CN213476145U

CN213476145U - Copper plating solution measuring and supplementing device

Info

Publication number: CN213476145U
Application number: CN202021922869.9U
Authority: CN
Inventors: 董峰波; 孙中强
Original assignee: Zhengzhou Zhongqiang Gravure Plate Making Co ltd
Current assignee: Zhengzhou Zhongqiang Gravure Plate Making Co ltd
Priority date: 2020-09-03
Filing date: 2020-09-03
Publication date: 2021-06-18
Anticipated expiration: 2030-09-03

Abstract

The application relates to a copper plating solution measures supplementary device, and it includes the electroplating bath, installs a storage vat that is used for storing copper plating solution on the outer wall of electroplating bath. The bottom of the storage vat is communicated with the electroplating pool through a feeding pipe, and the inner wall of the electroplating pool is provided with a feeding hole. One side welding of feed inlet has a guide arm, and the slip is provided with two first protection boxes on the guide arm, all is provided with the metal block in two first protection boxes, is provided with the connecting rod between two first protection boxes, and the chock sets up on the first protection box at top, and the floating block slides and sets up on the connecting rod, and the top and the bottom of guide arm all are provided with the second protection box, are provided with the magnetism piece in the second protection box. The kicking block descends when the liquid level descends, drives about the first protection box of bottom under the action of gravity and passes through the first protection box and the chock lapse that the connecting rod drove the top, opens the feed inlet, makes the copper-plating solution that the feeding leads to in get into the electroplating bath, need not manual operation, makes the process of adding solution convenient and fast more.

Description

Copper plating solution measuring and supplementing device

Technical Field

The application relates to the field of electro-coppering technology, in particular to a copper plating solution measuring and supplementing device.

Background

The outer surface of the gravure roll is provided with a layer of copper, and the copper layer is a matrix for electronic engraving of the gravure roll. The copper layer in the prior art is realized by electroplating, and the method is to plate a layer of nickel before plating copper, so as to stably and firmly plate the copper layer. The copper layer is then electroplated. In the currently adopted copper sulfate electroplating process, many chemical materials such as sulfuric acid, additives and the like are used.

With respect to the related art among the above, there are the following drawbacks: during copper electroplating, copper sulfate solution is consumed, in order to ensure normal electroplating work, a worker is required to continuously add solution into the container, and the working process consumes time and labor.

SUMMERY OF THE UTILITY MODEL

In order to make the process of adding solution convenient and fast more, this application provides a copper facing solution measures supplementary device.

The application provides a copper facing solution measures supplementary device adopts following technical scheme:

the utility model provides a copper facing solution measures supplementary device, includes the electroplating bath, be provided with the storage vat on the outer wall on the electroplating bath, through the inlet pipe intercommunication between electroplating bath and the storage vat, the feed inlet of inlet pipe is located the lateral wall of electroplating bath, the inner wall of electroplating bath has set firmly the guide arm along vertical direction, it is provided with the chock that is used for the switching feed inlet to slide along self length direction on the guide arm, be provided with the kicking block that floats on solution on the chock.

By adopting the technical scheme, when the copper plating solution in the electroplating pool is consumed, the floating block and the plug block descend, the feed inlet is opened, and the solution in the storage barrel enters the electroplating pool; liquid level in the electroplating pool rises, and the floater rises and drives the chock and blocks up the feed inlet after, and the feed inlet stops the feeding to realize automatic feeding's effect, need not the manual interpolation of workman, make the process of adding solution convenient and fast more.

Preferably, the electroplating pool is provided with a sealing ring on the circumferential side wall of the feeding hole, and one side of the chock facing the feeding hole is provided with a groove matched with the sealing ring.

Through adopting above-mentioned technical scheme, the in-process that the inserted block rises, the feed inlet is blockked up to the chock, and the leakproofness when effectively improving the feed inlet and closing in the recess is gone into to the sealing washer card around the feed inlet.

Preferably, the surface of the sealing ring is provided with a sliding layer.

Through adopting above-mentioned technical scheme, the in-process that the feed inlet was closed to the chock effectively reduces the resistance that produces when chock and sealing washer sliding contact, and is more smooth and easy when making the chock slide.

Preferably, the edge of the side wall of the chock close to the feed inlet is provided with a chamfer.

Through adopting above-mentioned technical scheme, the in-process that the feed inlet was closed to the chock further reduces the resistance that the sealing washer produced the chock when the edge of chock contacted with the sealing washer, and is more smooth and easy when making the chock slide.

The utility model discloses a two-in-one machine protection device, including guide arm, guide bar, chock, floating block, connecting rod, the guide arm is gone up to slide and is provided with two first protection boxes, two all be provided with the metal block in the first protection box, two be provided with the connecting rod between the first protection box, the chock sets up on first protection box, the floating block slides and sets up on the connecting rod, be provided with two second protection boxes on the guide arm, be provided with the magnetism piece in the second protection box.

By adopting the technical scheme, the first protection box at the bottom and the second protection box at the bottom are mutually adsorbed at the beginning, the feed inlet is opened, the liquid level of the copper plating solution rises and rises gradually, the floating block is driven to rise by buoyancy along the connecting rod, when the floating block is contacted with the first protection box at the top, the floating block is driven to rise to block the feed inlet, the first protection box at the top is adsorbed with the second protection box at the top, and the plug block is limited to leave the clamping groove; when the copper plating solution is reduced, the floating block descends, when the floating block is contacted with the first protection box at the bottom, the first protection box at the bottom descends, the plug block is driven to slide downwards, the feed inlet is opened, and the copper plating solution enters the electroplating pool. The copper plating solution feeding device is reciprocating, so that the effect that the feeding hole is opened when the copper plating solution is reduced by a fixed amount is realized, and the repeated opening and closing of the feeding hole is effectively avoided.

Preferably, the connecting rod is a telescopic rod, the second protection boxes are arranged on the guide rod in a sliding mode, two insertion holes are formed in the second protection boxes, pin rods used for being connected with the guide rod in an inserting mode are arranged in the insertion holes in a sliding mode in a penetrating mode, and a plurality of pin holes for the pin rods to be connected in an inserting mode are evenly formed in the guide rod along the length direction.

Through adopting above-mentioned technical scheme, through the position of adjustment second protection box and the length of connecting rod to adjust the sliding distance of floating block, thereby adjust the time that the feed inlet was opened.

Preferably, the locating part is a pin rod, the second protection box is provided with a jack, the pin rod is slidably arranged in the jack in a penetrating mode and used for being connected with the guide rod in an inserting mode, the guide rod is provided with a plurality of pin holes for the pin rod to be connected in an inserting mode, and the pin holes are evenly distributed at intervals along the length direction.

Through adopting above-mentioned technical scheme, slide the second protection box to a certain position after, fix through the pin rod, improved the stability of device.

Preferably, the side wall of the storage vat is provided with an observation window.

Through adopting above-mentioned technical scheme, make the staff can observe the surplus in the storage vat, make things convenient for the staff to add.

In summary, the present application includes at least one of the following beneficial technical effects:

1. the inner wall of the electroplating pool is provided with a feed inlet for supplementing a copper plating solution, the feed inlet is provided with a chock block with a floating block, when the liquid level of the electroplating pool is lowered, the floating block drives the chock block to descend to open the feed inlet, so that the copper plating solution enters the electroplating pool, manual addition of workers is not needed, and the solution adding process is more convenient and faster;

2. the inner wall of the electroplating pool is provided with a guide rod, the guide rod is provided with a metal block connected through a connecting rod in a sliding manner, the top and the bottom of the guide rod are provided with magnetic blocks, and the floating block is arranged on the connecting rod in a sliding manner, so that the effect that the feeding hole is opened when the copper plating solution is reduced by a fixed amount is realized, and the feeding hole is effectively prevented from being repeatedly opened and closed;

3. the electroplating pool is provided with a sealing layer on the circumferential side wall of the feeding hole, so that the sealing performance of the feeding hole is effectively improved when the feeding hole is blocked by the plug block.

Drawings

Fig. 1 is a schematic overall structure diagram of an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a floating block and the like in the embodiment of the present application.

Description of reference numerals: 1. an electroplating pool; 2. a storage barrel; 21. a feed pipe; 22. a feed inlet; 3. a guide bar; 4. a chock block; 5. a seal ring; 6. floating blocks; 7. a groove; 8. a first protective case; 81. a connecting rod; 9. a second protection box; 10. a pin rod; 11. a pin hole; 12. and (4) an observation window.

Detailed Description

The present application is described in further detail below with reference to figures 1-2.

The embodiment of the application discloses copper plating solution measures supplementary device. Referring to fig. 1, the device for measuring and supplementing the copper plating solution comprises an electroplating pool 1, wherein a storage barrel 2 for storing the copper plating solution is arranged on the outer wall of the electroplating pool 1, and a transparent observation window 12 is arranged on the discharge barrel. The bottom of the storage vat 2 is communicated with the electroplating pool 1 through a feeding pipe 21, and the inner wall of the electroplating pool 1 is provided with a feeding hole. One side welding of feed inlet has a vertical surface copper-plated guide arm 3, and guide arm 3 is gone up the slip and is provided with chock 4 and the hollow plastics floater 6 that is used for driving chock 4 gliding that are used for the plastics material of switching feed inlet.

Referring to fig. 1 and 2, a sealed second protection box 9 is slidably arranged at the top and the bottom of the guide rod 3, a magnet block is arranged in the second protection box 9, two sealed first protection boxes 8 are slidably arranged on the guide rod 3, an iron block is arranged in each first protection box 8, and the first protection boxes 8 and the second protection boxes 9 are made of plastic materials. Connect through a connecting rod 81 between two first protection boxes 8, chock 4 is connected with the 8 hot melts of the first protection box at top, and the setting that slides of floating block 6 is on connecting rod 81, and the gravity of floating block 6 is greater than the adsorption affinity of magnet and iron plate, and the biggest buoyancy that the floating block 6 receives all is greater than the gravity that the iron plate received.

Referring to fig. 1 and 2, when the liquid level of the copper plating solution in the electroplating pool 1 descends, the floating block 6 slides downwards, when the floating block 6 contacts with the first protection box 8 at the bottom, the floating block 6 drives the first protection box 8 at the bottom to drive the first protection box 8 at the top and the plug block 4 to slide downwards through the connecting rod 81 under the action of gravity, the first protection box 8 at the bottom and the second protection box 9 at the bottom are adsorbed with the metal block through the magnetic block, the feed inlet is continuously opened, and the copper plating solution enters the electroplating pool 1; the 1 liquid level in electroplating bath rises, and the kicking block 6 rises along connecting rod 81, and when the kicking block 6 contacted with the first protection box 8 at top, the first protection box 8 that drives the top under the effect of buoyancy rose, drives chock 4 and blocks up feed inlet 22, and the first protection box 8 at top and the second protection box 9 at top adsorb through magnetism piece and metal block simultaneously, make chock 4 rise and close the feed inlet.

Referring to fig. 1 and 2, a circle of rubber seal ring 5 is fixedly arranged around the feed inlet 22, the cross section of the seal ring 5 is arc-shaped, the convex surface of the seal ring faces the plug block 4, the surface of the seal ring 5 is wrapped by a teflon sliding layer, a groove 7 matched with the seal ring 5 is formed in one side wall, close to the feed inlet 22, of the plug block 4, the seal ring 5 is clamped into the groove 7 when the feed inlet 22 is closed by the plug block 4, and the sealing performance of the feed inlet 22 is effectively improved. The edge of the side wall of the chock 4 close to the feed inlet 22 is provided with a chamfer, and the chock 4 is in contact with the sliding layer through the chamfer in the sliding process, so that the resistance of the chock 4 in the sliding process is effectively reduced.

Referring to fig. 1 and 2, the side wall of the second protection box 9 is provided with a through hole, a pin rod 10 is slidably arranged in the through hole, and the side wall of the guide rod 3 is uniformly provided with a plurality of pin holes 11 for the pin rod 10 to pass through in a vertical direction; the connecting rod 81 between the two first protection boxes 8 is a telescopic rod; the pin rod 10 is pulled out of the pin hole 11, so that the two second protection boxes 9 can slide along the vertical direction, the distance between the two second protection boxes 9 is adjusted, then the length of the telescopic rod is adjusted, and the height of the liquid level when the feed inlet is opened is adjusted.

The implementation principle of the copper plating solution measuring and supplementing device in the embodiment of the application is as follows: when the liquid level in the electroplating pool 1 is higher, the second protection box 9 at the top is adsorbed with the first protection box 8, the sealing ring 5 around the feed port 22 is clamped in the groove 7, and the feed port 22 is closed; when the liquid level descends, the floating block 6 descends along the guide rod, when the liquid level descends to the position below the first protection box 8 at the bottom, the floating block 6 drives the first protection box 8 to descend under the action of gravity to be adsorbed by the second protection box 9 at the bottom, the plug block 4 slides downwards through the connecting rod 81, the feed inlet 22 is opened, and the copper plating solution in the storage tank 2 enters the electroplating pool 1; when the liquid level rose, the floating block 6 rose along connecting rod 81, when the first protection box 8 contact at floating block 6 and top, the first protection box 8 that drives the top rose under the effect of buoyancy, then the first protection box 8 at top and the second protection box 9 at top pass through magnetism piece and metal block mutual adsorption, make chock 4 rise and make in sealing washer 5 card goes into recess 7, close feed inlet 22, whole process need not manual operation, make the process of adding solution convenient and fast more.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. A copper plating solution measuring and supplementing device is characterized in that: including electroplating pool (1), be provided with storage vat (2) on the outer wall on electroplating pool (1), through inlet pipe (21) intercommunication between electroplating pool (1) and storage vat (2), feed inlet (22) of inlet pipe (21) are located the lateral wall of electroplating pool (1), the inner wall of electroplating pool (1) has set firmly guide arm (3) along vertical direction, it is provided with chock (4) that are used for switching feed inlet (22) to slide along self length direction on guide arm (3), be provided with on chock (4) and float on the floating block (6) of solution.

2. The copper plating solution measuring and replenishing device according to claim 1, wherein: the electroplating pool (1) is provided with a sealing ring (5) on the circumferential side wall of the feeding hole (22), and a groove (7) matched with the sealing ring is formed in one side, facing the feeding hole (22), of the plug block (4).

3. The copper plating solution measuring and replenishing device according to claim 2, characterized in that: and a sliding layer is arranged on the surface of the sealing ring (5).

4. The copper plating solution measuring and replenishing device according to claim 2, characterized in that: the edge of the side wall of the chock (4) close to the feed inlet (22) is provided with a chamfer.

5. The copper plating solution measuring and replenishing device according to claim 1, wherein: slide on guide arm (3) and be provided with two first protection box (8), two all be provided with the metal block in first protection box (8), two be provided with connecting rod (81) between first protection box (8), chock (4) set up on first protection box (8), it slides and sets up on connecting rod (81) to float piece (6), be provided with two second protection box (9) on guide arm (3), be provided with the magnetic block in second protection box (9).

6. The copper plating solution measuring and replenishing device according to claim 5, wherein: the connecting rod (81) is a telescopic rod, the second protection boxes (9) are arranged on the guide rod (3) in a sliding mode, and limiting parts for limiting the sliding of the second protection boxes (9) are arranged on the two second protection boxes.

7. The copper plating solution measuring and replenishing device according to claim 6, wherein: the locating part is pin rod (10), the jack has been seted up on second protection box (9), pin rod (10) slide to wear to establish in the jack and be used for pegging graft with guide arm (3), set up a plurality of pinhole (11) that supply pin rod (10) to peg graft on guide arm (3), it is a plurality of even interval distribution of length direction along guide arm (3) is followed in pinhole (11).

8. The copper plating solution measuring and replenishing device according to claim 1, wherein: an observation window (12) is arranged on the side wall of the storage barrel (2).