CN213424976U

CN213424976U - Mounting member and chip module

Info

Publication number: CN213424976U
Application number: CN202022075879.XU
Authority: CN
Inventors: 祝远昌
Original assignee: Guangzhou Zhono Electronic Technology Co ltd
Current assignee: Guangzhou Zhongnuo Microelectronics Co ltd
Priority date: 2020-09-21
Filing date: 2020-09-21
Publication date: 2021-06-11
Anticipated expiration: 2030-09-21

Abstract

The utility model relates to an installation part, which comprises a shell and a positioning part fixed on the shell; the shell is provided with an installation space, and the installation space comprises a first space and a second space; the positioning piece is fixed on the shell and extends to the first space and/or the second space; the housing comprises a first portion and a second portion; the second portion is secured to a surface of the first portion. The utility model discloses a be fixed in the casing with the setting element, can effectually prevent the condition that spare part lost to also need not to install unnecessary spare part when the installation, it is more convenient to install. The chip of chip subassembly can be through cooperating with the setting element, realize making things convenient for the combination of chip and installed part to make up chip and installed part again can let the chip installation stable.

Description

Mounting member and chip module

Technical Field

The utility model relates to a be applied to imaging system's chip technical field, concretely relates to installed part of chip and including the chip subassembly of this installed part.

Background

In an image forming system, an image forming apparatus and a developing cartridge (a cartridge, an ink cartridge, a toner cartridge, or the like) detachably mounted to the image forming apparatus are generally included, and a chip is provided in the developing cartridge in order to better manage use in the developing cartridge. When the developing cartridge is mounted to the image forming apparatus, the chip communicates with the image forming apparatus, and the image forming apparatus manages the use of the developing cartridge by recognizing information in the chip. It is therefore necessary to ensure the stability of the chip in the developing cartridge to ensure that the imaging device can communicate with the chip properly after the developing cartridge is mounted in place.

Different mounting may be required for different imaging devices: some are directly fixing the chip to the developing cartridge, for example, by using a double-sided tape or soldering. Some are through the installed part with the chip location in developing box, relative snap-on developing box, so can more conveniently change the chip. As shown in fig. 1, a conventional mounting device includes a housing a and a cover B, and the mounting device is configured to mount a chip in the housing a and then position the chip through the cover B to prevent the chip from sliding off the housing a.

However, the case a and the cover B in the conventional mounting device are two separate parts, and the parts are easily lost in the chip replacement process, and once a certain part is lost, the chip cannot be stably mounted on the imaging cartridge. For example, if the housing a is lost, the chip cannot be mounted on the imaging cartridge, or if the cover B is lost, the chip is easily loosened or separated after the chip is mounted on the housing a. Therefore, it is desirable to provide a mounting member and a chip assembly that can be easily mounted and can stably mount a chip.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem, the utility model provides a can easy to assemble can let stable installed part of chip installation and chip subassembly again.

A mounting piece comprises a shell and a positioning piece fixed on the shell; the shell is provided with an installation space, and the installation space comprises a first space and a second space; the positioning piece is fixed on the shell and extends to the first space and/or the second space; the housing comprises a first portion and a second portion; the second portion is secured to a surface of the first portion.

Preferably, the first space is located in the first portion and the second space is located in the second part; the positioning member is fixed to the second portion.

Preferably, the positioning member includes a fixing portion and a protrusion portion; the fixing part is fixed on the shell, and the bulge extends towards the direction of the first space and/or the second space from the shell.

Preferably, the second part is provided with a third space; the fixing part is located in the third space, and the bulge is at least partially located in the second space.

Preferably, the projection located in the second space includes an inclined surface intersecting with a plane of the second portion, the plane being in contact with the second contact space.

Preferably, the thickness of the protrusions is sequentially decreased from the second portion toward the second space.

Preferably, the projection reciprocates between a first position and a second position.

Preferably, the positioning member is fixed to the second portion and extends to the second space.

The utility model also provides a chip module, which comprises a mounting piece, wherein the chip is detachably mounted on the mounting piece; the mounting member is the mounting member described in the above embodiments.

Preferably, the chip comprises a positioning part, and when the chip is installed on the installation part, the positioning part is contacted with the positioning part of the case piece.

The utility model has the advantages that:

compared with the prior art, the utility model discloses a be fixed in the casing with the setting element, can effectually prevent the condition that spare part lost to also need not to install unnecessary spare part when the installation, it is more convenient to install. The chip of chip subassembly can be through cooperating with the setting element, realize making things convenient for the combination of chip and installed part to make up chip and installed part again can let the chip installation stable.

Drawings

FIG. 1 is a schematic view of a prior art mount;

fig. 2 is a schematic view of a mounting member according to a preferred embodiment of the present invention;

FIG. 3 is another view of a mounting member according to the preferred embodiment of the present invention;

FIG. 4 is a schematic view of a mounting member according to another preferred embodiment of the present invention;

fig. 5 is a schematic diagram of a chip assembly according to a preferred embodiment of the present invention.

Detailed Description

The invention will be further described with reference to the accompanying drawings and specific embodiments:

referring to fig. 2 to 4, an embodiment of the present invention relates to a mounting member 100, which includes a housing 1 and a positioning member 2 fixed to the housing. The housing 1 is provided with an installation space 11. The installation space 11 includes a first space 101 and a second space 102. At least part of the positioning element 2 may extend to the first space 101 and/or the second space 102. The housing 1 comprises a first portion 111 and a second portion 112. The second portion 112 is fixed to a surface (first surface 111a) of the first portion 111. The mount 100 may be used to mount a chip or card or other similar item. The first space 101 and the second space 102 may have different shapes, and the first space 101 and the second space 102 are communicated with each other. The positioning member 2 is used for positioning a chip or a card or other similar object mounted to the mounting member 2. Because the locating piece 2 is fixed in the casing 1, only need install chip or card or other similar article to installation space 11 after, can fix a position chip or card or other similar article through locating piece 2, need not to fix a position at the extra installation other spare parts for it is more convenient to operate in the in-process of using.

The first portion 111 includes a first surface 111a and a second surface 111b, which are described with reference to fig. 2 and 3. The first space 101 may be located at the first portion 111. The first space 101 may penetrate the first surface 111a and the second surface 111b, and a first opening 110a and a second opening 110b are formed on the first surface 111a and the second surface 111 b. The end of the second portion 112 for attachment to the first portion 111 is located at the second opening 110 b. The second space 102 may communicate with the first space 101 through a second opening 110 b. The first space 101 may be located within the first portion 111, and the first space 101 communicates with other spaces except the first space 101 through the first opening 110a and the second opening 110 b. The first portion 111 may form a sidewall (no sidewall at the first opening 110a and the second opening 110 b) at other peripheries of the first space 101, and the sidewall may be used to protect components in the first space 101, for example, when a portion of a chip is located in the first space 101, the sidewall of the first space 101 may protect the components on the chip, and the chip may be located at the same time.

The second space 102 may be located in the second portion 112. The second portion 112 defines a concave space 102a and defines a limiting groove 102b on each side of the second member. The limiting groove 102b can further position the chip. As another preferred scheme, the limiting groove 102b can also be used as the positioning member 2. The concave space 102a and the limiting groove 102b can be combined together to form the second space 102. Part of the chip is located in the second space 102.

Preferably, the positioning member 2 includes a fixing portion 21 and a protrusion 22. The fixing portion is fixed to the housing, and the protrusion extends from the housing toward at least one of the first space or the second space.

Preferably, the positioning member 2 can be fixed to the second portion 112. The second space 102 may be a space with a part of its side surface opened, or a side surface of the second space 102 away from the second portion 112 is opened, and the side surface is not formed with a side wall. Since the second space 102 of the second portion 112 is mostly not formed with a side wall, the fixing member 21 may be disposed on the second portion 112, which may make a portion of the positioning member 2 have a possibility of deformation or displacement when being subjected to an external force, thereby making it more convenient to mount or dismount an object, such as a chip, mounted on the mounting member 100.

Preferably, the second portion 112 may be opened with a third space 103. The fixing portion 21 may be located in the third space 103. At least part of the boss 22 is located in the second space 102. The third space 103 may communicate with the second space 102. Preferably, the third space 103 may be a notch or a through hole.

The projection 22 located at the second space 102 includes an inclined surface 221, and the inclined surface 221 intersects with a plane of the second portion 112, which is in contact with the second space 102. The inclined surface 221 may be one side surface facing the first portion 111. When a chip is mounted to the mounting member 100, a portion of the chip first contacts the inclined surface 221 when the portion of the chip first contacts the positioning member 2. As the chip is further moved, a force crossing the moving direction of the chip is applied to the inclined surface 211 so that the convex portion 22 can be moved to mount the chip in place.

The thickness of the boss 22 decreases in the direction from the second portion 112 toward the second space 102. The projection 22 may have a trapezoidal mesa shape due to the inclined surface 221. Therefore, when the protruding portion 22 is used for positioning a chip or other components, the chip or other components can be more conveniently combined with the corresponding components, and the thickness can be sequentially increased from the initial position to the positioning position, so that after the positioning is completed, the chip or other objects can be effectively prevented from moving randomly, and the stability of the mounting piece after being mounted is improved. The initial position may be a position where the chip or other component is located at the bump when the bump is initially positioned on the chip or other component; the positioning position may be a position where the chip or other component is located in the protrusion when the chip or other component is positioned

The boss 22 reciprocates between a first position and a second position. The first position may be a maximum position away from the second portion, and the first position is a greater distance from the second space 102 than the second portion 112 is from the second space 102. The second position may be located within the second space 102. The boss 22 also includes a rest position, which may be the position of the boss 22 when nothing is installed (in the event that the boss does not receive any external force). The rest position may be between a first position and a second position. The position of the boss 22 may be between a first position and a rest position when a chip or other article is mounted.

Referring to fig. 4, as another preferred embodiment, the third space 103 may not be opened, and the positioning member 2 is fixed to the second portion 112 and extends to the second space 102. The positioning element 2 may be a protrusion 23, and the number of the protrusions 23 may be two, and the protrusions 23 are respectively located on two side walls of the second space 102 and extend from the side walls into the second space 102.

Referring to fig. 5, the present invention also provides a chip assembly, including a chip 200, including a mounting member 100, wherein the chip 200 is detachably mounted to the mounting member 100. The mounting member 100 is the mounting member 100 described in the above embodiments. The chip 200 is provided with a positioning portion 201 matched with the positioning member. The positioning portion 201 may be a through hole or a notch.

After the chip 200 is mounted on the mounting member 100, the protrusion 23 or the protrusion 22 of the positioning member 2 may pass through the positioning portion 201 or be snapped into the positioning portion 201. Preferably, a portion of the chip 200 is located in the first space 101, and the other portion of the chip 200 is located in the second space 102. At least one sidewall of the portion of the chip located in the second space 102 may be snap-fitted into the stopper groove 102 b. When the chip 200 is mounted on the mounting device 100, the positioning portion 201 contacts the positioning member 2 of the mounting device 100.

The following description will be made of the mounting process and the mounted state of the mounting device and the chip, taking the positioning portion 201 as a through hole as an example:

the positioning member 2 includes a fixing portion 21 and a protrusion 22, and the second portion 112 has a third space 103. The fixing portion 21 is fixed to the second portion 112 and located in the third space 103, and the protruding portion 22 extends from the third space 103 to the second space 102. The chip 200 is inserted through the first opening 101a of the mounting member 100, passes through the first space 101, and enters the second space 102 through the second opening 101 b. After the chip enters the second space 102, the chip continues to advance to contact the fixing portion 21, the end of the chip 200 contacts the inclined surface 221 of the protruding portion 22, and the chip presses the inclined surface 221 to deform the fixing portion 21, so that the protruding portion 22 moves from the static position to the first position. After the top end (the end with the smallest thickness) of the protruding portion 22 slides into the positioning portion 201, the force of the chip pushing the protruding portion 22 is weakened, and the protruding portion 22 rebounds toward the static position (or the second position), so that the protruding portion 22 penetrates through the positioning portion 201 more, and the chip 200 is positioned.

In addition, when the chip 200 passes through the first space 101 and then enters the second space 102 through the second opening 101b, the edge portion of the chip 200 may sink into the limiting groove 102b, and the limiting groove 102b may also position the chip.

When detaching, the protruding portion 22 can be moved to the first position, and after the protruding portion 22 is separated from the positioning portion 201, the chip is pushed toward the first opening 101a, so that the chip 200 can be detached from the mounting member 100.

The following description will be made of the mounting process and the mounted state of the mounting device and the chip, taking the positioning portion as a notch as an example:

the notch may penetrate through the edge of the chip, so that the fixing portion 21, the protruding portion 22 and the third space 103 may be omitted. The chip continues to advance to contact the protrusion 23 of the fixing member after entering the second space 102 through the second opening 101b, the protrusion 23 may have a chip edge sliding into the positioning portion 201, and the chip 200 is matched with the mounting member 100 by matching the protrusion 23 with the notch. Part of the edge of the chip 200 may also be snapped into the retaining groove 102 b. When detaching, the chip 200 may be pushed toward the first opening 101a, thereby detaching the chip 200 from the mounting member 100. Bumps (not shown) may be further disposed on the chip, wherein the bumps extend outward from the first opening 101a and are located outside the first space 101. The detachment may be accomplished by pulling the tab away from the first space 101 and the second space 102, thereby removing the chip 200 from the mounting member 100.

Of course, the positioning portion 201 may be a partial edge of the chip 200, the positioning member 2 may be the limiting groove 102b, and the height of the limiting groove 102b may be set to be consistent with the thickness of the chip, so that the chip may be mounted more stably. In order to facilitate the detachment, a bump (not shown) may be disposed on the chip 200, and the bump extends outward from the first opening 101a and is located outside the first space 101 after the chip 200 is mounted on the mounting member 100. Removal may be by pulling the tab 23 away from the first space 101 and the second space 102, such that the chip 200 is removed from the mount 100.

As another preferred embodiment, the mounting member 100 further defines a fourth space 104, and the fourth space 104 is communicated with at least one of the first space 101 or the second space 102. The chip 200 is provided with a portion of a metal terminal (not shown). A portion of the metal terminal is aligned with the fourth space. This makes it possible to perform appropriate operations on the part of the metal terminals through the fourth space without taking the chip out of the mount. The operation may be data burning, data repairing, etc. of the chip.

To sum up, the utility model discloses an installed part 100 can install chip 200 and other spare parts, realizes installing chip 200 and other spare parts to preset position, can dismantle installed part 100 after, realizes the dismantlement to chip and other spare parts, its convenient operation during the dismantlement. Furthermore, the utility model discloses a chip subassembly can be installed to the developing box after installing chip 200 to installed part 100, and this installed part 100 can be more stable with chip 200 with install to developing box among, of course, can also directly install this installed part 100 to imaging device in. The mount may position the chip 200 so that the chip 200 communicates with the imaging device more stably.

Various other modifications and changes may be made by those skilled in the art based on the above-described technical solutions and concepts, and all such modifications and changes are intended to fall within the scope of the claims.

It should be noted that: the embodiments described above are only a part of the embodiments of the present invention, and not all of them. As used in the examples and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

Claims

1. A mount, characterized by: comprises a shell and a positioning piece fixed on the shell; the shell is provided with an installation space, and the installation space comprises a first space and a second space; the positioning piece is fixed on the shell and extends to the first space and/or the second space; the housing comprises a first portion and a second portion; the second portion is secured to a surface of the first portion.

2. The mount of claim 1, wherein: the first space is located in the first portion and the second space is located in the second portion; the positioning member is fixed to the second portion.

3. The mount of claim 1 or 2, wherein: the positioning piece comprises a fixing part and a bulge part; the fixing part is fixed on the shell, and the bulge extends towards the direction of the first space and/or the second space from the shell.

4. The mount of claim 3, wherein: the second part is provided with a third space; the fixing part is located in the third space, and the bulge is at least partially located in the second space.

5. The mount of claim 4, wherein: the projection located in the second space includes an inclined surface intersecting with a plane of the second portion, the plane being in contact with the second contact space.

6. The mount of claim 3, wherein: the projection reciprocates between a first position and a second position.

7. The mount of claim 1 or 2, wherein: the positioning piece is fixed on the second part and extends to the second space.

8. A chip assembly comprising a chip, wherein: the chip comprises a mounting part, wherein the chip is detachably mounted on the mounting part; the mount is as claimed in any one of claims 1 to 7.

9. The chip assembly according to claim 8, wherein: the chip comprises a positioning part, and when the chip is installed on the installation part, the positioning part is in contact with the positioning part of the case piece.

10. The chip assembly according to claim 8 or 9, wherein: the mounting piece is provided with a fourth space, and the fourth space is communicated with at least one of the first space or the second space; the chip is provided with a metal terminal; a portion of the metal terminal is aligned with the fourth space.