CN213485197U - Defrosting and demisting automobile glass film - Google Patents
Defrosting and demisting automobile glass film Download PDFInfo
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- CN213485197U CN213485197U CN202121092305.1U CN202121092305U CN213485197U CN 213485197 U CN213485197 U CN 213485197U CN 202121092305 U CN202121092305 U CN 202121092305U CN 213485197 U CN213485197 U CN 213485197U
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- defrosting
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- 239000011521 glass Substances 0.000 title claims abstract description 36
- 238000010257 thawing Methods 0.000 title claims abstract description 28
- 239000010410 layer Substances 0.000 claims abstract description 173
- 239000004065 semiconductor Substances 0.000 claims abstract description 55
- 238000010438 heat treatment Methods 0.000 claims abstract description 53
- 239000002346 layers by function Substances 0.000 claims abstract description 32
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 230000004888 barrier function Effects 0.000 claims abstract description 20
- 238000004806 packaging method and process Methods 0.000 claims description 11
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 238000004544 sputter deposition Methods 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 9
- 239000004814 polyurethane Substances 0.000 claims description 9
- 229920002635 polyurethane Polymers 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 8
- 229920006267 polyester film Polymers 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- 239000013077 target material Substances 0.000 claims description 7
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 5
- XXLJGBGJDROPKW-UHFFFAOYSA-N antimony;oxotin Chemical compound [Sb].[Sn]=O XXLJGBGJDROPKW-UHFFFAOYSA-N 0.000 claims description 5
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 claims description 5
- 229910052733 gallium Inorganic materials 0.000 claims description 5
- 229910001195 gallium oxide Inorganic materials 0.000 claims description 5
- 229910052738 indium Inorganic materials 0.000 claims description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 5
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 5
- KYKLWYKWCAYAJY-UHFFFAOYSA-N oxotin;zinc Chemical compound [Zn].[Sn]=O KYKLWYKWCAYAJY-UHFFFAOYSA-N 0.000 claims description 5
- -1 polytetrafluoroethylene Polymers 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- 239000011701 zinc Substances 0.000 claims description 5
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 5
- 239000011787 zinc oxide Substances 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 239000004408 titanium dioxide Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000012535 impurity Substances 0.000 description 5
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 3
- 239000005357 flat glass Substances 0.000 description 3
- 239000003595 mist Substances 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Abstract
The application discloses defrosting defogging automobile glass pad pasting contains: the semiconductor heating layer comprises a substrate and a functional layer, and a barrier layer is arranged between the substrate and the functional layer; the side provided with the functional layer and the barrier layer is a first surface of the semiconductor heating layer, and the other side is a second surface; the electrode layer is fixedly connected with the first surface of the semiconductor heating layer; the hydrophobic layer is arranged on the second surface of the semiconductor heating layer; and encapsulating the semiconductor heating layer, the electrode layer and the hydrophobic layer by using the bonding film layer and the encapsulation layer. The semiconductor heating layer is connected with a safety power supply lower than 24V through the electrode layer, the temperature of the automobile glass is improved through the electrothermal conversion capacity of the semiconductor heating layer, and the defrosting and demisting functions are achieved. The defrosting and demisting automobile glass film is directly pasted on the automobile glass, is simple to operate, is convenient to cut and has wide application range.
Description
Technical Field
The application relates to the technical field of vehicle window glass films, in particular to a defrosting and demisting automobile glass film.
Background
As a modern important transportation tool, the automobile is particularly important in safety and comfort. The existing vehicle is often equipped with additional pad pasting effect on the door window is that block ultraviolet ray, block partial heat and prevent that glass bursts and injures people, anti-dazzle etc.. However, such a film cannot prevent condensation of water mist at low temperatures, and such water mist particularly affects the field of vision of the driver during night driving. Moreover, when a large amount of rainfall occurs, the phenomenon that water drops are attached to the surface of the vehicle window can occur, the driving is affected, and even if a wiper is adopted, a large amount of water marks still remain. Finally, frost in winter can also cause very tedious cleaning work for the car window, wasting time and energy.
The electric heating film technology can effectively solve the problems, the antifogging vehicle window glass provided by the patent document CN201700029U needs to be prepared on a vehicle window semi-finished product, and the assembly performance is poor. The automobile anti-fog window glass provided in patent document CN104254157A uses a resistance wire to generate heat, but the resistance wire affects the visual field of the driver, and is not favorable for safe driving.
Disclosure of Invention
To prior art's not enough, this application provides a defrosting defogging automobile glass pad pasting, solves among the prior art automobile glass frosting and hazing and influence the problem of driving the field of vision.
The invention aims to be achieved through the following technical scheme.
A defrosting and defogging automobile glass film, comprising:
the semiconductor heating layer comprises a substrate and a functional layer, wherein a barrier layer is arranged between the substrate and the functional layer; the side provided with the functional layer and the barrier layer is a first surface of the semiconductor heating layer, and the other side is a second surface;
the electrode layer is fixedly connected with the first surface of the semiconductor heating layer;
the hydrophobic layer is a transparent film provided with a hydrophobic material and is arranged on the second surface of the semiconductor heating layer;
the electrode layer is arranged on one side of the semiconductor heating layer, the bonding film layer and the packaging layer are arranged on one side of the electrode layer, the side of the hydrophobic layer is far away from the semiconductor heating layer, and the bonding film layer and the packaging layer are arranged on one side of the hydrophobic layer, the side of the hydrophobic layer is far away from the semiconductor heating layer;
wherein,
the barrier layer is formed on the substrate by adopting a target material containing silicon through a sputtering process;
the functional layer is formed on the barrier layer by adopting a target material which is made of one or more of tin antimony oxide, indium tin oxide, zinc gallium oxide, indium gallium zinc oxide, zinc tin oxide and indium zinc oxide through a sputtering process.
Preferably, the electrode layers are in a strip shape, and each of the two electrode layers is positioned at two opposite ends of the semiconductor heating layer.
Preferably, a silver glue layer is arranged between the semiconductor heating layer and the electrode layer.
Preferably, the outer contour sizes of the semiconductor heating layer, the hydrophobic layer and the packaging layer are sequentially increased.
Preferably, the hydrophobic material of the hydrophobic layer is one or more of titanium dioxide, silicon dioxide or polytetrafluoroethylene; the transparent film of the hydrophobic layer is a polyester film or a polyimide film.
Preferably, the hydrophobic layer has a thickness of 50-100 microns.
Preferably, the substrate is a polyester film or a polyimide film.
Preferably, a polyurethane layer and an acrylate layer are arranged between the substrate and the barrier layer, and the polyurethane layer is positioned between the substrate and the acrylate layer.
Preferably, the semiconductor heating layer is provided with a plasma functional layer on the acrylate layer.
Preferably, the thickness of the semiconductor heating layer is 50-100 microns.
Compared with the prior art, the defrosting defogging automobile glass pad pasting that this application provided adopts the semiconductor layer that generates heat, generates heat the layer through the electrode layer with the semiconductor and is connected with the safety power supply that is less than 24V, and the electric heat conversion ability through the semiconductor layer that generates heat promotes automobile glass's temperature, plays the effect of defrosting defogging.
The defrosting and demisting automobile glass film is directly pasted on the automobile glass, is simple to operate, is convenient to cut and has wide application range.
The functional layer is formed by sputtering one or more of tin antimony oxide, indium tin oxide, zinc gallium oxide, indium gallium zinc oxide, zinc tin oxide and indium zinc oxide, has high transmittance of more than 85%, can be applied to front windshield and does not influence driving vision.
Drawings
Fig. 1 is an exploded schematic view of a defrosting and defogging automobile glass film according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a top view angle of the defrosting and defogging automobile glass film provided by the embodiment of the present invention.
1-an electrode layer; 2-silver glue layer; 3-an encapsulation layer; 4-adhesive film layer, 5-hydrophobic layer, 6-semiconductor heating layer.
Detailed Description
The technical solution of the present invention will be described in detail with reference to the accompanying drawings and embodiments. The principles and features of the present invention are described below in conjunction with the following drawings, which illustrate, without conflict, that the embodiments and features of the embodiments of the present invention may be combined with each other. The examples given are only for explaining the invention and are not intended to limit the scope of the invention.
Examples
As shown in fig. 1 and 2, the present embodiment provides a defrosting and defogging automobile glass film, comprising:
the semiconductor heating layer 6 comprises a substrate and a functional layer, and a barrier layer is arranged between the substrate and the functional layer; the side provided with the functional layer and the barrier layer is a first surface of the semiconductor heating layer, and the other side is a second surface;
the electrode layer 1, the electrode layer 1 is fixedly connected with the first surface of the semiconductor heating layer 6;
the hydrophobic layer 5 is a transparent film provided with a hydrophobic material and is arranged on the second surface of the semiconductor heating layer 6;
the packaging layer 3 and the bonding film layer 4 are sequentially arranged on one side, away from the semiconductor heating layer 6, of the electrode layer 1, and the bonding film layer 4 and the packaging layer 3 are sequentially arranged on one side, away from the semiconductor heating layer 6, of the hydrophobic layer 5;
wherein,
the barrier layer is formed on the substrate by adopting a target material containing silicon through a sputtering process;
the functional layer is formed on the barrier layer by adopting a target material which is made of one or more of tin antimony oxide, indium tin oxide, zinc gallium oxide, indium gallium zinc oxide, zinc tin oxide and indium zinc oxide through a sputtering process.
In the embodiment, the functional layer is formed by sputtering one or more of tin antimony oxide, indium tin oxide, zinc gallium oxide, indium gallium zinc oxide, zinc tin oxide and indium zinc oxide, the process is pollution-free, the formed semiconductor heating layer 6 has high permeability, the permeability is up to more than 80%, the uniformity is high, the low-temperature radiation deviation is +/-1 ℃, and the film-shaped semiconductor heating layer becomes a planar heat source after being electrified, and has the characteristics of high melting point, high hardness, low resistance and good chemical stability. The defrosting and demisting automobile glass film is adhered to the glass of an automobile, and the temperature of the automobile glass is raised through the electrothermal conversion capacity of the functional layer, so that the fog or frost layer on the glass is dispersed and melted. The application provides a semiconductor heating layer 6 in defrosting defogging automobile glass pad pasting has high permeability, high homogeneity, therefore can not influence driver's sight, guarantees driving safety.
This embodiment is through establish the barrier layer that siliceous target material sputtering formed between basement and the functional layer, impurity in the basement can be outwards diffused under the circumstances of intensification, and the barrier layer blocks the impurity in the basement on the one hand and diffuses to the functional layer, and on the other hand prevents that steam infiltration from getting into the functional layer, and impurity and steam all have the harm to the efficiency of generating heat and life-span on layer that generates heat. By introducing the film layer design, the thermal expansion coefficient and the lattice constant of the substrate and the functional layer can be matched, so that the novel composite semiconductor heating film is reliably connected between each layer structure in the using process, and the service life is prolonged.
In this embodiment, the electrode layers 1 are in a strip shape, and are made of high-conductivity materials such as copper or aluminum, the two electrode layers 1 are respectively located at two opposite ends of the semiconductor heating layer 6, and the semiconductor heating layer 6 is electrified after a safety voltage source lower than 24V is connected between the two electrode layers 1, so that electric energy is converted into heat energy. The silver glue layer 2 is arranged between the semiconductor heating layer 6 and the electrode layer 1 to reduce the contact resistance.
In this embodiment, the outer dimensions of the semiconductor heating layer 6, the hydrophobic layer 5, and the encapsulation layer 3 are gradually increased, so as to completely protect the semiconductor heating layer 6.
In this embodiment, the hydrophobic layer 5 is made of one or more of titanium dioxide, silicon dioxide or polytetrafluoroethylene; the transparent film is a polyester film or a polyimide film. One or more of titanium dioxide, silicon dioxide or polytetrafluoroethylene are fixed on a polyester film or a polyimide film by a sputtering method, a sol-gel method, a spraying method, an evaporation method or a screen printing method, and the thickness of the hydrophobic layer 5 is 50-100 microns. The hydrophobic layer 5 is positioned between the semiconductor heating layer 6 and the packaging layer 3, so that the semiconductor heating layer 6 is prevented from being eroded by water mist.
In this embodiment, the substrate is a polyester film or a polyimide film, and a polyurethane layer and an acrylate layer are disposed between the substrate and the barrier layer; the polyurethane layer is located between the substrate and the acrylate layer. The semiconductor heating layer 6 is provided with a plasma functional layer on the acrylate layer. The thickness of the semiconductor heating layer is 50-100 microns.
The surface roughness of the substrate is large, so that the later-stage film coating is influenced. According to the method, the substrate is cleaned and then coated with the polyurethane in a liquid state, the smoothness of the substrate is treated through the leveling effect, and the roughness is reduced after the polyurethane layer is arranged, so that the functional layer is attached. Meanwhile, the polyurethane layer also has the effect of blocking impurities, and the impurities in the substrate can be further prevented from diffusing to the functional layer.
Under heating state, the basement of flexible materials such as PET can take place the shrink, and the basement shrink can lead to functional layer inefficacy or resistance to change, and this application is through setting up the acrylic ester layer, increases the basement hardness, prevents that functional layer inefficacy or resistance from changing, prolongs the life of functional layer.
Further, the plasma functional layer is a layer of structure formed by bombarding the surface of the substrate by plasma, and the layer of structure can improve the adhesion of the barrier layer and the functional layer of the substrate.
In this embodiment, the adhesive film layer 4 is a thermosetting adhesive film, such as polyethylene-polyvinyl acetate copolymer (EVA), and has a thickness of 30-80 μm. It is heated to become colorless transparent cross-linked substance, and has anti-reflection and adhesive effects.
When the defrosting and demisting automobile glass film provided by the embodiment is manufactured, the packaging layer 3 is ultrasonically cleaned for 30min by using glass cleaning liquid, alkali liquor prepared by sodium hydroxide and deionized water respectively, and then is blown dry for later use; after the structures are placed according to the position relation between the structures shown in the figures 1 and 2, the overall packaging of the defrosting and demisting automobile glass film is realized by adopting the temperature of 100-150 ℃ and hot pressing in the vacuum environment of 0.1-0.5Mpa, so that the protection effect on the semiconductor heating layer 4 is ensured.
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "circumferential", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.
Claims (10)
1. The utility model provides a defrosting defogging automobile glass pad pasting which characterized in that contains:
the semiconductor heating layer comprises a substrate and a functional layer, wherein a barrier layer is arranged between the substrate and the functional layer; the side provided with the functional layer and the barrier layer is a first surface of the semiconductor heating layer, and the other side is a second surface;
the electrode layer is fixedly connected with the first surface of the semiconductor heating layer;
the hydrophobic layer is a transparent film provided with a hydrophobic material and is arranged on the second surface of the semiconductor heating layer;
the electrode layer is arranged on one side of the semiconductor heating layer, the bonding film layer and the packaging layer are arranged on one side of the electrode layer, the side of the hydrophobic layer is far away from the semiconductor heating layer, and the bonding film layer and the packaging layer are arranged on one side of the hydrophobic layer, the side of the hydrophobic layer is far away from the semiconductor heating layer;
wherein,
the barrier layer is formed on the substrate by adopting a target material containing silicon through a sputtering process;
the functional layer is formed on the barrier layer by a sputtering process by adopting a target material which is made of one of tin antimony oxide, indium tin oxide, zinc gallium oxide, indium gallium zinc oxide, zinc tin oxide and indium zinc oxide.
2. A defrosting and defogging automobile glass sticker as recited in claim 1, wherein said electrode layers are in the shape of a strip, and each of said two electrode layers is located at opposite ends of said semiconductor heating layer.
3. The defrosting and defogging automobile glass film as recited in claim 1, wherein a silver glue layer is arranged between said semiconductor heating layer and said electrode layer.
4. The defrosting and demisting automobile glass film according to claim 1, wherein the outer contour sizes of the semiconductor heating layer, the hydrophobic layer and the packaging layer are sequentially increased.
5. The defrosting and defogging automobile glass sticker of claim 1, wherein the hydrophobic layer is made of one of titanium dioxide, silicon dioxide or polytetrafluoroethylene; the transparent film of the hydrophobic layer is a polyester film or a polyimide film.
6. The defrosting and defogging automotive glass film of claim 5, wherein said hydrophobic layer has a thickness of 50-100 microns.
7. The defrosting and defogging automobile glass sticker according to claim 1, wherein the substrate is a polyester film or a polyimide film.
8. A defrosting and defogging automotive glass film as recited in claim 7, wherein a polyurethane layer and an acrylate layer are disposed between said substrate and said barrier layer, said polyurethane layer being disposed between said substrate and said acrylate layer.
9. The defrosting and defogging automobile glass film as recited in claim 8, wherein said semiconductor heating layer is provided with a plasma functional layer on said acrylate layer.
10. The defrosting and defogging automobile glass film as recited in claim 9, wherein the thickness of said semiconductor heating layer is 50-100 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121092305.1U CN213485197U (en) | 2021-05-21 | 2021-05-21 | Defrosting and demisting automobile glass film |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121092305.1U CN213485197U (en) | 2021-05-21 | 2021-05-21 | Defrosting and demisting automobile glass film |
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| Publication Number | Publication Date |
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| CN213485197U true CN213485197U (en) | 2021-06-18 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113527934A (en) * | 2021-09-16 | 2021-10-22 | 中熵科技(北京)有限公司 | Electrothermal coating slurry, preparation method and application |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113527934A (en) * | 2021-09-16 | 2021-10-22 | 中熵科技(北京)有限公司 | Electrothermal coating slurry, preparation method and application |
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