CN213447376U

CN213447376U - Electronic components surface spraying plating gilding device

Info

Publication number: CN213447376U
Application number: CN202022576279.1U
Authority: CN
Inventors: 王茂茹
Original assignee: Jiangsu Suqian Economic And Trade Occupation Technology School (suqian Economic And Trade Branch Of Jiangsu Union Technical College)
Current assignee: Jiangsu Suqian Economic And Trade Occupation Technology School (suqian Economic And Trade Branch Of Jiangsu Union Technical College)
Priority date: 2020-11-09
Filing date: 2020-11-09
Publication date: 2021-06-15
Anticipated expiration: 2030-11-09

Abstract

The utility model discloses an electronic components surface spraying plating gilding device, including base and agitator tank, the top fixed mounting of base has two risers, the equal fixed mounting in opposite side of two risers has the diaphragm, two T shape spouts have been seted up to gilding roof portion inboard, the opposite side fixed mounting of T shape slider has electric slide bar, the bottom of connecting block is fixed with the gilding shower nozzle, the bottom fixed mounting of telescopic link has the dust removal fan, the top fixed mounting of base has dust absorption fan, the top fixed mounting of base has the motor, the drive end of motor is connected with the puddler, the jar wall fixed mounting of agitator tank has antiseized layer, one side intercommunication that the agitator tank was kept away from to the filter screen has the transfer line. Through setting up the dust removal fan and dust absorption fan, can blow up the dust on the electronic components at first at the dust removal fan, thereby the dust that will blow up carries out suction spraying plating case and reaches and clean electronic components, can increase the adhesion of electronic components surface gilding like this, increase live time.

Description

Electronic components surface spraying plating gilding device

Technical Field

The utility model belongs to the technical field of electronic components processing, concretely relates to electronic components surface spraying plating gilding device.

Background

The electroplating is to plate a layer of other metal or alloy on the appointed area of the metal surface by a special tool so as to enhance the external performance of the metal; the common electroplating methods include spot plating, brush plating, dip plating, spray plating and the like, wherein the spray plating adjusts a product traveling groove according to the shape and the size of a product, the spray plating is suitable for various products in a debugging mode, and the gold plating solution is divided according to the service life of the product, so that the functional requirements of certain electronic elements are met, and the wear resistance is improved. In order to obtain a plating layer with good wear resistance, cobalt salt, nickel salt and other additives are generally added into certain acidic gold plating solution to deposit a gold alloy plating layer containing a certain amount of cobalt or nickel components, thereby achieving the purpose of improving wear resistance.

The existing spraying plating gold-plating device only has a simple spraying plating device, so that electronic components can only be sprayed to perform surface spraying plating, especially, the electronic components are neglected to be exposed for a long time when the surface is sprayed, so that the surface of the electronic components is full of dust particles, then the dust on the surface is not cleaned in time when the spraying plating is performed, so that the surface gold plating of the electronic components has no adhesiveness, the gold plating is easy to fall off the surface of the electronic components, then too many electronic component resources are wasted, then, because the gold-plating stock solution is in a stirring tank for a long time, some residues of gold-plating liquid can be remained in the tank for a long time, then fine impurities can be encountered during long-term stirring, the spraying plating port of the device can be blocked by the fine impurities difficultly during the spraying plating, and then the spraying port needs to be cleaned, in severe cases, the nozzle needs to be replaced, so that on one hand, the complicated operation of work is increased, the work efficiency is delayed by workers, and on the other hand, the resource of gold-plating raw materials is wasted.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electronic components surface plating gilding device, in order to solve and to propose a current plating gilding device in the above-mentioned background art in the use, owing to do not in time with the timely clearance of the dust on surface when carrying out spraying plating, thereby the surface plating who leads to electronic components does not have the adhesion, can make spraying plating device's spraying plating mouth blockked up by tiny impurity when carrying out spraying plating unavoidably, thereby make the surface that the electronic components drops easily of gilding and make spraying plating device's spraying plating mouth carry out the problem of blockking up by tiny impurity.

In order to achieve the above object, the utility model provides a following technical scheme: a gold plating device for surface plating of electronic components comprises a base and a stirring tank, wherein a seat block is fixedly installed at the bottom of the base, two vertical plates are fixedly installed at the top of the base, transverse plates are fixedly installed on opposite sides of the two vertical plates, a gold plating box is fixedly installed at the top of the base, two T-shaped sliding grooves are formed in the inner side of the top of the gold plating box, T-shaped sliding blocks are movably installed in the two T-shaped sliding grooves, electric sliding rods are fixedly installed on opposite sides of the T-shaped sliding blocks, sliding blocks are movably installed on the outer sides of the electric sliding rods, a connecting block is fixedly installed at the bottom of each sliding block, a nozzle cover is fixedly installed at one end of the bottom of each connecting block, a gold plating nozzle is fixedly installed at the bottom of each connecting block, a telescopic rod is fixedly installed at one side, the bottom fixed mounting of telescopic link has the fan casing, the top fixed mounting of base has dust absorption fan, dust absorption fan's play dirt mouth intercommunication has a dirt pipe, dust absorption fan's dust absorption mouth intercommunication has the dust absorption pipe, the top fixed mounting of base has the motor, the drive end of motor is connected with the puddler, the top movable mounting of agitator tank has the cover, the jar wall fixed mounting of agitator tank has antiseized layer, the inside movable mounting in one side of agitator tank has the filter screen, one side intercommunication that the agitator tank was kept away from to the filter screen has the transfer line.

Preferably, the specification size of the T-shaped sliding groove is matched with the specification size of the T-shaped sliding block.

Preferably, the front surface of the gold plating box is fixedly provided with an observation window, and the back surface of the gold plating box is provided with a discharging groove.

Preferably, one end of the dust suction pipe, which is far away from the dust suction fan, penetrates through one side wall of the gold-plated box and extends to the inside of the gold-plated box.

Preferably, agitator tank bottom fixed mounting has sealed bearing, bearing fixed mounting is in the outside of stirring post, the bottom fixed mounting of agitator tank has the supporting leg, the supporting leg has four to be the bottom of symmetric distribution at the agitator tank, one side welding that the agitator tank was kept away from to the supporting leg has the base.

Preferably, one end of the infusion tube, which is far away from the stirring tank, is communicated with the gold-plating spray head.

Compared with the prior art, the beneficial effects of the utility model are that:

1. through setting up the dirt fan and dust absorption fan, can then start the dust absorption fan when the dirt fan at first blows the dust on electronic components, the dust that will blow up carries out suction spraying plating case, adopt mutually supporting of dirt fan and dust absorption fan like this, thereby reach and clean electronic components before carrying out spraying plating for electronic components, can increase the adhesion nature of electronic components surface gilding like this on the one hand, on the other hand can also increase electronic components's wearability, increase live time.

2. Through setting up antiseized layer and filter screen, can carry out antiseized through antiseized layer with jar internal portion adhesive gilding raw materials, then obtain timely resource utilization, through the filter screen, can filter jar internal portion's tiny impurity, in time keep apart in jar impurity for the no impurity gilding liquid that the transfer line was carried reachs and spouts the gilding device and carry out the spraying plating, has practiced thrift the gilding resource on the one hand like this, has reduced and has changed the gilding shower nozzle, and on the other hand has still improved the work efficiency of gilding.

Drawings

Fig. 1 is a schematic front view of a cross-sectional structure of the present invention;

fig. 2 is a schematic front view of the structure of the present invention;

fig. 3 is a schematic rear view of the present invention;

fig. 4 is a schematic view of the partial three-dimensional appearance structure of the present invention.

In the figure: 1. a base; 2. a seat block; 3. a transverse plate; 4. a vertical plate; 5. a dust collection pipe; 6. a discharging groove; 7. a dust collection fan; 8. a dust outlet pipe; 9. a gold plating box; 10. a T-shaped slider; 11. a T-shaped chute; 12. an electric slide bar; 13. a fan cover; 14. a dust removing fan; 15. a telescopic rod; 16. connecting blocks; 17. a slider; 18. a transfusion tube; 19. a nozzle cover; 20. a gold plating shower nozzle; 21. a stirring tank; 22. an observation window; 23. a filter screen; 24. a can lid; 25. an anti-sticking layer; 26. a stirring column; 27. a stirring rod; 28. a motor; 29. supporting legs; 30. and a bearing.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a gold plating device for surface plating of electronic components comprises a base 1 and an agitator tank 21, wherein a seat block 2 is fixedly arranged at the bottom of the base 1, two vertical plates 4 are fixedly arranged at the top of the base 1, transverse plates 3 are fixedly arranged on opposite sides of the two vertical plates 4, a gold plating box 9 is fixedly arranged at the top of the base 1, two T-shaped chutes 11 are formed in the inner side of the top of the gold plating box 9, T-shaped sliders 10 are movably arranged in the two T-shaped chutes 11, electric slide rods 12 are fixedly arranged on opposite sides of the T-shaped sliders 10, sliders 17 are movably arranged on the outer sides of the electric slide rods 12, a connecting block 16 is fixedly arranged at the bottom of each slider 17, a nozzle cover 19 is fixedly arranged at one end of the bottom of each connecting block 16, a gold plating nozzle 20 is fixedly arranged at the bottom of each connecting block 16, an expansion link 15 is fixedly arranged on, bottom fixed mounting of telescopic link 15 has fan casing 13, the top fixed mounting of base 1 has dust absorption fan 7, dust absorption fan 7's play dirt mouth intercommunication has out dirt pipe 8, dust absorption fan 7's dust absorption mouth intercommunication has dust absorption pipe 5, the top fixed mounting of base 1 has motor 28, motor 28's drive end is connected with puddler 27, the top movable mounting of agitator tank 21 has cover 24, the jar wall fixed mounting of agitator tank 21 has antiseized layer 25, the inside movable mounting in one side of agitator tank 21 has filter screen 23, one side intercommunication that agitator tank 21 was kept away from to filter screen 23 has transfer line 18.

In the embodiment, when a worker needs to use the gold spraying device, firstly, the tank cover 24 on the top of the stirring tank 21 is opened, then the spraying raw material and water are added into the tank together, then the tank cover 24 is covered, then the motor 28 is opened, then the motor 28 drives the stirring column 26 by the driving end, the stirring rod 27 is driven by the stirring column 26, then the gold spraying raw material is stirred, then the electronic component is put on the transverse plate 3 through the material discharge groove 6 arranged at the back of the gold plating tank 9, then the sliding block 17 can slide left and right through the electric sliding rod 12 and then slide to the upper part of the electronic component, then the dust removing fan 14 is lowered to the designated height through the telescopic rod 15, then the dust removing fan 14 is opened to remove dust of the electronic component, then the dust suction fan 7 is opened while removing dust, and the dust in the gold plating tank 9 is sucked out by the dust suction pipeline 5 communicated with the dust suction port of, then the dust is discharged through a dust outlet pipe 8 communicated with the dust outlet, and then after the dust is removed, the dust removing fan 14 is retracted through a telescopic rod 15, then the position is retracted to be lower than the gold plating spray head 20, then the position of the gold plating spray head 20 is adjusted to be above the electronic component, then the spray head is driven, then the gold plating liquid passes through the filter screen 23 to carry out impurity filtration, then the gold plating liquid is conveyed through the infusion tube 18, then reaches the gold plating spray head 20, and then the gold plating liquid is atomized and sprayed on the electronic components through the gold plating spray head 20, because the electronic components are different in size, the electric sliding rod 12 can pass through the T-shaped sliding block 10, sliding in the T-shaped sliding chute 11, then driving the gold plating spray head 20 to move back and forth for spraying, the fan shroud 13 on the outside of the fan can then help the fan to simply shield the gold-plated particles that are generated during sputtering.

Specifically, the specification and the size of the T-shaped sliding chute 11 are matched with those of the T-shaped sliding block 10.

In this embodiment, the T-shaped sliding slot 11 is used for facilitating the forward and backward movement of the T-shaped sliding block 10.

Specifically, the front surface of the gold plating box 9 is fixedly provided with an observation window 22, and the back surface of the gold plating box 9 is provided with a discharging groove 6.

In this embodiment, the observation window 22 is used for facilitating observation of the inside of the tank during thermal spraying, and the discharge chute 6 is used for discharging.

Specifically, one end of the dust suction pipe 5, which is far away from the dust suction fan 7, penetrates through one side wall of the gold plating box 9 and extends to the inside of the gold plating box 9.

In this embodiment, the dust suction fan 7 is used to suck out dust in the gold plating box 9.

Specifically, agitator tank 21 bottom fixed mounting has sealed bearing 30, and bearing 30 fixed mounting has supporting leg 29 in the outside of churning column 26, and the bottom fixed mounting of agitator tank 21 has four to be the symmetric distribution in the bottom of agitator tank 21, and one side welding that agitator tank 21 was kept away from to supporting leg 29 has base 1.

In this embodiment, the bearing 30 functions to prevent rotational friction of the stirring column 26, and the support leg 29 functions to support the stirring tank 21.

Specifically, one end of the infusion tube 18, which is far away from the stirring tank 21, is communicated with the gold-plating spray head 20.

In this embodiment, the fluid line 18 is used to deliver the gold plating liquid to the gold plating nozzle 20.

The utility model discloses a theory of operation and use flow: when a worker needs to use the gold spraying device, firstly, a tank cover 24 at the top of a stirring tank 21 is opened, then spraying raw materials and water are added into the tank together, then, the tank cover 24 is closed, then, a motor 28 is opened, then, the motor 28 drives a stirring column 26 through a driving end, the stirring column 26 drives a stirring rod 27, then, the gold spraying raw materials are stirred, then, electronic components are placed on a transverse plate 3 through a material discharge groove 6 arranged at the back of a gold plating box 9, then, a sliding block 17 can slide left and right through an electric sliding rod 12 and then slide to the upper side of the electronic components, then, a dust removing fan 14 is lowered to a specified height through a telescopic rod 15, then, the dust removing fan 14 is opened to remove dust of the electronic components, then, a dust collecting fan 7 is opened while removing the dust, dust in the gold plating box 9 is sucked out through a dust outlet pipe 8 communicated with the dust outlet, after dust removal is finished, the dust removal fan 14 is retracted through the telescopic rod 15, then the retracted position is lower than the gold plating nozzle 20, then the gold plating nozzle 20 is adjusted to be located above the electronic component, then the nozzle is opened, then the gold plating liquid passes through the filter screen 23 to be subjected to impurity filtration, then the gold plating liquid is conveyed through the infusion tube 18 and then reaches the gold plating nozzle 20, then the gold plating liquid is atomized and sprayed on the electronic component through the gold plating nozzle 20, due to the fact that the electronic component is different in size, the electric slide rod 12 can slide in the T-shaped slide groove 11 through the T-shaped slide block 10 and then drives the gold plating nozzle 20 to move back and forth to perform spraying, and then the fan cover 13 on the outer side of the fan can help the fan to perform simple shielding spraying on gold plating particles.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an electronic components surface plating gilding device, includes base (1) and agitator tank (21), its characterized in that: the bottom of the base (1) is fixedly provided with a seat block (2), the top of the base (1) is fixedly provided with two vertical plates (4), the opposite sides of the two vertical plates (4) are fixedly provided with transverse plates (3), the top of the base (1) is fixedly provided with a gold plating box (9), the inner side of the top of the gold plating box (9) is provided with two T-shaped sliding grooves (11), the inner sides of the two T-shaped sliding grooves (11) are movably provided with T-shaped sliding blocks (10), the opposite sides of the T-shaped sliding blocks (10) are fixedly provided with electric sliding rods (12), the outer sides of the electric sliding rods (12) are movably provided with sliding blocks (17), the bottom of each sliding block (17) is fixedly provided with a connecting block (16), one end of the bottom of each connecting block (16) is fixedly provided with a nozzle cover (19), and the bottom of each connecting, one side fixed mounting that nozzle cover (19) was kept away from to connecting block (16) bottom has telescopic link (15), the bottom fixed mounting of telescopic link (15) has dust removing fan (14), the bottom fixed mounting of telescopic link (15) has fan housing (13), the top fixed mounting of base (1) has dust absorption fan (7), the play dirt mouth intercommunication of dust absorption fan (7) has out dirt pipe (8), the dust absorption mouth intercommunication of dust absorption fan (7) has dust absorption pipe (5), the top fixed mounting of base (1) has motor (28), the drive end of motor (28) is connected with puddler (27), the top movable mounting of agitator tank (21) has cover (24), the jar wall fixed mounting of agitator tank (21) has antiseized layer (25), the inside movable mounting in one side of agitator tank (21) has filter screen (23), and a transfusion tube (18) is communicated with one side of the filter screen (23) far away from the stirring tank (21).

2. A device for plating gold on a surface of an electronic component as claimed in claim 1, wherein: the specification and the size of the T-shaped sliding groove (11) are matched with those of the T-shaped sliding block (10).

3. A device for plating gold on a surface of an electronic component as claimed in claim 1, wherein: the front surface of the gold plating box (9) is fixedly provided with an observation window (22), and the back surface of the gold plating box (9) is provided with a discharging groove (6).

4. A device for plating gold on a surface of an electronic component as claimed in claim 1, wherein: one end of the dust suction pipe (5) far away from the dust suction fan (7) penetrates through the side wall of one side of the gold-plated box (9) and extends to the inside of the gold-plated box (9).

5. A device for plating gold on a surface of an electronic component as claimed in claim 1, wherein: agitator tank (21) bottom fixed mounting has sealed bearing (30), bearing (30) fixed mounting is in the outside of stirring post (26), the bottom fixed mounting of agitator tank (21) has supporting leg (29), supporting leg (29) have four to be the bottom of symmetric distribution at agitator tank (21), one side welding that agitator tank (21) was kept away from in supporting leg (29) has base (1).

6. A device for plating gold on a surface of an electronic component as claimed in claim 1, wherein: one end of the infusion tube (18) far away from the stirring tank (21) is communicated with the gold-plating spray head (20).