CN218679734U - Heat dissipation module of electronic equipment and electronic equipment - Google Patents
Heat dissipation module of electronic equipment and electronic equipment Download PDFInfo
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- CN218679734U CN218679734U CN202222506565.XU CN202222506565U CN218679734U CN 218679734 U CN218679734 U CN 218679734U CN 202222506565 U CN202222506565 U CN 202222506565U CN 218679734 U CN218679734 U CN 218679734U
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Abstract
The utility model discloses an electronic equipment's heat dissipation module and electronic equipment. The heat dissipation module of the electronic equipment comprises a heat dissipation piece and a heat dissipation module, wherein the heat dissipation piece is used for generating heat dissipation airflow; the mounting piece is connected with the radiating piece and is used for detachably mounting the radiating module between the first baffle and the second baffle; the operating piece is connected with the mounting piece, is positioned on one side of the mounting piece, which is far away from the heat dissipation piece, and is used for taking the heat dissipation module out of the accommodating cavity based on the pulling force in a first direction, wherein the first direction is a direction from the heat dissipation piece to the operating piece; wherein, the installed part is the elastic component, and when exerting pulling force to the operating parts, the installed part can take place deformation to reduce the ascending size of line direction of first baffle and second baffle.
Description
Technical Field
The utility model relates to a heat dissipation module technical field especially relates to a heat dissipation module and electronic equipment of electronic equipment.
Background
Electronic equipment such as server or host computer etc. set up fan cooling module usually and dispel the heat to it, and fan cooling module passes through plug structure to be installed on electronic equipment, and current plug structure is comparatively complicated, leads to extracting the operation comparatively loaded down with trivial details, has reduced fan cooling module's dismantlement convenience.
Therefore, how to improve the assembly convenience of the fan heat dissipation module is a technical problem that needs to be solved by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
In view of this, an object of the present invention is to provide a heat dissipation module for an electronic device, so as to improve the convenience of assembling the heat dissipation module.
In order to achieve the above object, the present invention provides the following technical solutions:
a heat dissipation module of an electronic device, a bottom shell of the electronic device is fixed with a first baffle and a second baffle which are opposite to each other, a containing cavity for containing the heat dissipation module is formed between the first baffle and the second baffle, and the heat dissipation module comprises:
a heat sink for generating a heat-dissipating airflow;
the mounting piece is connected with the heat dissipation piece and is used for detachably mounting the heat dissipation module between the first baffle and the second baffle;
the operating part is connected with the mounting part, is positioned on one side of the mounting part, which is far away from the heat radiating part, and is used for taking the heat radiating module out of the accommodating cavity based on pulling force in a first direction, wherein the first direction is a direction from the heat radiating part to the operating part;
the mounting piece is an elastic piece, and can deform when the tensile force is applied to the operating piece, so that the size of the first baffle plate and the size of the second baffle plate in the direction of a connecting line are reduced.
Optionally, in the heat dissipation module, the first baffle and the second baffle both have a first clamping structure;
the mounting piece is provided with a second clamping structure matched with the first clamping structure.
Optionally, in the above heat dissipation module, one of the first clamping structure and the second clamping structure is a boss, and the other is a clamping hole adapted to the boss.
Optionally, in the heat dissipation module, the first clamping structure is a clamping hole, and the second clamping structure is a boss.
Optionally, in the heat dissipation module, the mounting member has a first frame and a second frame, the first frame is used for being opposite to the first baffle, and the second frame is used for being opposite to the second baffle;
the operating part is provided with a first end connected with the first frame and a second end connected with the second frame, the first end is adjacent to the second clamping structure on the first frame, and the second end is adjacent to the second clamping structure on the second frame.
Optionally, in the above heat dissipation module, the operating part is an elastic part integrally formed with the mounting part.
Optionally, in the above heat dissipation module, an electromagnetic shield disposed between the heat dissipation member and the mounting member is further included;
a reserved gap is reserved between the operating piece and the electromagnetic shielding piece, so that the operating piece can be held conveniently.
Optionally, in the above heat dissipation module, the operating part has a first end connected with the mounting part and a second end connected with the mounting part, the side of the electromagnetic shield close to the first baffle has a first notch, the side of the electromagnetic shield close to the second baffle has a second notch, and the first notch and the second notch are used for adapting to the size change when the mounting part deforms.
An electronic device, comprising:
the bottom shell is provided with a first baffle plate and a second baffle plate which are oppositely arranged, and an accommodating cavity is formed between the first baffle plate and the second baffle plate;
a heat dissipation module removably mounted in the receiving cavity, the heat dissipation module comprising:
a heat sink for generating a heat-dissipating airflow;
the mounting piece is connected with the heat dissipation piece and is used for detachably mounting the heat dissipation module between the first baffle and the second baffle;
the operating part is connected with the mounting part, is positioned on one side of the mounting part, which is far away from the heat radiating part, and is used for taking the heat radiating module out of the accommodating cavity based on pulling force in a first direction, wherein the first direction is a direction from the heat radiating part to the operating part;
the mounting piece is an elastic piece, and can deform when the tensile force is applied to the operating piece, so that the size of the first baffle plate and the size of the second baffle plate in the direction of a connecting line are reduced.
Optionally, in the electronic device, the first baffle and the second baffle each have a first clamping structure;
the mounting piece is provided with a second clamping structure matched with the first clamping structure.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is an exploded schematic view of a heat dissipation module of an electronic device according to an embodiment of the present invention;
fig. 2 is a schematic view of an assembly structure of a heat dissipation module of an electronic device according to an embodiment of the present invention;
fig. 3 is a schematic view of an assembly structure of a heat dissipation module installed on an electronic device according to an embodiment of the present invention.
Wherein 100 is a bottom case, 200 is a first baffle, 300 is a second baffle, 400 is a heat dissipation module, 401 is a heat dissipation member, 402 is a mounting member, 4021 is a second clamping structure, 403 is an operation member, 404 is an electromagnetic shielding member, and X is a first direction.
Detailed Description
In view of this, the core of the present invention is to provide a heat dissipation module for an electronic device to improve the convenience of assembling the heat dissipation module.
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1 to 3, the embodiment of the present invention discloses a heat dissipation module 400 of an electronic device, a bottom case 100 of the electronic device is fixed with a first baffle 200 and a second baffle 300 which are opposite to each other, a containing cavity for containing the heat dissipation module 400 is formed between the first baffle 200 and the second baffle 300, and the heat dissipation module 400 includes a heat dissipation member 401, a mounting member 402 and an operation member 403.
The heat dissipation member 401 is configured to generate a heat dissipation airflow to dissipate heat of the electronic device; the mounting member 402 is connected to the heat sink 401, and is configured to detachably mount the heat sink module 400 between the first barrier 200 and the second barrier 300; an operating member 403 is connected to the mounting member 402, and is located on a side of the mounting member 402 facing away from the heat dissipation member 401, for taking the heat dissipation module 400 out of the accommodating cavity based on a pulling force in a first direction X, where the first direction X is a direction from the heat dissipation member 401 to the operating member 403; the mounting member 402 is an elastic member, and when a pulling force is applied to the operating member 403, the mounting member 402 can deform to reduce the dimension in the direction of the connection line between the first baffle 200 and the second baffle 300, so that the mounting member 402 can be separated from the accommodating cavity, and the heat dissipation module 400 can be pulled out.
Therefore, when the heat dissipation module 400 provided by the utility model is used, with heat dissipation member 401 through installed part 402 demountable installation in the chamber that holds between first baffle 200 and second baffle 300, because operating part 403 is connected with installed part 402 and is located one side that installed part 402 deviates from heat dissipation member 401, therefore, when this heat dissipation module 400 needs to be extracted, only need apply first direction X's pulling force to operating part 403, make installed part 402 take place to warp, reduce the size of installed part 402 at the line direction of first baffle 200 with second baffle 300, based on the size of installed part 402 diminishes and first direction X's pulling force, installed part 402 breaks away from smoothly and holds the chamber, and drive heat dissipation member 401 and break away from and hold the chamber, realize heat dissipation member 401's extraction operation. Therefore, the utility model provides a heat dissipation module 400 simple structure makes heat dissipation module 400 easily extract on electronic equipment through the deformation of installed part 402, extracts easy operation convenience, has improved heat dissipation module 400's dismantlement convenience.
It should be understood that, when the mounting member 402 is in interference fit with the first baffle 200 and the second baffle 300, the first baffle 200 and the second baffle 300 can fix the heat sink 401 by the extrusion force of the mounting member 402, or a clamping structure can be arranged on the mounting member 402, and the heat sink 401 is fixed between the first baffle 200 and the second baffle 300 by the clamping fit of the clamping structure and the first baffle 200 and the second baffle 300, so long as the mounting member is in a structure capable of meeting the use requirement, which falls within the protection scope of the present invention; optionally, the mounting member 402 provided by the embodiment of the present invention is detachably connected to the first baffle 200 and the second baffle 300 through a clamping structure, so as to detachably mount the heat dissipation module 400 between the first baffle 200 and the second baffle 300.
Specifically, the first baffle 200 and the second baffle 300 both have a first clamping structure; the mounting piece 402 is provided with a second clamping structure 4021, and the second clamping structure 4021 is matched with the first clamping structure to realize the clamping matching of the first clamping structure and the second clamping structure 4021.
It should be noted that, above-mentioned first joint structure and second joint structure 4021 can cooperate through boss and card hole joint, perhaps the joint cooperation in metal shrapnel and card hole, as long as can satisfy operation requirement's joint structure all belongs to the utility model discloses in the protection scope.
Optionally, one of the first clamping structure and the second clamping structure 4021 is a boss, and the other is a clamping hole for being matched with the boss, so that clamping matching is realized through matching of the boss and the clamping hole, the structure is simple, and processing and manufacturing are facilitated.
The boss can be arranged on the mounting part 402 or on the first baffle 200 and the second baffle 300, and correspondingly, the clamping hole can be arranged on the first baffle 200 and the second baffle 300 or on the mounting part 402, so that the boss can be flexibly modified in practical application as long as clamping matching can be realized.
The utility model discloses a specific embodiment, first joint structure is the card hole, and second joint structure 4021 is the boss, namely with the card hole setting on first baffle 200 and second baffle 300, with the boss setting on installed part 402, avoids offering the card hole on installed part 402, prevents that installed part 402 from reducing the intensity and the rigidity of installed part 402 owing to offering the card hole, and under the pulling force effect of first direction X, the card hole takes place to warp, influences this radiating module 400's normal use.
In addition, the boss can be in the shape of a hemispherical boss, a wedge-shaped boss or a trapezoidal boss, and the like, and the shape which can meet the use requirement belongs to the protection scope of the utility model; optionally, the embodiment of the utility model provides a boss is slide wedge type boss to play the guide effect through the slide wedge face of slide wedge type boss, make radiator module 400 insert first baffle 200 and second baffle 300 smoothly, prevent because reasons such as tolerance accumulation when manufacturing error or equipment from making installed part 402 and first baffle 200 and second baffle 300 take place to interfere, can't insert this radiator module 400.
Moreover, for reducing the alignment requirement of the boss and the clamping hole, the clamping holes of the first baffle plate 200 and the second baffle plate 300 can be set to be elongated openings along the vertical direction, or the tolerance of the clamping hole in the vertical direction is enlarged, so that even if the clamping hole and the boss have position deviation in the vertical direction due to manufacturing errors, the clamping hole and the boss can also realize clamping matching.
Further, the mounting member 402 has a first frame and a second frame, the first frame is used for facing the first baffle 200, the second frame is used for facing the second baffle 300, so as to set the above bosses on the first frame and the second frame, and the above fastening holes are set on the first baffle 200 and the second baffle 300, so that the mounting member 402 is fastened between the first baffle 200 and the second baffle 300.
The operating element 403 has a first end connected to the first frame and a second end connected to the second frame, the first end is adjacent to the second clamping structure 4021 on the first frame, and the second end is adjacent to the second clamping structure 4021 on the second frame, so that when a pulling force in the first direction X is applied to the operating element 403, the first end of the operating element 403 pulls the first frame to deform, and the second end of the operating element 403 pulls the second frame to deform, so that the distance between the first frame and the second frame is reduced, accordingly, the distance between the boss on the first frame and the boss on the second frame is reduced, and the distance between the first baffle 200 and the second baffle 300 is unchanged, so that the boss can be disengaged from the clamping hole, and the heat dissipation module 400 can be pulled out.
The operating member 403 and the mounting member 402 provided by the present invention can be a split structure or an integrally formed structure, and any structural form that can satisfy the use requirement belongs to the protection scope of the present invention; optionally, the present invention provides an operating member 403 and a mounting member 402 as an integral member to improve the connection strength between the operating member 403 and the mounting member 402, and reduce the assembling process and simplify the assembling process of the heat dissipation module 400.
The operation member 403 and the mounting member 402 are integrally formed as an elastic member, and when the operation member 403 is pulled in the first direction X, the mounting member 402 can be deformed and separated from the locking hole.
It should be noted that, the operating element 403 and the mounting element 402 may be integrally formed plastic pieces, or may be metal elastic pieces or plastic elastic pieces, and any type of elastic piece that can meet the use requirement is within the protection scope of the present invention; optionally, in an embodiment of the present invention, the operating part 403 and the mounting part 402 are integrally formed plastic parts, which is low in cost and suitable for mass production.
As shown in fig. 1, the heat dissipation module 400 further includes an electromagnetic shielding element 404 disposed between the heat dissipation element 401 and the mounting element 402 to perform an electromagnetic shielding function; a clearance is provided between the operation member 403 and the electromagnetic shield 404 to facilitate the handling of the operation member 403.
It should be understood that, the operating element 403 may be bent at the middle thereof to form an arc handle, so that a reserved gap is formed between the operating element 403 and the electromagnetic shielding element 404, or the size of the operating element 403 in the first direction X may be directly increased, so that a reserved gap is formed between the operating element 403 and the electromagnetic shielding element 404, as long as the operating element 403 can be held conveniently, the present invention is also within the protection scope of the present invention.
In addition, the operating member 403 has a first end connected to the mounting member 402 and a second end connected to the mounting member 402, a side of the electromagnetic shielding member 404 close to the first baffle 200 has a first notch, a side of the electromagnetic shielding member 404 close to the second baffle 300 has a second notch, and the first notch and the second notch are used for adapting to a size change of the mounting member 402 during deformation, so as to prevent the mounting member 402 from interfering with the electromagnetic shielding member 404 during deformation when the operating member 403 is pulled in the first direction X, so that the mounting member 402 cannot be removed from the clamping hole, and the heat dissipation module 400 cannot be removed.
The operating part 403 is provided with a first pressing portion at a position close to the first end, and a second pressing portion at a position close to the second end, so that when the heat dissipation module 400 is installed, the first pressing portion and the second pressing portion are pressed respectively, the boss is matched with the clamping hole, and the heat dissipation module 400 is clamped and matched with the first baffle 200 and the second baffle 300.
In addition, the utility model also discloses an electronic device, which comprises a bottom shell 100 and a heat dissipation module 400; the bottom case 100 has a first baffle 200 and a second baffle 300 disposed opposite to each other, an accommodating cavity is formed between the first baffle 200 and the second baffle 300, and the heat dissipation module 400 is detachably mounted in the accommodating cavity.
The heat dissipation module 400 includes a heat dissipation member 401, a mounting member 402, and an operation member 403, where the heat dissipation member 401 is configured to generate a heat dissipation airflow to dissipate heat of the electronic device; the mounting member 402 is connected to the heat sink 401, and is configured to detachably mount the heat sink module 400 between the first barrier 200 and the second barrier 300; operating element 403 is connected to mounting element 402 and located on a side of mounting element 402 facing away from heat sink 401, for removing heat sink module 400 from the receiving cavity based on a pulling force in a first direction X, which is a direction from heat sink 401 towards operating element 403; the mounting member 402 is an elastic member, and when a pulling force is applied to the operating member 403, the mounting member 402 can deform to reduce the dimension of the first barrier 200 in the direction of the connection line with the second barrier 300.
The heat dissipation module 400 is detachably mounted in the accommodating cavity between the first baffle 200 and the second baffle 300 of the electronic device, and the operating element 403 is connected with the mounting element 402 and located on one side of the mounting element 402 departing from the heat dissipation element 401, so that the heat dissipation module 400 is required to be pulled out, only the pulling force in the first direction X needs to be applied to the operating element 403, the mounting element 402 is deformed, the size of the mounting element 402 in the connecting line direction of the first baffle 200 and the second baffle 300 is reduced, the mounting element 402 is smoothly separated from the accommodating cavity based on the size reduction of the mounting element 402 and the pulling force in the first direction X, and the heat dissipation element 401 is driven to be separated from the accommodating cavity, so that the pulling-out operation of the heat dissipation element 401 is realized. Therefore, the utility model provides a heat dissipation module 400 simple structure makes heat dissipation module 400 easily extract on electronic equipment through the deformation of installed part 402, extracts easy operation convenience, has improved heat dissipation module 400's dismantlement convenience.
When the mounting member 402 is in interference fit with the first baffle 200 and the second baffle 300, the first baffle 200 and the second baffle 300 can fix the heat dissipation member 401 to the extrusion force of the mounting member 402, and a clamping structure can be arranged on the mounting member 402, so that the heat dissipation member 401 is fixed between the first baffle 200 and the second baffle 300 by the clamping fit of the clamping structure and the first baffle 200 and the second baffle 300, and the mounting member 402 can be in a structure meeting the use requirement; optionally, the mounting member 402 provided by the embodiment of the present invention is detachably connected to the first baffle 200 and the second baffle 300 through a clamping structure, so as to detachably mount the heat dissipation module 400 between the first baffle 200 and the second baffle 300.
Specifically, the first baffle 200 and the second baffle 300 both have a first clamping structure; the mounting piece 402 is provided with a second clamping structure 4021, and the second clamping structure 4021 is matched with the first clamping structure to realize the clamping matching of the first clamping structure and the second clamping structure 4021.
It should be noted that, the above-mentioned first clamping structure and second clamping structure 4021 can cooperate with the joint of card hole through the boss, or metal shrapnel cooperates in the joint in card hole, as long as can satisfy operation requirement's joint structure all belongs to the utility model discloses in the scope of protection.
When the heat dissipation module 400 is mounted. In order to facilitate the smooth insertion of the bosses into the fastening holes, the bosses are tapered wedge-shaped bosses, so that when the heat dissipation module 400 is inserted between the first baffle 200 and the second baffle 300, the tapered wedge surfaces of the tapered wedge-shaped bosses serve as a guide to allow the heat dissipation module 400 to be smoothly inserted into the first baffle 200 and the second baffle 300, thereby preventing the mounting member 402 from interfering with the first baffle 200 and the second baffle 300 due to manufacturing errors or tolerance accumulation during assembly, and preventing the heat dissipation module 400 from being inserted into the mounting member.
The terms "first" and "second," and the like in the description and claims of the present invention and the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not set forth for a listed step or element but may include other steps or elements not listed.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A heat radiation module of an electronic device, a first baffle and a second baffle which are opposite to each other are fixed on a bottom shell of the electronic device, an accommodating cavity for accommodating the heat radiation module is formed between the first baffle and the second baffle, and the heat radiation module is characterized in that,
the heat dissipation module includes:
a heat sink for generating a heat-dissipating airflow;
the mounting piece is connected with the heat dissipation piece and is used for detachably mounting the heat dissipation module between the first baffle and the second baffle;
the operating piece is connected with the mounting piece, is positioned on one side, away from the heat dissipation piece, of the mounting piece and is used for taking the heat dissipation module out of the accommodating cavity based on pulling force in a first direction, and the first direction is the direction from the heat dissipation piece to the operating piece;
the mounting piece is an elastic piece, and can deform when the tensile force is applied to the operating piece, so that the size of the first baffle plate and the size of the second baffle plate in the direction of a connecting line are reduced.
2. The thermal module of claim 1, wherein the first baffle and the second baffle each have a first snap-fit structure;
the mounting piece is provided with a second clamping structure matched with the first clamping structure.
3. The heat dissipation module of claim 2, wherein one of the first and second clamping structures is a boss, and the other is a clamping hole adapted to the boss.
4. The thermal module of claim 3, wherein the first snap-fit structure is a snap hole and the second snap-fit structure is a boss.
5. The thermal module of claim 2 wherein the mount has a first rim for opposing the first baffle and a second rim for opposing the second baffle;
the operating part is provided with a first end connected with the first frame and a second end connected with the second frame, the first end is adjacent to the second clamping structure on the first frame, and the second end is adjacent to the second clamping structure on the second frame.
6. The heat dissipating module of claim 1, wherein the operating member is a resilient member integrally formed with the mounting member.
7. The heat dissipation module of claim 1, further comprising an electromagnetic shield disposed between the heat dissipation member and the mounting member;
a reserved gap is reserved between the operating piece and the electromagnetic shielding piece, so that the operating piece can be held conveniently.
8. The heat dissipation module of claim 7, wherein the operating member has a first end connected to the mounting member and a second end connected to the mounting member, the electromagnetic shield has a first notch on a side thereof close to the first baffle, and a second notch on a side thereof close to the second baffle, and the first notch and the second notch are adapted to a size change of the mounting member when the mounting member is deformed.
9. An electronic device, comprising:
the bottom shell is provided with a first baffle plate and a second baffle plate which are oppositely arranged, and an accommodating cavity is formed between the first baffle plate and the second baffle plate;
a heat dissipation module removably mounted in the receiving cavity, the heat dissipation module comprising:
a heat sink for generating a heat-dissipating airflow;
the mounting piece is connected with the heat dissipation piece and is used for detachably mounting the heat dissipation module between the first baffle and the second baffle;
the operating part is connected with the mounting part, is positioned on one side of the mounting part, which is far away from the heat radiating part, and is used for taking the heat radiating module out of the accommodating cavity based on pulling force in a first direction, wherein the first direction is a direction from the heat radiating part to the operating part;
the mounting piece is an elastic piece, and can deform when the tensile force is applied to the operating piece, so that the size of the first baffle plate and the size of the second baffle plate in the direction of a connecting line are reduced.
10. The electronic device of claim 9, wherein the first bezel and the second bezel each have a first snap-fit structure;
the mounting piece is provided with a second clamping structure matched with the first clamping structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222506565.XU CN218679734U (en) | 2022-09-21 | 2022-09-21 | Heat dissipation module of electronic equipment and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222506565.XU CN218679734U (en) | 2022-09-21 | 2022-09-21 | Heat dissipation module of electronic equipment and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218679734U true CN218679734U (en) | 2023-03-21 |
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ID=85559670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222506565.XU Active CN218679734U (en) | 2022-09-21 | 2022-09-21 | Heat dissipation module of electronic equipment and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218679734U (en) |
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2022
- 2022-09-21 CN CN202222506565.XU patent/CN218679734U/en active Active
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