CN213507261U

CN213507261U - Electroplating device

Info

Publication number: CN213507261U
Application number: CN202022621040.1U
Authority: CN
Inventors: 余仁水
Original assignee: Guangdong Prosper Automation Equipment Co ltd
Current assignee: Guangdong Prosper Automation Equipment Co ltd
Priority date: 2020-11-13
Filing date: 2020-11-13
Publication date: 2021-06-22
Anticipated expiration: 2030-11-13

Abstract

The utility model discloses an electroplating device, which comprises a cathode conductive copper flat, a guide rail and a plurality of electroplating mechanisms positioned between the cathode conductive copper flat and the guide rail, wherein each electroplating mechanism comprises a conductive block, a steel guide wheel, a transmission part and a clamp; and a first interlocking plate and a second interlocking plate which are arranged on two opposite sides of each connecting plate, wherein the two adjacent connecting plates are movably connected through the first interlocking plate and the second interlocking plate. This application passes through the cooperation between guide rail and the steel guide pulley, restriction connecting plate reciprocate, connects two adjacent connecting plates through setting up first interlocking board and second interlocking board, and first interlocking board and second interlocking board make all connecting plates be a conveying whole for the device even running, thereby make the cladding material thickness of circuit board even, improve electroplating quality.

Description

Electroplating device

Technical Field

The utility model relates to a circuit board processing technology field specifically, mainly relates to an electroplating device.

Background

The circuit board needs to be subjected to a plurality of processing procedures in the production process, and particularly needs to be subjected to various electroplating treatments. When the circuit board is electroplated, if the stability of the device is not good, the circuit board can be electroplated unevenly, so that the circuit board is thinner, thicker or layered, and the use of the circuit board is influenced. Therefore, a transfer-stable apparatus is required to ensure the plating quality of the circuit board.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects of the prior art, the utility model provides an electroplating device.

The utility model discloses an electroplating device, it includes:

cathode conductive copper flat;

the guide rail is positioned on one side of the cathode conductive copper flat;

a plurality of electroplating mechanisms are arranged between the cathode conductive copper flat and the guide rail; the electroplating mechanisms are sequentially arranged, and each electroplating mechanism comprises a connecting plate, a conductive block, a steel guide wheel, a transmission part and a clamp; the upper end of the connecting plate is positioned between the cathode conductive copper flat and the guide rail, and the lower end of the connecting plate extends towards the direction far away from the guide rail; the conductive block is arranged at the upper end of the connecting plate and is close to the cathode conductive copper flat; the steel guide wheel is arranged on the side wall of the connecting plate back to the cathode conductive copper flat and is movably connected with the guide rail; the transmission part is arranged on the side wall of the connecting plate back to the steel guide wheel; the clamp is arranged at the lower end of the connecting plate; and

a plurality of first interlocking plates;

a plurality of second interlocking plates;

the first interlocking plate and the second interlocking plate are respectively arranged on two opposite sides of the connecting plate, and the two adjacent connecting plates are movably connected through the first interlocking plate and the second interlocking plate.

Preferably, the first interlocking plate of each connecting plate is movably connected with the second interlocking plate of another adjacent connecting plate.

Preferably, the first interlock plate has a first concave portion and a first convex portion disposed adjacently; the second interlocking plate is provided with a second convex part and a second concave part which are matched with each other respectively at the positions corresponding to the first concave part and the first convex part; the first concave part is movably connected with the second convex part, and the first convex part is movably connected with the second concave part.

Preferably, the first concave part and the second concave part are both V-shaped grooves; the first convex part and the second convex part are both V-shaped plates.

Preferably, the plating apparatus further comprises a conductive wire; two ends of the conductor wire are respectively connected with two adjacent connecting plates.

Preferably, the number of the steel guide wheels is two, and the two steel guide wheels are respectively connected to the upper side and the lower side of the guide rail in a rolling manner.

Preferably, a plurality of clamps are provided on each connection plate.

Preferably, the longitudinal section of the connecting plate is L-shaped.

Preferably, the electroplating device further comprises a first suspension frame, and the cathode conductive copper flat is arranged on the first suspension frame.

Preferably, the electroplating device further comprises a second suspension frame, and the guide rail is arranged on the second suspension frame.

The beneficial effect of this application lies in: through the cooperation between guide rail and the steel guide pulley, the reciprocating of restriction connecting plate is connected adjacent two connecting plates through setting up first interlocking board and second interlocking board, and first interlocking board and second interlocking board make all connecting plates be a conveying whole for the device even running, thereby make the cladding material thickness of circuit board even, improve electroplating quality.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

FIG. 1 is a schematic structural diagram of an electroplating apparatus according to the present embodiment;

FIG. 2 is a schematic cross-sectional view of an electroplating apparatus according to the present embodiment;

fig. 3 is a schematic structural diagram of the first interlocking plate, the second interlocking plate and the conductive wire in the present embodiment.

In the figure, 1-cathode conductive copper flat, 2-guide rail, 3-electroplating mechanism, 30-connecting plate, 31-conductive block, 32-steel guide wheel, 33-transmission part, 34-clamp, 4-first interlocking plate, 41-first concave part, 42-first convex part, 5-second interlocking plate, 51-second convex part, 52-second concave part, 6-conductive wire, 7-first suspension bracket, 8-second suspension bracket and 9-circuit board.

Detailed Description

In the following description, numerous implementation details are set forth in order to provide a more thorough understanding of the present invention. It should be understood, however, that these implementation details should not be used to limit the invention. That is, in some embodiments of the invention, details of these implementations are not necessary. In addition, some conventional structures and components are shown in simplified schematic form in the drawings.

It should be noted that all the directional indicators in the embodiments of the present invention, such as upper, lower, left, right, front and rear … …, are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture as shown in the drawings, and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, the descriptions related to "first", "second", etc. in the present invention are only for description purposes, not specifically referring to the order or sequence, and are not intended to limit the present invention, but only to distinguish the components or operations described in the same technical terms, and are not to be construed as indicating or implying any relative importance or implicit indication of the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

For further understanding of the contents, features and functions of the present invention, the following embodiments will be exemplified in conjunction with the accompanying drawings as follows:

the electroplating device in the embodiment comprises a cathode conductive copper flat 1, a guide rail 2, an electroplating mechanism 3, a first interlocking plate 4 and a second interlocking plate 5.

Referring to fig. 1 and 2, fig. 1 is a schematic structural diagram of a plating apparatus in the present embodiment; FIG. 2 is a schematic cross-sectional view of the electroplating apparatus in this embodiment. The number of the electroplating mechanisms 3 is multiple, the electroplating mechanisms 3 are all located between the cathode conductive copper flat 1 and the guide rail 2, the electroplating mechanisms 3 are sequentially arranged, and each electroplating mechanism 3 comprises a connecting plate 30, a conductive block 31, a steel guide wheel 32, a transmission part 33 and a clamp 34. The upper end of the connecting plate 30 is located between the cathode conductive copper flat 1 and the guide rail 2, and the lower end thereof extends away from the guide rail 2. The conductive block 31 is arranged at the upper end of the connecting plate 30 and close to the cathode conductive copper flat 1. The steel guide wheel 32 is arranged on the side wall of the connecting plate 30 back to the cathode conductive copper flat 1, and the steel guide wheel 32 is movably connected with the guide rail 2. The transmission part 33 is arranged on the side wall of the connecting plate 30, which faces away from the steel guide wheel 32. The clamp 34 is provided at the lower end of the connection plate 30.

Through the cooperation between guide rail 2 and the steel guide wheel 32, restriction connecting plate 30 reciprocate for the device operates steadily, thereby makes cladding material thickness even, improves electroplating quality. The clamp 34 is used for clamping the circuit board 9, and the circuit board 9 in this embodiment is an FPC board.

Referring back to fig. 2, further, the connecting plate 30 has an L-shaped longitudinal section, and in a specific application, the connecting plate 30 is made of stainless steel. The connecting plate 30 is used to conduct current from the conductive block 31 to the jig 34, and to connect and mount other components. The conductive block 31 is arranged at the horizontal end of the connecting plate 30 and is positioned above the cathode conductive copper flat 1. The connecting plate 30 is formed in an L shape, so that the conductive block 31 and the cathode conductive copper flat 1 are conductive by friction. The conductive block 31 conducts electricity by friction with the cathode conductive copper flat 1 and conducts the current to the connecting plate 30.

Referring back to fig. 2, further, the number of the steel guide wheels 32 is two, and the two steel guide wheels 32 are respectively connected to the upper side and the lower side of the guide rail 2 in a rolling manner. The guide rail 2 is matched with the steel guide wheel 32, so that the up-and-down movement of the connecting plate 30 is limited, and the connecting plate 30 is stable in movement; meanwhile, the guide rail 2 also plays a role in supporting the electroplating mechanism 3.

Referring back to fig. 2, further, a transmission part 33 is disposed between the two steel guide wheels 32, and the transmission part 33 moves to drive the connecting plate 30 to move and simultaneously drive the steel guide wheels 32 to roll on the guide rail 2, so that the connecting plate 30 moves along the direction of the guide rail 2. In the present embodiment, the transmission part 33 is a chain.

Referring back to fig. 2, further, a plurality of clamps 34 are provided on each connection plate 30, the clamps 34 being used to hold the circuit board 9 and conduct current to the circuit board 9. In this embodiment, two clamps 34 are provided on each connection plate 30.

Referring to fig. 1 and 3, fig. 3 is a schematic structural diagram of the first interlocking plate, the second interlocking plate and the conductive wire in the embodiment. Further, the number of the first interlock plate 4 is plural, and the number of the second interlock plate 5 is plural. First interlocking board 4 and second interlocking board 5 locate the relative both sides of connecting plate 30 respectively, carry out swing joint through first interlocking board 4 and second interlocking board 5 between two adjacent connecting plates 30. The first interlocking plate 4 of each connecting plate 30 is movably connected with the second interlocking plate 5 of another adjacent connecting plate 30.

Connect two adjacent connecting plates 30 through setting up first interlocking board 4 and second interlocking board 5, first interlocking board 4 and second interlocking board 5 make all connecting plates 30 be a conveying wholly for the device even running, thereby make circuit board 9's cladding material thickness even, improve electroplating quality.

Preferably, the first interlocking plate 4 has a first concave portion 41 and a first convex portion 42 which are adjacently arranged, and the first concave portion 41 and the first convex portion 42 are arranged at one end of the first interlocking plate 4 close to the outside of the connecting plate 30. The second interlocking plate 5 is provided with a second convex portion 51 and a second concave portion 52 corresponding to the first concave portion 41 and the first convex portion 42. The first concave part 41 is movably connected with the second convex part 51, and the first convex part 42 is movably connected with the second concave part 52.

The first concave part 41 and the second convex part 51 are in staggered clamping, and the first convex part 42 and the second concave part 52 are in staggered clamping, so that the two adjacent connecting plates 30 can still be movably connected when not in the same straight line.

Preferably, the first concave portion 41 and the second concave portion 52 are both V-shaped grooves, and the first convex portion 42 and the second convex portion 51 are both V-shaped plates. By providing the first interlocking plate 4 and the second interlocking plate 5 on each connecting plate 30, the adjacent two connecting plates 30 are movably connected so that the connecting plates 30 are in a straight line without dislocation, so that the connecting plates 30 are smoothly moved.

The first concave part 41 and the second convex part 51, and the first convex part 42 and the second concave part 52 are clamped conveniently by arranging the V-shaped grooves and the V-shaped plates.

Referring to fig. 1 and 3 again, further, the electroplating apparatus further includes a conductive wire 6, one end of the conductive wire 6 is disposed on the first interlocking plate 4, and the other end is disposed on the second interlocking plate 5 on the adjacent connecting plate 30. The current of two adjacent connecting plates 30 is conducted through the conductive wire 6, so that the current of each connecting plate 30 is equal in magnitude, and the current conducted to the circuit board 9 is equal in magnitude, so that the plating thickness of the circuit board 9 is uniform, and the electroplating quality is improved.

By providing the conductive wire 6, the movable connection of the adjacent first interlocking plate 4 and second interlocking plate 5 can be assisted. Meanwhile, the first interlocking plate 4 and the second interlocking plate 5 on the adjacent connecting plate 30 are connected to conduct the current of the adjacent connecting plate 30. Through mutually supporting of first interlocking board 4, second interlocking board 5 and conductor wire 6 for the device operates steadily, and the electric current size of every connecting plate 30 equals, makes the electric current size that switches on to circuit board 9 simultaneously equal, thereby makes the cladding material thickness of circuit board 9 even, improves electroplating quality.

The electroplating device also comprises a first suspension frame 7, and the cathode conductive copper flat 1 is fixedly arranged on the first suspension frame 7.

The electroplating device further comprises a second suspension frame 8, and the guide rail 2 is fixedly arranged on the second suspension frame 8.

The electroplating process of the electroplating device in the embodiment is as follows: when the circuit board 9 is electroplated, the circuit board 9 is clamped by a clamp 34, and the connecting plate 30 is driven by the transmission part 33 to run on the guide rail 2 in cooperation with the steel guide wheel 32; at this time, the conductive block 31 and the cathode conductive copper bar 1 are always kept in frictional conduction. First interlocking board 4 and second interlocking board 5 joint all the time, conductor wire 6 switches on adjacent connecting plate 30 all the time for when the device steadily removed, still keep switching on the electric current size of circuit board 9 the same, thereby make cladding material thickness even, improve electroplating quality.

To sum up: through the cooperation between guide rail and the steel guide pulley, restrict the reciprocating of connecting plate. Through setting up first interlocking board and second interlocking board and connecting two adjacent connecting plates, first interlocking board and second interlocking board make all connecting plates be a conveying whole, through setting up the conductor wire, can assist the swing joint of adjacent first interlocking board and second interlocking board. Meanwhile, the first interlocking plate and the second interlocking plate on the adjacent connecting plates are connected, and the current of the adjacent connecting plates can be conducted. Through mutually supporting of first interlocking board, second interlocking board and conductor wire for the device operates steadily, and the electric current size of every connecting plate equals, makes the electric current size that switches on the circuit board equal simultaneously, thereby makes the cladding material thickness of circuit board even, improves electroplating quality.

The above is only an embodiment of the present invention, and is not intended to limit the present invention. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. An electroplating apparatus, comprising:

a cathode conductive copper flat (1);

a guide rail (2) which is positioned on one side of the cathode conductive copper flat (1);

a plurality of electroplating mechanisms (3), wherein the plurality of electroplating mechanisms (3) are all positioned between the cathode conductive copper flat (1) and the guide rail (2); the electroplating mechanisms (3) are sequentially arranged, and each electroplating mechanism (3) comprises a connecting plate (30), a conductive block (31), a steel guide wheel (32), a transmission part (33) and a clamp (34); the upper end of the connecting plate (30) is positioned between the cathode conductive copper flat (1) and the guide rail (2), and the lower end of the connecting plate extends towards the direction far away from the guide rail (2); the conductive block (31) is arranged at the upper end of the connecting plate (30) and is close to the cathode conductive copper flat (1); the steel guide wheel (32) is arranged on the side wall of the connecting plate (30) back to the cathode conductive copper flat (1), and the steel guide wheel (32) is movably connected with the guide rail (2); the transmission part (33) is arranged on the side wall of the connecting plate (30) back to the steel guide wheel (32); the clamp (34) is arranged at the lower end of the connecting plate (30); and

a plurality of first interlock plates (4);

a plurality of second interlocking plates (5);

first interlocking board (4) and second interlocking board (5) are located respectively connecting plate (30) relative both sides, adjacent two carry out swing joint between connecting plate (30) through first interlocking board (4) with second interlocking board (5).

2. Electroplating apparatus according to claim 1, wherein a first interlocking plate (4) of each connection plate (30) is movably connected to a second interlocking plate (5) of another adjacent connection plate (30).

3. A plating apparatus according to claim 1, wherein said first interlock plate (4) has a first concave portion (41) and a first convex portion (42) disposed adjacently; the second interlocking plate (5) is provided with a second convex part (51) and a second concave part (52) which are matched with each other at the positions corresponding to the first concave part (41) and the first convex part (42); the first concave part (41) is movably connected with the second convex part (51), and the first convex part (42) is movably connected with the second concave part (52).

4. A plating apparatus according to claim 3, wherein said first recess (41) and said second recess (52) are each a V-groove; the first convex part (42) and the second convex part (51) are both V-shaped plates.

5. Electroplating apparatus according to any of claims 1-4, characterized in that it further comprises a conductive wire (6); two ends of the conductive wire (6) are respectively connected with two adjacent connecting plates (30).

6. The electroplating device according to claim 1, wherein the number of the steel guide wheels (32) is two, and the two steel guide wheels (32) are respectively connected to the upper side and the lower side of the guide rail (2) in a rolling manner.

7. Electroplating apparatus according to claim 1, wherein each connection plate (30) is provided with a plurality of clamps (34).

8. Electroplating apparatus according to claim 1, characterized in that the longitudinal section of the connection plate (30) is L-shaped.

9. An electroplating apparatus according to claim 1, further comprising a first suspension frame (7), wherein the cathode conductive copper plate (1) is provided on the first suspension frame (7).

10. Electroplating apparatus according to claim 1, further comprising a second overhead frame (8), wherein the guide rail (2) is provided to the second overhead frame (8).