CN213430517U

CN213430517U - Semiconductor laser appearance handle that moults

Info

Publication number: CN213430517U
Application number: CN202021643126.8U
Authority: CN
Inventors: 王振邦
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-08-10
Filing date: 2020-08-10
Publication date: 2021-06-15
Anticipated expiration: 2030-08-10

Abstract

The utility model discloses a cosmetic semiconductor laser appearance handle that moults of medical treatment, the electric iron comprises a handle body, the outside of handle body is including row's bellows, location double-screw bolt, heat dissipation wind tower, radiator fan and louvre, the bottom of row's bellows and the top fixed connection of handle body, the surface of location double-screw bolt and the interior diapire threaded connection of row's bellows, the surface of heat dissipation wind tower and the inside fixed connection of the case of airing exhaust, radiator fan's surface and the inside electric connection of the case of airing exhaust, radiator fan's left side and the right side fixed mounting of heat dissipation wind tower, the louvre is located the inner wall right side of row's bellows and is seted up. Through the cooperation setting of the heat dissipation copper pipe, the first semiconductor fin, the silicone grease layer, the second semiconductor fin, small-size water pump, heat dissipation water pipe, connecting pipe and the metal conducting strip that set up to make earlier pour into the refrigerant into in the inside of heat dissipation water pipe before using, and compress to being close the vacuum through the compressor.

Description

Semiconductor laser appearance handle that moults

Technical Field

The utility model relates to a cosmetic field of medical treatment specifically is a semiconductor laser appearance handle that moults.

Background

Semiconductor laser depilation is a depilation technology commonly used in the field of beauty and body care, and has the advantages of safely, quickly and permanently removing body hair. The principle is that the selective photothermal effect principle is utilized, and the melanocyte in the hair absorbs light with specific wavelength and converts the light into heat energy for damaging hair follicles, so that the hair loses the regeneration capacity. The currently popular freezing point hair removal technology is a modern hair removal technology mainly adopting laser with 808nm wavelength.

When the existing semiconductor laser depilator handle is used, equipment needs to be started for a period of time in advance, the cold compress head on one side of the handle is started, the cold compress head reaches an ice point and is used for people, and the condition causes that redundant electric quantity needs to be wasted in the using process to fully preheat the handle, so that a large amount of electric power and resources can be consumed. Accordingly, one skilled in the art provides a semiconductor laser epilator handle that solves the problems set forth in the background above.

Disclosure of Invention

An object of the utility model is to provide a semiconductor laser appearance handle that moults to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a semiconductor laser appearance handle that moults, includes the handle body, the outside of handle body is including row's bellows, positioning stud, heat dissipation wind tower, radiator fan and louvre, the top fixed connection of the bottom of row's bellows and handle body, positioning stud's the surface and the interior diapire threaded connection who arranges the bellows, the surface of heat dissipation wind tower and the inside fixed connection of the case of airing exhaust, radiator fan's the surface and the inside electric connection of the case of airing exhaust, radiator fan's left side and the right side fixed mounting of heat dissipation wind tower, the louvre is located the inner wall right side of arranging the bellows and sets up.

The handle comprises a handle body and is characterized in that the inside of the handle body comprises a heat dissipation copper pipe, a first semiconductor cooling fin, a silicone grease layer, a second semiconductor cooling fin, a small water pump and a heat dissipation water pipe, the top end of the heat dissipation copper pipe is fixedly connected with the bottom of a heat dissipation air tower, one side of the first semiconductor cooling fin is fixedly connected with one end, far away from the heat dissipation air tower, of the heat dissipation copper pipe, the surface of the silicone grease layer is arranged on the surface of the first semiconductor cooling fin, one side of the second semiconductor cooling fin is mounted on the surface of the silicone grease layer, one side of the small water pump is fixedly connected with the other side of the second semiconductor cooling fin, and the inside of the heat dissipation.

As a further aspect of the present invention: the surface of the heat dissipation water pipe comprises a connecting pipe, and one end of the connecting pipe is fixedly connected with the surface of the heat dissipation water pipe.

As a further aspect of the present invention: the surface of the connecting pipe comprises a metal heat-conducting fin, the surface of the metal heat-conducting fin is fixedly connected with one end of the connecting pipe, and the surface of the metal heat-conducting fin is arranged in the handle body.

As a further aspect of the present invention: the surface of the handle body comprises a metal layer, and one side of the metal layer is fixedly connected with the left side of the handle body.

As a further aspect of the present invention: the surface of the handle body comprises a laser treatment layer, and one side of the laser treatment layer is fixedly and electrically connected with the surface of the handle body.

As a further aspect of the present invention: the surface of the laser treatment layer and the middle part of the metal layer are arranged.

Compared with the prior art, the beneficial effects of the utility model are that:

1. in the utility model, through the matching arrangement of the arranged heat dissipation copper pipe, the first semiconductor cooling fin, the silicone layer, the second semiconductor cooling fin, the small-sized water pump, the heat dissipation water pipe, the connecting pipe and the metal heat conduction fin, thereby the refrigerant is injected into the interior of the heat dissipation water pipe before use, and is compressed to be close to vacuum through the compressor, when in use, the interior is operated by opening the arranged handle body, the refrigerant in the heat dissipation water pipe is driven by the small-sized water pump, the heat is transferred to the arranged second semiconductor cooling fin, and the silicone layer arranged on the surface of the second semiconductor cooling fin is passed, thereby the gap between the middle parts of the second semiconductor cooling fin and the first semiconductor cooling fin is reduced, and under the principle of a heat exchange system, the heat is transferred to the heat dissipation copper pipe, thereby the surface of the metal layer is cooled, and the second semiconductor cooling fin is heated, and the subsequent cooling is carried out, the effect of quickly cooling the metal layer is achieved, and the problem that the cooling of the cold compress head of the handle of the existing depilating instrument is slow is solved.

2. In the utility model, through the matching arrangement of the arranged air exhaust box, the positioning stud, the heat dissipation air tower, the heat dissipation fan, the heat dissipation holes and the heat dissipation copper pipe, the heat brought out by the arranged heat dissipation copper pipe is transferred to the inside of the arranged air exhaust box when in use, the air exhaust box is fixed on the upper part of the handle body through the plurality of positioning studs on the bottom wall in the air exhaust box, the heat absorbed by the heat dissipation copper pipe is absorbed through the arranged heat dissipation air tower, the heat in the heat dissipation air tower is dissipated to the right side of the air exhaust direction through the heat dissipation fans arranged at the two sides of the heat dissipation air tower, the hot air is discharged through the arranged heat dissipation holes, the heat dissipation of a heat exchange system in the handle of the semiconductor laser depilation instrument is realized, the heat is rapidly discharged, and the cold compress head is rapidly cooled to the minus degree, the problem of current laser appearance handle that moults that needs a large amount of time start-up handle, make the cold compress head reach certain temperature, power consumptive and consume the resource is solved.

Drawings

Fig. 1 is a schematic front view of a cross-sectional structure of the present invention;

fig. 2 is a front view schematically illustrating the present invention;

fig. 3 is an enlarged schematic view of the utility model at a in fig. 1;

fig. 4 is an enlarged schematic view of the position B in fig. 1 according to the present invention.

In the figure: 1. a handle body; 2. an exhaust box; 3. positioning the stud; 4. a heat dissipation wind tower; 5. a heat radiation fan; 6. heat dissipation holes; 7. a heat dissipation copper pipe; 8. a first semiconductor heat sink; 9. a silicone layer; 10. a second semiconductor heat sink; 11. a small-sized water pump; 12. a heat dissipation water pipe; 13. a connecting pipe; 14. a metal heat-conducting sheet; 15. a metal layer; 16. and (3) a laser treatment layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Please refer to fig. 1-4, in the embodiment of the present invention, a semiconductor laser depilation instrument handle, including handle body 1, handle body 1's outside is including row bellows 2, positioning stud 3, heat dissipation wind tower 4, radiator fan 5 and louvre 6, the bottom of case 2 and the top fixed connection of handle body 1 of airing exhaust, positioning stud 3's the surface and the interior diapire threaded connection of case 2 of airing exhaust, the surface of heat dissipation wind tower 4 and the inside fixed connection of row bellows 2, radiator fan 5's the surface and the inside electric connection of row bellows 2, radiator fan 5's left side and radiator fan 4's right side fixed mounting, louvre 6 is located the inner wall right side of row bellows 2 and sets up.

Handle body 1's inside is including heat dissipation copper pipe 7, first semiconductor fin 8, silicone grease layer 9, second semiconductor fin 10, small-size water pump 11 and heat dissipation water pipe 12, the top of heat dissipation copper pipe 7 and the bottom fixed connection of heat dissipation wind tower 4, the one end fixed connection of heat dissipation wind tower 4 is kept away from with heat dissipation copper pipe 7 in one side of first semiconductor fin 8, the surface of silicone grease layer 9 and the surface setting of first semiconductor fin 8, the surface mounting of one side and silicone grease layer 9 of second semiconductor fin 10, one side of small-size water pump 11 and the opposite side fixed connection of second semiconductor fin 10, the inside and the surface connection of small-size water pump 11 of heat dissipation water pipe 12.

The surface of the heat dissipation water pipe 12 comprises a connecting pipe 13, and one end of the connecting pipe 13 is fixedly connected with the surface of the heat dissipation water pipe 12; the surface of the connecting pipe 13 comprises a metal heat conducting sheet 14, the surface of the metal heat conducting sheet 14 is fixedly connected with one end of the connecting pipe 13, and the surface of the metal heat conducting sheet 14 is arranged in the handle body 1; the surface of the handle body 1 comprises a metal layer 15, and one side of the metal layer 15 is fixedly connected with the left side of the handle body 1; the surface of the handle body 1 comprises a laser treatment layer 16, and one side of the laser treatment layer 16 is fixedly and electrically connected with the surface of the handle body 1.

The utility model discloses a theory of operation is: through the matching arrangement of the arranged heat dissipation copper pipe 7, the first semiconductor heat dissipation fin 8, the silicone grease layer 9, the second semiconductor heat dissipation fin 10, the small water pump 11, the heat dissipation water pipe 12, the connecting pipe 13 and the metal heat conduction fin 14, the refrigerant is injected into the heat dissipation water pipe 12 before use and is compressed to be close to vacuum through the compressor, when the heat dissipation device is used, the inside is operated by opening the arranged handle body 1, the refrigerant in the arranged heat dissipation water pipe 12 is driven through the small water pump 11, heat is transferred to the arranged second semiconductor heat dissipation fin 10, the silicone grease layer 9 arranged on the surface of the second semiconductor heat dissipation fin 10 is used, so that the gaps between the middle parts of the second semiconductor heat dissipation fin 10 and the first semiconductor heat dissipation fin 8 are reduced, and under the principle of a heat exchange system, the heat is transferred to the heat dissipation copper pipe 7, so that the surface of the metal layer 15 is cooled, the second semiconductor heat sink 10 is heated and cooled later, the second semiconductor heat sink is provided with a plurality of positioning studs 3 through the arranged air exhaust box 2, a positioning stud 3, a heat dissipation air tower 4, a heat dissipation fan 5, a heat dissipation hole 6 and a heat dissipation copper pipe 7, so that heat brought out by the arranged heat dissipation copper pipe 7 is transferred to the inside of the arranged air exhaust box 2 when the second semiconductor heat sink is used, the air exhaust box 2 is fixed on the upper portion of the handle body through the plurality of positioning studs 3 on the inner bottom wall of the air exhaust box 2, the heat absorbed by the heat dissipation copper pipe 7 is absorbed through the arranged heat dissipation air tower 4, the heat inside the heat dissipation air tower 4 is dissipated to the right side of the air exhaust direction through the heat dissipation fans 5 arranged on two sides of the heat dissipation air tower 4, and the heat is exhausted through the arranged heat dissipation hole 6.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A semiconductor laser appearance handle that moults, includes handle body (1), its characterized in that: the handle is characterized in that the handle body (1) comprises an air exhaust box (2), a positioning stud (3), a heat dissipation air tower (4), a heat dissipation fan (5) and heat dissipation holes (6) in the outer part, the bottom of the air exhaust box (2) is fixedly connected with the top of the handle body (1), the surface of the positioning stud (3) is in threaded connection with the inner bottom wall of the air exhaust box (2), the surface of the heat dissipation air tower (4) is fixedly connected with the inner part of the air exhaust box (2), the surface of the heat dissipation fan (5) is electrically connected with the inner part of the air exhaust box (2), the left side of the heat dissipation fan (5) is fixedly installed with the right side of the heat dissipation air tower (4), and the heat dissipation holes (6) are formed in the right side of the inner wall of the air;

the handle body (1) comprises a heat radiation copper pipe (7), a first semiconductor heat radiation fin (8), a silicone grease layer (9), a second semiconductor heat radiation fin (10), a small water pump (11) and a heat radiation water pipe (12) inside, the top end of the heat dissipation copper pipe (7) is fixedly connected with the bottom of the heat dissipation wind tower (4), one side of the first semiconductor radiating fin (8) is fixedly connected with one end of the radiating copper pipe (7) far away from the radiating wind tower (4), the surface of the silicone grease layer (9) and the surface of the first semiconductor heat sink (8) are arranged, one side of the second semiconductor heat sink (10) is mounted with the surface of the silicone grease layer (9), one side of the small water pump (11) is fixedly connected with the other side of the second semiconductor cooling fin (10), the interior of the heat radiation water pipe (12) is connected with the surface of the small water pump (11).

2. A semiconductor laser epilator handpiece in accordance with claim 1, wherein: the surface of the heat dissipation water pipe (12) comprises a connecting pipe (13), and one end of the connecting pipe (13) is fixedly connected with the surface of the heat dissipation water pipe (12).

3. A semiconductor laser epilator handpiece in accordance with claim 2, wherein: the surface of the connecting pipe (13) comprises a metal heat-conducting sheet (14), the surface of the metal heat-conducting sheet (14) is fixedly connected with one end of the connecting pipe (13), and the surface of the metal heat-conducting sheet (14) is arranged in the handle body (1).

4. A semiconductor laser epilator handpiece in accordance with claim 1, wherein: the surface of the handle body (1) comprises a metal layer (15), and one side of the metal layer (15) is fixedly connected with the left side of the handle body (1).

5. A semiconductor laser epilator handpiece in accordance with claim 1, wherein: the surface of the handle body (1) comprises a laser treatment layer (16), and one side of the laser treatment layer (16) is fixedly and electrically connected with the surface of the handle body (1).

6. A semiconductor laser epilator handpiece in accordance with claim 5, wherein: the surface of the laser treatment layer (16) and the middle part of the metal layer (15) are arranged.