CN213440649U - Device for efficiently cleaning semiconductor packaging die by using dry ice technology - Google Patents
Device for efficiently cleaning semiconductor packaging die by using dry ice technology Download PDFInfo
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- CN213440649U CN213440649U CN202021825743.XU CN202021825743U CN213440649U CN 213440649 U CN213440649 U CN 213440649U CN 202021825743 U CN202021825743 U CN 202021825743U CN 213440649 U CN213440649 U CN 213440649U
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Abstract
The utility model discloses a device for efficiently cleaning a semiconductor packaging mold by using a dry ice technology, which relates to the technical field of dry ice cleaning devices and comprises a semiconductor packaging mold, a dry ice cleaning device and a placing mechanism; the dry ice cleaning device provided by the utility model has the advantages that the nozzle is held by hand to spray dry ice particles 3-5cm away from the cleaning surface, the dry ice is sprayed to the surface at supersonic speed, the dry ice is sublimated instantly to generate impact micro-blasting effect, stains are shrunk by cooling, and the stains are stripped and removed from the surface of a workpiece by strong blast, so that the working process is simplified, the yield is improved, the working efficiency is improved, the cleaning cost is reduced, and no secondary pollution is caused; through mutually supporting of dwang, fixed ring gear and the garrulous ice tooth that garrulous ice mechanism set up, realized the high-efficient breakage of cubic dry ice, simple structure, convenient operation.
Description
Technical Field
The utility model relates to a dry ice belt cleaning device technical field specifically is a device with high-efficient washing semiconductor encapsulation mould of dry ice technique.
Background
The traditional cleaning mode for the surface treatment of the semiconductor packaging mold is a mold cleaning adhesive tape, the mold cleaning adhesive tape is rubber for cleaning the mold, the mold is required to be heated to about 170 ℃, and dirt on the surface of the mold is adsorbed into the adhesive tape to realize cleaning. The existing mold cleaning rubber strip contains a cleaning agent, a vulcanizing agent and a cleaning auxiliary agent, is toxic to a human body and pollutes the environment, and has long mold cleaning time, high cost and incomplete mold cleaning effect.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a device with high-efficient washing semiconductor package mould of dry ice technique to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a device for efficiently cleaning a semiconductor packaging mold by using a dry ice technology comprises the semiconductor packaging mold, a dry ice cleaning device and a placing mechanism;
the dry ice cleaning device comprises a rack, a workbench and a cleaning mechanism; the workbench is arranged on the rack and provided with a groove; the cleaning mechanism comprises a cleaning machine body, a nozzle and an ice crushing mechanism; the ice crushing mechanism comprises an ice crushing motor, a rotating rod and a fixed gear ring; the plurality of rotating rods are arranged in the cleaning machine body in a staggered mode, a plurality of fixed gear rings are sleeved on each rotating rod, each fixed gear ring is provided with ice crushing teeth, and each rotating rod is connected with an ice crushing motor arranged on the cleaning machine body; the ice crusher body is arranged on the workbench, a feed hopper is arranged on the ice crusher body, the ice crusher body is connected with the nozzle through a material conveying pipeline, and the nozzle is arranged on one side of the cleaning machine body; the arranged dry ice cleaning device is used for holding a nozzle by hand and spraying dry ice particles 3-5cm away from the cleaning surface, the dry ice is sprayed to the surface at supersonic speed, the dry ice is instantly sublimated to generate impact micro-blasting effect, stains are cooled and shrunk, and the stains are stripped and removed from the surface of a workpiece by strong blast, so that the working flow is simplified, the yield is improved, the working efficiency is improved, the cleaning cost is reduced, and no secondary pollution is caused; the rotating rod, the fixed gear ring and the crushed ice teeth arranged on the ice crushing mechanism are matched with each other, so that efficient crushing of the blocky dry ice is realized, the structure is simple, the operation is convenient, meanwhile, the crushed dry ice is powdery, and the problem that the traditional dry ice cleaning machine adopts granular dry ice for spraying is solved, and the cleaning work of parts with low external force tolerance such as pressure and impact cannot be solved due to the factors such as high required working pressure, large granularity of the sprayed dry ice and the like; the traditional dry cleaning machine has the problem that the phenomenon of material accumulation and blockage is easily caused after the machine works or is placed for a period of time due to the physical characteristics of the dry ice;
the placing mechanism drives the motor, the motor box body, the rotating rod and the placing platform; the motor box body is arranged on the lower end face of the rack, the driving motor is arranged in the motor box body, a motor shaft of the driving motor sequentially penetrates through grooves formed in the rack and the workbench and is connected with the rotating rod, the rotating rod is arranged in the groove, one end, away from the groove, of the rotating rod is connected with the placing platform, and the semiconductor packaging mold is placed on the placing platform; the placing mechanism who sets up uses through driving motor, bull stick and placing platform's cooperation, and placing platform can carry out the rotation of for place the semiconductor packaging mould at placing platform can obtain the washing at no dead angle, also need not the position of artifical removal semiconductor packaging mould, degree of automation is high, has practiced thrift the scavenging period.
Further, the present application provides an atom absorption cell, wherein the placing mechanism further comprises a fixing mechanism; the fixing mechanism comprises a fixing block, a telescopic cylinder and a clamping plate; the two fixed blocks are symmetrically arranged on the placing platform, each fixed block is provided with a fixed end of the telescopic cylinder, a movable end of the telescopic cylinder is provided with the clamping plate, one end, away from the telescopic cylinder, of the clamping plate is provided with a rubber pad, and the semiconductor packaging mold is clamped between the two clamping plates; through the fixed semiconductor package mould that needs wash of the fixed establishment of crossing that sets up, prevent that semiconductor package mould from taking place to slide, reduce the cost of labor.
Further, the atomic absorption cell provided by the application, wherein the light source assembly comprises an LED lamp housing, an LED lamp and a height adjusting column; one ends of the two height adjusting columns are symmetrically arranged on the rack, the other ends of the two height adjusting columns are hinged with the LED lamp housing, and the LED lamp is arranged in the LED lamp housing; the light source assembly enables an operator to see the semiconductor packaging mold clearly when the operator cleans the semiconductor packaging mold in a dark environment, and the working efficiency is improved.
Further, the atom absorption cell provided by the application is characterized in that a roller is arranged on the lower end face of the rack; the rollers are arranged to facilitate movement of the device.
Further, the atom absorption cell provided by the application is characterized in that baffles are arranged on the left side surface, the right side surface and the back surface of the rack; the baffle plate is arranged to prevent the sprayed dry ice from splashing outwards.
Further, the application provides an atom absorption cell, wherein the nozzle adopts a high-pressure nozzle.
Compared with the prior art, the beneficial effects of the utility model are that: the dry ice cleaning device provided by the utility model has the advantages that the nozzle is held by hand to spray dry ice particles 3-5cm away from the cleaning surface, the dry ice is sprayed to the surface at supersonic speed, the dry ice is sublimated instantly to generate impact micro-blasting effect, stains are shrunk by cooling, and the stains are stripped and removed from the surface of a workpiece by strong blast, so that the working process is simplified, the yield is improved, the working efficiency is improved, the cleaning cost is reduced, and no secondary pollution is caused; the rotating rod, the fixed gear ring and the crushed ice teeth arranged on the ice crushing mechanism are matched with each other, so that efficient crushing of the blocky dry ice is realized, the structure is simple, the operation is convenient, meanwhile, the crushed dry ice is powdery, and the problem that the traditional dry ice cleaning machine adopts granular dry ice for spraying is solved, and the cleaning work of parts with low external force tolerance such as pressure and impact cannot be solved due to the factors such as high required working pressure, large granularity of the sprayed dry ice and the like; and the traditional dry cleaning machine has the problem that the phenomenon of material accumulation and blockage is easily caused after the machine works or is placed for a period of time due to the physical characteristics of the dry ice.
Drawings
FIG. 1 is a schematic diagram of the structure of a device for efficiently cleaning a semiconductor packaging mold by using dry ice technology according to the present invention;
FIG. 2 is a schematic view of a structural cleaning mechanism of a device for efficiently cleaning a semiconductor package mold by using dry ice technology according to the present invention;
FIG. 3 is an enlarged schematic view of part A of the apparatus for efficiently cleaning semiconductor package molds by dry ice technology according to the present invention;
in the figure: 1. a semiconductor package mold; 2. a frame; 3. a work table; 4. a cleaning machine body; 5. a nozzle; 6. an ice crushing motor; 7. rotating the rod; 8. a fixed gear ring; 9. crushing ice teeth; 10. a feed hopper; 11. a delivery pipeline; 12. a groove; 13. a drive motor; 14. a motor box body; 15. a rotating rod; 16. placing a platform; 17. a fixed block; 18. a telescopic cylinder; 19. a clamping plate; 20. a rubber pad; 21. an LED lamp housing; 22. an LED lamp; 23. a height adjustment post; 24. a roller; 25. and a baffle plate.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention;
it should be noted that, in the description of the present invention, it is to be noted that the terms "inside", "outside", "upper", "lower", "both sides", "one end", "the other end", "left", "right", and the like indicate the directions or positional relationships based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of the present invention, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a device for efficiently cleaning a semiconductor packaging mold by using a dry ice technology comprises a semiconductor packaging mold 1, a dry ice cleaning device and a placing mechanism;
the dry ice cleaning device comprises a rack 2, a workbench 3 and a cleaning mechanism; the workbench 3 is arranged on the frame 2, the lower end face of the frame 2 is provided with a roller 24, and the arranged roller is convenient for the movement of the device; baffles 25 are arranged on the left side surface, the right side surface and the back surface of the rack 2, and the arranged baffles can prevent the sprayed dry ice from splashing outwards; the workbench 3 is provided with a groove 12; the cleaning mechanism comprises a cleaning machine body 4, a nozzle 5 and an ice crushing mechanism; the ice crushing mechanism comprises an ice crushing motor 6, a rotating rod 7 and a fixed gear ring 8; a plurality of rotating rods 7 are arranged in the cleaning machine body 4 in a staggered mode, a plurality of fixed tooth rings 8 are sleeved on each rotating rod 7, ice crushing teeth 9 are arranged on each fixed tooth ring 8, and each rotating rod 7 is connected with an ice crushing motor 6 arranged on the cleaning machine body 4; the cleaning machine body 4 is arranged on the workbench 3, the cleaning machine body 4 is provided with a feed hopper 10, the cleaning machine body 4 is connected with the nozzle 5 through a feed conveying pipeline 11, the nozzle 5 adopts a high-pressure nozzle, and the nozzle 5 is arranged on one side of the cleaning machine body 4; the arranged dry ice cleaning device is used for holding a nozzle by hand and spraying dry ice particles 3-5cm away from the cleaning surface, the dry ice is sprayed to the surface at supersonic speed, the dry ice is instantly sublimated to generate impact micro-blasting effect, stains are cooled and shrunk, and the stains are stripped and removed from the surface of a workpiece by strong blast, so that the working flow is simplified, the yield is improved, the working efficiency is improved, the cleaning cost is reduced, and no secondary pollution is caused; the rotating rod, the fixed gear ring and the crushed ice teeth arranged on the ice crushing mechanism are matched with each other, so that efficient crushing of the blocky dry ice is realized, the structure is simple, the operation is convenient, meanwhile, the crushed dry ice is powdery, and the problem that the traditional dry ice cleaning machine adopts granular dry ice for spraying is solved, and the cleaning work of parts with low external force tolerance such as pressure and impact cannot be solved due to the factors such as high required working pressure, large granularity of the sprayed dry ice and the like; the traditional dry cleaning machine has the problem that the phenomenon of material accumulation and blockage is easily caused after the machine works or is placed for a period of time due to the physical characteristics of the dry ice;
the placing mechanism drives the motor 13, the motor box 14, the rotating rod 15 and the placing platform 16; the motor box body 14 is arranged on the lower end face of the rack 2, the driving motor 13 is arranged in the motor box body 14, a motor shaft of the driving motor 13 sequentially penetrates through a groove 12 formed in the rack 2 and the workbench 3 and is connected with the rotating rod 15, the rotating rod 15 is arranged in the groove 12, one end, far away from the groove 12, of the rotating rod 15 is connected with the placing platform 16, and the semiconductor packaging mold 1 is placed on the placing platform 16; the placing mechanism who sets up uses through driving motor, bull stick and placing platform's cooperation, and placing platform can carry out 360 rotations for place the semiconductor packaging mould at placing platform and can obtain the washing at no dead angle, also need not the position of artifical removal semiconductor packaging mould, degree of automation is high, has practiced thrift the scavenging time.
The placing mechanism further comprises a fixing mechanism; the fixing mechanism comprises a fixing block 17, a telescopic cylinder 18 and a clamping plate 19; the two fixed blocks 17 are symmetrically arranged on the placing platform 16, each fixed block 17 is provided with a fixed end of the telescopic cylinder 18, a movable end of the telescopic cylinder 18 is provided with the clamping plate 19, one end, far away from the telescopic cylinder 18, of the clamping plate 19 is provided with a rubber pad 20, and the semiconductor packaging mold 1 is clamped between the two clamping plates 19; through the fixed semiconductor package mould that needs wash of the fixed establishment of crossing that sets up, prevent that semiconductor package mould from taking place to slide, reduce the cost of labor.
The LED lamp comprises a light source component, a light source component and a control circuit, wherein the light source component comprises an LED lamp housing 21, an LED lamp 22 and a height adjusting column 23; one ends of the two height adjusting columns 23 are symmetrically arranged on the frame 2, the other ends of the two height adjusting columns 23 are hinged with the LED lamp housing 21, and the LED lamp 22 is arranged in the LED lamp housing 21; the light source assembly enables an operator to see the semiconductor packaging mold clearly when the operator cleans the semiconductor packaging mold in a dark environment, and the working efficiency is improved.
The use process and principle are as follows: when a device is used for cleaning a semiconductor packaging mold 1 to be cleaned, the semiconductor packaging mold 1 is placed on a placing platform 16, then telescopic air cylinders 18 with two sides fixed on fixing blocks 17 push clamping blocks 19 through movable ends, the semiconductor packaging mold 1 is fixed through the clamping blocks 19 on the two sides, the semiconductor packaging mold 1 cannot move during cleaning, a cleaning mechanism and a driving motor 13 are opened simultaneously, an operator holds a nozzle and sprays dry ice particles 3-5cm away from the cleaning surface of the semiconductor packaging mold 1, the dry ice is sprayed to the surface at supersonic speed, the dry ice is sublimated instantly to generate an impact micro-explosion effect, stains are cooled and shrunk, strong air waves peel off and remove the stains from the surface of a workpiece, the driving motor 13 drives a rotating rod 15 to drive the placing platform 16 to rotate, so that the semiconductor packaging mold 1 is driven to rotate by the placing platform 16, and the semiconductor packaging mold 1 is rotated by 360 degrees during cleaning, the cleaning without dead angles can be achieved, the position of the semiconductor packaging mold 1 does not need to be moved manually, the automation degree is high, and the cleaning time is saved; under the dim circumstances of environment, can open the light source subassembly, adjust LED lamp body 21 and aim at the washing surface of semiconductor package mould 1 with LED lamp 22 for operating personnel still can see the semiconductor package mould clearly, has improved work efficiency, can adjust the height of light source subassembly through altitude mixture control post 23, makes operating personnel realize more clearly.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. A device for efficiently cleaning a semiconductor packaging mold by using a dry ice technology is characterized by comprising a semiconductor packaging mold (1), a dry ice cleaning device and a placing mechanism;
the dry ice cleaning device comprises a rack (2), a workbench (3) and a cleaning mechanism; the workbench (3) is arranged on the rack (2), and a groove (12) is formed in the workbench (3); the cleaning mechanism comprises a cleaning machine body (4), a nozzle (5) and an ice crushing mechanism; the ice crushing mechanism comprises an ice crushing motor (6), a rotating rod (7) and a fixed gear ring (8); the plurality of rotating rods (7) are arranged in the cleaning machine body (4) in a staggered mode, a plurality of fixed gear rings (8) are sleeved on each rotating rod (7), crushed ice teeth (9) are arranged on each fixed gear ring (8), and each rotating rod (7) is connected with an ice crushing motor (6) arranged on the cleaning machine body (4); the cleaning machine body (4) is arranged on the workbench (3), the cleaning machine body (4) is provided with a feed hopper (10), the cleaning machine body (4) is connected with the nozzle (5) through a material conveying pipeline (11), and the nozzle (5) is arranged on one side of the cleaning machine body (4);
the placing mechanism drives a motor (13), a motor box body (14), a rotating rod (15) and a placing platform (16); motor box (14) set up in terminal surface under frame (2), be equipped with in motor box (14) driving motor (13), the motor shaft of driving motor (13) runs through in proper order frame (2) with recess (12) that workstation (3) were seted up, and with bull stick (15) link to each other, bull stick (15) set up in recess (12), bull stick (15) are kept away from the one end of recess (12) with place the platform (16) are connected, place semiconductor encapsulation mould (1).
2. An apparatus for efficiently cleaning a semiconductor package mold using dry ice technology as claimed in claim 1, wherein said placement mechanism further comprises a fixing mechanism; the fixing mechanism comprises a fixing block (17), a telescopic cylinder (18) and a clamping plate (19); two fixed block (17) symmetry set up in place platform (16), every fixed block (17) are provided with the stiff end of telescopic cylinder (18), the expansion end of telescopic cylinder (18) is equipped with pinch-off blades (19), pinch-off blades (19) are kept away from the one end of telescopic cylinder (18) is provided with rubber pad (20), two it has to press from both sides tightly between pinch-off blades (19) semiconductor packaging mold (1).
3. The apparatus for efficiently cleaning semiconductor package molds with dry ice technology as claimed in claim 1, further comprising a light source assembly comprising an LED lamp housing (21), an LED lamp (22) and a height adjusting post (23); two the one end symmetry of altitude mixture control post (23) set up in frame (2), two it articulates to have between the other end of altitude mixture control post (23) LED lamp body (21), be equipped with in LED lamp body (21) LED lamp (22).
4. The apparatus for efficiently cleaning the semiconductor packaging mold by the dry ice technology as claimed in claim 1, wherein the lower end face of the frame (2) is provided with a roller (24).
5. The apparatus for efficiently cleaning the semiconductor package mold by the dry ice technology as claimed in claim 1, wherein the frame (2) is provided with a baffle (25) at both left and right sides and at the rear.
6. An apparatus for efficiently cleaning a semiconductor package mold using dry ice technology as claimed in claim 1, wherein the nozzle (5) is a high pressure nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021825743.XU CN213440649U (en) | 2020-08-27 | 2020-08-27 | Device for efficiently cleaning semiconductor packaging die by using dry ice technology |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021825743.XU CN213440649U (en) | 2020-08-27 | 2020-08-27 | Device for efficiently cleaning semiconductor packaging die by using dry ice technology |
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| CN213440649U true CN213440649U (en) | 2021-06-15 |
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| CN202021825743.XU Active CN213440649U (en) | 2020-08-27 | 2020-08-27 | Device for efficiently cleaning semiconductor packaging die by using dry ice technology |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114683479A (en) * | 2022-03-30 | 2022-07-01 | 深圳市明格精密科技有限公司 | Online cleaning method for EMC support injection mold |
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2020
- 2020-08-27 CN CN202021825743.XU patent/CN213440649U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114683479A (en) * | 2022-03-30 | 2022-07-01 | 深圳市明格精密科技有限公司 | Online cleaning method for EMC support injection mold |
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