the arc-shaped connecting section, and simultaneously adopting the arc-shaped distribution mode for the air slot on the molded insulator, on one hand, the material is saved, the influence of crosstalk is improved, the high-frequency signal transmission can be realized, and the loss is reduced.
It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (3)
1. A signal modular differential pair arrangement for a high speed I/O connector includes a signal molded differential pair and a ground terminal; the signal molding differential pair and the grounding terminal are formed in an overlapped mode; the method is characterized in that:
the signal molded differential pair comprises a signal terminal and a molded insulator, wherein the signal terminal is provided with two pieces which are stacked through the molded insulator, and the signal terminal is arranged in the molded insulator; the signal terminals are stacked with a grounding terminal by adopting two pieces to form a signal molding differential pair, and the two pieces of signal terminals are arranged adjacently;
the signal molding differential pair at least comprises a fixed end at one side and a contact end at one side; the fixed end is connected with the contact end through an arc-shaped section;
in the monolithic structure of the signal terminal, adjacent differential pairs in the same plane are in a truss structure formed by arcs; an air groove is arranged in the middle of the adjacent differential pairs in the plane, and the air groove is arranged between the signal terminals in an arc shape along the extending direction of the arc-shaped connecting section in the signal terminal of the single chip.
2. The differential pair arrangement of signal modules for a high speed I/O connector of claim 1, wherein: and positioning columns and positioning holes for the adjacent molded insulators to be in layered stacking positioning fit are arranged on the two side surfaces of the molded insulators.
3. The differential pair arrangement of signal modules for a high speed I/O connector of claim 1, wherein: the air groove extends from the fixing end to the contact end direction, and is gradually separated into a plurality of air groove units in point-break connection by one air groove unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022696684.7U CN213520390U (en) | 2020-11-19 | 2020-11-19 | Signal module differential pair arrangement structure of high-speed I/O connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022696684.7U CN213520390U (en) | 2020-11-19 | 2020-11-19 | Signal module differential pair arrangement structure of high-speed I/O connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213520390U true CN213520390U (en) | 2021-06-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022696684.7U Active CN213520390U (en) | 2020-11-19 | 2020-11-19 | Signal module differential pair arrangement structure of high-speed I/O connector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213520390U (en) |
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2020
- 2020-11-19 CN CN202022696684.7U patent/CN213520390U/en active Active
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