CN213462782U

CN213462782U - Radiator with direction locking structure

Info

Publication number: CN213462782U
Application number: CN202022532250.3U
Authority: CN
Inventors: 杨军华
Original assignee: CETC 52 Research Institute
Current assignee: CETC 52 Research Institute
Priority date: 2020-11-05
Filing date: 2020-11-05
Publication date: 2021-06-15
Anticipated expiration: 2030-11-05

Abstract

The utility model discloses a radiator with a guiding and locking structure, which comprises a radiating module and a back plate module, wherein the radiating module comprises a radiating body and a plurality of fastening modules, and the radiating body comprises a radiating piece and a base plate; the fastening module comprises a guide nut, a pressure spring and a stop element, the guide nut comprises a limiting part and a guide rod, the guide rod is provided with a limiting groove, and one end of the guide rod is sequentially provided with a guide hole and an internal thread along the axis in the direction of the limiting part; the guide rod penetrates through the substrate, the pressure spring is sleeved on the guide rod, two ends of the pressure spring respectively abut against the limiting part and one side of the substrate, and the stop element is positioned on the other side of the substrate and matched with the limiting groove; the back plate module comprises a back plate bracket, a boss and a stud, and the boss is provided with a second stop surface; when the locking device is in a locking state, each stud is matched with the corresponding internal thread, and the first stop surface is abutted against the second stop surface. This application equipment is easy centering, when improving the radiating efficiency, avoids destroying electronic components, and the packaging efficiency is high, and application scope is wide.

Description

Radiator with direction locking structure

Technical Field

The utility model belongs to the technical field of the heat dissipation, concretely relates to radiator with direction locking structure.

Background

The radiator is a device for radiating electronic components which are easy to generate heat in electronic equipment, and mainly comprises a radiator body, a fastening piece, a back plate bracket and the like. Generally, when the radiator is used, the radiator body and the upper surface of the electronic component are more fully attached through locking of the fastening piece, so that heat emitted by the electronic component can be more effectively conducted to the radiator and then dissipated to the ambient air through the radiator.

However, with the continuous development of integrated circuits, the heat productivity of electronic devices such as CPUs, GPUs and the like is increased, and in order to ensure good operating efficiency of the integrated circuits, a larger heat dissipation area is required for a corresponding heat sink, so that the number of fins is increased, and at the moment, the fasteners are usually arranged in the middle of the fins, and the fasteners are difficult to align and connect with the back plate bracket and lock, so that on one hand, the fasteners are difficult to align when being connected with the back plate bracket; on the other hand, the surface of the board card can be scratched in exploration type centering, and the situation of collision can occur in severe cases.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to the above-mentioned problem, a radiator with direction locking structure is proposed, this radiator is used for the heat dissipation of electronic components that generates heat, easy centering locking during the equipment, reduce the condition that the exploration formula centering caused the integrated circuit board surface to scratch or hit the piece, be favorable to guaranteeing product property ability, packaging efficiency is high, and adopt elastic deformation and limiting displacement to make the electronic components that generate heat on heat dissipation module and the integrated circuit board in close contact with improvement radiating efficiency, avoided the too big electronic components that destroy of load, application scope is wide.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a pair of radiator with direction locking structure for electronic components's heat dissipation, including the heat dissipation module, still include the backplate module, the heat dissipation module is including heat dissipation body and a plurality of fastening module, wherein:

the heat dissipation body comprises a heat dissipation piece and a substrate, the heat dissipation piece is connected with the substrate, and a plurality of through holes are formed in the substrate;

the fastening module comprises a guide nut, a pressure spring and a stop element, the guide nut comprises a limiting part and a guide rod which are connected with each other, a limiting groove is formed in the outer wall of the guide rod, a first stop surface is arranged at one end, away from the limiting part, of the guide rod, and a guide hole and an internal thread are sequentially formed in the guide rod from the first stop surface to the limiting part along the axis;

each guide rod correspondingly penetrates through the through hole of the substrate, the compression spring is sleeved on the guide rod, one end of the compression spring is abutted against the limiting part, the other end of the compression spring is abutted against one side of the substrate, and the stop element is positioned on the other side of the substrate and matched with the limiting groove to prevent the fastening module from falling off relative to the substrate;

the back plate module comprises a back plate support, a plurality of bosses are arranged on the back plate support, studs perpendicular to the back plate support are arranged on the bosses, and a second stop surface is arranged at one end, away from the back plate support, of each boss;

when the locking device is in a locking state, each stud is matched and connected with the corresponding internal thread, and the first stop surface is abutted against the second stop surface.

Preferably, the limiting groove is an annular groove, and the stop element is a snap spring.

Preferably, the diameter of the pilot hole is larger than the diameter of the internal thread.

Preferably, the stud is a clinch stud.

Preferably, the surface of the back plate bracket provided with the boss is also adhered with back glue.

Preferably, the heat dissipation member is a heat dissipation fin.

Compared with the prior art, the beneficial effects of the utility model are that:

1) the guide hole and the stud are adopted for matched guide, so that centering and locking are easy to realize during assembly, the condition that the surface of the board card is scratched or collided due to exploratory centering is reduced, the product performance is favorably ensured, and the assembly efficiency is high;

2) elastic deformation and the first position stopping surface that adopts the pressure spring to produce are stopped the position face with the second and are contradicted spacing, when making the electronic components that generate heat on heat dissipation module and the integrated circuit board in close contact with and improving the radiating efficiency, have avoided the too big electronic components that destroy of load, are suitable for the heat dissipation of various electronic components that generate heat that need and radiator fastening connection.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic structural view of the heat dissipation module of the present invention;

fig. 3 is a schematic structural view of the fastening module of the present invention;

fig. 4 is a schematic structural view of the guide nut of the present invention;

fig. 5 is a schematic diagram of the back plate module of the present invention.

Description of reference numerals: 1. a heat dissipation module; 2. a board card; 3. a back panel module; 11. a heat dissipation body; 12. a fastening module; 121. a guide nut; 122. a pressure spring; 123. a stop element; 121a and a limiting groove; 121b, internal threads; 121c, a guide hole; 121d, a first stop surface; 21. a front side; 22. a back side; 31. a stud; 32. carrying out gum application; 33. a back plate holder; 34. a boss; 341. a second stop surface.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

As shown in fig. 1-5, a radiator with direction locking structure for electronic components's heat dissipation, including heat dissipation module 1, still include back board module 3, heat dissipation module 1 includes heat dissipation body 11 and a plurality of fastening module 12, wherein:

the heat dissipation body 11 comprises a heat dissipation piece and a substrate, wherein the heat dissipation piece is connected with the substrate, and a plurality of through holes are formed in the substrate;

the fastening module 12 comprises a guide nut 121, a pressure spring 122 and a stop element 123, the guide nut 121 comprises a limiting part and a guide rod which are connected with each other, a limiting groove 121a is formed in the outer wall of the guide rod, a first stop surface 121d is arranged at one end of the guide rod, which is far away from the limiting part, and a guide hole 121c and an internal thread 121b are sequentially formed in the guide rod from the first stop surface 121d to the direction of the limiting part along the axis;

each guide rod correspondingly penetrates through the through hole of the base plate, the pressure spring 122 is sleeved on the guide rod, one end of the pressure spring abuts against the limiting part, the other end of the pressure spring abuts against one side of the base plate, and the stop element 123 is positioned on the other side of the base plate and matched with the limiting groove 121a to prevent the fastening module 12 from falling off relative to the base plate;

the back plate module 3 comprises a back plate support 33, a plurality of bosses 34 are arranged on the back plate support 33, each boss 34 is provided with a stud 31 perpendicular to the back plate support 33, and one end of each boss 34 far away from the back plate support 33 is a second stop surface 341;

in the locked state, each stud 31 is engaged with the corresponding internal thread 121b, and the first stop surface 121d abuts against the second stop surface 341.

Wherein, this embodiment includes heat dissipation module 1 and backplate module 3, is provided with between the two and installs electronic components's integrated circuit board 2, and heat dissipation module 1 installs on the front 21 of integrated circuit board 2, and backplate module 3 installs on the back 22 of integrated circuit board 2. The heat dissipation module 1 comprises a heat dissipation body 11 and four fastening modules 12, wherein the heat dissipation body 11 comprises a heat dissipation piece and a substrate, the heat dissipation piece is connected with the substrate, and four through holes are formed in the substrate. It should be noted that the fastening module 12 and the through holes on the substrate may be any other number.

As shown in fig. 3 and 4, the fastening module 12 includes a guiding nut 121, a pressure spring 122 and a stop element 123, the guiding nut 121 includes a limiting portion and a guide rod that are connected to each other, the limiting portion is similar to a head of a screw rod in the prior art, and is used for the cooperation of a locking tool to screw, a limiting groove 121a is provided on an outer wall of the guide rod, one end of the guide rod away from the limiting portion is a first stop surface 121d, and the guide rod is sequentially provided with a guiding hole 121c and an internal thread 121b from the first stop surface 121d to the direction of the limiting portion along an axis. The tail of the guide nut 121 is provided with a section of guide hole 121c for centering and guiding with the stud 31, namely, when the heat dissipation module 1 initially contacts with the back plate module 3, the guide hole 121c can be automatically aligned to the corresponding stud 31, then the external thread connection of the internal thread 121b and the stud 31 is realized, the condition that the board card surface is scratched or a part is collided due to the probe type centering is reduced, the product performance is favorably ensured, the assembling efficiency is high, and then the internal thread 121b of the guide nut 121 is matched and locked with the stud 31 by using a locking tool. The compression spring 122 is a spring, and may also be other elastic elements, such as a spring plate.

As shown in fig. 2, the guide rods of the four guide nuts 121 respectively and correspondingly penetrate through the four through holes of the substrate, each guide rod is sleeved with a compression spring 122, one end of the compression spring 122 abuts against the limiting portion, the other end abuts against one side of the substrate, and each stop element 123 is located on the other side of the substrate and cooperates with the corresponding limiting groove 121a to prevent the fastening module 12 from falling off relative to the substrate. The four fastening modules 12 are all installed on the heat dissipation body 11, and the stop element 123 is installed after the guide nut 121 and the pressure spring 122 are installed on the heat dissipation body 11, so that the fastening modules 12 are limited on the heat dissipation body 11, and the subsequent assembly with the back panel module 3 is facilitated.

As shown in fig. 5, the back plate module 3 includes a back plate support 33, four bosses 34 are disposed on the back plate support 33, each boss 34 is provided with a stud 31 perpendicular to the back plate support 33, and one end of the boss 34 away from the back plate support 33 is a second stop surface 341. After the backboard module 3 and the board card 2 are installed, the stud 31 on the backboard module 3 penetrates through the board card 2 and protrudes out of the front surface 21 of the board card 2 by a distance, so that the heat dissipation module 1 and the backboard module 3 can be conveniently guided to be aligned when being installed correspondingly.

In the locking state, the guide nuts 121 of the fastening modules 12 are connected and locked with the studs 31 on the corresponding back plate module 3, and the studs 31 are connected with the internal threads 121b in a matching manner. In order to ensure that the excessive force generated by the locking of the heat dissipation module 1 and the backplane module 3 will not damage the board card 2, a stop device is further provided, i.e., the first stop surface 121d and the second stop surface 341 are adopted to be abutted and limited, and when the fastening module 12 and the backplane module 3 are locked to a certain degree, i.e., the pressure spring 122 generates appropriate pressure and then stops. Elastic deformation and the first position face of ending that adopts the pressure spring to produce end the position face with the second and contradict spacingly, make the electronic components in close contact with that generates heat on heat dissipation module and the integrated circuit board, the heat conducts on heat dissipation body 11 more effectively to give off in the air around, when helping improving the radiating efficiency, avoided the too big electronic components that destroy of load, be suitable for the heat dissipation of the electronic components that generate heat of various needs and radiator fastening connection.

In one embodiment, the limiting groove 121a is an annular groove, and the stop element 123 is a snap spring.

The limiting groove 121a is an annular groove, the stop element 123 is a snap spring, and axial limiting is performed through cooperation of the snap spring and the annular groove, so that the structure is simple, the cost is low, and the structure is conventional in the field and is not described herein again. It should be noted that the limiting groove 121a may also be a hole opened on the guide rod of the guiding nut 121, the hole is a through hole or a threaded hole perpendicular to the axis of the guide rod, the stop element 123 is a corresponding pin or a corresponding screw, and the limiting is performed through the cooperation of the hole and the pin or the threaded hole and the screw, or other conventional alternative technologies in the art are adopted.

In one embodiment, the diameter of the guide hole 121c is larger than the diameter of the internal thread 121 b.

The diameter of the guide hole 121c is larger than that of the internal thread 121b, the stud 31 is sleeved in the guide nut 121 correspondingly, the guide hole 121c of the guide nut 121 is automatically aligned to the corresponding stud 31 when initial contact is facilitated, then the guide nut 121 and the stud 31 are locked by a locking tool, guide alignment is achieved, and assembling efficiency is improved.

In one embodiment, the studs 31 are clinch studs.

The studs 31 are press-riveting studs, and form an integrated structure with the back plate support 33, so that the whole assembly and disassembly are convenient. It should be noted that the stud 31 may also be screwed or welded to the back plate bracket 33.

In one embodiment, the surface of the back plate bracket 33 having the boss 34 is further adhered with a back adhesive 32.

Wherein, back support 33 still has the back glue 32 of laminating on the face that is equipped with boss 34 in this embodiment, and back glue 32 adopts the two-sided back glue of 3M, and one side bonds back support 33, and the back of another side bonding integrated circuit board 2 is fixed both, the equipment of being convenient for. It should be noted that the back plate bracket 33 and the board card 2 may be fixed by other methods, such as fixing by screws or pressing.

In one embodiment, the heat dissipation member is a heat dissipation fin.

Wherein, the radiating piece is radiating fin in this embodiment, and four fastening modules 12 all are located the fin in the middle of, adopt this fastening module 12 and backplate module 3's cooperation locking, are favorable to the centering to be connected, avoid the probe type centering to cause the integrated circuit board surface to rip or hit the piece, are favorable to guaranteeing product property ability, and packaging efficiency is high. It should be noted that the heat dissipation member may also be a heat dissipation product commonly used in other prior art, such as a heat dissipation member that uses a combination of heat dissipation fins and a fan to dissipate heat.

During installation, the fastening module 12 and the heat dissipation body 11 are assembled, the protective film of the gum 32 attached to the back plate support 33 is torn, then the back plate module 3 is installed at the corresponding position on the board card 2, the back plate support 33 is fixedly bonded with the board card 2, the heat dissipation module 1 is assembled with the back plate module 3 with the board card 2, the stud 31 is correspondingly sleeved by the guide nut 121 on the fastening module 12, the heat dissipation module 1 and the back plate module 3 are locked by screwing the guide nut 121 respectively through a tool, when the fastening module is locked to a certain degree, namely, the first stopping surface 121d is automatically stopped when being abutted against the second stopping surface 341, the situation that the generated force exceeds the bearing limit of an electronic component to damage the board card 2 is prevented, and the assembly is completed.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express the more specific and detailed embodiments described in the present application, but not should be interpreted as limiting the scope of the claims of the present application. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The utility model provides a radiator with direction locking structure for electronic components's heat dissipation, includes heat dissipation module (1), its characterized in that: the radiator with direction locking structure still includes backplate module (3), heat dissipation module (1) is including heat dissipation body (11) and a plurality of fastening module (12), wherein:

the heat dissipation body (11) comprises a heat dissipation piece and a substrate, the heat dissipation piece is connected with the substrate, and a plurality of through holes are formed in the substrate;

the fastening module (12) comprises a guide nut (121), a pressure spring (122) and a stop element (123), the guide nut (121) comprises a limiting part and a guide rod which are connected with each other, a limiting groove (121a) is formed in the outer wall of the guide rod, a first stop surface (121d) is arranged at one end, away from the limiting part, of the guide rod, and a guide hole (121c) and an internal thread (121b) are sequentially formed in the guide rod from the first stop surface (121d) to the limiting part along the axis;

each guide rod correspondingly penetrates through the through hole of the base plate, the pressure spring (122) is sleeved on each guide rod, one end of each guide rod abuts against the limiting part, the other end of each guide rod abuts against one side of the base plate, and the stop element (123) is positioned on the other side of the base plate and matched with the limiting groove (121a) to prevent the fastening module (12) from falling off relative to the base plate;

the back plate module (3) comprises a back plate support (33), a plurality of bosses (34) are arranged on the back plate support (33), each boss (34) is provided with a stud (31) perpendicular to the back plate support (33), and one end, far away from the back plate support (33), of each boss (34) is a second stop surface (341);

when the locking device is in a locking state, each stud (31) is matched and connected with the corresponding internal thread (121b), and the first stop surface (121d) is abutted against the second stop surface (341).

2. The heat sink with guiding and locking structure as claimed in claim 1, wherein: the limiting groove (121a) is an annular groove, and the stop element (123) is a clamp spring.

3. The heat sink with guiding and locking structure as claimed in claim 1, wherein: the diameter of the guide hole (121c) is larger than the diameter of the internal thread (121 b).

4. The heat sink with guiding and locking structure as claimed in claim 1, wherein: the stud (31) is a press riveting stud.

5. The heat sink with guiding and locking structure as claimed in claim 1, wherein: the back plate support (33) is provided with a back glue (32) adhered to the surface of the boss (34).

6. The heat sink with guiding and locking structure as claimed in claim 1, wherein: the heat dissipation piece is a heat dissipation fin.